CN107993990A - A kind of 16 pin high-density integrated circuit package structures - Google Patents
A kind of 16 pin high-density integrated circuit package structures Download PDFInfo
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- CN107993990A CN107993990A CN201711320641.5A CN201711320641A CN107993990A CN 107993990 A CN107993990 A CN 107993990A CN 201711320641 A CN201711320641 A CN 201711320641A CN 107993990 A CN107993990 A CN 107993990A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of 16 pin high-density integrated circuit package structures, its structure includes bar in top, auxiliary pin, protuberance, mark, plastics body side surface, pin, plastic body front, fixed substrate, heat sink, cooling system, bearing seat, extension board, placement hole, IC chip, heat-radiating substrate, the first scolding tin, power chip, resistance, driving chip, lead frame, wiring, resin, beneficial effects of the present invention：IC chip is arranged in the placement hole of bearing seat, then bearing seat is resisted against on the side wall of IC chip, thus the heat transfer that IC chip produces is gone out, to realize heat dissipation, the channel for heat dissipation of heat emission hole thereon and the unplugged radiating frame of thermal vias at the same time, so as to fulfill air circulation, high efficiency and heat radiation is realized.
Description
Technical field
The present invention is a kind of 16 pin high-density integrated circuit package structures, belongs to integrated antenna package field.
Background technology
The encapsulated type of integrated circuit may be summarized to be two major classes：Seal ceramic package and Plastic Package.Sealing ceramics
Encapsulation is to be encapsulated chip with the mode that circular ambient is isolated using vacuum sealing device, and typical seal ceramic package should
For dynamical encapsulation grade.And Plastic Package chip be then using epoxy by chip package, its be difficult to completely with
It is environmentally isolated, therefore the air on periphery may pass through this encapsulation, and can exert an adverse impact in process to the quality of chip.
Carry out plastic package technology this year and obtained significant development in its application and effect, and the production technology of Plastic Package can be into
Row automated production, so as to significantly reduce cost.
But existing encapsulating structure produces the heat of higher due to high-effect integrated circuit component, causes encapsulating structure
On radiator structure heat dissipation effect it is undesirable.
The content of the invention
In view of the deficienciess of the prior art, it is an object of the present invention to provide a kind of 16 pin high-density integrated circuits encapsulation knot
Structure, to solve existing encapsulating structure since high-effect integrated circuit component produces the heat of higher, causes on encapsulating structure
The problem of heat dissipation effect of radiator structure is undesirable.
To achieve these goals, the present invention is to realize by the following technical solutions：A kind of 16 pin high density collection
Into circuit encapsulating structure, its structure includes bar in top, auxiliary pin, protuberance, mark, plastics body side surface, pin, plastics
Body front, the plastics body side surface and plastic body front being integrated molding structure, the pin be equipped with two or more and
Size is consistent, and the pin is fixed at plastics body side surface both ends, the pin and plastic body respectively using welding manner
Side is connected using interference fit, after the mark bottom is fixed at plastics body side surface upper end using bonding way
Side, the auxiliary pin are equipped with two and being integrated molding structure, the auxiliary pin and protuberance with protuberance
Connected using interference fit, the auxiliary pin is fixed at plastics body side surface respectively with protuberance bottom using embedded mode
Upper end both ends, bar is fixed at plastics body side surface upper center and is gap-matched with it in the top, in the top
Bar and plastics body side surface being integrated molding structure, the plastics body side surface by fixed substrate, heat sink, cooling system, hold
Seat, extension board, placement hole, IC chip composition are carried, the fixed substrate is fixed in plastics body side surface, described
Fixed substrate fixes and is set to basic unit, between the heat sink is fixed at fixed substrate top using welding manner and uses with it
Gap coordinates, and the cooling system is equipped with two and is respectively arranged on heat sink both sides altogether, and the cooling system is adopted with heat sink
With electrical connection, the IC chip is fixed above heat sink and is used with it and is electrically connected, and the placement hole is consolidated
Surely it is arranged on above IC chip and uses interference fit to connect with it, the bearing seat is fixed at cooling system and collection
It is gap-matched between circuit chip and with it, the extension board is fixed between bearing seat and IC chip
And it is gap-matched with it.
Further, the plastic body front by heat-radiating substrate, the first scolding tin, power chip, resistance, driving chip,
Lead frame, wiring, resin composition.
Further, the lead frame, driving chip, heat-radiating substrate, power chip and resistance are sealed in resin
Inside, the heat-radiating substrate are fixed at resin inner wall, and the power chip is fixed at below heat-radiating substrate, described
Driving chip is fixed at below lead frame.
Further, first scolding tin is fixed at heat-radiating substrate lower left, and the resistance is fixed at scattered
Hot substrate lower right, the resistance are fixedly connected on power chip and driving chip, the power chip by wiring
Resistance and the first scolding tin are fixedly connected on by wiring.
Further, the cooling system is made of heat sink, thermal vias, radiating frame, heat emission hole, and described dissipates
Plugged and fixed has multiple vertical heat sinks in hot framework, and the heat sink is secured against on the left of bearing seat, and described dissipates
Backing lower end is fixed with some thermal vias, and the thermal vias is arranged on heat sink longitudinal direction side by side, and described dissipates
Formed in hot framework and the corresponding heat emission hole of thermal vias.
Further, the resistance is made of resistor main body, metal layer, insulating layer, the second scolding tin, groove, described
Groove is interlocked with heat-radiating substrate and being integrated molding structure.
Further, second scolding tin is fixed at groove both sides, and the insulating layer is fixed at the second scolding tin
With groove top, the resistor main body is fixed above insulating layer and is used with it and is electrically connected, and the metal layer is fixed
Both sides and being used with it are electrically connected above resistor main body.
Beneficial effect
IC chip, is arranged on the placement of bearing seat by 16 pin high-density integrated circuit package structures of one kind of the invention
In hole, then bearing seat is resisted against on the side wall of IC chip, thus goes out the heat transfer that IC chip produces
Go, to realize heat dissipation, while the channel for heat dissipation of heat emission hole thereon and the unplugged radiating frame of thermal vias, so as to fulfill air
Circulation, realizes high efficiency and heat radiation.
Brief description of the drawings
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, further feature of the invention,
Objects and advantages will become more apparent upon：
Fig. 1 is a kind of structure diagram of 16 pin high-density integrated circuit package structure of the present invention；
Fig. 2 is the cut-away view of plastics body side surface of the present invention；
Fig. 3 is the positive cut-away view of plastic body of the present invention；
Fig. 4 is the cooling system structure schematic diagram of plastics body side surface of the present invention；
Fig. 5 is the structure diagram of resistance of the present invention.
In figure：Bar -1, auxiliary pin -2, protuberance -3, mark -4, plastics body side surface -5, pin -6, plastics in top
Body front -7, fixed substrate -501, heat sink -502, cooling system -503, bearing seat -504, extension board -505, placement hole -
506th, IC chip -507, heat-radiating substrate -701, the first scolding tin -702, power chip -703, resistance -704, driving core
Piece -705, lead frame -706, wiring -707, resin -708, heat sink -5031, thermal vias -5032, radiating frame -
5033rd, heat emission hole -5034, resistor main body -7041, metal layer -7042, insulating layer -7043, the second scolding tin -7044, groove -
7045。
Embodiment
To make the technical means, the creative features, the aims and the efficiencies achieved by the present invention easy to understand, with reference to
Embodiment, the present invention is further explained.
- Fig. 5 is please referred to Fig.1, the present invention provides a kind of 16 pin high-density integrated circuit package structure technical solutions：It is tied
Structure includes bar 1 in top, auxiliary pin 2, protuberance 3, mark 4, plastics body side surface 5, pin 6, plastic body front 7, described
Plastics body side surface 5 and 7 being integrated molding structure of plastic body front, the pin 6 is equipped with two or more and size is consistent,
The pin 6 is fixed at 5 both ends of plastics body side surface respectively using welding manner, and the pin 6 is adopted with plastics body side surface 5
It is connected with interference, 4 bottom of mark is fixed on rear side of 5 upper end of plastics body side surface using bonding way, institute
The auxiliary pin 2 stated is equipped with two and being integrated molding structure with protuberance 3, and the auxiliary pin 2 is adopted with protuberance 3
It is connected with interference, the auxiliary pin 2 is fixed at plastics body side surface respectively with 3 bottom of protuberance using embedded mode
5 upper ends both ends, bar 1 is fixed at 5 upper center of plastics body side surface and is gap-matched with it, the top in the top
Middle bar 1 and 5 being integrated molding structure of plastics body side surface, the plastics body side surface 5 by fixed substrate 501, heat sink 502,
Cooling system 503, bearing seat 504, extension board 505, placement hole 506, IC chip 507 form, the fixed substrate
501 are fixed in plastics body side surface 5, and the fixed substrate 501, which is fixed, is set to basic unit, and the heat sink 502 is using weldering
The mode of connecing is fixed at the top of fixed substrate 501 and is gap-matched with it, the cooling system 503 be equipped with altogether two and
502 both sides of heat sink are respectively arranged on, the cooling system 503 is used with heat sink 502 and is electrically connected, the ic core
Piece 507 is fixed at the top of heat sink 502 and is used with it and is electrically connected, and the placement hole 506 is fixed at ic core
Interference fit is used to connect above piece 507 and with it, the bearing seat 504 is fixed at cooling system 503 and integrated circuit
It is gap-matched between chip 507 and with it, the extension board 505 is fixed at bearing seat 504 and IC chip
It is gap-matched between 507 and with it, the plastic body front 7 is by heat-radiating substrate 701, the first scolding tin 702, power chip
703rd, resistance 704, driving chip 705, lead frame 706, wiring 707, resin 708 form, and the lead frame 706, drive
Dynamic chip 705, heat-radiating substrate 701, power chip 703 are sealed in inside resin 708 with resistance 704, the heat-radiating substrate
701 are fixed at 708 inner wall of resin, and the power chip 703 is fixed at the lower section of heat-radiating substrate 701, the driving core
Piece 705 is fixed at the lower section of lead frame 706, and first scolding tin 702 is fixed at 701 lower left of heat-radiating substrate, institute
The resistance 704 stated is fixed at 701 lower right of heat-radiating substrate, and the resistance 704 is fixedly connected on power by wiring 707
Chip 703 and driving chip 705, the power chip 703 are fixedly connected on 704 and first scolding tin of resistance by wiring 707
702, the cooling system 503 is made of heat sink 5031, thermal vias 5032, radiating frame 5033, heat emission hole 5034, institute
Plugged and fixed has multiple vertical heat sinks 5031 on the radiating frame 5033 stated, and the heat sink 5031 is secured against holding
The left side of seat 504 is carried, 5031 lower end of heat sink is fixed with some thermal vias 5032, and the thermal vias 5032 is simultaneously
Row is arranged on 5031 longitudinal direction of heat sink, is formed on the radiating frame 5033 corresponding scattered with thermal vias 5032
Hot hole 5034, the resistance 704 is by resistor main body 7041, metal layer 7042, insulating layer 7043, the second scolding tin 7044, groove
7045 compositions, the groove 7045 is interlocked with heat-radiating substrate 701 and being integrated molding structure, second scolding tin
7044 are fixed at 7045 both sides of groove, and the insulating layer 7043 is fixed at the second scolding tin 7044 and the top of groove 7045,
The resistor main body 7041 is fixed at the top of insulating layer 7043 and is used with it and is electrically connected, and the metal layer 7042 is fixed
Both sides and being used with it are electrically connected above resistor main body 7041.
Generally and temperature, material, length also has that cross-sectional area is related to the resistance value size of resistance 704 described in this patent,
The physical quantity that gauge resistor is affected by temperature size is temperature coefficient, it is defined as resistance value when temperature often raises 1 DEG C and becomes
The percentage of change.The main physical characteristics of resistance are to become electric energy as thermal energy, can also say it is a dissipative cell, electric current passes through it
With regard to producing interior energy.Resistance usually plays partial pressure, shunting in circuit.For signal, exchange can with direct current signal
Pass through resistance.
Carrying out in use, IC chip 507 is arranged in the placement hole 506 of bearing seat 504, then bearing seat
504 are resisted against on the side wall of IC chip 507, thus the heat transfer that IC chip 507 produces are gone out, with reality
Now radiate, heat sink 5031 is arranged on radiating frame 5031, the heat further produced to IC chip 507 dissipates
Heat, radiating efficiency, while heat emission hole 5034 thereon and 5032 unplugged heat dissipation of thermal vias are improved by radiating frame 5031
The channel for heat dissipation of framework 5031, so as to fulfill air circulation, realizes high efficiency and heat radiation, at this time, the wiring adjacent thereto of resistance 704
The groove 7045 being equipped between 707, since the electrode of resistance 704 needs to be electrically connected respectively with driving chip 705 and power chip 703
Connect, and be electrically connected by wiring 707, the electrode of resistance 704 is connected with its wiring 707 nearest apart from 704 electrode of resistance, should
Groove 7045 can prevent the first scolding tin 702 of 704 electrode of resistance from flowing to the place of its adjacent wiring 707, can cause whole
The stability of a encapsulating structure improves.
The present invention solves existing encapsulating structure since high-effect integrated circuit component produces the heat of higher, causes to encapsulate
The problem of heat dissipation effect of radiator structure in structure is undesirable, being combined with each other by above-mentioned component of the invention, so as to fulfill
Air circulation, realizes high efficiency and heat radiation, and the stability of whole encapsulating structure can be caused to improve.
The basic principles, main features and the advantages of the invention have been shown and described above, for this area skill
For art personnel, it is clear that the invention is not restricted to the details of above-mentioned one exemplary embodiment, and without departing substantially from the present invention spirit or
In the case of essential characteristic, the present invention can be realized in other specific forms.Therefore, in all respects, should all incite somebody to action
Embodiment regards exemplary as, and is non-limiting, the scope of the present invention by appended claims rather than on state
Bright restriction, it is intended that including all changes fallen in the implication and scope of the equivalency of claim in the present invention
It is interior.Any reference numeral in claim should not be considered as to the involved claim of limitation.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical solution, this narrating mode of specification is only that those skilled in the art should for clarity
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It is appreciated that other embodiment.
Claims (7)
1. a kind of 16 pin high-density integrated circuit package structures, its structure includes bar (1) in top, auxiliary pin (2), protuberance
(3), mark (4), plastics body side surface (5), pin (6), plastic body are positive (7), it is characterised in that：
The plastics body side surface (5) is equipped with two with positive (7) the being integrated molding structure of plastic body, the pin (6)
Above and size is consistent, and the pin (6) is fixed at plastics body side surface (5) both ends respectively using welding manner, described
Pin (6) is connected with plastics body side surface (5) using interference fit, and the mark (4) bottom is fixed using bonding way
On rear side of plastics body side surface (5) upper end, the auxiliary pin (2) is equipped with two and is integrated chemical conversion with protuberance (3)
Type structure, the auxiliary pin (2) are connected with protuberance (3) using interference fit, the auxiliary pin (2) and protuberance
(3) bottom is fixed at plastics body side surface (5) upper end both ends respectively using embedded mode, and bar (1) is fixed in the top
Plastics body side surface (5) upper center and it is gap-matched with it, bar (1) is integrated with plastics body side surface (5) in the top
Change molding structure；
The plastics body side surface (5) by fixed substrate (501), heat sink (502), cooling system (503), bearing seat (504),
Extension board (505), placement hole (506), IC chip (507) composition；
The fixed substrate (501) is fixed in plastics body side surface (5), and the fixed substrate (501) fixation is set to base
Layer, the heat sink (502) are fixed above fixed substrate (501) using welding manner and are gap-matched with it,
The cooling system (503) is equipped with two and is respectively arranged on heat sink (502) both sides altogether, the cooling system (503) with
Using being electrically connected, the IC chip (507) is fixed above heat sink (502) and is adopted with it heat sink (502)
With electrical connection, the placement hole (506) is fixed above IC chip (507) and uses interference fit to connect with it
Connect, between the bearing seat (504) is fixed between cooling system (503) and IC chip (507) and uses with it
Gap coordinates, and the extension board (505) is fixed between bearing seat (504) and IC chip (507) and is used with it
Clearance fit.
A kind of 2. 16 pin high-density integrated circuit package structure according to claim 1, it is characterised in that：The modeling
Expect body positive (7) by heat-radiating substrate (701), the first scolding tin (702), power chip (703), resistance (704), driving chip
(705), lead frame (706), wiring (707), resin (708) composition.
A kind of 3. 16 pin high-density integrated circuit package structure according to claim 2, it is characterised in that：Described draws
Wire frame (706), driving chip (705), heat-radiating substrate (701), power chip (703) and resistance (704) are sealed in resin
(708) internal, the heat-radiating substrate (701) is fixed at resin (708) inner wall, and the power chip (703) fixation is set
Below heat-radiating substrate (701), the driving chip (705) is fixed at below lead frame (706).
A kind of 4. 16 pin high-density integrated circuit package structure according to claim 2, it is characterised in that：Described
One scolding tin (702) is fixed at heat-radiating substrate (701) lower left, and the resistance (704) is fixed at heat-radiating substrate (701)
Lower right, the resistance (704) are fixedly connected on power chip (703) and driving chip (705) by wiring (707),
The power chip (703) is fixedly connected on resistance (704) and the first scolding tin (702) by wiring (707).
A kind of 5. 16 pin high-density integrated circuit package structure according to claim 1, it is characterised in that：Described dissipates
Hot systems (503) are made of heat sink (5031), thermal vias (5032), radiating frame (5033), heat emission hole (5034), described
Radiating frame (5033) on plugged and fixed have multiple vertical heat sinks (5031), the heat sink (5031) seats against
On the left of bearing seat (504), the heat sink (5031) lower end is fixed with some thermal vias (5032), the heat dissipation
Through hole (5032) is arranged on heat sink (5031) longitudinal direction side by side, is formed on the radiating frame (5033) logical with heat dissipation
Hole (5032) corresponding heat emission hole (5034).
A kind of 6. 16 pin high-density integrated circuit package structure according to claim 2, it is characterised in that：The electricity
(704) are hindered by resistor main body (7041), metal layer (7042), insulating layer (7043), the second scolding tin (7044), groove (7045) group
Into the groove (7045) is interlocked with heat-radiating substrate (701) and being integrated molding structure.
A kind of 7. 16 pin high-density integrated circuit package structure according to claim 6, it is characterised in that：Described
Two scolding tin (7044) are fixed at groove (7045) both sides, the insulating layer (7043) be fixed at the second scolding tin (7044) with
Above groove (7045), the resistor main body (7041) is fixed above insulating layer (7043) and is used with it and is electrically connected,
The metal layer (7042) is fixed at resistor main body (7041) top both sides and is used with it and is electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711320641.5A CN107993990A (en) | 2017-12-12 | 2017-12-12 | A kind of 16 pin high-density integrated circuit package structures |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711320641.5A CN107993990A (en) | 2017-12-12 | 2017-12-12 | A kind of 16 pin high-density integrated circuit package structures |
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| CN107993990A true CN107993990A (en) | 2018-05-04 |
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| CN201711320641.5A Pending CN107993990A (en) | 2017-12-12 | 2017-12-12 | A kind of 16 pin high-density integrated circuit package structures |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111785698A (en) * | 2020-07-13 | 2020-10-16 | 杭州很美网络科技有限公司 | Integrated circuit packaging process |
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| CN200965876Y (en) * | 2006-10-19 | 2007-10-24 | 英业达股份有限公司 | Integrated circuit package structure |
| CN202042483U (en) * | 2011-02-25 | 2011-11-16 | 比亚迪股份有限公司 | Package structure of power semiconductor device |
| CN106098641A (en) * | 2016-06-20 | 2016-11-09 | 东莞市联洲知识产权运营管理有限公司 | A kind of integrated circuit package structure of high efficiency and heat radiation |
| CN106067451A (en) * | 2016-08-22 | 2016-11-02 | 王文庆 | A kind of heat dissipation type integrated circuit package structure |
| CN106328613A (en) * | 2016-08-22 | 2017-01-11 | 王文庆 | Integrated circuit package mechanism convenient to dissipate heat |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111785698A (en) * | 2020-07-13 | 2020-10-16 | 杭州很美网络科技有限公司 | Integrated circuit packaging process |
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Application publication date: 20180504 |