CN107926134A - 车载控制装置 - Google Patents

车载控制装置 Download PDF

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Publication number
CN107926134A
CN107926134A CN201680046296.8A CN201680046296A CN107926134A CN 107926134 A CN107926134 A CN 107926134A CN 201680046296 A CN201680046296 A CN 201680046296A CN 107926134 A CN107926134 A CN 107926134A
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mentioned
circuit substrate
heat sink
sink material
component
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铃木和弘
石井利昭
河合义夫
金子裕二朗
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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Abstract

本发明提供具备使从半导体元件等电子器件产生的热量向箱体的外部散出的散热构造的发动机控制单元、自动变速器用控制单元等搭载于车辆的廉价且可靠性优异的树脂密封型车载电子控制装置。具备电路基板、与上述电路基板对置设置的部件、安装于上述电路基板与上述部件之间的发热电子器件、设于上述发热电子器件与上述部件之间的散热材料、以及对上述电路基板和上述发热电子器件进行密封的密封树脂，在上述部件的在与上述电路基板之间未设置上述散热材料的部位，设有该部件与上述电路基板的间隔比该部件与上述发热电子器件之间设有上述散热材料的部位更窄的部位。

Description

车载控制装置
技术领域
本发明涉及搭载于车辆的电子控制装置。
背景技术
在发动机控制单元、自动变速器用控制单元等搭载于车辆的电子控制装置的箱体内组装有大量运算处理装置、半导体元件等发热的电子器件，内部温度容易上升。因此，开发出使电子器件所产生的热量向装置的箱体传递，并从箱体的表面向箱体外释放的散热构造(例如，专利文献1)。
并且，近年来，搭载于汽车的电子控制装置的热环境变得越来越严重。背景中，因从现有的车室内置向发动机室、发动机上变更设置场所，从而有电子控制装置暴露于更高的温度、因电子控制装置的小型化而每单位体积的发热量增加的状况。另外，伴随这样的搭载环境变化，要求电子控制装置的耐振动、耐冲击性的等级变高。
现有技术文献
专利文献
专利文献1：日本特开2014-187063号公报
发明内容
发明所要解决的课题
为了确保耐热、耐振动、耐冲击性，成为利用树脂来密封电子器件和电路基板的整体树脂密封结构是有利的，但若在日本特开2014-187063号公报公开的结构中保持原样地应用树脂密封方法，则产生如下的问题。
用于散出发热器件的发热的散热材料(尤其是散热脂膏之类的柔软性材料的情况)因树脂流而流动或者变形，从而无法实现在设计中作为目标的散热性。
在树脂密封方法中，一般的流程为：将由安装有连接器、各种器件的控制电路基板、散热基座构成的构造体放置于金属模具，并从金属模具的树脂注入孔注入已熔融的树脂，使树脂在金属模具内硬化，之后将其取出。该注入树脂由于具有设定好的压力和流速，因而进行密封的部件需要具有承受该树脂流的强度。若强度不足，则构成部件发生破坏或变形、不良情况，从而无法确保正常的功能。因此，在散热材料使用柔软性材料的情况下产生上述那样的问题。
并且，在现有的树脂密封方法中，树脂向控制电路基板上的发热器件的搭载部等狭窄的缝隙的填充变得不充分，从而接合部的可靠性确保产生问题。
并且，在现有的树脂密封方法中，因树脂流的影响而控制电路基板产生变形，在搭载器件残留应力，从而对可靠性带来不好影响。
本发明的目的是在树脂密封型车载控制装置中提供排除上述的与树脂密封相关的问题、廉价且可靠性较高的车载控制装置。
用于解决课题的方案
为了实现上述目的，本发明的代表性车载控制装置之一具备：电路基板；，与上述电路基板对置设置的部件；安装于上述电路基板上的上述部件侧的发热电子器件；设于上述发热电子器件与上述部件之间的散热材料；以及对上述电路基板和上述发热电子器件进行密封的密封树脂，上述部件与上述电路基板之间的间隔在未设有上述散热材料的范围内的至少一部分比设有上述散热材料的范围窄。
发明的效果如下。
根据本发明的结构，使用硬软任意的散热材料都能够进行树脂密封。并且，能够在发热器件周围的狭窄的缝隙填充树脂。并且，能够排除伴随树脂密封时的基板变形而产生的残留应力，其结果，能够提供廉价且可靠性较高的树脂密封型车载控制装置。
附图说明
图1是本发明的车载控制装置的示意剖视图。
图2是本发明的车载控制装置的示意剖视图。
图3是示出现有的车载控制装置的一个例子的示意剖视图。
图4是示出本发明的散热金属基座的散热材料配置结构的示意剖视图。
图5是示出本发明的车载控制装置的散热金属基座突起部的示意剖视图以及立体图。
图6是示出本发明的车载控制装置的散热金属基座突起部的高度的示意剖视图。
图7是示出本发明的车载控制装置的组装工序的示意剖视图。
图8是示出本发明的车载控制装置的组装工序的示意剖视图。
图9是示出本发明的车载控制装置的散热金属基座突起部的效果的示意剖视图。
图10是示出本发明的车载控制装置的散热金属基座突起部的效果的示意剖视图。
图11是示出本发明的车载控制装置的散热金属基座突起部的效果的示意剖视图。
图12是示出本发明的车载控制装置的散热金属基座突起部的结构的示意剖视图以及立体图。
图13是本发明的车载控制装置的示意剖视图。
具体实施方式
以下，基于附图对本发明的实施例进行说明。
图3是示出上述散热构造的示意剖视图。在搭载于控制电路基板40的发热电子器件42与散热金属基座10之间配置散热材料50，来自发热电子器件42的发热经由散热材料50向散热金属基座传递，并向箱体外散热。作为上述散热材料，使用散热脂膏。散热脂膏在涂覆后也保持粘性，能够抑制应力集中于发热电子器件的焊锡接合部。但是，如上所述，保持原样地应用于对电子控制装置进行树脂密封的结构还留有课题。以下，具体地使用附图对能够解决这样的课题的方案进行说明。
(第一实施方式)
图1是本发明的第一实施方式的车载控制装置的剖视图。图4是将图1的发热电子器件周围的局部构造抽取来示出的图。作为本发明的结构，能够是图4的(A)、(B)、(C)。图4的(A)是在散热金属基座10的相当于发热电子器件42下部的区域设置凹入部并在此配置有散热材料50的结构。图4的(B)是在图4(A)的凹入部周围设有突起部的结构。图4的(C)是没有图4的(B)的凹入部而留有突起部的结构。
图1中示出应用了图4的(C)的结构。图7示出该组装工序。
图7的(1)示出散热金属基座，例如由铝压铸材料等形成，但也可以使用其它金属材料。
本实施例的主要特征之一在于：在散热金属基座10形成有突起部11。在本实施例中，突起部11与散热金属基座一体形成。作为突起部11的形状，能够应用各种形状，图5示出多个例子。仅在(A)的情况下记载立体图。突起部的截面形状能够呈各种形状，并不限定于图5所示例子。
如图7的(2)所示，在散热金属基座10的突起部11内侧的空间填充散热材料50。为了将散热材料50留在突起部11内侧空间，至少突起部的散热金属基座侧连接部形成为无间断地包围的形状。作为散热材料50，能够选择各种材料，例如能够举出柔软性的散热脂膏或散热硅酮凝胶、导热性硅酮粘接剂、硬的导热性有机树脂材料等，但并不限定于这些材料。均处于未硬化状态。散热材料的填充量能够根据目的能够调节。由于能够以填充至突起部内侧空间的量来调节散热材料量，所以能够以所需最小量来管理比较昂贵的散热材料，从而有利于低成本化。边将搭载连接器30、基板面安装小型器件亦即例如电阻、电容器、二极管、IC、FET、晶体管等各种电子器件41、发热电子器件42的控制电路基板40进行对位，边将其放置于填充有散热材料50的散热金属基座并进行固定(图7的(3))。图7的(3)虽未示出控制电路基板40的固定构造，但能够应用包括螺纹固定、粘接、热铆接在内的各种方法。此时，需要散热材料50与发热器件42接触、或者对发热器件42进行密封。散热材料50的硬化也能够应用各种方法。在加热硬化性的情况下，在图7的(3)的阶段中，也可以添入加热硬化工序进行处理，也可以在之后的加热模制工序中同时进行硬化。也能够使用湿气硬化性、紫外线硬化性等加热硬化性以外的材料，适当地追加硬化工序即可。
接下来，经由模制工序而最终得到图7的(4)(与图1相同)的树脂密封型车载控制装置。图8示出模制工序的一个例子。将图7的(3)的构造体放置于金属模具(图8的(A)、(B))。在该状态下，例如从图8的(B)的箭头所示的方向向金属模具内注入熔融树脂，进行树脂密封。注入树脂是加热熔融并以规定的压力设定而流动的树脂流，而且在加热硬化前以填充金属模具缝隙所需的流速流动。因此，被其密封的部件需要具有承受上述树脂流的强度。
尤其需要注意发热电子器件42周围的散热材料50。对于散热材料50而言，能够根据目的而应用从柔软性材料至硬的材料为止的各种材料，但在使用柔软的材料的情况下，在直接接触树脂流的环境中，散热材料有流动或者变形的可能性。在散热材料50使用硬的材料的情况下，即使向现有例的结构保持原样地注入树脂，如图13的(A)所示，能够实现正常的树脂密封状态。但是，在散热材料使用柔软性材料的情况下，如图13的(B)所示，在树脂注入时散热材料流动而发热电子器件42的散热路径产生异常。
图9是抽取发热电子器件的周围来示出上述的状况的图。图9的(A-1)是向现有例的结构保持原样地注入树脂的情况，但在柔软性散热材料的情况下散热材料因树脂流而流动，变成(A-2)的状态，无法实现在设计中作为目标的散热性。与此相对，在本发明的结构(B-1)的情况下，对于散热金属基座10与控制电路基板40之间的间隔而言，未设置散热材料50的范围的至少一部分形成突出的突起部，其比设有散热材料50的范围内的间隔窄。由此，散热金属基座突起部作为防波堤发挥功能，从而能够保护散热材料不受树脂流的影响。以上，对图4的(C)的结构的情况进行了说明，但即使是图4的(A)、(B)的结构的情况，由于形成凹部，从而散热金属基座10与控制电路基板40之间的间隔在设有散热材料40的范围比未设置散热材料40的范围宽，树脂流不会直接与散热材料接触，从而能够期待与上述相同的效果。
根据本实施例，由于在散热金属基座设置凹入部、突起部，并在其内侧填充散热材料，所以能够节约散热材料量而有利于低成本化，并且进行保护而使树脂流不直接与散热材料接触，因而散热材料能够应用柔软性材料。
(第二实施方式)
本实施例是使第一实施方式的散热金属基座突起部为图10的(B)、(C)、(D)的形状的情况。散热金属基座突起部的高度能够应用图6所示的各种例子，并且分别能够期待的效果的内容产生不同。图6的(A)是第一实施方式所记载的效果，图6的(B)是本实施例的情况。图2示出利用图6的(B)的结构进行树脂密封的情况的实施方式的车载控制装置的剖视图。由于突起部高度较高，所以能够填充更多的散热材料50，能够将散热材料50配置成还覆盖发热电子器件引线部，因而能够进一步提高散热效果。
如图10的(A)所示，在发热电子器件42的控制电路基板40侧的搭载部存在较多引线间或器件之下等由狭窄的缝隙构成的区域，有树脂无法充分地遍及的可能性。若在利用焊锡等接合的器件搭载部存在缝隙，则因温度循环等的应力而在接合部产生疲劳，从而有导致功能不全的担忧。因此，需要在狭窄的缝隙也充分地填充树脂。若使本发明的散热金属基座突起部为图10的(B)、(C)、(D)的形状，并成为向器件之下缝隙部引导树脂流的结构，则除了在第一实施方式中所述的散热材料保护的效果之外，还能够确保向狭窄的缝隙填充树脂的树脂填充性。对于散热金属基座突起部的形状而言，若能够具有相同的效果，则不限定于上述形状。
根据本实施例，除了散热材料节约、保护的效果之外，在发热电子器件周围的狭窄的缝隙也能够充分地填充树脂，因而能够实现可靠性较高的树脂密封状态。
(第三实施方式)
本实施例是使第一实施方式的散热金属基座突起部为图11的(B-1)的形状的情况。散热金属基座突起部的高度能够应用图6所示的各种例子，并且分别能够期待的效果产生不同。图6的(A)具有第一实施方式所记载的散热材料节约、保护的效果，图6的(B)除了第二实施方式所记载的散热材料节约、保护的效果还具有确保向狭窄的缝隙填充树脂的树脂填充性的效果，图6的(C)是本实施例的情况。
如图11的(A-2)、(A-3)所示，在对控制电路基板40的两面进行树脂密封的情况下，根据成形条件不同，有控制电路基板40两侧的树脂流的平衡崩塌而在控制电路基板产生变形的情况。认为变形的方向根据成形条件而如图11的(A-2)以及(A-3)所示那样的情况。在图11的(A-1)所示的结构的情况下，从左侧注入的树脂流更容易在障碍物较少的控制电路基板上部流动，流量会变多。在该情况下，首先树脂集中于树脂流入部附近，之后依次向内部流动，在这样的状况下，预料图11的(A-2)所示的上凸形状的控制电路基板变形。另一方面，在树脂滞留在中央部那样的状况下，预料图11的(A-3)所示的变形。伴随该控制电路基板变形，在发热电子器件的控制电路基板搭载部(焊锡接合部)也会残留应力，其结果，对发热电子器件的可靠性产生不好影响，因而需要抑制树脂密封时的控制电路基板变形。无论哪一种情况都是因控制电路基板上侧的树脂流所带来的力所致的变形，阴而若成为本发明的图11的(B-1)所示的散热金属基座突起部与控制电路基板的下表面接触来进行支撑的结构，则成为短跨度地克服树脂所带来的力结构，因此能够抑制发热电子器件42周围的控制电路基板变形。若成为使本发明的散热金属基座突起部为图11的(B-1)的形状并使突起部与控制电路基板接触来进行支撑的结构，则除了能够得到在第一实施方式说明的散热材料保护的效果和在第二实施方式中说明的确保向狭窄的缝隙填充树脂的树脂填充性的效果之外，能够抑制树脂密封时的控制电路基板变形。
作为散热金属基座突起部的形状能够是各种形状，图12示出一个例子。与控制电路基板接触来对该基板进行支撑的突起部分需要如图12的(H)所示的三点以上，但若是确保了树脂流路的形状，则并不限定于此。在图12的(A)～(H)所示的各种形状中，突起部的最高部是与控制电路基板接触的部分，比其低的区域作为树脂流路发挥功能。
根据本实施例，除了散热材料节约、保护的效果和确保向狭窄的缝隙填充树脂的树脂填充性的效果之外，还能够抑制树脂密封时的控制电路基板变形，从而能够实现可靠性更高的树脂密封状态。
(第四实施方式)
本实施例是使散热金属基座的突起部为与散热基座分体的部件的情况。能够应用于上述第一～第三实施例中的任一实施例。作为突起部的材质，能够从与散热金属基座相同的材料、其它金属材料、树脂材料、玻璃或陶瓷等无机材料等进行选择。预先由上述材料形成突起构造体，并将其固定于散热金属基座的相当的位置。作为固定方法，选择包括粘接、熔敷、摩擦接合等在内的适当的方法。并且，也可以将膏状的材料以分配方法等在散热金属基座的规定位置形成突起形状，之后使之硬化或者固化。
根据本实施例，即使因设计变更而改变发热电子器件的搭载位置，也能够灵活地对应。
符号的说明
10—散热金属基座，11—突起部，20—密封罩，30—连接器，31—金属端子，40—控制电路基板，41—电子器件，42—发热电子器件，50—散热材料，60—下金属模具，61—上金属模具，62—可动金属模具部件，63—金属模具部件，70—密封树脂，80—防水过滤器，90—粘接剂。

Claims (7)

1.一种车载控制装置，其特征在于，具备：
电路基板；
部件，其与上述电路基板对置设置；
发热电子器件，其安装于上述电路基板上的上述部件侧；
散热材料，其设于上述发热电子器件与上述部件之间；以及
密封树脂，其对上述电路基板和上述发热电子器件进行密封，
上述部件与上述电路基板之间的间隔在未设有上述散热材料的范围内的至少一部分比设有上述散热材料的范围窄。
2.根据权利要求1所述的车载控制装置，其特征在于，
上述部件在未设有上述散热材料的范围内的至少一部分具备向上述电路基板侧突出的突出部，
因上述突出部，上述部件与上述电路基板之间的间隔在未设有上述散热材料的范围内的至少一部分比设有上述散热材料的范围窄。
3.根据权利要求2所述的车载控制装置，其特征在于，
上述突出部以包围上述发热器件的方式形成为无间断的形状。
4.根据权利要求2或3所述的车载控制装置，其特征在于，
上述突出部比上述部件与上述发热电子器件之间的间隔长且向上述电路基板侧突出。
5.根据权利要求2至4任一项中所述的车载控制装置，其特征在于，
上述突出部至少在三处与上述电路基板接触。
6.根据权利要求1至5任一项中所述的车载控制装置，其特征在于，
上述散热材料是选自导热性树脂、导热性粘接剂、导热性脂膏、导热性凝胶中的任一种材料。
7.根据权利要求2至6任一项中所述的车载控制装置，其特征在于，
上述突出部由与上述部件分体的部件构成。
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