CN108011508B - 具有共源极电感布局以避免直通的逆变器切换器件 - Google Patents

具有共源极电感布局以避免直通的逆变器切换器件 Download PDF

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CN108011508B
CN108011508B CN201711021952.1A CN201711021952A CN108011508B CN 108011508 B CN108011508 B CN 108011508B CN 201711021952 A CN201711021952 A CN 201711021952A CN 108011508 B CN108011508 B CN 108011508B
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diode
gate
transistor
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source inductance
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CN108011508A (zh
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徐竹娴
陈清麒
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Ford Global Technologies LLC
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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/08Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/38Means for preventing simultaneous conduction of switches
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/08Modifications for protecting switching circuit against overcurrent or overvoltage
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/08Modifications for protecting switching circuit against overcurrent or overvoltage
    • H03K17/081Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
    • H03K17/0814Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the output circuit
    • H03K17/08148Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the output circuit in composite switches
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/16Modifications for eliminating interference voltages or currents
    • H03K17/161Modifications for eliminating interference voltages or currents in field-effect transistor switches
    • H03K17/162Modifications for eliminating interference voltages or currents in field-effect transistor switches without feedback from the output circuit to the control circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601Structure
    • H01L2224/0603Bonding areas having different sizes, e.g. different heights or widths
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/08Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
    • H02M1/084Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters using a control circuit common to several phases of a multi-phase system
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/08Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
    • H02M1/088Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters for the simultaneous control of series or parallel connected semiconductor devices
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/38Means for preventing simultaneous conduction of switches
    • H02M1/385Means for preventing simultaneous conduction of switches with means for correcting output voltage deviations introduced by the dead time
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H02M7/538Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a push-pull configuration
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H02M7/5387Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration

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  • Inverter Devices (AREA)
  • Power Conversion In General (AREA)

Abstract

一种逆变桥中的相脚具有上部晶体管,上部晶体管具有上部栅极、集电极、和发射极端子,其中上部栅极和发射极端子布置为产生上部共源极电感。下部晶体管具有下部栅极、集电极、和发射极端子,其中下部栅极和发射极端子布置为产生下部共源极电感。上部二极管跨接在上部集电极和发射极端子上,并且大体上与上部共源极电感并联。下部二极管跨接在下部集电极和发射极端子上,并且大体上与下部共源极电感并联。因此,当在其中一个晶体管关闭时承载换向电流时,二极管大体上绕过共源极电感。这允许相脚在避免“直通”问题的同时,在栅极端子处具有显著的共源电感。

Description

具有共源极电感布局以避免直通的逆变器切换器件
技术领域
本发明大体涉及逆变桥中的功率切换器件,并且更具体地,涉及使用高切换效率的分立式功率切换器件的电动车辆的逆变器驱动***。
背景技术
例如混合动力电动车辆(hybrid electric vehicle,HEV)、插电式混合动力电动车辆(plug-in hybrid electric vehicle,PHEV)、电池电动车辆(battery electricvehicle,BEV)的电动车辆使用逆变驱动的电机提供牵引力矩。典型的电驱动***可以包括直流(Direct-current,DC)电源(例如电池组或燃料电池),DC电源通过接触器开关连接到可变电压转换器(variable voltage converter,VVC)来调节主DC链路电容器两端的主母线电压。逆变器连接在主母线和牵引马达之间,便于将DC母线功率转换成与马达的绕组相耦合的交流(Alternating current,AC)电压以推动车辆。
逆变器包括桥接有多个相脚的晶体管切换器件,例如绝缘栅双极晶体管(insulated gate bipolar transistor,IGBT)。典型配置包括由三相脚的逆变器驱动的三相马达。电子控制器通断开关以便于将来自母线的直流电压转换成施加到马达的交流电压。为了传递正弦电流输出的近似值而以期望的速度和力矩来驱动电动机,逆变器可以对DC链路电压进行脉宽调制。施加到IGBT栅极的脉宽调制(Pulse Width Modulation,PWM)控制信号按需使栅极通断使得得到的电流与期望的电流相匹配。
因为逆变器的每个相脚具有跨接在DC链路两端的一对上下开关晶体管,重要的是相脚中的两个器件不会同时导通(即打开)。通常在PWM开关信号中***短时间间隔(称为死区时间),在死区时间期间相脚的上下开关器件关闭以防直通。
共源极电感是指由功率开关晶体管中的主功率回路(即晶体管的漏极到源极或集电极到发射极的功率输出)和栅极驱动回路(即栅极到源极或栅极到发射极)共享的电感。共源极电感同时承载器件输出电流(例如漏极到源极电流)和栅极充/放电电流。共源极电感的输出(功率回路)部分的电流以增强(例如,加速)切换性能的方式改变栅极电压。对于切换桥而言,可能期望减少的切换时间,因为只要包含其它潜在的副作用,就会具有在切换转换期间消耗(即丢失)的能量的相关减少,因此。例如,大的共源极电感可能增加发生直通的可能性。
发明内容
根据本发明的一个方面,相脚配置为以避免“直通”的方式在栅极端子处具有显著的共源极电感。上部晶体管具有上部栅极、集电极、和发射极端子,其中上部栅极和发射极端子布置为产生上部共源极电感。下部晶体管具有下部栅极、集电极、和发射极端子,其中下部栅极和发射极端子布置为产生下部共源极电感。上部二极管跨接在上部集电极和发射极端子上,并且大体上与上部共源极电感并联。下部二极管跨接在下部集电极和发射极端子上,并且大体上与下部共源极电感并联。因此,当在其中一个晶体管关闭时承载换向电流时,二极管大体上绕过共源极电感。
根据本发明,提供一种相脚,包括:
上部晶体管,上部晶体管具有上部栅极端子、上部集电极端子、和上部发射极端子,所述上部栅极端子和上部发射极端子布置为产生上部共源极电感;
下部晶体管,下部晶体管具有下部栅极端子、下部集电极端子、和下部发射极端子,下部栅极端子和下部发射极端子布置为产生下部共源极电感;和
上部二极管,上部二极管跨接到上部集电极端子和上部发射极端子上并且大体上与上部共源极电感并联。
在本发明的一个实施例中,相脚还包括下部二极管,下部二极管跨接到下部集电极端子和下部发射极端子上并且大体上与下部共源极电感并联。
在本发明的一个实施例中,晶体管串联在正母线和负母线端子之间,并且具有提供相脚的输出的中间连接点,并且其中上部二极管具有连接到大体上绕过上部共源极电感的中间连接点的阳极端子。
在本发明的一个实施例中,下部二极管具有连接到大体上绕过下部共源极电感的负母线端子的阳极端子。
在本发明的一个实施例中,相脚还包括承载多个导电层的功率模块基板,其中导电层限定布置在第一和第二安装区域之间的正电轨和负电轨;
其中上部晶体管和下部二极管安装到第一安装区域中的基板;和
其中下部晶体管和上部二极管安装到第二安装区域中的基板。
在本发明的一个实施例中,导电层还限定在第一安装区域内的上部栅极回路和在第二安装区域内的下部栅极回路。
在本发明的一个实施例中,相脚还包括各自承载多个导电层的第一和第二功率模块基板;
其中上部晶体管和下部二极管安装到第一基板;和
其中下部晶体管和上部二极管安装到第二基板。
在本发明的一个实施例中,导电层还限定在第一基板上的上部栅极回路和在第二基板上的下部栅极回路。
在本发明的一个实施例中,晶体管各自包括绝缘栅双极晶体管(IGBT)。
根据本发明,提供一种功率转换器,包括:
具有正和负母线的DC链路,DC链路配置为接收DC电源电压;
相脚,相脚包括串联在母线之间的上部晶体管和下部晶体管、以及跨接到相应的上部晶体管和下部晶体管的相应集电极端子和发射极端子的上部二极管和下部二极管,其中上部晶体管和下部晶体管之间的连接点配置为连接到负载,其中上部栅极端子和发射极端子布置为产生上部共源极电感,其中下部栅极端子和发射极端子布置为产生下部共源极电感,其中上部二极管大体上与上部共源极电感并联,并且其中下部二极管大体上与下部共源极电感并联;和
连接到相脚的栅极驱动器,栅极驱动器根据上部栅极信号激活上部晶体管,并且根据下部栅极信号激活下部晶体管。
在本发明的一个实施例中,上部二极管具有连接到连接点的阳极端子,连接点大体上绕过上部共源极电感,并且其中下部二极管具有连接到负母线的阳极端子,负母线大体上绕过下部共源极电感。
在本发明的一个实施例中,相脚还包括承载多个导电层的功率模块基板,其中导电层限定布置在第一和第二安装区域之间的正电轨和负电轨;
其中上部晶体管和下部二极管安装到第一安装区域中的基板;并且
其中下部晶体管和上部二极管安装到第二安装区域中的基板。
在本发明的一个实施例中,导电层还限定在第一安装区域内的上部栅极回路和在第二安装区域内的下部栅极回路。
在本发明的一个实施例中,相脚还包括各自承载多个导电层的第一和第二功率模块基板;
其中上部晶体管和下部二极管安装到第一基板;并且
其中下部晶体管和上部二极管安装到第二基板。
在本发明的一个实施例中,导电层还限定在第一基板上的上部栅极回路和在第二基板上的下部栅极回路。
在本发明的一个实施例中,晶体管各自包括绝缘栅双极晶体管(IGBT)。
附图说明
图1是示出具有产生公共源极电感的一对IGBT的逆变器相脚的等效电路的示意图;
图2和图3是分别示出不同级别的公共源极电感的输出电压尖峰和开关能量的变化曲线图;
图4是示出了在下部晶体管关断期间的上部反向并联的二极管中的换向电流的逆变器相脚的示意图;
图5是示出了通过低级别和高级别二者的公共源极电感由换向电流引起的上栅极端子中的栅极电压的曲线图;
图6是示出本发明中用于减小由换向电流引起的栅极电压而不减小公共源极电感的等效电路的示意图;
图7是示出具有如图4所示的等效电路的配置的相脚的2合1功率模块中的IGBT和二极管的布局图;
图8是示出了用于上下晶体管的功率回路的紧密连接的图7的注释图;
图9是示出具有如图6所示的等效电路的配置的本发明的相脚的2合1功率模块中的IGBT和二极管的布局图;
图10是示出了用于上下晶体管的功率回路的隔离的图9的注释图;
图11是示出具有如图4所示的等效电路的配置的相脚的一对1合1功率模块中的IGBT和二极管的布局图;
图12是示出具有如图6所示的等效电路的配置的本发明的相脚的一对1合1功率模块中的IGBT和二极管的布局图。
具体实施方式
共源极电感是由用于晶体管切换器件的主功率回路和栅极驱动回路共享的电感。共源极电感通常来自与印刷电路板上的器件封装和迹线相关的寄生电感。就用于从直流到交流功率转换的切换桥而言,共源极电感的存在是有益的。图1示出了在驱动电动马达的电动车辆中的逆变器驱动***中常用类型的相脚10的示例。功率晶体管器件11和12(例如IGBT或功率金属氧化物半导体场效应晶体管(MOSFET))串联在具有正和负DC母线的DC链路上。晶体管11和12之间的连接点13提供相脚10的AC输出。晶体管11具有栅极端子g1和发射极端子(例如开尔文发射极)e1,同时晶体管12具有栅极端子g2和发射极端子e2。与晶体管11相关联的栅极电感14磁耦合到也与晶体管11相关联的输出功率回路电感15。与晶体管12相关联的栅极电感16磁耦合到也与晶体管12相关联的输出功率回路电感17。
功率回路和栅极回路之间的耦合有时会产生不期望的相互作用,其中改变来自器件的输出电流导致改变试图控制器件的栅极信号。因此,在开发晶体管器件封装期间使用的典型设计规则和使用这种器件的电路旨在最小化共源极电感。
对于相脚中的晶体管,共源极电感的大小对切换时间和电压过冲的影响如图2所示,图2描绘了在从导通状态到断开状态的转变期间晶体管两端的集电极到发射极电压(VCE)随时间的变化。轨迹18A、18B、18C、和18D分别对应于0nH、1nH、2nH、和3nH的共源极电感(LCSI)。因此,当LCSI从0增加到3nH时,切换时间有利地降低,同时电压过冲或尖峰的大小保持大体恒定。减少的切换时间导致较少的能量损失(即提高了效率),如图3所示。轨迹19A、19B、19C、和19D分别对应于0nH、1nH、2nH、和3nH的LCSI。因此,当LCSI从0增加到3nH时,晶体管中消耗的能量从近乎19mJ下降到约11mJ。因此,可以认识到更高的LCSI可以在保持相同的电压尖峰的同时降低切换损耗。
栅极回路电感和/或功率回路电感的大小以及二者之间的相互耦合程度可以通过选择适当的布局和/或包括在PCB迹线中添加重叠线圈形成到晶体管栅极或发射极的导电路径来容易地操纵(例如增强),以便于获得所需的共源极电感。
然而,如果LCSI增加太多,则可能会发生如图4所示的直通的潜在副作用。常规的相脚20具有上部晶体管21,上部晶体管21具有上部栅极、集电极、和发射极端子,其中上部栅极和发射极端子产生由栅极回路电感28和功率回路电感29组成的上部共源极电感。栅极驱动器30和栅极电阻器31连接到栅极端子以便于控制上部晶体管21的切换。上部二极管在与晶体管21反向并联的方向上跨接到上部集电极和发射极端子。
具有下部栅极、集电极和发射极端子的下部晶体管22在正母线23和负母线24之间的连接点25处与上部晶体管21串联。下部栅极和发射极端子产生由栅极回路电感32和功率回路电感33组成的下部共源极电感。栅极驱动器34和栅极电阻器35连接到栅极端子,以便于控制下部晶体管22的切换。下部二极管在与晶体管22反向并联的方向上跨接到下部集电极和发射极端子。图4示出了切换状态,在该切换状态中,下部晶体管22已经导通,并且处于正在被栅极驱动器34关断的过程中(晶体管21已经断开)。在晶体管22关断的情况下,从在连接点25处的AC输出端通过晶体管22流动的电流如箭头36所示从晶体管22转到上部二极管26。通过上部二极管26的电流也流过电感29,从而在电感29上引起电压降,其继而通过电感28在上部晶体管21的栅极端子处产生电压。图5示出了沿着曲线37的上部晶体管21的感应栅极电压VGE。对于较低级别的共源极电感LCSI,感应栅极电压VGE如曲线38所示保持较低水平。然而在较高级别的LCSI处,如曲线39所示,产生更大的栅极电压VGE。如果栅极-发射极间电压VGE超过晶体管21的阈值电压,则上部晶体管21可能导通,由于两个晶体管都可能部分导通而导致直通状态。
本发明能够有意识地增加共源极电感,同时避免在相脚的其互补晶体管的切换过程期间增加未切换的晶体管的VGE。不同于其中电流换向路径包括反向并联的二极管和产生共源极电感的结构二者的现有技术,本发明重新配置反向并联二极管使得换向电流大体上不流过共源极电感。如图6所示,相脚40包括具有上部栅极、集电极、和发射极端子的上部晶体管(例如IGBT)41和具有下部栅极、集电极、和发射极端子的下部晶体管42。晶体管41和42具有中间连接点45并且在正母线43和负母线44之间串联。上部反向并联二极管46跨接到上部晶体管41的上部集电极和发射极端子上。下部反向并联二极管47跨接到下部晶体管42的下部集电极和发射极端子上。上部栅极驱动器48通过栅极电阻器49驱动晶体管41的栅极端子。下栅极驱动器50通过栅极电阻器51驱动晶体管42的栅极端子。
上部栅极和发射极端子布置为由于栅极电感52和功率回路电感53之间的耦合而产生上部LCSI。下部栅极和发射极端子布置为由于栅极电感54和功率回路电感55之间的耦合而产生下部LCSI。上部二极管46大体上与上部共源极电感LCSI并联,使得当下部晶体管42关断时通过上部二极管46的换向电流被定向为远离电感53。特别地,上部二极管46具有连接到大体上绕过上部LCSI的中间连接点45的阳极端子。即使可能难以从包含上部二极管46的电路分支中消除所有共源极电感,但大多数功率回路电感53与二极管46并联已经足够。如下面更具体地描述的,可以引入用于故意增加上部LCSI的结构(例如导体中的回路或携带栅极驱动信号的迹线)可以与上部二极管46物理分离,以确保二极管46与大体上所有的上部LCSI保持并联。同样地,下部二极管47与共源极电感LCSI大体上并联,使得当上部晶体管41关断时通过下部二极管47的换向电流被定向为远离电感55。特别地,下部二极管47具有连接到大体上绕过下部LCSI的负母线端子44的阳极端子。
图7示出了用于构建具有连接以形成相脚的半导体器件的功率卡或功率模块的直接覆铜(Direct Bonded Copper,DBC)基板60。DBC基板60可以包括具有形成电路迹线和接合焊盘的两个金属化层的陶瓷层,其中半导体器件和各种接合线被焊接/结合到迹线上。功率模块还可以包括具有多个输入/输出引脚的引线框架和封装该模块的包覆成型体(未示出)。在图7所示的传统布局中,单个导电焊盘61设置在DBC基板60的表面上以接收用于上部IGBT 62和上部二极管63的半导体芯片,其中焊接芯片62和63使得IGBT 62的集电极端子和二极管63的阴极端子通过焊盘61与正母线DC+电接触。接合线64将IGBT 62的发射极端子与二极管63的阳极端子互连。栅极焊盘65通过线圈栅极迹线66和接合线67连接到IGBT 62的栅极端子。对于相脚的下部,导电焊盘68接收下部IGBT 70和下部二极管71。下部相脚的线圈栅极迹线72和其他方面与上部相脚相似。用于负母线DC-和输出连接点AC的焊盘显示在DBC 60的相应边缘。
在图7的布局中,相脚的各自相应的一半的切换器件和反向并联二极管在物理和电气上都相互靠近。如图8所示,在这种布置中用于上部相脚的功率回路73和用于下部相脚的功率回路74相重叠。其结果是栅极线圈66与两个功率回路73和74相重叠。当下部IGBT 70关断时,磁通量跨越功率回路73和74耦合并耦合到栅极回路66中导致栅极电压变化。
图8示出了本发明的二合一功率卡的改进布局的一个示例,其中功率模块DBC基板75承载多个导电层,其中导电层限定了布置在第一和第二安装区域之间的正电轨(即迹线)DC+和负电轨DC-。例如,电轨DC+和DC-与输出电轨AC一起可以布置为平分基板75的表面,在电轨的相对辆侧上设置第一和第二安装区域。分别为上部IGBT 80、上部二极管81、下部IGBT 82、和下部二极管83提供分离的导电焊盘76、77、78、和79。因此,上部IGBT 80和下部二极管83安装在第一安装区域中,并且下部IGBT 82和上部二极管81安装在第二安装区域中。每个IGBT可以在其各自的安装区域中包括栅极回路,但是由于每个IGBT的反向并联二极管处于相反的安装区域,因此添加的共源极电感大体上仅耦合到其自身的功率回路。图10示出了上部功率回路84和下部功率回路85。因此,每个二极管绕过其匹配的晶体管的共源极电感。
图11示出了互相连接以形成相脚的一对1合1功率卡。上部相脚基板90接收与DC+母线、AC输出、发射极引脚e1、和栅极引脚g1的层/引脚互相连接的上部IGBT 91和上部二极管92。下部相脚基板93接收与DC-母线、AC输出、发射极引脚e2、和栅极引脚g2的层/引脚互相连接的下部IGBT 94和下部二极管95。鉴于相脚的每一半的晶体管和二极管紧密地封装在一起,上部功率回路96和下部功率回路97再次紧密耦合。使用环形栅极迹线的这种紧密耦合和增强的共源极电感增加了由换向电流引起直通的潜在性。
图12示出了一对1合1功率卡的本发明的实施例,其中每个IGBT及其反向并联二极管通过将它们放置在相对的功率卡上而分开。因此,基板100承载上部IGBT 102和下部二极管103,同时基板101承载下部IGBT 104和上部二极管105。每个基板需要为正母线DC+、负母线DC-、和输出AC提供输出引脚,使得每个IGBT与其二极管可以进行必要的互相连接。然而,组件的重新组合导致上部功率回路106与下部功率回路107分离,使得相关联的磁通量不耦合,并且避免直通问题。

Claims (8)

1.一种相脚,包括:
上部晶体管,所述上部晶体管具有上部栅极端子、上部集电极端子、和上部发射极端子,所述上部栅极端子和所述上部发射极端子布置为产生上部共源极电感;
下部晶体管,所述下部晶体管具有下部栅极端子、下部集电极端子、和下部发射极端子,所述下部栅极端子和所述下部发射极端子端子布置为产生下部共源极电感;
上部二极管,所述上部二极管跨接到所述上部集电极端子和所述上部发射极端子上并且大体上与所述上部共源极电感并联;
下部二极管,所述下部二极管跨接到所述下部集电极端子和所述下部发射极端子上并且大体上与所述下部共源极电感并联;和
承载多个导电层的功率模块基板,其中所述导电层限定布置在第一和第二安装区域之间的正电轨和负电轨,其中所述上部晶体管和所述下部二极管安装到所述第一安装区域中的所述基板,和其中所述下部晶体管和所述上部二极管安装到所述第二安装区域中的所述基板。
2.根据权利要求1所述的相脚,其中所述晶体管串联在正母线和负母线端子之间,并且具有提供所述相脚的输出的中间连接点,并且其中所述上部二极管具有连接到大体上绕过所述上部共源极电感的所述中间连接点的阳极端子。
3.根据权利要求2所述的相脚,其中所述下部二极管具有连接到大体上绕过所述下部共源极电感的所述负母线端子的阳极端子。
4.根据权利要求3所述的相脚,其中所述导电层还限定在所述第一安装区域内的上部栅极回路和在所述第二安装区域内的下部栅极回路。
5.一种功率转换器,包括:
具有正和负母线的DC链路,所述DC链路配置为接收DC电源电压;
相脚,所述相脚包括串联在所述母线之间的上部晶体管和下部晶体管、以及跨接到相应的所述上部晶体管和所述下部晶体管的相应集电极端子和发射极端子的上部二极管和下部二极管,其中所述上部晶体管和所述下部晶体管之间的连接点配置为连接到负载,其中上部栅极端子和所述发射极端子布置为产生上部共源极电感,其中下部栅极端子和所述发射极端子布置为产生下部共源极电感,其中所述上部二极管大体上与所述上部共源极电感并联,并且其中所述下部二极管大体上与所述下部共源极电感并联;和
连接到所述相脚的栅极驱动器,所述栅极驱动器根据上部栅极信号激活所述上部晶体管,并且根据下部栅极信号激活所述下部晶体管;
其中,所述相脚包括承载多个导电层的功率模块基板,其中所述导电层限定布置在第一和第二安装区域之间的正电轨和负电轨,其中所述上部晶体管和所述下部二极管安装到所述第一安装区域中的所述基板,并且其中所述下部晶体管和所述上部二极管安装到所述第二安装区域中的所述基板。
6.根据权利要求5所述的功率转换器,其中所述上部二极管具有连接到所述连接点的阳极端子,所述连接点大体上绕过所述上部共源极电感,并且其中所述下部二极管具有连接到所述负母线的阳极端子,所述负母线大体上绕过所述下部共源极电感。
7.根据权利要求5所述的功率转换器,其中所述导电层还限定在所述第一安装区域内的上部栅极回路和在所述第二安装区域内的下部栅极回路。
8.根据权利要求5所述的功率转换器,其中所述晶体管各自包括绝缘栅双极晶体管(IGBT)。
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