CN108100987A - A kind of placement tray that circuit board placement is used for suitable for constraint circle sealed in unit - Google Patents
A kind of placement tray that circuit board placement is used for suitable for constraint circle sealed in unit Download PDFInfo
- Publication number
- CN108100987A CN108100987A CN201711352837.2A CN201711352837A CN108100987A CN 108100987 A CN108100987 A CN 108100987A CN 201711352837 A CN201711352837 A CN 201711352837A CN 108100987 A CN108100987 A CN 108100987A
- Authority
- CN
- China
- Prior art keywords
- placement
- circuit board
- placement tray
- placing groove
- material returned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coating Apparatus (AREA)
Abstract
The present invention relates to sensor production apparatus fields, and specifically for a kind of constraint circle sealed in unit that is suitable for for the placement tray that circuit board is placed, the placement tray includes placement tray body, is equipped with to place the placing groove of circuit board on placement tray body；The placing groove is identical with circuit board size.The present invention is suitable for constraint circle sealed in unit, passes through the design of placement tray so that needs the circuit board for being adhered constraint circle can be there are one riding position, while the present invention has additional material returned component, and circuit board is facilitated to depart from from placing groove.
Description
Technical field
The present invention relates to sensor production apparatus fields, and specifically a kind of constraint circle sealed in unit that is suitable for is for electricity
The placement tray that road plate is placed.
Background technology
During package structure of MEMS device packaging technology is realized, chip can be protected using constraint circle after D/B and W/B, tradition is viscous
Technique is pasted using manual or semi-automatic realization, low production efficiency, the uniformity of machining accuracy can not ensure, and glue quantity can not obtain
It to effective control, and then can cause quality problems occur in product paste process, influence sensor service life；So a kind of energy
The equipment of enough automatic adhesion constraint circles is now required.
The content of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of for being adhered the installing of the automatic sealing package of constraint circle
It is standby.
To achieve these goals, the technical solution adopted by the present invention is：
A kind of placement tray that circuit board placement is used for suitable for constraint circle sealed in unit, the placement tray include placing
Tray body is equipped with to place the placing groove of circuit board on placement tray body；The placing groove and circuit board size phase
Together.
The placing groove is set through placement plate, positive stop strip rib is equipped on placing groove lower end inner wall, in the placing groove
Equipped with for placing the placement plate of circuit board.
The placement tray further includes the material returned group being adapted with placement tray body for the placing groove interior circuit board material returned
Part.
The material returned component includes material returned disk, and material returned column, each material returned column and a placement are equipped on material returned disk
Slot is corresponding.
The advantage of the invention is that：
The present invention is suitable for constraint circle sealed in unit, passes through the design of placement tray so that need to be adhered the electricity of constraint circle
Road plate can be there are one riding position, while the present invention has additional material returned component, and circuit board is facilitated to depart from from placing groove.
Description of the drawings
Below to each width attached drawing of description of the invention expression content and figure in mark be briefly described：
Fig. 1 is the structural diagram of the present invention.
Fig. 2 is the installation diagram of the present invention.
Fig. 3 is the structure diagram of glue system in sealed in unit of the present invention.
Mark in above-mentioned figure is：
1st, pedestal is detected, 2, feeding device, 3, gripping body, 4, coordinate locating mechanism, 5, placement tray, 6, placing groove,
7th, holding box, 8, glue scraping plate, 9, glue system, 51, material returned disk, 52, material returned column, 61, placement plate, 62, positive stop strip rib, 901, branch
Support, 902, support plate, 903, poly-bag, 904, disk roller.
Specific embodiment
Below against attached drawing, by the description to optimum embodiment, the specific embodiment of the present invention is made further detailed
Thin explanation.
One kind is for sensor assembly constraint circle sealed in unit, and sealed in unit includes support base 1, in support base 1
Equipped with coordinate locating mechanism 4, coordinate locating mechanism 4 is equipped with to clamp the gripping body 3 of constraint circle, in support base 1
Equipped with the feeding device 2 for feeding；It is equipped with to hold the apparatus for placing of glue and in support base in support base 1
1 is equipped with to place the placement tray 5 of circuit board；Sensor assembly is exactly sensor chip in the present invention；In the present invention about
Beam circle is the frame of rectangular cross-section, and for being socketed in the periphery of circuit board chip, chip size is less than frame size, and frame is
It is made of four side plates, frame ends are adhered on circuit boards, play the role of circuit board chip, and encapsulation disclosed by the invention is set
It is standby to include coordinate locating mechanism 4, it is the first slide being mainly just provided in support base 1 using the prior art here,
First slide is equipped with the first adjustable plate, and the second slide is equipped on the first adjustable plate, and second is equipped on the second slide and is adjusted
Plate is equipped with the 3rd slide on the second adjustable plate vertical direction, the 3rd adjustable plate is equipped on the 3rd slide, in the 3rd adjustable plate
It is equipped with gripping body 3；First slide perpendicular to the second slide, the second slide perpendicular to the 3rd slide, by the first adjustable plate,
Second adjustable plate and the 3rd adjustable plate move in respective rail, can realize the adjusting to 3 position of gripping body, more than institute
State a kind of simply simple coordinate locating mechanism 4, it is therefore an objective to adjust the relative position of gripping body 3, certainly it is some other can
The coordinate locating mechanism 4 for adjusting gripping body 3 is also what can be used, and which is not described herein again, while on coordinate locating mechanism 4
Corresponding position it is definite by being programmed to accordingly, these are all known technologies, are clear here；This hair simultaneously
Gripping body 3 disclosed in bright includes the propulsion cylinder being arranged on the 3rd adjustable plate, and propulsion cylinder end is connected with clamping gas
Cylinder by the movement of propulsion cylinder, can realize that gripping body 3 moves up and down, and the setting of clamping cylinder is used for the folder of constraint circle
It holds；And feeding device 2 is also known technology in the present invention, can be retrieved on Baidupedia, be called vibrating disk, is vibrated
Disk is the auxiliary feeder equipment of a kind of automatic assembling or automatic processing machine, abbreviation component feed device；Vibrating disk operation principle:
Frequency converter, motor realize automatic transport effect, have a impulse mgnet below vibrating disk hopper, hopper can be made to make Vertical Square
To vibration, by inclined spring leaf hopper is driven to rock vibration around its vertical axis；Part in hopper, due to being subject to this vibration
And rise along helical orbit；A series of screening by tracks or attitudes vibration, part can be according to during rising
The requirement that assembling is either processed is in unified state automatically into assembling or Working position；The purpose of its work is by vibrating nothing
Sequence workpiece automatic order align it is neat, be transported to next procedure exactly；So the feeding device 2 that the present invention uses is also
Known technology, so also repeating no more here；The present invention also includes setting in support base 1 except more than structure in of the invention
The apparatus for placing put and the placement tray 5 set in support base 1, the setting of apparatus for placing can provide placement for glue
Place, placement tray 5 provide place for the placement of circuit board, and apparatus for placing includes being arranged on support base 1 in the present invention
On the holding box 7 that is assemblied to form by multiple side plates；Holding box 7 includes Bottom of box body, divides on the opposite two sides of Bottom of box body
It does not set there are one horizontal side plate, two horizontal side plates are arranged in parallel, and two horizontal side ends are connected respectively by longitudinal side plate
It connects, longitudinal side plate surrounds a rectangular in cross-section with horizontal side plate and has the box body of bottom plate；The setting of holding box 7 can be used for
Glue is held, the follow-up gripping of gripping body 3 constraint circle is facilitated to be glued at holding box 7 and takes glue, and placement tray 5 wraps in the present invention
5 body of placement tray is included, is equipped with to place the placing groove 6 of circuit board on 5 body of placement tray；Placing groove 6 and circuit board
Size is identical, and the placement for being arranged to circuit board of placement tray 5 provides place, and the circuit board fixation that is arranged to of placing groove 6 carries
Basis is supplied；As the preferred of bigger, increase wide angle camera in setting disclosed by the invention, wide angle camera is connected with detection identification
System, preferably realizes the positioning of placing groove 6 on placement tray 5, preferably realizes the assembling to constraint circle；Simultaneously in order to real-time
The operation of control device further includes master regulation system in the present invention, and each portion is controlled by the controller in master regulation system
The running of part；Microcontroller may be employed in controller；To sum up, the setting of more than structure is passed through so that the present invention can replace artificial
Operations specific realizes mechanization production, can monitor power and displacement in real time, constraint circle installation accuracy is effectively ensured, is provided simultaneously with glue
Water automatic compensation function, instead of traditional dispensing mode, in addition more effective control constraints circle paste process switches different model rule
Lattice product is woth no need to replacing positioning fixture, it is only necessary to change respective stored degree and corresponding placement tray 5, operation letter
It is single.
As preference, 7 inner wall of holding box is equipped with that glue is avoided to remain on 7 inner wall of holding box in the present invention
Glass plate；Being provided with beneficial to the glue on cleaning 7 inner wall of holding box for glass plate, is conducive to the cleaning of holding box 7.
As preference, the glue scraping plate 8 for frictioning is equipped in the present invention in holding box 7；Glue scraping plate 8 is vertically and holding box
7 bottom surfaces are set；8 both ends of glue scraping plate fit respectively with 7 inner wall of holding box, and glue scraping plate 8 moves back and forth, and can realize to holding box
The cleaning of 7 inner wall glues.
As preference, apparatus for placing further includes to add the glue system 9 of glue in the present invention；Glue system 9 is wrapped
It includes to detect the detecting system of glue surplus in holding box 7 and puts colloid system for glue；Putting colloid system includes holding glue
The poly-bag 903 of liquid, adhesive tape are connected to by support member in support base 1, and support member includes supporting rack 901, in supporting rack
901 tops are equipped with to place the support plate 902 of poly-bag 903, and support plate 902 is equipped with to squeeze the disk roller of poly-bag 903
904；Detecting system includes detection module and the control module for receiving detection module signal, and control module is connected with execution
Module；By movement of the disk roller 904 in support plate 902, disk roller 904 and the interaction of support plate 902 can realize glue
Glue in bag 903 squeezes out, and the glue of extrusion drops in holding box 7, for supplementing the glue in holding box 7；And in this hair
Further include detecting system in bright, detection module using sensor or some close to the device of Switch, detection module can use
The height of glue is detected, when detection module detects that glue is reduced in holding box 7, detection module delivers a signal to control mould
Block, control module control are lived glue system 9 and are opened, and then realize the glue operation to holding box 7.
It sets through placement plate 61 as preference, the present invention summarizes placing groove 6, is equipped on 6 lower end inner wall of placing groove
Positive stop strip rib 62, is equipped with to place the placement plate 61 of circuit board in placing groove 6, placing groove 6 of the present invention similar to straight slot setting,
Facilitate the use of cooperation material returned component, and positive stop strip rib 62 can be come off with /V placement plate 61 from placing groove 6, placement plate 61 can
To be used for supporting circuit board；In order to facilitate the circuit board material returned, placement tray 5 further includes and 5 body phase of placement tray in the present invention
It is adapted for the material returned component of the 6 interior circuit board material returned of placing groove；Material returned component includes material returned disk 51, is equipped with and moves back on material returned disk 51
Stock column 52, each material returned column 52 are corresponding with a placing groove 6；The placement tray 5 that constraint circle has been adhered during use is placed in and moves back
Expect on component, the impetus of material returned component causes circuit board to depart from from placing groove 6, and then realizes the de- material of placement tray 5
Operation.
A kind of application method for sensor assembly constraint circle sealed in unit, application method include the following steps：(1) open
Moving constraint circle sealed in unit；
(2) constraint circle is launched in feeding device 2, circuit board is placed in 5 placing groove 6 of placement tray；
(3) coordinate locating mechanism 4 is started, by the movement of coordinate locating mechanism 4, drive is connected to coordinate locating mechanism 4
On gripping body 3 be moved to the top of feeding device 2, gripping body 3 starts one constraint circle of gripping；
(4) after the completion of step (3), then moved by coordinate locating mechanism 4, drive the constraint circle movement on gripping body 3
To 7 top of holding box, gripping body 3 starts, and constraint circle is driven to move down so that constraint circle lower face, which is glued, takes glue, viscous to take glue
Afterwards, 3 return of gripping body；
(5) after the completion of step (4), coordinate locating mechanism 4 is again started up, and coordinate locating mechanism 4 is moved to 5 phase of placement tray
Above the placing groove answered, restart gripping body 3 at this time, gripping body 3 moves down so that constraint circle is adhered in circuit board corresponding positions
It puts；
(6) after the completion of step (5), a constraint circle is adhered with a circuit board and finishes, and if necessary to repeat to be adhered, repeats
Step (3)-(5).
Obviously present invention specific implementation is not subject to the restrictions described above, as long as employing the methodology and skill of the present invention
The improvement for the various unsubstantialities that art scheme carries out, within protection scope of the present invention.
Claims (4)
1. a kind of placement tray that circuit board placement is used for suitable for constraint circle sealed in unit, which is characterized in that described to place support
Disk includes placement tray body, is equipped with to place the placing groove of circuit board on placement tray body；The placing groove and electricity
Road board size is identical.
2. a kind of placement tray that circuit board placement is used for suitable for constraint circle sealed in unit according to claim 1,
It is characterized in that, the placing groove is set through placement plate, positive stop strip rib is equipped on placing groove lower end inner wall, in the placing groove
Equipped with for placing the placement plate of circuit board.
3. a kind of placement tray that circuit board placement is used for suitable for constraint circle sealed in unit according to claim 1,
It is characterized in that, the placement tray further includes the material returned group being adapted with placement tray body for the placing groove interior circuit board material returned
Part.
4. a kind of placement tray that circuit board placement is used for suitable for constraint circle sealed in unit according to claim 3,
It is characterized in that, the material returned component includes material returned disk, and material returned column, each material returned column and a placement are equipped on material returned disk
Slot is corresponding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711352837.2A CN108100987A (en) | 2017-12-15 | 2017-12-15 | A kind of placement tray that circuit board placement is used for suitable for constraint circle sealed in unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711352837.2A CN108100987A (en) | 2017-12-15 | 2017-12-15 | A kind of placement tray that circuit board placement is used for suitable for constraint circle sealed in unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108100987A true CN108100987A (en) | 2018-06-01 |
Family
ID=62216376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711352837.2A Pending CN108100987A (en) | 2017-12-15 | 2017-12-15 | A kind of placement tray that circuit board placement is used for suitable for constraint circle sealed in unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108100987A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2505200Y (en) * | 2001-09-25 | 2002-08-14 | 恩德科技股份有限公司 | Material-returning device for forming machine of printed circuit board |
| CN1857969A (en) * | 2006-05-29 | 2006-11-08 | 友达光电股份有限公司 | Plate bearing tray |
| CN201008234Y (en) * | 2007-02-15 | 2008-01-16 | 李炳蔚 | Mounting structure for a pressure sensor on the circuit board |
| CN101742821A (en) * | 2008-11-24 | 2010-06-16 | 华通电脑股份有限公司 | Circuit board bearing device and application method thereof |
| CN102501229A (en) * | 2011-10-12 | 2012-06-20 | 幸星(南京)数码有限公司 | Tray for circuit board and use method thereof |
| CN202295765U (en) * | 2011-10-12 | 2012-07-04 | 幸星(南京)数码有限公司 | Circuit board tray with crossed grooves |
| US20140167243A1 (en) * | 2012-12-13 | 2014-06-19 | Yuci Shen | Semiconductor packages using a chip constraint means |
| CN104439610A (en) * | 2014-12-03 | 2015-03-25 | 镇江市中协电气有限公司 | Automatic material returning device |
| CN206014430U (en) * | 2016-08-25 | 2017-03-15 | 金堆城钼业股份有限公司 | A kind of voluminous powder extrusion die |
| CN107204293A (en) * | 2016-03-16 | 2017-09-26 | 东芝存储器株式会社 | The manufacture method and semiconductor device of semiconductor device |
-
2017
- 2017-12-15 CN CN201711352837.2A patent/CN108100987A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2505200Y (en) * | 2001-09-25 | 2002-08-14 | 恩德科技股份有限公司 | Material-returning device for forming machine of printed circuit board |
| CN1857969A (en) * | 2006-05-29 | 2006-11-08 | 友达光电股份有限公司 | Plate bearing tray |
| CN201008234Y (en) * | 2007-02-15 | 2008-01-16 | 李炳蔚 | Mounting structure for a pressure sensor on the circuit board |
| CN101742821A (en) * | 2008-11-24 | 2010-06-16 | 华通电脑股份有限公司 | Circuit board bearing device and application method thereof |
| CN102501229A (en) * | 2011-10-12 | 2012-06-20 | 幸星(南京)数码有限公司 | Tray for circuit board and use method thereof |
| CN202295765U (en) * | 2011-10-12 | 2012-07-04 | 幸星(南京)数码有限公司 | Circuit board tray with crossed grooves |
| US20140167243A1 (en) * | 2012-12-13 | 2014-06-19 | Yuci Shen | Semiconductor packages using a chip constraint means |
| CN104439610A (en) * | 2014-12-03 | 2015-03-25 | 镇江市中协电气有限公司 | Automatic material returning device |
| CN107204293A (en) * | 2016-03-16 | 2017-09-26 | 东芝存储器株式会社 | The manufacture method and semiconductor device of semiconductor device |
| CN206014430U (en) * | 2016-08-25 | 2017-03-15 | 金堆城钼业股份有限公司 | A kind of voluminous powder extrusion die |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180601 |
|
| RJ01 | Rejection of invention patent application after publication |