CN207869578U - A kind of heat conducting material prepared by stratified material - Google Patents
A kind of heat conducting material prepared by stratified material Download PDFInfo
- Publication number
- CN207869578U CN207869578U CN201721695982.6U CN201721695982U CN207869578U CN 207869578 U CN207869578 U CN 207869578U CN 201721695982 U CN201721695982 U CN 201721695982U CN 207869578 U CN207869578 U CN 207869578U
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- Prior art keywords
- dissipating layer
- heat
- heat dissipating
- graphene
- mucigel
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses heat conducting materials prepared by a kind of stratified material, including graphene heat dissipating layer, it is compounded with mucigel on one end face of the graphene heat dissipating layer, the material of mucigel is heat conductive silica gel, and the heat conducting material being made of graphene heat dissipating layer and mucigel is overlapped into the circular roll of multilayer.Graphene heat dissipating layer has excellent heat conductivility, also there is the plasticity as organic plastics, and also special hot property, chemical stability, it can be widely used on fever electronic equipment or device coated in some equal good processing performances of the surface of solids, heat sink material prepared by this graphene heat dissipating layer, when use fits in graphene heat dissipating layer on electronic device, it is easy to use, it is applied widely.
Description
Technical field
The utility model is related to heat sink material fields, and in particular to a kind of heat conducting material prepared by stratified material.
Background technology
With the development of large scale integrated circuit and encapsulation technology, electronic product also develops to thin, light, small direction so that
Electronic product surface temperature is also constantly increasing, and also there is an urgent need to the environment of a relative low temperature reliably to transport for component
Row, otherwise can reduce the service life of electronic component, therefore the heat dissipation of electronic product becomes a very distinct issues.
Existing market portioned product carries out heat conduction and heat radiation, especially copper and aluminium by metal class, although the thermal coefficient of copper
For (398W/mK), but weight is big, the application for limiting it such as oxidizable, and the thermal coefficient of aluminium is not high (237W/mK),
It is difficult to meet the needs of existing product is to heat conduction and heat radiation.The natural graphite material and artificial synthesized graphite material used at present
Heat dissipation film has certain improvement to the heat dissipation of electronic product made of material.
The chemical composition of heat conductivity graphite material (Thermal Flexible Graphite sheet) is mainly single carbon
(C) element is a kind of native element metal mineral.Film high-molecular compound can obtain graphite under high temperature and pressure chemically
Change film, because carbon is nonmetalloid, but has the conduction of metal material, heat conductivility also has as organic modeling
The same plasticity of material, and also special hot property, chemical stability, lubrication and can coated in the surface of solids etc. one
A little good processing performances, therefore, conductive graphite are communicated in electronics, and illumination, many fields such as aviation and defence and military all obtain
It is widely applied.
Graphite heat conducting material provides a high performance unique solution of synthesis to thermal management industry.Conductive graphite
Material solves application by a series of different thermal managements and brings new technology to the increasingly extensive industrial emissions field of demand
The hot graphite material product of scheme provides the innovation new technology of electronics industry thermal management.Conductive graphite is by mitigating device weight
Superior heat conductivility is provided in the case of amount, conductive graphite heat dissipation solution is the brand-new application scheme of thermal design.It leads
The thermal design problem of hot graphite effective solution electronic equipment.
Utility model content
To be solved in the utility model is the deficiencies in the prior art, and it is an object of the present invention to provide heat prepared by a kind of stratified material
Conductive material.
The utility model is achieved through the following technical solutions：
A kind of heat conducting material prepared by stratified material, including graphene heat dissipating layer, one of the graphene heat dissipating layer
Mucigel is compounded on end face.
The material of preferred embodiment, the mucigel is heat conductive silica gel.
Preferred embodiment, the heat conducting material being made of graphene heat dissipating layer and mucigel are overlapped into the circle of multilayer
Volume.
The thickness of preferred embodiment, the heat conductive silica gel is 20-60 μm.
Preferred embodiment, the area of the mucigel are greater than or equal to the area of the graphene heat dissipating layer.
The thickness of preferred embodiment, the graphene heat dissipating layer is 25-300 μm.
Preferred embodiment, the graphene heat dissipating layer are to contain one kind in graphite, carbon fiber, carbon black and carbon nanotube or more
Kind or more material composition graphene heat dissipating layer.
The utility model compared with prior art, has the following advantages and advantages：Graphene heat dissipating layer has excellent
Good heat conductivility also has the plasticity as organic plastics, and also special hot property, chemical stability, energy
Some equal good processing performances coated in the surface of solids, heat sink material prepared by this graphene heat dissipating layer can be transported widely
With on fever electronic equipment or device, when use, fits in graphene heat dissipating layer on electronic device, easy to use, fits
It is wide with range.
Description of the drawings
Attached drawing described herein is used for providing further understanding the utility model embodiment, constitutes the one of the application
Part does not constitute the restriction to the utility model embodiment.In the accompanying drawings：
Fig. 1 is the structural schematic diagram of heat conducting material prepared by a kind of stratified material of the utility model.
Label and corresponding parts title in attached drawing：
1- graphene heat dissipating layers, 2- mucigels.
Specific implementation mode
To make the purpose of this utility model, technical solution and advantage be more clearly understood, with reference to embodiment and attached drawing,
The utility model is described in further detail, and the exemplary embodiment and its explanation of the utility model are only used for explaining this
Utility model is not intended to limit the scope of the present invention.
Embodiment
As shown in Figure 1, heat conducting material prepared by a kind of stratified material of the utility model, including graphene heat dissipating layer 1, institute
It states and is compounded with mucigel 2 on an end face of graphene heat dissipating layer 1, the material of the mucigel 2 is heat conductive silica gel.By graphene
The heat conducting material overlap wrapping that heat dissipating layer 1 and mucigel 2 form is at circular roll.Facilitate the processing and storage of heat conducting material.
The thickness of heat conductive silica gel is preferably 20 μm, and the effect for accelerating heat dissipation can be played under conditions of not inharmonious degree.Heat conductive silica gel has
There are remarkable cold-and-heat resistent alternation performance, ageing-resistant performance and electrical insulation capability.And with excellent moisture-proof, antidetonation, Inverter fed motor, anti-
Performance of leaking electricity and chemical mediator-resitant property.- 60~280 DEG C of sustainable use and retention property.Heat conductive silica gel has high thermal conductivity,
Splendid thermal conductivity, the good exhausted property of electricity, wider temperature in use, good stability in use, lower consistency and good
Workability.The area of mucigel 2 is equal to the area of the graphene heat dissipating layer 1, and graphene heat dissipating layer 1 is made to pass through mucigel 2
It is fully connect with the surface of heater, while the effect of heat conductive silica gel is exactly to fill up between graphene heat dissipating layer 1 and heater
The heat-sinking capability of graphene heat dissipating layer 1 is utilized in gap to greatest extent.
The thickness of preferred embodiment scheme, the graphene heat dissipating layer 1 is 25-300 μm.
Preferred embodiment scheme, the graphene heat dissipating layer 1 are containing in graphite, carbon fiber, carbon black and carbon nanotube
The graphene heat dissipating layer 1 of one or more above material compositions.The utility model does not have the ratio of graphene and carbon-based material
Have it is specifically limited, according to specific implementation situation selected.
Above-described specific implementation mode, to the purpose of this utility model, technical solution and advantageous effect carried out into
One step is described in detail, it should be understood that the foregoing is merely specific embodiment of the present utility model, is not used to limit
Determine the scope of protection of the utility model, within the spirit and principle of the utility model, any modification for being made equally is replaced
It changes, improve, should be included within the scope of protection of this utility model.
Claims (5)
1. heat conducting material prepared by a kind of stratified material, it is characterised in that：Including graphene heat dissipating layer, the graphene heat dissipation
Mucigel is compounded on one end face of layer, the material of the mucigel is heat conductive silica gel.
2. heat conducting material prepared by a kind of stratified material according to claim 1, which is characterized in that described by graphene
The heat conducting material of heat dissipating layer and mucigel composition is overlapped into the circular roll of multilayer.
3. heat conducting material prepared by a kind of stratified material according to claim 1, which is characterized in that the heat conductive silica gel
Thickness be 20-60 μm.
4. heat conducting material prepared by a kind of stratified material according to claim 1, which is characterized in that the mucigel
Area is greater than or equal to the area of the graphene heat dissipating layer.
5. heat conducting material prepared by a kind of stratified material according to claim 1, which is characterized in that the graphene dissipates
The thickness of thermosphere is 25-300 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721695982.6U CN207869578U (en) | 2017-12-07 | 2017-12-07 | A kind of heat conducting material prepared by stratified material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721695982.6U CN207869578U (en) | 2017-12-07 | 2017-12-07 | A kind of heat conducting material prepared by stratified material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207869578U true CN207869578U (en) | 2018-09-14 |
Family
ID=63468321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721695982.6U Expired - Fee Related CN207869578U (en) | 2017-12-07 | 2017-12-07 | A kind of heat conducting material prepared by stratified material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207869578U (en) |
-
2017
- 2017-12-07 CN CN201721695982.6U patent/CN207869578U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180914 Termination date: 20191207 |