CN203760473U

CN203760473U - System-level LED packaging device

Info

Publication number: CN203760473U
Application number: CN201320838210.9U
Authority: CN
Inventors: 范青青; 李东明; 贾晋
Original assignee: Sichuan Sunfor Light Co Ltd
Current assignee: Sichuan Sunfor Light Co Ltd
Priority date: 2013-12-18
Filing date: 2013-12-18
Publication date: 2014-08-06
Anticipated expiration: 2023-12-18

Abstract

The utility model relates to a system-level LED packaging device (100), comprising a semiconductor substrate (101), an LED chip (102), and a driving module circuit (103). The device is characterized in that the LED chip (102) is disposed on the upper surface of the semiconductor substrate (101), and the driving module circuit (103) is disposed on the lower surface of the semiconductor substrate (101) according to an embedded and flushed manner. The driving module circuit and the LED chip and others are integrated on the upper surface and the lower surface of the semiconductor substrate, an external circuit is not needed, and an LED is directly lightened by alternating current, and the packaging device in high integration density is formed, and volume of the whole system is reduced. The packaging device can have various functions, and can be widely applied in various lamps.

Description

A kind of system-level LED packaging

Technical field

The utility model relates to a kind of LED packaging, especially relates to a kind of system-level LED packaging.

Background technology

In recent years, white light LEDs development rapidly, with advantages such as its energy-saving and environmental protection, life-span length, occupies whole illumination market just gradually, is called as 21 century a new generation's light source.LED application product uses DC driven mostly now, need a power supply changeover device, alternating current is converted to direct current by power supply changeover device, and the introducing of power supply changeover device, first can cause the reduction in LED life-span, secondly can make circuit complexity, volume is excessive, and occupies the inner space that light fixture is very large, be not easy to the design of fitting structure and heat radiation, thereby cause light fixture too large, outside cabling is various, affect the reliability of light fixture and attractive in appearance.And run counter to now semiconductor industry and required by design, technique, made that device is more microminiaturized, the aim of miniaturization.

Patent CN 201904368 U disclose a kind of silicon substrate and have been integrated with the LED surface mounting structure of functional circuit.It,, by LED chip and functional circuit are integrated on the same surface of silicon substrate, can reduce the volume of LED surface mounting structure to a certain extent.But because LED chip and functional circuit are integrated on the same surface of silicon substrate, so the degree that the volume of LED surface mounting structure reduces is limited, can not maximizedly reduce the volume of LED packaging.

Utility model content

For the problems referred to above, the utility model provides the system-level LED packaging of the microminiaturization of a kind of LED of realization packaging, miniaturization.

The utility model discloses a kind of system-level LED packaging, it comprises semiconductor substrate, LED chip and driver module circuit, wherein, described LED chip is arranged at the upper surface of described semiconductor substrate, and described driver module circuit flushes on the lower surface that is arranged at described semiconductor substrate according to setting-in mode.Driver module circuit employing setting-in and the set-up mode flushing are innovations of the present utility model, and it contributes to produce in enormous quantities.An advantage that flushes setting-in is to protect in process of production driver module to avoid mechanical stress and damages; Another advantage is multiple batches ofly to stack, and effectively optimizes memory space.

According to one preferred embodiment, described semiconductor substrate is SOI substrate, silicon substrate or germanium substrate.

Preferred embodiment be provided with groove at the lower surface of described semiconductor substrate according to one, the position of described groove is corresponding to the circuit of described driver module circuit.

According to one preferred embodiment, described driver module circuit comprises and is intended to function element that harmonic wave, efficiency, power factor and/or stroboscopic are controlled.

According to one preferred embodiment, described function element comprises controls IC, resistance R, capacitor C, rectifier bridge and MOSFET.

Preferred embodiment described function element is mounted in the groove of lower surface of described semiconductor substrate according to one, or described function element is directly by circuit interconnection and be integrated in the lower surface inside of described semiconductor substrate.

According to one preferred embodiment, described LED chip is fixed on the upper surface of described semiconductor substrate by surface encapsulation, support row encapsulation or module packaging.

Preferred embodiment on described semiconductor substrate, be provided with through hole according to one, described LED chip is realized and being electrically connected by described through hole with described driver module circuit.

The utility model has the advantage of:

1. the utility model is integrated into driver module circuit etc. and LED chip the upper and lower surface of one block semiconductor substrate, makes that LED packaging is more microminiaturized, miniaturization.

2. the utility model is integrated into driver module circuit etc. and LED chip the upper and lower surface of one block semiconductor substrate, and without outer circuits, directly alternating current is lighted LED, and can have several functions simultaneously, can be widely used in various light fixtures.

3. the utility model adopts silica-base material as LED base plate for packaging, and it has the excellent capacity of heat transmission, can greatly improve the radiating effect of LED packaging, increases the useful life of LED packaging.

Brief description of the drawings

Fig. 1 is the structural representation of system-level LED packaging of the present utility model;

Fig. 2 is the encapsulation schematic diagram of LED chip of the present utility model;

Fig. 3 is the structural representation of another execution mode of the present utility model;

Fig. 4 is the function element schematic diagram being directly integrated on semiconductor substrate of the present utility model.

Reference numerals list:

100: system-level LED packaging

101: semiconductor substrate 102:LED chip 103: driver module circuit

201: control IC 202: resistance R 203: capacitor C

204: rectifier bridge 205:MOSFET

301: groove

Embodiment

Illustrate the utility model below in conjunction with accompanying drawing.

Fig. 1 is the structural representation of system-level LED packaging of the present utility model.Fig. 1 shows the first execution mode of the present utility model.This LED packaging comprises semiconductor substrate 101, LED chip 102 and driver module circuit 103.LED chip 102 is arranged at the upper surface of semiconductor substrate 101.Driver module circuit 103 is arranged at the lower surface of semiconductor substrate 101.

Semiconductor substrate 101 can be SOI substrate, silicon substrate or germanium substrate, can be also other non-metal base plates such as ceramic substrate.Adopt silicon materials to be that as the sharpest edges of LED base plate for packaging it has the excellent capacity of heat transmission.Silicon substrate, with respect to conventional substrate material, has higher thermal conductivity (130W/mK), can provide good heat dispersion for LED product.The thermal coefficient of expansion of silicon is consistent with LED chip material, can ensure reliability and the lifting in life-span in the use of LED product.In addition, silicon based package technique and ic manufacturing process compatibility, be convenient to meet product miniaturization and personalized demand.

LED chip 102 can be fixed on the upper surface of semiconductor substrate 101 by the LED encapsulation technology of the routines such as surface encapsulation, support row encapsulation or module packaging.

The lower surface of semiconductor substrate 101 is provided with groove 301.The circuit of driver module circuit 103 is arranged in groove 301.

Driver module circuit 103 comprises that controlling IC201, resistance R 202, capacitor C 203, rectifier bridge 204 and MOSFET205 etc. can realize the function element to harmonic wave, efficiency, power factor, frequent flashing control.These function element can be fixed in the groove 301 of lower surface of semiconductor substrate 101 by the mode mounting.

On semiconductor substrate 101, be provided with through hole.LED chip 102 can be realized and being electrically connected by through hole with driver module circuit 103.

In this embodiment, can realize according to processing step below the system in package of LED.

First, as shown in Figure 2, carry out die bond, the bonding wire etc. of conventional LED encapsulation technology at the upper surface of silicon substrate, LED chip 102 is fixed on to the upper surface of silicon substrate;

Secondly, design as required a driver module circuit 103 at the lower surface of silicon substrate, on the circuit of driver module circuit 103, set groove 301;

Again, needed driver module circuit 103 control IC201, resistance R 202, capacitor C 203, rectifier bridge 204 and MOSFET205 etc. can be realized the function element of harmonic wave, efficiency, power factor, frequent flashing control is fixed in groove 301 by mounting.

Finally, by the through hole being arranged on silicon substrate, LED chip 102 and driver module circuit 103 are electrically connected.

Fig. 3 is the structural representation of another execution mode of the present utility model.Its main distinction of comparing with above-mentioned the first execution mode is, the function element such as control IC201, resistance R 202, capacitor C 203, rectifier bridge 204 and the MOSFET205 that driver module circuit 103 is required can be according to certain circuit interconnection, are directly integrated in the lower surface inside of semiconductor substrate 101.

For this execution mode, can realize according to processing step below the system in package of LED.

The first, as shown in Figure 4, can directly on silicon substrate, make driver module circuit 103 by IC manufacturing process etc.;

The second, carry out die bond, the bonding wire etc. of conventional LED encapsulation technology at the upper surface of silicon substrate, LED chip 102 is fixed on to the upper surface of silicon substrate.

Above-mentioned two kinds of execution modes all can be realized the integrated of LED chip and function components and parts.Finally reduce device volume, made that LED packaging is more microminiaturized, miniaturization.

Further, can on silicon substrate, prepare LED by direct epitaxial growth GaN material.Silicon, as the substrate of growth LED, has that Lattice Matching is good, thermal conductivity advantages of higher, is desirable LED backing material.Taking silicon substrate as substrate, the LED that grows thereon, and integrated drive electronics, can " single step " realize device growth+encapsulation+assembling, can further improve properties of product and reduce costs.

The utility model has the advantage of:

It should be noted that; above-mentioned specific embodiment is exemplary; under above-mentioned instruction of the present utility model, those skilled in the art can carry out various improvement and distortion on the basis of above-described embodiment, and these improvement or distortion drop in protection range of the present utility model.It will be understood by those skilled in the art that specific descriptions are above in order to explain the purpose of this utility model, not for limiting the utility model.Protection range of the present utility model is limited by claim and equivalent thereof.

Claims

1. a system-level LED packaging (100), it comprises semiconductor substrate (101), LED chip (102) and driver module circuit (103),

It is characterized in that,

Described LED chip (102) is arranged at the upper surface of described semiconductor substrate (101), and described driver module circuit (103) flushes on the lower surface that is arranged at described semiconductor substrate (101) according to setting-in mode.

2. system-level LED packaging according to claim 1 (100), is characterized in that, described semiconductor substrate (101) is SOI substrate, silicon substrate or germanium substrate.

3. system-level LED packaging according to claim 2 (100), it is characterized in that, be provided with groove (301) at the lower surface of described semiconductor substrate (101), the position of described groove (301) is corresponding to the circuit of described driver module circuit (103).

4. system-level LED packaging according to claim 3 (100), is characterized in that, described driver module circuit (103) comprises and is intended to function element that harmonic wave, efficiency, power factor and/or stroboscopic are controlled.

5. system-level LED packaging according to claim 4 (100), is characterized in that, described function element comprises controls IC(201), resistance R (202), capacitor C (203), rectifier bridge (204) and MOSFET(205).

6. according to the system-level LED packaging (100) described in claim 4 or 5, it is characterized in that, described function element is mounted in the groove (301) of lower surface of described semiconductor substrate (101), or described function element is directly by circuit interconnection and be integrated in the lower surface inside of described semiconductor substrate (101).

7. system-level LED packaging according to claim 1 (100), is characterized in that, described LED chip (102) is fixed on the upper surface of described semiconductor substrate (101) by surface encapsulation, support row encapsulation or module packaging.

8. according to the system-level LED packaging (100) one of claim 1 to 7 Suo Shu, it is characterized in that, described semiconductor substrate is provided with through hole on (101), and described LED chip (102) is realized and being electrically connected by described through hole with described driver module circuit (103).