CN108878377B - Power module, manufacturing method thereof and air conditioner - Google Patents
Power module, manufacturing method thereof and air conditioner Download PDFInfo
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- CN108878377B CN108878377B CN201810695061.2A CN201810695061A CN108878377B CN 108878377 B CN108878377 B CN 108878377B CN 201810695061 A CN201810695061 A CN 201810695061A CN 108878377 B CN108878377 B CN 108878377B
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses a power module, a manufacturing method thereof and an air conditioner, wherein the power module comprises: the power assembly is arranged in the thermosetting packaging shell; the thermosetting packaging shell comprises a thermosetting plastic packaging material and a thermosetting filling material, wherein the softening point of the thermosetting plastic packaging material is smaller than that of the thermosetting filling material. The invention solves the problem that the rejection rate of the power module is increased due to the fact that air holes on a packaging shell cannot be repaired and poor manufacturing occurs because the manufacturing process of thermosetting plastic packaging is irreversible. The invention improves the yield of power module manufacture.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a power module, a manufacturing method thereof and an air conditioner.
Background
A Power module, i.e., an ipm (intelligent Power module), is a Power driving product combining Power electronics and integrated circuit technology, and is generally applied to an electronic control board for driving equipment such as a fan and a compressor.
The power module generally has a power component and a package casing for packaging the power component, and the package casing may be made of a thermoplastic material or a thermosetting material, and the thermosetting plastic package material cannot recover fluidity after being molded. However, after the power module is packaged, the outer wall surface of the package casing of the power module may have a package air hole. The packaging air holes cannot be repaired due to the irreversible manufacturing process of the thermosetting plastic package, poor manufacturing is caused, and the rejection rate of the power module is increased.
Disclosure of Invention
The invention mainly aims to provide a power module, a manufacturing method thereof and an air conditioner, and aims to improve the yield of the power module.
To achieve the above object, the present invention provides a power module, including:
a power component, and,
a thermoset package housing, the power component disposed within the thermoset package housing; wherein the content of the first and second substances,
the thermosetting packaging shell comprises a thermosetting plastic packaging material and a thermosetting filler, wherein the softening point of the thermosetting plastic packaging material is smaller than that of the thermosetting filler.
Optionally, the adding proportion of the thermosetting filler is 10% -15%.
Optionally, the thermoset package housing further comprises silica and/or alumina;
the thermoset filler is no larger in size than the silica and alumina.
Optionally, the thermosetting molding compound and the thermosetting filler are one or more of epoxy resin, polyurethane and phenolic resin.
Optionally, the power assembly comprises:
a mounting substrate;
an insulating layer disposed on the mounting substrate;
a circuit wiring layer formed on a surface of the insulating layer, the circuit wiring layer having a mounting site where an electronic component of the power module is mounted;
the power switch tube and the driving chip are respectively arranged on the corresponding installation positions of the circuit wiring layer.
Optionally, the mounting substrate is inside the package housing or at least partially exposed outside the thermosetting package housing.
Optionally, the outer side wall surface of the thermosetting packaging shell is further coated with a sealant.
The invention also provides a manufacturing method of the power module, which comprises the following steps:
preparing a mounting substrate, an insulating material, copper foil, a power switch tube, a driving chip, a plurality of pins and a thermosetting packaging shell material; the thermosetting packaging shell comprises a thermosetting plastic packaging material and a thermosetting filler, wherein the thermosetting packaging shell comprises the thermosetting plastic packaging material and the thermosetting filler, and the softening point of the thermosetting plastic packaging material is smaller than that of the thermosetting filler;
sequentially forming an insulating layer and a circuit wiring layer on the mounting substrate; arranging a mounting position for mounting an electronic element of the power module on the circuit wiring layer;
installing a power switch tube and a driving chip of a power module on the installation position corresponding to the circuit wiring layer;
welding a plurality of pins at positions corresponding to the circuit wiring layer, wherein the plurality of pins are connected with the corresponding power switch tubes and the corresponding driving chips through the circuit wiring layer to form a circuit board;
manufacturing a thermosetting plastic package;
heating the thermosetting packaging plastic package to a first preset temperature so as to package the mounting substrate, the circuit wiring layer, the power switch tube and the main control chip in a thermosetting plastic package shell formed by the thermosetting packaging plastic package when the thermosetting plastic package material in the thermosetting packaging shell plastic package is softened, thereby obtaining a power module;
and when the outer side wall surface of the thermosetting plastic package shell is detected to have air holes, heating the thermosetting plastic package shell to a second preset temperature so that the thermosetting filler is filled into the air holes when the thermosetting filler in the thermosetting plastic package part of the thermosetting package shell is softened.
Optionally, the manufacturing of the thermosetting package housing plastic package specifically includes:
mixing a thermosetting plastic packaging material and a thermosetting filler to form a first mixed material;
heating and cooling the first mixed material in sequence;
crushing the cooled first mixed material;
and rolling and forming the first mixed material by an ingot particle forming process to form the thermosetting shell plastic package part.
The invention also provides an air conditioner, which comprises the power module; the power module includes: a power assembly, and a thermoset package housing, the power assembly disposed within the thermoset package housing; the thermosetting packaging shell comprises a thermosetting plastic packaging material and a thermosetting filler, wherein the softening point of the thermosetting plastic packaging material is smaller than that of the thermosetting filler.
In the manufacturing process of the power module, the manufactured power assembly is placed into a die cavity, a thermosetting plastic package material and a thermosetting filler are mixed, and then the mixed thermosetting package shell material is heated; and after cooling, crushing the thermosetting packaging shell material, and then rolling and forming the thermosetting packaging shell material by an ingot particle forming process to form the thermosetting plastic packaging piece. And then heating the inside of the glue injection pipeline of the mould at high temperature, when the heating temperature reaches the softening point of the thermosetting plastic packaging material, enabling the thermosetting plastic packaging material to become a flowing state and be injected into the mould cavity, then heating the inside of the mould cavity again to be cured and molded to form a thermosetting packaging shell, and thus packaging the power component inside. And then, detecting whether the thermosetting packaging shell is provided with air holes through ultrasonic detection equipment, continuously heating the thermosetting packaging shell when the air holes are detected to exist until the thermosetting packaging shell reaches the softening point of the thermosetting filling material, so that the thermosetting filling material is converted from a solid phase to a flowing state, and secondarily filling the packaging air holes on the surface of the packaging shell by the softened thermosetting filling material to eliminate the packaging air holes. Then heating to curing temperature T3 again to post-cure molding forms thermosetting encapsulation casing to including power component encapsulation, and then realize that thermosetting encapsulation casing and power component are integrative to be set up. The invention solves the problem that the rejection rate of the power module is increased due to the fact that air holes on a packaging shell cannot be repaired and poor manufacturing occurs because the manufacturing process of thermosetting plastic packaging is irreversible. The invention improves the yield of power module manufacture.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a power module according to an embodiment of the invention;
fig. 2 is a schematic flow chart illustrating a manufacturing method of an intelligent power module according to an embodiment of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | |
14 | |
| 11 | |
20 | |
| 12 | |
30 | |
| 13 | Metal binding wire |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a power module.
Referring to fig. 1, in an embodiment of the present invention, the power module includes:
the power module 10, and,
a thermoset package housing 20, the power component 10 disposed within the thermoset package housing 20; wherein the content of the first and second substances,
the material of the thermosetting package housing 20 includes a thermosetting molding compound and a thermosetting filler, and the softening point T1 of the thermosetting molding compound is smaller than the softening point T2 of the thermosetting filler.
In this embodiment, the power module 10 includes a power switch tube and a driving chip for driving the power switch tube to operate, and in some embodiments, the power module 10 may further include a main control chip, and when the power module operates, the driving chip converts the control instruction into a corresponding driving signal when receiving the control instruction output by the main control chip, so as to drive the corresponding power switch tube to be turned on, thereby outputting the driving electric energy. The power switch tubes can be realized by MOS tubes or IGBT, the number of the power switch tubes is generally six or four, the six power switch tubes form a three-phase inverter bridge circuit, or the four power switch tubes form a two-phase inverter bridge circuit, and the three-phase inverter bridge circuit is used for driving loads such as a fan, a compressor and the like to work.
In the implementation process, the power module 10 further includes:
a mounting substrate 11;
and an insulating layer 14, wherein the insulating layer 14 is arranged on the mounting substrate 11.
A circuit wiring layer 12 formed on a surface of the insulating layer 14, the circuit wiring layer 12 having a mounting site for mounting an electronic component of the power module;
the circuit board comprises a power switch tube (not marked in the figure) and a driving chip (not marked in the figure), wherein the driving chip and the power switch tube are respectively arranged on the corresponding installation positions of the circuit wiring layer 12.
The power module further comprises a pin 30, wherein the pin 30 is arranged on the circuit wiring layer 12 and is electrically connected with the power element and the driving chip through the metal wire.
In this embodiment, the pins 30 may be gull-wing type or straight type, the pins 30 are soldered on the mounting substrate 11, and the circuit wiring layer 12 is located at the corresponding pad position on the mounting position.
After the driving chip, the main control chip and each power switch tube are arranged on the corresponding mounting position of the circuit wiring layer 12 by adopting a surface mounting process, the driving chip, the main control chip and each power switch tube can be electrically connected with the circuit wiring layer 12 through conductive materials such as soldering tin and the like, and a current loop is formed. The driving chip, the main control chip and each power switch tube can also be attached to the corresponding mounting position of the circuit wiring layer 12 through an inverted process, and a current loop is formed between the circuit wiring layer 12 and each circuit element through the metal binding wires 13, so that the manufacturing of the power module circuit board is completed. It can be understood that the electronic components in the power switching tubes, the driving chip, and the main control chip may be implemented by using a bare wafer, or may be implemented by using a packaged patch element.
The mounting substrate 11 may be implemented by a substrate made of a material such as a lead frame, a paper board, a half glass fiber board, or a glass fiber board, or may be implemented by a metal substrate made of aluminum or an aluminum alloy, copper or a copper alloy, or a ceramic substrate made of aluminum oxide (Al2O3) or aluminum nitride (AlN), or a substrate made of another material having high heat conductivity and heat dissipation properties. This embodiment is preferably implemented using a glass fiber board. The shape of the mounting substrate 11 may be determined according to the number and positions of the circuit wiring layers 12 and the power switching tubes, and the specific positions and sizes of other electronic components in the power module, and may be a square shape, but is not limited to a square shape.
The circuit wiring layer 12 is formed by forming corresponding lines and corresponding mounting positions, i.e., pads, for mounting each electronic component on the mounting substrate 11 according to a circuit design of the power module, specifically, after the insulating layer 14 is provided on the mounting substrate 11, a copper foil is laid on the insulating layer 14, and the copper foil is etched according to a preset circuit design, thereby forming the circuit wiring layer 12. Of course, in other embodiments, for example, when the mounting substrate 11 is implemented by a ceramic substrate, the circuit wiring layer 12 is directly provided on the surface of the ceramic substrate or embedded in the ceramic substrate without providing the insulating layer 14.
In this embodiment, the thermosetting package housing 20 is made of thermosetting molding compound and thermosetting filler, and the thermosetting molding compound may be one of epoxy resin, polyurethane, and phenolic resin or a mixture of multiple materials of epoxy resin, polyurethane, and phenolic resin; the thermosetting filler can be one of epoxy resin, polyurethane and phenolic resin or a mixture of multiple materials of epoxy resin, polyurethane and phenolic resin, and the addition proportion of the thermosetting filler is 10-15%.
Referring to fig. 1, in some embodiments, the thermosetting plastic package housing further includes a high thermal conductivity material with good insulation property such as silicon dioxide and aluminum oxide, and the high thermal conductivity material can improve the heat transfer capability of the thermosetting plastic package housing 20 according to the characteristics of good heat resistance and good thermal conductivity, so as to improve the heat dissipation efficiency of the power module.
In the present embodiment, the softening point is also understood to be a temperature at which the thermosetting material is converted from a solid phase to a molten state. That is, in the process of high-temperature heating, when the softening point of the thermosetting material is reached, the state of the thermosetting material is changed from a solid state to a flowing state, so that the thermosetting material can be injected into the thermosetting plastic package shell mold after the mold is opened after the thermosetting material is heated at high temperature, and the thermosetting plastic package shell can be obtained. In this embodiment, the softening point T1 of the thermosetting plastic molding compound is smaller than the softening point T2 of the thermosetting filler, and after heating at a high temperature, the thermosetting plastic molding compound reaches the softening point T1 of the thermosetting plastic molding compound, so that the thermosetting plastic molding compound is changed from a solid state to a fluid state, and at this time, the thermosetting filler still maintains a solid state because the thermosetting plastic molding compound does not reach the softening point T2 of the thermosetting filler.
When the thermosetting package housing 20 is manufactured, materials such as epoxy resin, polyurethane, phenolic resin, alumina, silica and the like can be mixed, and then the mixed material of the thermosetting package housing 20 is heated; after cooling, the thermosetting packaging shell 20 material is crushed, and then the thermosetting packaging shell 20 material is roll-formed by an ingot particle forming process to form a thermosetting plastic packaging piece. Afterwards, the manufactured power module circuit board can be placed into a mold cavity, the thermosetting plastic package member is heated at high temperature in a glue injection pipeline of the mold, when the heating temperature reaches the softening point T1 of the thermosetting plastic package material in the thermosetting plastic package member, the thermosetting plastic package material becomes a flowing state and is injected into the mold cavity, and then the thermosetting plastic package material is heated again to the curing temperature T3 in the mold cavity to be cured and molded to form the thermosetting package housing 20, so that the power assembly 10 is packaged in the power assembly, and the thermosetting package housing 20 and the power assembly 10 are integrally arranged.
Note that the thermosetting molding compound cannot recover fluidity after molding. Therefore, when the thermosetting package case 20 of the power module is integrally disposed with the power module 10, that is, after the power module is packaged, the package air holes 100 may exist on the outer side wall surface of the package case of the power module. External water vapor, dust and the like may enter the power module through the air hole 100, so that the driving chip, the main control chip and each power switch tube in the power module have short-circuit and other faults, and the power module cannot work normally. Or, the normal operation of the power module is affected by external electromagnetic wave interference due to the air hole 100. The packaging air hole 100 cannot be repaired due to the irreversible manufacturing process of the thermosetting plastic package, and poor manufacturing occurs, so that the rejection rate of the power module is increased.
In order to solve the above problems, in the process of manufacturing the power module of the present invention, the manufactured power module 10 is placed in a mold cavity, and a thermosetting molding compound and a thermosetting filler are mixed, and then the mixed material of the thermosetting packaging shell 20 is heated; after cooling, the thermosetting packaging shell 20 material is crushed, and then the thermosetting packaging shell 20 material is rolled and formed by an ingot particle forming process to form a thermosetting plastic packaging piece. And then heating the thermosetting plastic package material in the glue injection pipeline of the mould at high temperature, when the heating temperature reaches the softening point T1 of the thermosetting plastic package material, enabling the thermosetting plastic package material to be in a flowing state and injected into the mould cavity, and then heating the thermosetting plastic package material in the mould cavity again to be cured and molded to form the thermosetting packaging shell 20, thereby packaging the power component 10 in the thermosetting packaging shell. Afterwards, whether the thermosetting packaging shell 20 has the air holes 100 or not can be detected through ultrasonic detection equipment, when the existence of the air holes 100 is detected, the thermosetting packaging shell 20 is continuously heated until the softening point of the thermosetting filling material is reached, so that the thermosetting filling material is converted from a solid phase to a flowing state, and the softened thermosetting filling material secondarily fills the packaging air holes 100 on the surface of the packaging shell to eliminate the packaging air holes 100. And then heating to the curing temperature T3 again to perform post-curing molding, so as to form the thermosetting package housing 20, thereby encapsulating the power assembly 10, and thus realizing that the thermosetting package housing 20 and the power assembly 10 are integrally arranged. The invention solves the problem that the rejection rate of the power module is increased due to the fact that the air hole 100 formed in the packaging shell cannot be repaired and the manufacturing is poor because the manufacturing process of the thermosetting plastic package is irreversible. The invention improves the yield of power module manufacture.
It is understood that in the above embodiments, the softening point T1 of the thermosetting molding compound, the softening point T2 of the thermosetting filler and the curing temperature T3 have the following relationship, T1< T2< T3; T1-T3 is the temperature range of the thermosetting plastic package material from complete softening to post-curing, and T2-T3 is the temperature range of the thermosetting filler from complete softening to post-curing. The temperature range of T1 is 175-185 ℃, the temperature range of T2 is 180-190 ℃, and the temperature range of T3 is 195-200 ℃.
Referring to fig. 1, in an alternative embodiment, the thermoset package housing 20 further comprises silica and/or alumina;
the thermoset filler is no larger in size than the silica and alumina.
In this embodiment, silica and alumina are also disposed in the thermosetting plastic package housing and are highly thermally conductive materials, so as to increase the heating rate of the power module, and the silica and alumina are macromolecular particles, and in the packaging process, in order to enable the thermosetting filler to be smoothly filled in the mold, most of the thermosetting filler exists in the form of micro particles, and the size of the thermosetting filler is equal to that of the silica and alumina particles, but not greater than that of the silica and alumina, and in this embodiment, the size of the thermosetting filler is selected to be the same as that of the thermosetting plastic package material.
Referring to fig. 1, in an alternative embodiment, the mounting substrate 11 is inside the package housing or at least partially exposed outside the thermosetting package housing 20.
In this embodiment, when the mounting substrate 11 is located inside the thermosetting packaging casing 20, the heat generated by the driving chip, the main control chip and each power switch tube is conducted to the mounting substrate 11 through the insulating layer 14, then conducted to the thermosetting packaging casing 20 through the mounting substrate 11, and conducted to the air through the thermosetting packaging casing 20, so as to accelerate the heat dissipation rate of the power module. Or one side of the mounting substrate 11 is partially or completely exposed outside the thermosetting packaging shell 20, so that heat generated by the driving chip, the main control chip and each power switch tube is conducted to the mounting substrate 11 through the insulating layer 14, and then is directly radiated to the air through the mounting substrate 11, thereby further increasing the contact area between the heat and the air and improving the radiating rate.
Referring to fig. 1, in an alternative embodiment, in order to eliminate the air holes 100 on the thermosetting encapsulating shell 20, a sealant may be further coated on the outer side wall surface of the thermosetting encapsulating shell 20 to form a sealing layer on the outer side wall surface of the thermosetting encapsulating shell 20.
Specifically, after the power module 10 is packaged and the thermosetting package housing 20 and the power module 10 are integrally arranged, if it is detected that the surface of the thermosetting package housing 20 has the air hole 100, a high-fluidity sealant may be coated on the surface of the power module having the package air hole 100, then the power module coated with the sealant is placed in a low vacuum environment, the high-fluidity sealant fills the package air hole 100, and is continuously heated to the post-curing temperature T3, so as to realize curing at a high temperature, and the package air hole 100 is sealed for heat curing.
The invention also provides a manufacturing method of the power module.
Referring to fig. 2, the method for manufacturing the power module includes the following steps:
s10, preparing a mounting substrate, an insulating material, a copper foil, a power switch tube, a plurality of pins and a thermosetting packaging shell material; the thermosetting packaging shell comprises a thermosetting plastic packaging material and a thermosetting filler, wherein the thermosetting packaging shell comprises the thermosetting plastic packaging material and the thermosetting filler, and the softening point of the thermosetting plastic packaging material is smaller than that of the thermosetting filler;
in this embodiment, the power module mainly includes a mounting substrate, a power switch, a driver chip, and a package housing.
S20, sequentially forming an insulating layer and a circuit wiring layer on the mounting substrate; arranging a mounting position for mounting an electronic element of the power module on the circuit wiring layer;
an insulating material is laid on the mounting substrate to form an insulating layer.
The circuit wiring layer forms corresponding current routing lines and mounting positions, namely bonding pads, corresponding to the power element mounting on the insulating layer according to the circuit design of the power module.
Specifically, a copper foil is laid on the upper surface of the thermal substrate, and the copper foil is etched in accordance with a preset circuit design to form a circuit wiring layer.
S30, mounting the power switch tube and the driving chip of the power module on the mounting position corresponding to the circuit wiring layer;
installing a power switch tube of a power module on the installation position corresponding to the circuit wiring layer;
the driving chip, the main control chip and each power switch tube can be attached to the corresponding mounting position of the circuit wiring layer through a surface mounting or flip-chip process, and a current loop is formed between the circuit wiring layer and each circuit element through the metal binding wires, so that the manufacture of the power module circuit board is completed. It can be understood that the electronic components in the power switching tubes, the driving chip, and the main control chip may be implemented by using a bare wafer, or may be implemented by using a packaged patch element.
S40, welding a plurality of pins at positions corresponding to the circuit wiring layer, wherein the pins are connected with the corresponding power switch tubes and the corresponding driving chips through the circuit wiring layer to form a circuit board;
the pins can be gull-wing type or straight insertion type, the metal wires can be aluminum wires or gold wires, and the driving chip is electrically connected with the power element through the metal wires and the circuit wiring layer.
S50, manufacturing a thermosetting plastic package;
in this embodiment, the manufacturing of the thermosetting encapsulation housing plastic package specifically includes:
mixing a thermosetting plastic packaging material and a thermosetting filler to form a first mixed material;
heating and cooling the first mixed material in sequence;
crushing the cooled first mixed material;
and rolling and forming the first mixed material by an ingot particle forming process to form the thermosetting shell plastic package part.
S60, heating the thermosetting packaging plastic package to a first preset temperature so as to package the mounting substrate, the circuit wiring layer, the power switch tube and the main control chip in a thermosetting plastic package shell formed by the thermosetting packaging plastic package when the thermosetting plastic package material in the thermosetting packaging shell plastic package is softened, and obtaining a power module;
in this embodiment, the first predetermined temperature is the softening point of the thermosetting molding compound, i.e. the temperature at which the thermosetting material is transformed from the solid phase to the molten state. The thermosetting plastic packaging material is changed into a flowing state and is injected into the die cavity, and then the thermosetting plastic packaging material is heated to the curing temperature T3 in the die cavity again to be cured and molded to form the thermosetting packaging shell, so that the power component is packaged in the thermosetting packaging shell, and the thermosetting packaging shell and the power component are integrally arranged.
And S70, when the air holes are detected on the outer side wall surface of the thermosetting plastic package shell, heating the thermosetting plastic package shell to a second preset temperature so that the thermosetting filler is filled into the air holes when the thermosetting filler in the thermosetting plastic package shell is softened.
In this embodiment, whether the thermosetting encapsulation shell has the air holes or not can be detected by the ultrasonic detection device, and when the air holes are detected, the thermosetting encapsulation shell is continuously heated until the softening point of the thermosetting filling material is reached, so that the thermosetting filling material is converted from a solid phase to a flowing state, and the softened thermosetting filling material secondarily fills the encapsulation air holes on the surface of the encapsulation shell to eliminate the encapsulation air holes. And then heating to the curing temperature T3 again, maintaining the temperature within the temperature range of T2-T3, softening the thermosetting filling material, realizing secondary filling of the packaging air holes, preserving heat for a long time (10-20 minutes), and completely curing and molding the thermosetting filling material to form a thermosetting packaging shell, so that the power component is packaged in the thermosetting packaging shell, and further realizing the integral arrangement of the thermosetting packaging shell and the power component.
It can also be understood that when no packaging air hole is detected on the thermosetting packaging shell, the temperature of the thermosetting packaging shell is only required to be maintained within T1-T3 for long-time heat preservation and solidification.
The invention improves the yield of power module manufacture.
The invention also provides an air conditioner which comprises the power module. The detailed structure of the power module can refer to the above embodiments, and is not described herein again; it can be understood that, because the power module is used in the air conditioner of the present invention, the embodiment of the air conditioner of the present invention includes all technical solutions of all embodiments of the power module, and the achieved technical effects are also completely the same, and are not described herein again.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A power module, characterized in that the power module comprises:
a power component, and,
a thermoset package housing, the power component disposed within the thermoset package housing; the thermosetting packaging shell comprises a thermosetting packaging material and a thermosetting filling material, wherein the softening point of the thermosetting packaging material is smaller than that of the thermosetting filling material, and the thermosetting filling material is used for secondary filling of the thermosetting packaging shell formed by curing the thermosetting packaging material.
2. The power module of claim 1, wherein the thermosetting filler is added in a proportion of 10% to 15%.
3. The power module of claim 1, wherein the thermoset package housing further comprises silica and/or alumina;
the particle size of the thermoset filler is no greater than the particle size of the silica and the alumina.
4. The power module of claim 1 wherein the thermoset molding compound and thermoset filler is one or more of an epoxy, a polyurethane, and a phenolic.
5. The power module of claim 1, wherein the power component comprises:
a mounting substrate;
an insulating layer disposed on the mounting substrate;
a circuit wiring layer formed on a surface of the insulating layer, the circuit wiring layer having a mounting site where an electronic component of the power module is mounted;
the power switch tube and the driving chip are respectively arranged on the corresponding installation positions of the circuit wiring layer.
6. The power module of claim 5 wherein the mounting substrate is inside the thermoset package housing or a portion of the mounting substrate is exposed outside the thermoset package housing.
7. The power module of any one of claims 1 to 6 wherein the exterior side wall of the thermoset package housing is further coated with a sealant.
8. A method for manufacturing a power module is characterized by comprising the following steps:
preparing a mounting substrate, an insulating material, copper foil, a power switch tube, a driving chip, a plurality of pins and a thermosetting packaging shell material; the thermosetting packaging shell material comprises a thermosetting plastic packaging material and a thermosetting filler, wherein the softening point of the thermosetting plastic packaging material is smaller than that of the thermosetting filler;
sequentially forming an insulating layer and a circuit wiring layer on the mounting substrate; arranging a mounting position for mounting an electronic element of the power module on the circuit wiring layer;
installing a power switch tube and a driving chip of a power module on the installation position corresponding to the circuit wiring layer;
welding a plurality of pins at positions corresponding to the circuit wiring layer, wherein the plurality of pins are connected with the corresponding power switch tubes and the corresponding driving chips through the circuit wiring layer to form a circuit board;
manufacturing a thermosetting plastic package;
heating the thermosetting plastic package to a first preset temperature so as to package the mounting substrate, the circuit wiring layer, the power switch tube and the driving chip in a thermosetting package shell formed by the thermosetting plastic package when the thermosetting plastic package in the thermosetting plastic package is softened, thereby obtaining a power module;
when the air holes are detected on the outer side wall surface of the thermosetting packaging shell, the thermosetting packaging shell is heated to a second preset temperature, so that when the thermosetting filling material in the thermosetting packaging shell is softened, the thermosetting filling material is filled into the air holes.
9. The method for manufacturing a power module according to claim 8, wherein the manufacturing of the thermosetting plastic-molded component specifically includes:
mixing a thermosetting plastic packaging material and a thermosetting filler to form a first mixed material;
heating and cooling the first mixed material in sequence;
crushing the cooled first mixed material;
and carrying out roll forming on the first mixed material by an ingot particle forming process to form the thermosetting plastic package.
10. An air conditioner characterized by comprising the power module according to any one of claims 1 to 7.
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| US8148829B2 (en) * | 2009-12-30 | 2012-04-03 | Stmicroelectronics Pte Ltd. | Self repairing IC package design |
| CN102807757A (en) * | 2012-07-31 | 2012-12-05 | 烟台德邦先进硅材料有限公司 | Organic silica gel used for packaging IGBT (insulated gate bipolar translator) module, and preparation method of organic silica gel |
| US9431274B2 (en) * | 2012-12-20 | 2016-08-30 | Intel Corporation | Method for reducing underfill filler settling in integrated circuit packages |
| JP5975911B2 (en) * | 2013-03-15 | 2016-08-23 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
| CN104890325B (en) * | 2014-03-03 | 2017-02-08 | 中国科学院上海硅酸盐研究所 | Protective coating for thermoelectric material or thermoelectric device |
| CN105968808B (en) * | 2016-07-05 | 2018-08-24 | 苏州大学 | A kind of self-repair resin based composites and preparation method thereof |
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