CN106328613A - Integrated circuit package mechanism convenient to dissipate heat - Google Patents
Integrated circuit package mechanism convenient to dissipate heat Download PDFInfo
- Publication number
- CN106328613A CN106328613A CN201610703405.0A CN201610703405A CN106328613A CN 106328613 A CN106328613 A CN 106328613A CN 201610703405 A CN201610703405 A CN 201610703405A CN 106328613 A CN106328613 A CN 106328613A
- Authority
- CN
- China
- Prior art keywords
- bearing seat
- heat sink
- load bearing
- heat dissipation
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Ceramic Engineering (AREA)
Abstract
The invention discloses an integrated circuit package mechanism convenient to dissipate heat. The integrated circuit package mechanism comprises a substrate, wherein a heat dissipation plate is fixedly arranged on the substrate, a plurality of heat dissipation frame bodies are formed on the heat dissipation plate and encircle in a layer-by-layer way, a rectangular bearing seat is fixedly arranged at the middle of the heat dissipation frame body, a rectangular placing hole is formed in the center of the bearing seat, an integrated circuit chip is inserted into the placing hole, a plurality of heat sinks are inserted into and fixedly arranged on the heat dissipation frame body at an inner side of the heat dissipation plate, a plurality of heat dissipation through holes are formed in a lower end of each heat sink and communicate with an upper end surface of the heat dissipation plate, a plurality of connection holes are formed in the bearing seat, heat dissipation holes are formed in the heat dissipation frame bodies at two sides of the heat dissipation plate, a plurality of embedded grooves are formed in the upper end surface of the heat dissipation plate and transversely pass through the corresponding connection holes, the heat dissipation through holes and the heat dissipation holes, a cooling liquid pipe is embedded into the embedded grooves, a heat conduction ceramic ring sleeves an outer wall of the middle part of the cooling liquid pipe, and the integrated circuit chip props against the heat conduction ceramic ring. By the integrated circuit package mechanism, rapid heat dissipation can be achieved, and the service lifetime of an integrated circuit is prolonged.
Description
Technical field:
The present invention relates to the technical field of integrated circuit, be specifically related to a kind of integrated antenna package machine being easy to heat radiation
Structure.
Background technology:
Electronic industry constantly reduces the size of electronic component, and continues to increase function on electronic component so that integrated electricity
Function and the complexity on road constantly promote.And this trend also orders about the encapsulation technology of integrated circuit component towards small size, high foot
Several and high electricity/thermal efficiency direction is developed, and meets predetermined industrial standard.Owing to high-effect integrated circuit component produces higher
Heat, and existing compact package technology only provides designer fraction of cooling mechanism, it is therefore desirable in the envelope that it is small-sized
Designing radiator structure on assembling structure so that realizing heat radiation, extending the service life of integrated circuit, existing compact package structure
On the radiating effect of radiator structure undesirable.
Summary of the invention:
The purpose of the present invention aims to solve the problem that the problem that prior art exists, it is provided that one can realize quick heat radiating, extends collection
Become the integrated antenna package mechanism being easy to heat radiation in the service life of circuit.
The present invention relates to a kind of integrated antenna package mechanism being easy to heat radiation, including substrate, described substrate is fixed with scattered
Hot plate, described heat sink forms the radiating frame of multiple cincture layer by layer, described radiating frame be fixedly arranged in the middle of rectangle
Load bearing seat, the center of described load bearing seat forms the placement hole of rectangle, and IC chip is plugged in described placement hole, described
Form groove on the radiating frame of heat sink two opposite sides, four sides of described load bearing seat all form extension board, holds
Carry on seat relative to one group of extension board be plugged in described groove, on load bearing seat relative to another group extension board be plugged on heat sink
On the radiating frame of inner side；
On radiating frame inside described heat sink, grafting is fixed with multiple vertical fin, the lower end of described fin
Form some thermal vias being connected with heat sink upper surface, described load bearing seat forms some and described thermal vias
Corresponding connecting hole, the radiating frame of heat sink both sides forms the louvre corresponding with thermal vias, on heat sink
End face forms some and sets groove, described in set groove cross correspondence connecting hole, thermal vias and louvre, set recessed
Being equipped with coolant pipe in groove, the lower end of described coolant pipe is embedded in setting groove, upper end is exposed and set groove, coolant
Being arranged with thermal conductive ceramic ring on the middle part outer wall of pipe, IC chip is pressed against on described thermal conductive ceramic ring, coolant pipe
Two ends pass the radiating frame on heat sink and connection has buffering connecting tube, described buffering connecting tube is arranged with multiple graphite and dissipates
Hot ring.
By technique scheme, in use, IC chip is arranged in the placement hole of load bearing seat also the present invention
Being pressed against on thermal conductive ceramic ring, in coolant pipe, circulation has coolant, the heat that IC chip is produced by thermal conductive ceramic ring
Passing to the coolant in coolant pipe, to realize heat radiation, the coolant through heat exchange flows out coolant pipe and flows through buffering
Connecting tube, coolant is dispelled the heat by the graphite radiating ring in buffering connecting tube, and the coolant recovering cooling flows into again coolant
In pipe, IC chip is dispelled the heat by circulation, thus improves radiating efficiency.Fin is positioned at the heat radiation frame inside heat sink
On body, the heat produced IC chip further dispels the heat.The radiating frame of " returning " character form structure on heat sink,
Improve radiating efficiency, the radiating frame of thermal vias unplugged " time " the font mechanism on louvre the most thereon and fin
Channel for heat dissipation, thus realize air circulation, it is achieved high efficiency and heat radiation.
By such scheme, the integrated antenna package mechanism of the present invention can realize the quick heat radiating to IC chip,
Thus extend the service life of integrated circuit.
As such scheme a kind of preferably, on described load bearing seat relative to one group of extension board be plugged in described groove also
Forming relative two side plate, described side plate is fixed on pedestal and is resisted against the outer wall of the peripheral radiating frame of heat sink
On, the lateral wall of side plate is fixed with some stitch.
One as such scheme is preferred, described side plate is plugged with capping, the upper surface of side plate forms grafting
Groove, the bottom surface of described capping forms two grafting bars, described grafting bar sleeve respectively in corresponding inserting groove, grafting bar
Forming the first protection board on the closure skirt of side, described first protection board is located at outside described stitch, and the two ends of capping become
Type has two the second protection boards, described second protection board to be located at outside heat sink, and the bottom of the second protection board forms some arcs
Shape draw-in groove, described coolant pipe holding is in corresponding arc-shaped slot.
One as such scheme is preferred, and described buffering connecting tube is in " Contraband " font, and the two ends of buffering connecting tube are respectively
The two ends stretching out heat sink with coolant pipe are connected, and described graphite radiating ring is uniformly set in buffering connecting tube, and graphite dissipates
The inwall of hot ring is close to the outer wall buffering connecting tube, and one end of buffering connecting tube is provided with cooling liquid inlet, the other end is provided with circulation
Force (forcing) pump.By such scheme, coolant, institute can be added in buffering connecting tube and coolant pipe by described cooling liquid inlet
Stating circulation force (forcing) pump makes coolant circulate in circulation in coolant pipe and buffering connecting tube.
One as such scheme is preferred, is fixed with stem grafting if setting on the load bearing seat of described IC chip both sides
Point, described stitch and contact lay respectively on the dual-side of load bearing seat, stitch and contact electrical connection, the upper end of IC chip
If forming dry contact on face, described contact is electrically connected with described contact by wire.
One as such scheme is preferred, and the thermal vias on described fin is disposed side by side on the longitudinal direction side of fin
Upwards.
As such scheme a kind of preferably, the fin of the inner side on the radiating frame inside described heat sink against
On the extension board of load bearing seat.
One as such scheme is preferred, and the bottom surface of the extension board of described load bearing seat side is located in the same horizontal plane,
And the bottom surface of load bearing seat is less than the bottom surface of extension board.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of description, below with presently preferred embodiments of the present invention and coordinate accompanying drawing describe in detail as after.
Accompanying drawing illustrates:
The following drawings is only intended to, in schematically illustrating the present invention and explaining, not delimit the scope of the invention.Wherein:
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the sectional view of Fig. 1；
Fig. 3 is that the present invention is without partial structurtes schematic diagram during load bearing seat；
Fig. 4 is the structural representation of capping in the present invention；
Fig. 5 is the partial structurtes schematic diagram in the present invention between the second protection cap and coolant pipe；
Fig. 6 is the sectional view of line A-A in Fig. 1.
Detailed description of the invention:
Below in conjunction with the accompanying drawings and embodiment, the detailed description of the invention of the present invention is described in further detail.Hereinafter implement
Example is used for illustrating the present invention, but is not limited to the scope of the present invention.
Seeing Fig. 1 to Fig. 3, a kind of integrated antenna package mechanism being easy to heat radiation of the present invention, including substrate 10, institute
State and on substrate, be fixed with heat sink 20, described heat sink forms the radiating frame 21 of multiple cincture layer by layer, described heat radiation frame
The load bearing seat 30 being fixedly arranged in the middle of rectangle of body, the center of described load bearing seat forms the placement hole 31 of rectangle, ic core
Sheet 1 is plugged in described placement hole 31, and the radiating frame 21 of described heat sink 20 two opposite sides forms groove 211, described
All forming extension board 32 on four sides of load bearing seat 30, the bottom surface of described extension board is located in the same horizontal plane, and carrying
The bottom surface of seat 30 less than the bottom surface of extension board 32, on load bearing seat 30 relative to one group of extension board 32 be plugged in described groove 211,
On load bearing seat 30 relative to another group extension board 32 be plugged on the radiating frame 21 inside heat sink 20.
Seeing Fig. 1, Fig. 2, on the radiating frame 21 inside described heat sink 20, grafting is fixed with multiple vertical fin
40, the fin 40 of described inner side is resisted against on the extension board 32 of load bearing seat 30, if the lower end of described fin 40 forms
The dry thermal vias 41 being connected with heat sink 20 upper surface, described thermal vias is disposed side by side on the longitudinal direction of fin 40
On, described load bearing seat 30 forms the connecting hole 33 that some and described thermal vias 41 is corresponding, dissipating of heat sink 20 both sides
Forming the louvre 212 corresponding with thermal vias 41 in hot framework 21, heat sink 20 upper surface forms some and sets
Groove 22, described in set groove cross correspondence connecting hole 33, thermal vias 41 and louvre 212, set in setting groove 22
Have coolant pipe 50, the lower end of described coolant pipe be embedded in set in groove 22, upper end is exposed and is set groove 22, coolant pipe
Being arranged with thermal conductive ceramic ring 60 on the middle part outer wall of 50, IC chip 1 is pressed against on described thermal conductive ceramic ring 60, coolant
The two ends of pipe 50 pass the radiating frame 21 on heat sink 20 and connection has buffering connecting tube 70, sheathed in described buffering connecting tube
There is multiple graphite radiating ring 80.
See Fig. 1, Fig. 2, on described load bearing seat 30 relative to one group of extension board 32 be plugged on described groove 211 in and molding
Having relative two side plate 34, described side plate is fixed on pedestal 10 and is resisted against outside the radiating frame 21 of heat sink 20 periphery
On wall, the lateral wall of side plate 34 is fixed with some stitch 90, the load bearing seat 30 of described IC chip 1 both sides is set solid
If surely there being dry contact 91, described stitch 90 and contact 91 lay respectively on the dual-side of load bearing seat 30, stitch 90 and contact 91 electricity
Connecting, if forming dry contact 11 on the upper surface of IC chip 1, described contact is electrically connected with described contact 91 by wire
Connect.
See Fig. 1, Fig. 4, Fig. 5, described side plate 34 is plugged with capping 100, the upper surface of side plate 34 forms grafting
Groove 341, the bottom surface of described capping 100 forms two grafting bars 101, and described grafting bar sleeve respectively is at corresponding inserting groove
In 341, capping 100 side of grafting bar 101 side forming the first protection board 102, described first protection board is located at institute
Stating outside stitch 90, the two ends of capping 100 form two the second protection boards 103, and described second protection board is located at heat sink 20
Outward, the bottom of the second protection board 103 forms some arc-shaped slots 104, and the holding of described coolant pipe 50 is at corresponding arc card
In groove 104.
See Fig. 1, Fig. 6, described buffering connecting tube 70 in " Contraband " font, buffering connecting tube 70 two ends respectively with coolant
Pipe 50 stretches out the two ends of heat sink 20 and is connected, and described graphite radiating ring 80 is uniformly set in buffering connecting tube 70, and graphite dissipates
The inwall of hot ring 80 is close to the outer wall buffering connecting tube 70, and one end of buffering connecting tube 70 is provided with cooling liquid inlet 71, the other end
It is provided with circulation force (forcing) pump 72.
The present invention in the specific implementation, in IC chip 1 is arranged on the placement hole 31 of load bearing seat 30 and be pressed against and lead
On thermal Ceramics ring 60, the inner circulation of coolant pipe 50 has coolant, and the heat that IC chip 1 is produced by thermal conductive ceramic ring 60 passes
Passing the coolant in coolant pipe 50, to realize heat radiation, the coolant through heat exchange flows out coolant pipe 50 and flows through slow
Rushing connecting tube 70, coolant is dispelled the heat by the graphite radiating ring 80 in buffering connecting tube 70, and the coolant recovering cooling flows again
In entering coolant pipe 50, IC chip 1 is dispelled the heat by circulation, thus improves radiating efficiency.Fin 40 is positioned at heat sink
On radiating frame 21 inside 20, the heat produced IC chip 1 further dispels the heat." returning " on heat sink 20
The radiating frame 21 of character form structure, improves radiating efficiency, the thermal vias 41 on louvre 212 the most thereon and fin 40
The channel for heat dissipation of the radiating frame 21 of unplugged " time " font mechanism, thus realize air circulation, it is achieved high efficiency and heat radiation.
In sum, the integrated antenna package mechanism of the present invention can realize the quick heat radiating to IC chip, thus
Extend the service life of integrated circuit.
The integrated antenna package mechanism being easy to heat radiation provided by the present invention, the only detailed description of the invention of the present invention, but
Protection scope of the present invention is not limited thereto, and any those familiar with the art is at the technology model that the invention discloses
In enclosing, change can be readily occurred in or replace, all should contain within scope.Therefore, protection scope of the present invention
Should be as the criterion with described scope of the claims.
Claims (8)
1. it is easy to an integrated antenna package mechanism for heat radiation, including substrate (10), it is characterised in that:
It is fixed with heat sink (20) on described substrate (10), described heat sink forms the radiating frame of multiple cincture layer by layer
(21), the load bearing seat (30) being fixedly arranged in the middle of rectangle of described radiating frame, the center of described load bearing seat forms the peace of rectangle
Putting hole (31), IC chip (1) is plugged in described placement hole (31), the heat radiation frame of described heat sink (20) two opposite sides
Form groove (211) on body (21), four sides of described load bearing seat (30) all form extension board (32), load bearing seat
(30) upper one group of relative extension board (32) is plugged in described groove (211), and upper another the relative group of load bearing seat (30) extends
Plate (32) is plugged on the radiating frame (21) of heat sink (20) inner side；
The upper grafting of radiating frame (21) of described heat sink (20) inner side is fixed with multiple vertical fin (40), described heat radiation
The lower end of sheet forms some thermal vias (41) being connected with heat sink (20) upper surface, the upper molding of described load bearing seat (30)
There is the connecting hole (33) that some and described thermal vias (41) is corresponding, the upper molding of the radiating frame (21) of heat sink (20) both sides
Having the louvre (212) corresponding with thermal vias (41), heat sink (20) upper surface forms some and sets groove (22),
Described groove of setting crosses connecting hole (33), thermal vias (41) and the louvre (212) of correspondence, sets in setting groove (22)
Having coolant pipe (50), the lower end of described coolant pipe is embedded in setting groove (22), upper end is exposed and set groove (22), cold
But being arranged with thermal conductive ceramic ring (60) on the middle part outer wall of liquid pipe (50), IC chip (1) is pressed against described thermal conductive ceramic
On ring (60), the two ends of coolant pipe (50) pass the radiating frame (21) on heat sink (20) and connection has buffering connecting tube
(70), described buffering connecting tube is arranged with multiple graphite radiating ring (80).
The integrated antenna package mechanism being easy to heat radiation the most according to claim 1, it is characterised in that: described load bearing seat (30)
Go up in one group of the most relative extension board (32) is plugged on described groove (211) and form relative two side plate (34), described side
Plate is fixed on pedestal (10) and above and is resisted against on the outer wall of the peripheral radiating frame (21) of heat sink (20), the outside of side plate (34)
Some stitch (90) it are fixed with on wall.
The integrated antenna package mechanism being easy to heat radiation the most according to claim 2, it is characterised in that: on described side plate (34)
It is plugged with capping (100), the upper surface of side plate (34) forms inserting groove (341), molding on the bottom surface of described capping (100)
Have two grafting bars (101), described grafting bar sleeve respectively in corresponding inserting groove (341), the envelope of grafting bar (101) side
Forming the first protection board (102) on lid (100) side, described first protection board is located at described stitch (90) outward, capping
(100) two ends form two the second protection boards (103), and described second protection board is located at heat sink (20) outward, and second protects
The bottom of backplate (103) forms some arc-shaped slots (104), and described coolant pipe (50) holding is at corresponding arc-shaped slot
(104) in.
The integrated antenna package mechanism being easy to heat radiation the most according to claim 1, it is characterised in that: described buffering connecting tube
(70) in " Contraband " font, the two ends that heat sink (20) is stretched out with coolant pipe (50) respectively in the two ends of buffering connecting tube (70) are connected
Connecing, described graphite radiating ring (80) is uniformly set in buffering connecting tube (70), and the inwall of graphite radiating ring (80) is close to buffering
The outer wall of connecting tube (70), one end of buffering connecting tube (70) is provided with cooling liquid inlet (71), the other end is provided with circulation force (forcing) pump
(72)。
The integrated antenna package mechanism being easy to heat radiation the most according to claim 2, it is characterised in that: described ic core
(1) sheet both sides load bearing seat (30) if on set and be fixed with dry contact (91), described stitch (90) and contact (91) lay respectively at
On the dual-side of load bearing seat (30), stitch (90) and contact (91) electrical connection, the upper surface of IC chip (1) forms
If dry contact (11), described contact is electrically connected with described contact (91) by wire.
The integrated antenna package mechanism being easy to heat radiation the most according to claim 1, it is characterised in that: described fin (40)
On thermal vias (41) be disposed side by side on the longitudinal direction of fin (40).
The integrated antenna package mechanism being easy to heat radiation the most according to claim 1, it is characterised in that: described heat sink (20)
The fin (40) of the inner side on the radiating frame (21) of inner side is resisted against on the extension board (32) of load bearing seat (30).
The integrated antenna package mechanism being easy to heat radiation the most according to claim 1, it is characterised in that: described load bearing seat (30)
The bottom surface of the extension board (32) of side is located in the same horizontal plane, and the bottom surface of load bearing seat (30) is less than the end of extension board (32)
Face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610703405.0A CN106328613B (en) | 2016-08-22 | 2016-08-22 | A kind of integrated antenna package mechanism convenient for heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610703405.0A CN106328613B (en) | 2016-08-22 | 2016-08-22 | A kind of integrated antenna package mechanism convenient for heat dissipation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106328613A true CN106328613A (en) | 2017-01-11 |
| CN106328613B CN106328613B (en) | 2018-10-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610703405.0A Active CN106328613B (en) | 2016-08-22 | 2016-08-22 | A kind of integrated antenna package mechanism convenient for heat dissipation |
Country Status (1)
| Country | Link |
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| CN (1) | CN106328613B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993990A (en) * | 2017-12-12 | 2018-05-04 | 王孝裕 | A kind of 16 pin high-density integrated circuit package structures |
| CN109346418A (en) * | 2018-10-10 | 2019-02-15 | 李婵珊 | A kind of encapsulation of embedded chip and packaging method |
| CN109378301A (en) * | 2018-10-10 | 2019-02-22 | 邵金容 | A kind of chip packing-body and preparation method |
| CN110203494A (en) * | 2019-06-03 | 2019-09-06 | 黄浩瑞 | A kind of Feed Manufacturing radiator |
| WO2023129092A1 (en) * | 2021-12-31 | 2023-07-06 | Sabanci Üniversitesi | Integrated circuit systems cooled by embedded microtubes |
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| JPH06275752A (en) * | 1993-03-18 | 1994-09-30 | Hitachi Ltd | Cooling device for semiconductor device |
| US20070069369A1 (en) * | 2005-09-02 | 2007-03-29 | Foxconn Technology Co., Ltd. | Heat dissipation device and method for making the same |
| CN102456637A (en) * | 2010-10-26 | 2012-05-16 | 钰桥半导体股份有限公司 | Semiconductor chip assembly with post/base heat spreader and cavity over post |
| CN204516749U (en) * | 2015-04-15 | 2015-07-29 | 江苏晟芯微电子有限公司 | A kind of semiconductor package of pin type heat radiation |
-
2016
- 2016-08-22 CN CN201610703405.0A patent/CN106328613B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06275752A (en) * | 1993-03-18 | 1994-09-30 | Hitachi Ltd | Cooling device for semiconductor device |
| US20070069369A1 (en) * | 2005-09-02 | 2007-03-29 | Foxconn Technology Co., Ltd. | Heat dissipation device and method for making the same |
| CN102456637A (en) * | 2010-10-26 | 2012-05-16 | 钰桥半导体股份有限公司 | Semiconductor chip assembly with post/base heat spreader and cavity over post |
| CN204516749U (en) * | 2015-04-15 | 2015-07-29 | 江苏晟芯微电子有限公司 | A kind of semiconductor package of pin type heat radiation |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993990A (en) * | 2017-12-12 | 2018-05-04 | 王孝裕 | A kind of 16 pin high-density integrated circuit package structures |
| CN109346418A (en) * | 2018-10-10 | 2019-02-15 | 李婵珊 | A kind of encapsulation of embedded chip and packaging method |
| CN109378301A (en) * | 2018-10-10 | 2019-02-22 | 邵金容 | A kind of chip packing-body and preparation method |
| CN110203494A (en) * | 2019-06-03 | 2019-09-06 | 黄浩瑞 | A kind of Feed Manufacturing radiator |
| WO2023129092A1 (en) * | 2021-12-31 | 2023-07-06 | Sabanci Üniversitesi | Integrated circuit systems cooled by embedded microtubes |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106328613B (en) | 2018-10-16 |
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Effective date of registration: 20180829 Address after: 314000 188 Tea Garden Road, tanker town, Xiuzhou District, Jiaxing, Zhejiang Applicant after: ZHEJIANG JINYUAN INDUSTRIAL Co.,Ltd. Address before: 523000 A1112, Huai Kai square, Yuan Mei Road, Nancheng District, Dongguan, Guangdong Applicant before: Wang Wenqing |
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Effective date of registration: 20230814 Address after: No. 1 Electronic Information Industry Park, Qingzhen Economic Development Zone, Xiagaojian Group, Zhanjie Town, Qingzhen City, Guiyang City, Guizhou Province, 551404 Patentee after: Guizhou Zhongxin Microelectronics Technology Co.,Ltd. Address before: 314000 188 Tea Garden Road, tanker town, Xiuzhou District, Jiaxing, Zhejiang Patentee before: ZHEJIANG JINYUAN INDUSTRIAL Co.,Ltd. |
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