CN108012509A - A kind of double-face integral formula radiator and its processing technology - Google Patents
A kind of double-face integral formula radiator and its processing technology Download PDFInfo
- Publication number
- CN108012509A CN108012509A CN201711428014.3A CN201711428014A CN108012509A CN 108012509 A CN108012509 A CN 108012509A CN 201711428014 A CN201711428014 A CN 201711428014A CN 108012509 A CN108012509 A CN 108012509A
- Authority
- CN
- China
- Prior art keywords
- gear piece
- upper substrate
- infrabasal plate
- substrate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of double-face integral formula radiator, it includes upper substrate（2）And infrabasal plate（3）, the upper substrate（2）Bottom and along its length integrally formed with multiple upper gear pieces（4）, infrabasal plate（3）Top and along its length integrally formed with multiple lower gear pieces（5）, upper substrate（2）Parallel to infrabasal plate（3）Set, and upper substrate（2）With infrabasal plate（3）Between be welded with two side plates（6）, two side plates（6）Positioned at the both sides of gear piece, upper gear piece（4）With lower gear piece（5）Between reserve have the gap；It also discloses processing technology.The beneficial effects of the invention are as follows：It is compact-sized, without thermal resistance, heat dissipation effect is high, take without mould, manufacturing process is simple.
Description
Technical field
The present invention relates to the technical field of heat spreader structures, particularly a kind of double-face integral formula radiator and its processing work
Skill.
Background technology
In recent years, with scientific technological advance, easily mobile technology, 5G mobile communication, intelligent LED street lamp, industry 4.0
Change starts, Internet of Things sustainable development, everybody available technology such as new-energy automobile technology, allow the life of people it is more convenient,
Safety and environmental protection.High-reliability semiconductor power device product is just towards miniaturization, highly integrated, high speed, high-effect, high power
Direction is developed, these semiconductor devices are inevitably produced than more heat before, if the heat dissipation problem of semiconductor devices
Do not resolve, high temperature will result directly in the decline of semiconductor devices efficiency；To stablize the efficiency of semiconductor devices, semiconductor device
The heat dissipation design of part becomes of crucial importance, and otherwise equipment performance can not be improved or can not worked normally.
As depicted in figs. 1 and 2, convolution radiator is by several pieces engagement heat sinks by connecing for the structure of engagement type radiator
Mixture bonding forms, and the line for engaging the upper end of heat sink forms upper heat sink, engages the line structure of the bottom of heat sink
Into lower heat sink.The manufacture of engagement type radiator is first to close multiple engagement heat sinks by aluminium extrusion with special tooling
And together, cement is recycled to be attached heat dissipation gear piece, when the upper and lower end parts in engagement type radiator install one respectively
After a electronic component or power module 1, the heat transfer of generation is given what is be in contact with it to connect by electronic component or power module
Close on heat sink, the knot not contacted with electronic component or power module will laterally be transferred heat to by then engaging heat sink
Close on heat sink, produce lateral stacking thermal resistance, and it is bigger from electronic component or 1 more remote thermal resistance of power module.In addition also need to
The Aluminum-Extruding Die shaping engagement heat sink, if mould tolerance is big, greatly reduces the performance of heat sink.This outer engagement heat sink it
Between heat-conducting glue compared to other cements it is low, corresponding heat-conductive characteristic also can be poor.
As shown in Figure 3 and Figure 4, the processing technology of gear shaping formula radiator is that gear piece is passed through machine to the structure of gear shaping formula radiator
The mode of tool pressurization is inserted on substrate, although not having any cement between gear piece and substrate, is deposited between gear piece and substrate
In thermal contact resistance, the heat dissipation effect of gear shaping formula radiator is influenced.
The content of the invention
The shortcomings that it is an object of the invention to overcome the prior art, there is provided it is a kind of it is compact-sized, without thermal resistance, heat dissipation effect
It is high, take without mould, the simple double-face integral formula radiator of manufacturing process and its processing technology.
The purpose of the present invention is achieved through the following technical solutions：A kind of double-face integral formula radiator, it includes upper substrate
And infrabasal plate, the bottom of the upper substrate and along its length integrally formed with multiple upper gear pieces, the top and edge of infrabasal plate
Integrally formed with multiple lower gear pieces, upper substrate is set its length direction parallel to infrabasal plate, and is welded between upper substrate and infrabasal plate
Two side plates are connected to, two side plates are located at the both sides of gear piece, reserve and have the gap between upper gear piece and lower gear piece.
The processing technology of the double-face integral formula radiator, it is characterised in that：It comprises the following steps：
S1, be separately formed on the surface of upper substrate and infrabasal plate using forming machine and process gear piece and lower gear piece；
Vertical spacing on S2, adjustment between gear piece and lower gear piece, after being adjusted in place, the weld side between upper substrate and infrabasal plate
Plate；
S3, install electronic component or power module, the heat that electronic component or power module produce at the top of upper substrate
It is directly passed to substrate, the heat on substrate passes to gear piece again, since substrate with gear piece is integrally formed, transmits heat mistake
There is no thermal resistance in journey, and two substrates individually distribute heat.
The present invention has the following advantages：The present invention is compact-sized, takes without thermal resistance, heat dissipation effect height, without mould, manufactures work
Skill is simple.
Brief description of the drawings
Fig. 1 is the structure diagram of engagement type radiator；
Fig. 2 is the front view of engagement type radiator；
Fig. 3 is the structure diagram of gear shaping formula radiator；
Fig. 4 is the front view of gear shaping formula radiator；
Fig. 5 is the structure diagram of the present invention；
Fig. 6 is the front view of the present invention；
In figure, 1- electronic components or power module, 2- upper substrates, 3- infrabasal plates, the upper gear pieces of 4-, gear piece under 5-, 6- side plates.
Embodiment
The present invention will be further described below in conjunction with the accompanying drawings, and protection scope of the present invention is not limited to as described below：
As shown in Fig. 5 ~ 6, a kind of double-face integral formula radiator, it includes upper substrate 2 and infrabasal plate 3, the bottom of the upper substrate 2
And along its length integrally formed with multiple upper gear pieces 4, the top of infrabasal plate 3 and along its length integrally formed with multiple
Lower gear piece 5, upper substrate 2 are set parallel to infrabasal plate 3, and two side plates 6 are welded between upper substrate 2 and infrabasal plate 3, two sides
Plate 6 is located at the both sides of gear piece, reserves and has the gap between upper gear piece 4 and lower gear piece 5.Two side plates 6 are played in support
The effect of substrate 2 and infrabasal plate 3.
The processing technology of the double-face integral formula radiator, it is characterised in that：It comprises the following steps：
S1, be separately formed on the surface of upper substrate 2 and infrabasal plate 3 using forming machine and process gear piece 4 and lower gear piece 5；
Vertical spacing on S2, adjustment between gear piece 4 and lower gear piece 5, after being adjusted in place, is welded between upper substrate 2 and infrabasal plate 3
Connect side plate；
S3, install electronic component or power module 1, the heat that electronic component or power module 1 produce at the top of upper substrate 2
Amount is directly passed to substrate, and the heat on substrate passes to gear piece again, since substrate with gear piece is integrally formed, transmission heat
During there is no thermal resistance, and two substrates individually distribute heat, greatly improve radiating efficiency.In addition, upper gear piece 4 and lower tooth
Piece 5 is respectively shaped on upper substrate 2 and infrabasal plate 3, woth no need to any mould, reduces production cost, and no
What thermal resistance.
The above is only the preferred embodiment of the present invention, it should be understood that the present invention is not limited to described herein
Form, is not to be taken as the exclusion to other embodiment, and can be used for various other combinations, modification and environment, and can be at this
In the text contemplated scope, it is modified by the technology or knowledge of above-mentioned teaching or association area.And those skilled in the art institute into
Capable modifications and changes do not depart from the spirit and scope of the present invention, then all should be in the protection domain of appended claims of the present invention
It is interior.
Claims (2)
- A kind of 1. double-face integral formula radiator, it is characterised in that：It includes upper substrate（2）And infrabasal plate（3）, the upper substrate （2）Bottom and along its length integrally formed with multiple upper gear pieces（4）, infrabasal plate（3）Top and along its length Integrally formed with multiple lower gear pieces（5）, upper substrate（2）Parallel to infrabasal plate（3）Set, and upper substrate（2）With infrabasal plate（3）It Between be welded with two side plates（6）, two side plates（6）Positioned at the both sides of gear piece, upper gear piece（4）With lower gear piece（5）Between be reserved with Gap.
- 2. the processing technology of double-face integral formula radiator according to claim 1, it is characterised in that：It includes following step Suddenly：S1, using forming machine in upper substrate（2）And infrabasal plate（3）Surface on be separately formed and process gear piece（4）And lower tooth Piece（5）；Gear piece on S2, adjustment（4）With lower gear piece（5）Between vertical spacing, after being adjusted in place, in upper substrate（2）And infrabasal plate （3）Between weld side plate；S3, in upper substrate（2）Top installation electronic component or power module（1）, electronic component or power module（1）Production Raw heat is directly passed to substrate, and the heat on substrate passes to gear piece again, since substrate with gear piece is integrally formed, passes Passing during heat does not have thermal resistance, and two substrates individually distribute heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711428014.3A CN108012509A (en) | 2017-12-26 | 2017-12-26 | A kind of double-face integral formula radiator and its processing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711428014.3A CN108012509A (en) | 2017-12-26 | 2017-12-26 | A kind of double-face integral formula radiator and its processing technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108012509A true CN108012509A (en) | 2018-05-08 |
Family
ID=62061329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711428014.3A Pending CN108012509A (en) | 2017-12-26 | 2017-12-26 | A kind of double-face integral formula radiator and its processing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108012509A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905589A (en) * | 2021-10-15 | 2022-01-07 | 湖南恩智测控技术有限公司 | Radiator module suitable for electronic circuit observes and controls field |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090151898A1 (en) * | 2007-12-18 | 2009-06-18 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink |
| CN205066526U (en) * | 2015-10-14 | 2016-03-02 | 四川华力电子有限公司 | Welding radiator |
| CN206472429U (en) * | 2016-11-04 | 2017-09-05 | 潍坊歌尔电子有限公司 | A kind of radiator and a kind of electronic equipment |
-
2017
- 2017-12-26 CN CN201711428014.3A patent/CN108012509A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090151898A1 (en) * | 2007-12-18 | 2009-06-18 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink |
| CN205066526U (en) * | 2015-10-14 | 2016-03-02 | 四川华力电子有限公司 | Welding radiator |
| CN206472429U (en) * | 2016-11-04 | 2017-09-05 | 潍坊歌尔电子有限公司 | A kind of radiator and a kind of electronic equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905589A (en) * | 2021-10-15 | 2022-01-07 | 湖南恩智测控技术有限公司 | Radiator module suitable for electronic circuit observes and controls field |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180508 |
|
| RJ01 | Rejection of invention patent application after publication |