CN105081614B - A kind of pre- preserved material of OSP - Google Patents
A kind of pre- preserved material of OSP Download PDFInfo
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- CN105081614B CN105081614B CN201510561825.5A CN201510561825A CN105081614B CN 105081614 B CN105081614 B CN 105081614B CN 201510561825 A CN201510561825 A CN 201510561825A CN 105081614 B CN105081614 B CN 105081614B
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- osp
- preserved material
- preserved
- sodium
- chloride
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Abstract
Welding technology field is protected the present invention relates to printed circuit board (PCB), and in particular to a kind of pre- preserved material of OSP, the pre- preserved material of OSP includes the raw material of following component：The 50g/L of ring ketone compounds 30, the 5g/L of aminated compounds 1, water surplus.The pre- preserved material of OSP of the present invention can be initially formed active layer in copper face, accelerate the formation speed that organic guarantor welds film, can increase the thickness more than 20% that organic guarantor welds thickness within the identical reaction time.The pre- preserved material of OSP of the present invention is the higher alkaline pre-preg agent liquid medicine of pH value, it is possible to reduce the corrosion to copper face, reduces the metallic pollution speed of tank liquor, its service life can be made to extend one times；It is also prevented from Jafani effect, it can be ensured that preferably printed circuit board (PCB) outward appearance；The thickness of the intermetallic compound after scolding tin can be reduced, it is ensured that the shear strength and welding spot reliability of plumb joint.
Description
Technical field
Welding technology field is protected the present invention relates to printed circuit board (PCB), and in particular to a kind of pre- preserved material of OSP.
Background technology
Present printed substrate is more and more compact, and circuit is more and more closeer, and the assembling parts Chang Yaofen 3 times in downstream with
Upper assembling, and assemble every time will by a high temperature melt back, and some organic guarantors' weldering films and can not be resistance to more than 3 times high temperature
Melt back, and printed substrate is passed through organic by the gold face of golden finger, chemical nickel and gold weld pad and load board electroplating always for a long time
Solderability preservative（OSP）Discoloration problem puzzlement in golden face after processing, and the intermetallic compound produced through scolding tin（IMC）Layer has fragility, too
Thick intermetallic compound（IMC）Layer can decline the shear strength of plumb joint, cause welding spot reliability to fail.
To solve drawbacks described above, the surface for being typically employed in copper or copper alloy forms the technology that organic guarantor welds film, and early stage is main
If utilizing benzotriazole（benzotriazole）To form film, but various surface mount technologies recently（SMT）Apply in printing
The gradually maturation, and will generally carrying out at high temperature of circuit board, with the lifting of assembling temperature, progressively changes using imidazoles then
Compound（benzimidazole）, such as, using the imidazolium compounds of 2- bit length alkyl groups, its surface treatment method refers to Japanese special
Sharp JP 46-17046 publications, examined patent publication 48-11454 publications, examined patent publication 48-25621 publications, examined patent publication 49-
No. 1983 publications, examined patent publication 58-22545 publications, examined patent publication 61-41988 publications, examined patent publication 61-90492 publications and U.S.
State's patent the 5560785th（1996）Number.
But it is very poor because there is organic guarantor of the imidazolium compounds formation of chain alkyl to weld film heat resistance on 2-, therefore with such
The printed circuit board (PCB) of imidazolium compounds processing, very poor, and above-mentioned the delivered imidazoles become after the solderability after high-temperature process
Compound, molten point is no more than 250 DEG C, therefore its organic coating is unfavorable for lead-free high-temperature and repeatedly assembles processing procedure.
And to there is organic guarantor of the imidazolium compounds formation of chain alkyl to weld film processing procedure on this 2-, can be in printed substrate
The gold face of golden finger, chemical nickel and gold weld pad and load board electroplating grows organic guarantor weldering film of one layer of burgundy, causes golden face to change colour,
Cause problem of appearance, its formation organic film thickness speed is slower, and its intermetallic compound after weld formation（IMC）Thickness compared with
Thickness, therefore the solderability of the printed substrate treated through this inorganic agent is not good, hardly possible ensures the solderability through 3 high temperature melt backs.
U.S. Patent No. 6524644（1999）Number, Enthone companies are proposed with benzimidazole benzimidazole in pH8
The similar patent of the pre- preserved material of the organic solderability preservative of operation under the conditions of~9, works as cosolvent using isopropanol, dissolves benzimidazole, uses
Triisopropanolamine works as corrosion inhibitor, and works as buffer using amine salt such as ammonium acetate, operates pH=8~9.Tank liquor makes in the technology
With restricted lifetime, non-refractory encapsulation procedure, and organic solvent such as alcohols need to be used to work as cosolvent, easily be made under the conditions of pH is relatively low
Into Jafani effect（Galvaniceffect）, it is difficult to ensure preferably printed circuit board (PCB) outward appearance.
The content of the invention
In order to overcome shortcoming and defect present in prior art, it is an object of the invention to provide a kind of pre- preserved material of OSP,
The pre- preserved material of the OSP can be initially formed active layer in copper face, the formation speed that organic guarantor welds film be accelerated, when identical is reacted
It is interior to increase the thickness more than 20% that organic guarantor welds thickness.
The purpose of the present invention is achieved through the following technical solutions：A kind of pre- preserved material of OSP, the pre- preserved material of OSP includes as follows
The raw material of component：
Ring ketone compounds 30-50g/L
Aminated compounds 1-5g/L
Water surplus.
The pre- preserved material of OSP of the present invention can be initially formed active layer in copper face, accelerate the formation speed that organic guarantor welds film,
The thickness more than 20% that organic guarantor welds thickness can be increased within the identical reaction time.
The pre- preserved material of OSP of the present invention is the higher alkaline pre-preg agent liquid medicine of pH value, it is possible to reduce the corrosion to copper face,
The metallic pollution speed of tank liquor is reduced, its service life can be made to extend one times；It is also prevented from Jafani effect, it can be ensured that compared with
Good printed circuit board (PCB) outward appearance；The thickness of the intermetallic compound after scolding tin can be reduced, it is ensured that the shear strength of plumb joint and
Welding spot reliability.
It is preferred that, the ring ketone compounds are ring cyclohexadione compounds.It is more highly preferred to, the ring ketone compounds
Structural formula is：
, wherein n=1-10.
Another preferred, the ring ketone compounds are quinones.It is more highly preferred to, the ring ketone compounds
Chemical name is the naphthoquinones of 2,3- dihydros -1,4.The chemical name of the ring ketone compounds can also be the naphthalene of 3,4- dihydros -1,2
The quinones such as quinone, the anthraquinone of 2,3- dihydros -1,4, the anthraquinone of 3,4- dihydros -1,2 or 9,10- anthraquinones.
It is preferred that, the aminated compounds includes at least one in ethylenediamine, MEA, diethanol amine and triethanolamine
Kind.The present invention is by using aminated compounds, its good buffer effect, it is possible to reduce the corrosion to copper face, reduces the gold of tank liquor
Category pollution speed, can make its service life extend one times.It is more highly preferred to, the aminated compounds is by ethylenediamine and diethanol
Amine compares 1.5-2.5 with weight:The mixture of 1 composition.
It is preferred that, the pre- preserved material of OSP also includes nanometer accelerator 0.1-2g/L, and nanometer accelerator includes nanometer titanium dioxide
At least one of silicon, nano zine oxide, nano-aluminium oxide and nano titanium oxide, the particle diameter of nanometer accelerator is 10-
50nm.The present invention can increase the thickness that organic guarantor welds film by using nanometer accelerator, prevent golden face contaminated and reduction gold
The thickness of compound between category.It is more highly preferred to, the nanometer accelerator is with weight by nano silicon and nano titanium oxide
Amount compares 1:The mixture of 0.8-1.2 compositions.
The present invention is using the pre- preserved material of OSP of nano material, SiO2Etc. nanometer accelerator because electronegativity absorption is quickly heavy
Product generates active membrane in copper face, and the active membrane can obstruct effect of the liquid medicine to Cu faces, and OSP grooves film forming speed can be made to accelerate 20%
More than, i.e., OSP thickness more than 20% can be improved within the same reaction time, it is possible to reduce PCB is welded in pre-preg agent, organic guarantor
Action time in agent liquid medicine.Common drug Water l oad reaches 100m2Cu in tank liquor during/L2+Content uses this hair up to 100ppm
After bright machine solderability preservative pre-preg agent, the Cu in tank liquor in same load2+Content is less than 50ppm.
When there is local golden face on pcb board, using common liquid medicine after organic solderability preservative is handled, Jin Mianshang
The abnormal epithelium of one layer of thin light brown can be grown, although contact resistance will not be still caused during grafting or forceful contact,
But exterior quality but have dropped.Reason is, if golden face is too thin so that thin Kong Eryou occur exposes bottom nickel to the open air in acid condition
Possibility, because in corrosive environment, it may appear that the role of negative electrode is played the part of in golden face, force bottom nickel to play the part of anode role, then produce
Jafani effect, nickel metal melt into nickel ion, by the copper ion caused in solution, synchronously reduction is deposited two electronics dished out
On a gold surface so that golden musculus cutaneus film darkens, or even metal coppery occurs.And the present invention is to grasp in the basic conditions
Make, do not easily cause Jafani effect, it can be ensured that preferably printed circuit board (PCB) outward appearance.
In the present invention, due to SiO2It is attached to etc. nanometer accelerator in the lattice of copper face, makes copper face more smooth, so that table
The reduction of face tension force, can make scolding tin IMC thickness reduce by 30%, you can overcome the IMC layer intrinsic fragility of itself, improve shear strength with
Welding spot reliability.
It is preferred that, the pre- preserved material of OSP also includes inorganic base 0.5-1.5g/L, and inorganic base includes potassium hydroxide, hydroxide
At least one of sodium, sodium carbonate and sodium acid carbonate.The present invention can improve the molten of ring ketone compounds by using inorganic base
Xie Du.It is more highly preferred to, the inorganic base is with weight to compare 2-4 by sodium hydroxide and sodium carbonate:The mixture of 1 composition.
It is preferred that, the pre- preserved material of OSP also include metal salt 0.05-0.2g/L, metal salt include copper sulphate, copper nitrate,
Copper acetate, copper chloride, stannous chloride, cupric oxide, iron chloride, frerrous chloride, ferric sulfate, ferrous sulfate, zinc formate and zinc acetate
At least one of.The present invention is conducive to film forming and improves heat resistance by metal salt.It is more highly preferred to, the metal salt is
By copper chloride, iron chloride and zinc acetate with weight ratio 1:0.5-1.5:1.6-2.4 the mixture of composition.
It is preferred that, the pre- preserved material of OSP also includes halide 0.5-2g/L, and halide includes ammonium bromide, ammonium chloride, iodate
At least one of ammonium, sodium bromide, sodium chloride and sodium iodide.It is more highly preferred to, the halide is by ammonium chloride and sodium chloride
1.4-2.2 is compared with weight:The mixture of 1 composition.
The preparation method of the pre- preserved material of OSP of the present invention is：After whole raw materials are mixed, stir, OSP preimpregnation is made
Agent.
It is a kind of to weld film forming method using the above-mentioned organic guarantor for having the pre- preserved material of OSP, comprise the following steps：
（1）With acid or alkaline cleaning fluid processing printed circuit board (PCB), to remove the greasy dirt and other pollutants of copper face；
（2）After being cleaned with water, then the micro-corrosion liquid through sulfuric acid or hydrogen peroxide is roughened copper face, and film is welded in copper to lift organic guarantor
The adhesive force in face；
（3）Copper face after microetch washes the micro-corrosion liquid of residual in 5%-10% dilute sulfuric acid；
（4）Dried up after being cleaned again through water with cold air, be then placed in above-mentioned pre- infusion solutions and handled at a temperature of 25 DEG C
25s；
（5）Dried up after being cleaned again through water with cold air, be then placed in organic guarantor's weldering main liquid of film and handled at a temperature of 38 DEG C
60s, so that copper face forms in uniform thickness protect and welds film；The main liquid composition of organic guarantor weldering film comprising 5.0% weight than 2- n-heptyls
Benzimidazole, 20% weight than acetic acid, 0.2% weight than caproic acid and 0.8% weight sodium ethylene diamine tetracetate；
（6）Printed circuit board (PCB) after being dried up with cold air is cleaned through deionized water, after drying, that is, completes organic guarantor's weldering film
Processing procedure.
The Applicable temperature of the pre- preserved material of OSP of the present invention is 20-35 DEG C, and it is 11-13 to be applicable pH value, to obtain appropriate thickness institute
The time needed is 10-50s.It is preferred that, the Applicable temperature of the pre- preserved material of OSP of the invention is 23-27 DEG C；It is 11.5- to be applicable pH value
12.5, it is 20-30s for the time needed for obtaining appropriate thickness.
The beneficial effects of the present invention are：The pre- preserved material of OSP of the present invention can be initially formed active layer in copper face, accelerate
Organic guarantor welds the formation speed of film, can increase the thickness more than 20% that organic guarantor welds thickness within the identical reaction time.
The pre- preserved material of OSP of the present invention is the higher alkaline pre-preg agent liquid medicine of pH value, it is possible to reduce the corrosion to copper face,
The metallic pollution speed of tank liquor is reduced, its service life can be made to extend one times；It is also prevented from Jafani effect, it can be ensured that compared with
Good printed circuit board (PCB) outward appearance；The thickness of the intermetallic compound after scolding tin can be reduced, it is ensured that the shear strength of plumb joint and
Welding spot reliability.
Embodiment
For the ease of the understanding of those skilled in the art, with reference to embodiment, the present invention is further illustrated, real
The content that the mode of applying is referred to not limitation of the invention.
Embodiment 1
A kind of pre- preserved material of OSP, the pre- preserved material of OSP includes the raw material of following component：
Ring ketone compounds 30g/L
Aminated compounds 1g/L
Water surplus.
The structural formula of the ring ketone compounds is：
, wherein n=1.
The aminated compounds is ethylenediamine.
Embodiment 2
A kind of pre- preserved material of OSP, the pre- preserved material of OSP includes the raw material of following component：
Ring ketone compounds 35g/L
Aminated compounds 2g/L
Water surplus.
The structural formula of the ring ketone compounds is：
, wherein n=2.
The aminated compounds is MEA.
Embodiment 3
A kind of pre- preserved material of OSP, the pre- preserved material of OSP includes the raw material of following component：
Ring ketone compounds 40g/L
Aminated compounds 3g/L
Water surplus.
The structural formula of the ring ketone compounds is：
, wherein n=4.
The aminated compounds is diethanol amine.
Embodiment 4
A kind of pre- preserved material of OSP, the pre- preserved material of OSP includes the raw material of following component：
Ring ketone compounds 40g/L
Aminated compounds 4g/L
Water surplus.
The structural formula of the ring ketone compounds is：
, wherein n=6.
The aminated compounds is triethanolamine.
Embodiment 5
A kind of pre- preserved material of OSP, the pre- preserved material of OSP includes the raw material of following component：
Ring ketone compounds 50g/L
Aminated compounds 5g/L
Water surplus.
The structural formula of the ring ketone compounds is：
, wherein n=10.
The aminated compounds is ethylenediamine.
Embodiment 6
The difference of the present embodiment and above-described embodiment 1 is：
The chemical name of the ring ketone compounds is the naphthoquinones of 2,3- dihydros -1,4.
The aminated compounds is with weight to compare 1.5 by ethylenediamine and diethanol amine:The mixture of 1 composition.
Embodiment 7
The difference of the present embodiment and above-described embodiment 2 is：
The chemical name of the ring ketone compounds is the naphthoquinones of 3,4- dihydros -1,2.
The aminated compounds is with weight to compare 1.8 by ethylenediamine and diethanol amine:The mixture of 1 composition.
Embodiment 8
The difference of the present embodiment and above-described embodiment 3 is：
The chemical name of the ring ketone compounds is the anthraquinone of 2,3- dihydros -1,4.
The aminated compounds is with weight to compare 2 by ethylenediamine and diethanol amine:The mixture of 1 composition.
Embodiment 9
The difference of the present embodiment and above-described embodiment 4 is：
The chemical name of the ring ketone compounds is the anthraquinone of 3,4- dihydros -1,2.
The aminated compounds is with weight to compare 2.2 by ethylenediamine and diethanol amine:The mixture of 1 composition.
Embodiment 10
The difference of the present embodiment and above-described embodiment 5 is：
The chemical name of the ring ketone compounds is 9,10- anthraquinones.
The aminated compounds is with weight to compare 2.5 by ethylenediamine and diethanol amine:The mixture of 1 composition.
Embodiment 11
The difference of the present embodiment and above-described embodiment 1 is：
The pre- preserved material of OSP also includes nanometer accelerator 0.1g/L, and nanometer accelerator is by nano silicon and nanometer
Titanium dioxide compares 1 with weight:The mixture of 0.8 composition, the particle diameter of nanometer accelerator is 10nm.
The pre- preserved material of OSP also includes inorganic base 0.5g/L, and inorganic base is with weight ratio 2 by sodium hydroxide and sodium carbonate:1
The mixture of composition.
The pre- preserved material of OSP also includes metal salt 0.05g/L, and metal salt is with weight by copper chloride, iron chloride and zinc acetate
Amount compares 1:0.5:The mixture of 1.6 compositions.
The pre- preserved material of OSP also includes halide 0.5g/L, and halide is with weight ratio 1.4 by ammonium chloride and sodium chloride:1
The mixture of composition.
Embodiment 12
The difference of the present embodiment and above-described embodiment 2 is：
The pre- preserved material of OSP also includes nanometer accelerator 0.5g/L, and nanometer accelerator is by nano silicon and nanometer
Titanium dioxide compares 1 with weight:The mixture of 0.9 composition, the particle diameter of nanometer accelerator is 20nm.
The pre- preserved material of OSP also includes inorganic base 0.8g/L, and inorganic base is with weight ratio by sodium hydroxide and sodium carbonate
2.5:The mixture of 1 composition.
The pre- preserved material of OSP also includes metal salt 0.1g/L, and metal salt is with weight by copper chloride, iron chloride and zinc acetate
Than 1:0.8:The mixture of 1.8 compositions.
The pre- preserved material of OSP also includes halide 1g/L, and halide is with weight ratio 1.6 by ammonium chloride and sodium chloride:1 group
Into mixture.
Embodiment 13
The difference of the present embodiment and above-described embodiment 3 is：
The pre- preserved material of OSP also includes nanometer accelerator 1g/L, and nanometer accelerator is by nano silicon and nanometer two
Titanium oxide compares 1 with weight:The mixture of 1 composition, the particle diameter of nanometer accelerator is 30nm.
The pre- preserved material of OSP also includes inorganic base 1g/L, and inorganic base is with weight ratio 3 by sodium hydroxide and sodium carbonate:1 group
Into mixture.
The pre- preserved material of OSP also includes metal salt 0.12g/L, and metal salt is with weight by copper chloride, iron chloride and zinc acetate
Amount compares 1:1:The mixture of 2 compositions.
The pre- preserved material of OSP also includes halide 1.2g/L, and halide is with weight ratio 1.8 by ammonium chloride and sodium chloride:1
The mixture of composition.
Embodiment 14
The difference of the present embodiment and above-described embodiment 4 is：
The pre- preserved material of OSP also includes nanometer accelerator 1.5g/L, and nanometer accelerator is by nano silicon and nanometer
Titanium dioxide compares 1 with weight:The mixture of 0.8-1.2 compositions, the particle diameter of nanometer accelerator is 40nm.
The pre- preserved material of OSP also includes inorganic base 1.2g/L, and inorganic base is with weight ratio by sodium hydroxide and sodium carbonate
3.5:The mixture of 1 composition.
The pre- preserved material of OSP also includes metal salt 0.15g/L, and metal salt is with weight by copper chloride, iron chloride and zinc acetate
Amount compares 1:1.2:The mixture of 2.2 compositions.
The pre- preserved material of OSP also includes halide 1.5g/L, and halide is with weight ratio 2 by ammonium chloride and sodium chloride:1 group
Into mixture.
Embodiment 15
The difference of the present embodiment and above-described embodiment 5 is：
The pre- preserved material of OSP also includes nanometer accelerator 2g/L, and nanometer accelerator is by nano silicon and nanometer two
Titanium oxide compares 1 with weight:The mixture of 1.2 compositions, the particle diameter of nanometer accelerator is 10-50nm.
The pre- preserved material of OSP also includes inorganic base 1.5g/L, and inorganic base is with weight ratio 4 by sodium hydroxide and sodium carbonate:1
The mixture of composition.
The pre- preserved material of OSP also includes metal salt 0.2g/L, and metal salt is with weight by copper chloride, iron chloride and zinc acetate
Than 1:1.5:The mixture of 2.4 compositions.
The pre- preserved material of OSP also includes halide 2g/L, and halide is with weight ratio 2.2 by ammonium chloride and sodium chloride:1 group
Into mixture.
Above-described embodiment is the present invention preferably implementation, and in addition, the present invention can be realized with other manner,
Any obvious replacement is within protection scope of the present invention on the premise of not departing from present inventive concept.
Claims (5)
1. a kind of pre- preserved material of OSP, it is characterised in that：The pre- preserved material of OSP includes the raw material of following component：
Ring ketone compounds 30-50g/L
Aminated compounds 1-5g/L
Water surplus；
The structural formula of the ring ketone compounds is：
, wherein n=1-10；
Or, the chemical name of the ring ketone compounds is 2,3- dihydros-Isosorbide-5-Nitrae naphthoquinones；
The aminated compounds is ethylenediamine.
2. the pre- preserved material of a kind of OSP according to claim 1, it is characterised in that：The pre- preserved material of OSP also includes nanometer and promoted
Agent 0.1-2g/L, nanometer accelerator includes nano silicon, nano zine oxide, nano-aluminium oxide and nano titanium oxide
At least one of, the particle diameter of nanometer accelerator is 10-50nm.
3. the pre- preserved material of a kind of OSP according to claim 1, it is characterised in that：The pre- preserved material of OSP also includes inorganic base
0.5-1.5g/L, inorganic base includes at least one of potassium hydroxide, sodium hydroxide, sodium carbonate and sodium acid carbonate.
4. the pre- preserved material of a kind of OSP according to claim 1, it is characterised in that：The pre- preserved material of OSP also includes metal salt
0.05-0.2g/L, metal salt includes copper sulphate, copper nitrate, copper acetate, copper chloride, stannous chloride, cupric oxide, iron chloride, chlorination
At least one of ferrous iron, ferric sulfate, ferrous sulfate, zinc formate and zinc acetate.
5. the pre- preserved material of a kind of OSP according to claim 1, it is characterised in that：The pre- preserved material of OSP also includes halide
0.5-2g/L, halide includes at least one of ammonium bromide, ammonium chloride, ammonium iodide, sodium bromide, sodium chloride and sodium iodide.
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| CN110254025B (en) * | 2019-07-17 | 2021-01-15 | 江西省航宇新材料股份有限公司 | Copper-clad plate production treatment process |
| CN112492770B (en) * | 2020-11-24 | 2022-03-01 | 绍兴德汇半导体材料有限公司 | OSP (organic solderability preservative) processing method applied to copper-clad ceramic substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS6298792A (en) * | 1985-10-25 | 1987-05-08 | 旭化成株式会社 | Flexible printed circuit substrate |
| TW200609381A (en) * | 2004-09-07 | 2006-03-16 | Formochem Technology Co Ltd | Composition for formining a chemical layer on surfaces of copper and copper alloys |
| CN101508051A (en) * | 2009-03-11 | 2009-08-19 | 林原标 | Organic solderability preservative pre-soaking treating agent and organic solderability preservation film forming method |
| CN101982288B (en) * | 2010-09-30 | 2013-04-24 | 深圳市成功科技有限公司 | Organic copper solderability preservative having selective film forming function and use method thereof |
| WO2012043764A1 (en) * | 2010-09-30 | 2012-04-05 | 日立化成工業株式会社 | Adhesive composition, method for manufacturing semiconductor device, and semiconductor device |
| CN102199763B (en) * | 2011-04-01 | 2012-09-05 | 广东工业大学 | Preparation method for electroless plating activator capable of screen printing, and activating treatment process using same |
| CN102766874A (en) * | 2012-08-20 | 2012-11-07 | 合肥奥福表面处理科技有限公司 | Organic solderability preservative (OSP) protective agent for copper surfaces |
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