CN204375748U - A kind of COB encapsulation module of many glasss of polychromes - Google Patents
A kind of COB encapsulation module of many glasss of polychromes Download PDFInfo
- Publication number
- CN204375748U CN204375748U CN201420766101.5U CN201420766101U CN204375748U CN 204375748 U CN204375748 U CN 204375748U CN 201420766101 U CN201420766101 U CN 201420766101U CN 204375748 U CN204375748 U CN 204375748U
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- China
- Prior art keywords
- mug
- cuvette
- cup
- polychromes
- many glasss
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 56
- 239000003292 glue Substances 0.000 claims abstract description 33
- 238000001746 injection moulding Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 10
- 238000007639 printing Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 238000001459 lithography Methods 0.000 claims description 2
- 239000002991 molded plastic Substances 0.000 claims description 2
- 239000002002 slurry Substances 0.000 claims description 2
- PLXMOAALOJOTIY-FPTXNFDTSA-N Aesculin Natural products OC[C@@H]1[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)[C@H]1Oc2cc3C=CC(=O)Oc3cc2O PLXMOAALOJOTIY-FPTXNFDTSA-N 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 5
- 238000000605 extraction Methods 0.000 abstract description 5
- 230000004075 alteration Effects 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model relates to a kind of COB encapsulation module of many glasss of polychromes, specifically, by injection moulding arrange on circuit boards according to design module shape group two or more multiple mug together, two or more multiple cuvette is set in mug, form many glasss of COB and encapsulate wiring board, then be unit with mug, can according to a kind of coloured light of a mug, class wrapper is divided by LED chip, same chip is encapsulated in the cuvette of same mug, corresponding coloured light requires to drip encapsulation glue or the encapsulation glue containing fluorescent material, encapsulation glue in each mug exceedes each cuvette rim of a cup of the inside, and connect together after covering each cuvette rim of a cup, each cuvette in mug is entirely covered by glue to the eye and hides, and the rim of a cup between mug separates the glue in each mug, form a kind of COB encapsulation module of many glasss of polychromes.The utility model is by arranging cuvette inside mug, adopt many glasss of encapsulation of cup in cup, both the object that many glasss of light extraction efficiencies are high had been reached, overcome again and between conventional many glasss of encapsulation cups and cup, to have obvious luminous point and the larger defect of aberration, adopt with mug is unit simultaneously, different mugs is packaged into different coloured light, meets the demand of market to polychromatic light alternative types product.
Description
Technical field
The utility model relates to LED circuit substrate and LED decorations lighting field, is specifically related to a kind of COB encapsulation module of many glasss of polychromes.
Background technology
No matter many glasss of now all on the market COB circuit substrates are the cups that injection moulding is formed, the cup that box dam is formed, or the cup that punching press is formed, its each cup is too large, and the light that chip sends can not get effective head-on reflection, light extraction efficiency is low, and need glue and fluorescent material many, cost is high.
In order to overcome above defect and deficiency, the utility model arranges the module shape group two or more multiple mug together according to design on circuit boards by injection moulding, two or more multiple cuvette is set in mug, take mug as unit, can according to a kind of coloured light of a mug, class wrapper is divided by LED chip, same chip is encapsulated in the cuvette of same mug, corresponding coloured light requires to drip encapsulation glue or the encapsulation glue containing fluorescent material, encapsulation glue in each mug exceedes each cuvette rim of a cup of the inside, and connect together after covering each cuvette rim of a cup, each cuvette in mug is entirely covered by glue to the eye and hides, and the rim of a cup between mug separates the glue in each mug, so both reach the object that many glasss of light extraction efficiencies are high, overcome again and between conventional many glasss of encapsulation cups and cup, to have obvious luminous point and the larger defect of aberration, adopt with mug is unit simultaneously, different mugs is packaged into different coloured light, meet the demand of market to polychromatic light alternative types product.
Summary of the invention
The utility model relates to a kind of COB encapsulation module of many glasss of polychromes, specifically, by injection moulding arrange on circuit boards according to design module shape group two or more multiple mug together, two or more multiple cuvette is set in mug, form many glasss of COB and encapsulate wiring board, then be unit with mug, can according to a kind of coloured light of a mug, class wrapper is divided by LED chip, same chip is encapsulated in the cuvette of same mug, corresponding coloured light requires to drip encapsulation glue or the encapsulation glue containing fluorescent material, encapsulation glue in each mug exceedes each cuvette rim of a cup of the inside, and connect together after covering each cuvette rim of a cup, each cuvette in mug is entirely covered by glue to the eye and hides, and the rim of a cup between mug separates the glue in each mug, form a kind of COB encapsulation module of many glasss of polychromes.
The utility model is by arranging cuvette inside mug, adopt many glasss of encapsulation of cup in cup, both the object that many glasss of light extraction efficiencies are high had been reached, overcome again and between conventional many glasss of encapsulation cups and cup, to have obvious luminous point and the larger defect of aberration, adopt with mug is unit simultaneously, different mugs is packaged into different coloured light, meets the demand of market to polychromatic light alternative types product.
According to the utility model, provide a kind of COB encapsulation module of many glasss of polychromes, it is characterized in that, comprising: circuit board; Arrange on circuit boards by injection moulding, according to module combination of shapes two or more mugs together of design, two or more cuvette is set in mug; Be encapsulated in the LED chip in cuvette; Encapsulation glue or the encapsulation glue containing fluorescent material; Wherein, take mug as unit, drip encapsulation glue or the encapsulation glue containing fluorescent material by corresponding coloured light requirement, the encapsulation glue in each mug exceedes each cuvette rim of a cup of the inside, and connect together after covering the rim of a cup between each cuvette, form the cuvette encapsulating structure hidden.Rim of a cup between mug has separated the glue in each mug, forms the COB encapsulation module of many glasss of polychromes.
According to an embodiment of the present utility model, the COB encapsulation module of described a kind of many glasss of polychromes, it is characterized in that, described circuit board is the circuit board of the circuit board of the die-cut metal formation of etching metal formation circuit board or mould or the circuit board of wire circuit plate or the formation of printing electrocondution slurry or the formation of printer printing electrically conductive ink, or the circuit board of laser lithography formation.
According to an embodiment of the present utility model, the COB encapsulation module of described a kind of many glasss of polychromes, is characterized in that, described circuit board is thermoelectric separated wiring board.
According to an embodiment of the present utility model, the COB encapsulation module of described a kind of many glasss of polychromes, is characterized in that, described injection-moulded plastic is PPA or PCT or EMC or LCP.
According to an embodiment of the present utility model, the COB encapsulation module of described a kind of many glasss of polychromes, it is characterized in that, described chip is connected conducting with circuit board be connected by bonding wire or directly weld to connect on circuit boards on circuit boards or with conducting resinl.
According to an embodiment of the present utility model, the COB encapsulation module of described a kind of many glasss of polychromes, is characterized in that, is directly welded by the power supply components and parts of driving LED or is encapsulated on described circuit board, forming the COB encapsulation module of the many glasss of polychromes containing power supply.
Following in the description of the drawings and specific embodiments, one or more embodiments of the detail of the present utility model will be set forth.From these descriptions, accompanying drawing and claim, other features, objects and advantages of the present utility model can be known.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view that many glasss of COB encapsulate wiring board.
Fig. 2 is the floor map that many glasss of COB encapsulate wiring board.
Fig. 3 is the schematic cross-section that many glasss of COB encapsulate wiring board.
Fig. 4 is the floor map of die bond on many glasss of COB encapsulation wiring boards of being classified by LED chip.
Fig. 5 is the schematic cross-section of the COB encapsulation module of many glasss of polychromes.
Embodiment
To be described in detail the utility model for preferred embodiment below.
But it will be appreciated by those skilled in the art that the following stated is only illustrate and describe some preferred implementations, to claim of the present utility model, not there is any restriction.
Adopt the manufacture method of conventional aluminum-based circuit board, by aluminium base sheet material by the anti-etching circuit ink of printing, then etch, anti-etching printing ink of decorporating, namely print welding resistance is made into as shown in Figure 1, Figure 2, the circuit board of mark shown in (1) in Fig. 3.Due to the traditional handicraft that above processing step is printed substrate, belong to well known to those of ordinary skill in the art, just no longer carefully state at this.
Aluminum base circuit board (1) is gone out with mould the inlaid hole of injection moulding, then chemical silvering is carried out to the bond pad locations of packaging LED chips, again by the injection mold of injection molding machine, PPA resin is adopted to carry out injection moulding, according to the shape and structure of the COB encapsulation module of design, be injection molded on circuit boards as Fig. 1, Fig. 2, mug shown in Fig. 3 (2.1), mug (2.2), mug (2.3) and mug (2.4) group structure together, and be provided with cuvette (2.1.1) in mug (2.1) the inside, cuvette (2.2.1) is provided with in mug (2.2) the inside, mug (2.3) the inside is provided with cuvette (2.3.1), mug (2.4) the inside is provided with cuvette (2.4.1), so just be made into many glasss of COB and encapsulate wiring board (as Fig. 1, Fig. 2, shown in Fig. 3).
Then be unit with mug, LED chip classification is encapsulated in the cuvette in each mug, chip (3.1.1) die bond is inner at cuvette (2.1.1), chip (3.1.2) die bond is inner at cuvette (2.2.1), chip (3.1.3) die bond is inner at cuvette (2.3.1), chip (3.1.4) die bond is inner at cuvette (2.4.1), and die bond of so just being classified by LED chip encapsulates on wiring board (as shown in Figure 4) at many glasss of COB.Then metal bonding wire (3.2) is used to be welded on the electrode of circuit board (1) respectively at two electrodes of chip (3.1.1), chip (3.1.2), chip (3.1.3) and chip (3.1.4) respectively.By preparing the fluorescent powder packaging glue (4.1) that LED chip can be allowed to send out white light positive, to drop in each cuvette (2.3.1) that the inner each cuvette (2.1.1) of mug (2.1) is inner and mug (2.3) is inner respectively inner as requested again, baking-curing.By preparing the fluorescent powder packaging glue (4.2) that LED chip can be allowed to send out white light dim, to drop in each cuvette (2.4.1) that the inner each cuvette (2.2.1) of mug (2.2) is inner and mug (2.4) is inner respectively inner, baking-curing.Encapsulation glue in each mug exceedes each cuvette rim of a cup of the inside, and connect together after covering each cuvette rim of a cup, each cuvette in mug is entirely covered by glue to the eye and hides, and the rim of a cup between mug separates the glue in each mug, be made into just white and dim in vain alternate, can send out white light respectively positive, dim white light and while can send out many glasss of three look COB encapsulation module (as shown in Figure 5) of just white, dim white mixed-color light.
Certainly, according to another embodiment of the present utility model, can directly the power supply components and parts of driving LED be welded or be encapsulated on the circuit board of COB, be made into the COB encapsulation module of many glasss of polychromes of charged.
The utility model is by arranging cuvette inside mug, adopt many glasss of encapsulation of cup in cup, both the object that many glasss of light extraction efficiencies are high had been reached, overcome again and between conventional many glasss of encapsulation cups and cup, to have obvious luminous point and the larger defect of aberration, adopt with mug is unit simultaneously, different mugs is packaged into different coloured light, meets the demand of market to polychromatic light alternative types product.
Below by reference to the accompanying drawings a kind of specific embodiment of COB encapsulation module of many glasss of polychromes is described in detail the utility model.But, it will be appreciated by those skilled in the art that the above is only illustrate and describe some embodiments, to this by novel scope, the especially scope of claim, not there is any restriction.
Claims (6)
1. a COB encapsulation module for more than glass of polychrome, is characterized in that, comprising:
Circuit board;
Arrange on circuit boards by injection moulding, according to module combination of shapes two or more mugs together of design, two or more cuvette is set in mug;
Be encapsulated in the LED chip in cuvette;
Encapsulation glue or the encapsulation glue containing fluorescent material;
Wherein, take mug as unit, encapsulation glue or the encapsulation glue containing fluorescent material is dripped by corresponding coloured light requirement, encapsulation glue in each mug exceedes each cuvette rim of a cup of the inside, and connect together after covering the rim of a cup between each cuvette, form the cuvette encapsulating structure hidden, the rim of a cup between mug has separated the glue in each mug, forms the COB encapsulation module of many glasss of polychromes.
2. the COB encapsulation module of a kind of many glasss of polychromes according to claim 1, it is characterized in that, described circuit board is the circuit board of the circuit board of the die-cut metal formation of etching metal formation circuit board or mould or the circuit board of wire circuit plate or the formation of printing electrocondution slurry or the formation of printer printing electrically conductive ink, or the circuit board of laser lithography formation.
3. the COB encapsulation module of a kind of many glasss of polychromes according to claim 1, is characterized in that, described circuit board is thermoelectric separated wiring board.
4. the COB encapsulation module of a kind of many glasss of polychromes according to claim 1, is characterized in that, described injection-moulded plastic is PPA or PCT or EMC or LCP.
5. the COB encapsulation module of a kind of many glasss of polychromes according to claim 1, is characterized in that, described chip is connected conducting with circuit board be connected by bonding wire or directly weld to connect on circuit boards on circuit boards or with conducting resinl.
6. the COB encapsulation module of a kind of many glasss of polychromes according to claim 1, is characterized in that, is directly welded by the power supply components and parts of driving LED or is encapsulated on described circuit board, forming the COB encapsulation module of the many glasss of polychromes containing power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420766101.5U CN204375748U (en) | 2014-12-01 | 2014-12-01 | A kind of COB encapsulation module of many glasss of polychromes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420766101.5U CN204375748U (en) | 2014-12-01 | 2014-12-01 | A kind of COB encapsulation module of many glasss of polychromes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204375748U true CN204375748U (en) | 2015-06-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420766101.5U Expired - Fee Related CN204375748U (en) | 2014-12-01 | 2014-12-01 | A kind of COB encapsulation module of many glasss of polychromes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204375748U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108336081A (en) * | 2018-04-03 | 2018-07-27 | 广东雷腾智能光电有限公司 | A kind of COB light source and COB substrates |
| CN108336080A (en) * | 2018-04-03 | 2018-07-27 | 广东雷腾智能光电有限公司 | A kind of manufacturing method of COB light source |
| CN113299811A (en) * | 2021-05-06 | 2021-08-24 | 谢国州 | Novel COB anti-drop packaging method |
| CN110959199B (en) * | 2017-08-28 | 2023-12-15 | 奥斯兰姆奥普托半导体有限责任公司 | Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component |
-
2014
- 2014-12-01 CN CN201420766101.5U patent/CN204375748U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110959199B (en) * | 2017-08-28 | 2023-12-15 | 奥斯兰姆奥普托半导体有限责任公司 | Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component |
| CN108336081A (en) * | 2018-04-03 | 2018-07-27 | 广东雷腾智能光电有限公司 | A kind of COB light source and COB substrates |
| CN108336080A (en) * | 2018-04-03 | 2018-07-27 | 广东雷腾智能光电有限公司 | A kind of manufacturing method of COB light source |
| CN108336080B (en) * | 2018-04-03 | 2019-11-05 | 广东雷腾智能光电有限公司 | A kind of manufacturing method of COB light source |
| CN108336081B (en) * | 2018-04-03 | 2019-12-31 | 广东雷腾智能光电有限公司 | COB light source and COB base plate |
| CN113299811A (en) * | 2021-05-06 | 2021-08-24 | 谢国州 | Novel COB anti-drop packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150603 |