CN107848221A - Desktop 3 D-printing equipment - Google Patents

Desktop 3 D-printing equipment Download PDF

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Publication number
CN107848221A
CN107848221A CN201680047106.4A CN201680047106A CN107848221A CN 107848221 A CN107848221 A CN 107848221A CN 201680047106 A CN201680047106 A CN 201680047106A CN 107848221 A CN107848221 A CN 107848221A
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CN
China
Prior art keywords
dielectric layer
layer
method described
transparency
processing
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Granted
Application number
CN201680047106.4A
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Chinese (zh)
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CN107848221B (en
Inventor
康纳·麦科马克
芬坦·麦科马克
马克·博伊兰
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FINITE ENGINEERING SOLUTIONS
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FINITE ENGINEERING SOLUTIONS
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Priority claimed from GB1510582.8A external-priority patent/GB2539644A/en
Priority claimed from GBGB1522744.0A external-priority patent/GB201522744D0/en
Application filed by FINITE ENGINEERING SOLUTIONS filed Critical FINITE ENGINEERING SOLUTIONS
Publication of CN107848221A publication Critical patent/CN107848221A/en
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Publication of CN107848221B publication Critical patent/CN107848221B/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/141Processes of additive manufacturing using only solid materials
    • B29C64/147Processes of additive manufacturing using only solid materials using sheet material, e.g. laminated object manufacturing [LOM] or laminating sheet material precut to local cross sections of the 3D object
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/188Processes of additive manufacturing involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/205Means for applying layers
    • B29C64/218Rollers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/205Means for applying layers
    • B29C64/223Foils or films, e.g. for transferring layers of building material from one working station to another
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00Auxiliary operations or equipment, e.g. for material handling
    • B33Y40/20Post-treatment, e.g. curing, coating or polishing

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)

Abstract

A kind of method from multiple dielectric layers manufacture 3D objects is provided, including:Dielectric layer is handled to limit the layer of 3D objects, the processing includes:Dielectric layer is cut with the profile of confining layers;Print media layer is with the color of confining layers.The processing of cutting and printing including dielectric layer is completed in common reference plane, and multiple dielectric layers are processed and combined to form object in structure position.

Description

Desktop 3 D-printing equipment
Technical field
The application is related to a kind of integrated 2D and 3D printing to form the desk device of 3D objects.
Background technology
Rapid prototyping is defined as the increasing material manufacturing controlled by computer, because being by increasing material rather than passing through removal Or reduce the Conventional processing methods of material and manufacture object.It is appreciated that term " quick " is a relative terms, but it is one The individual term in the art with specific meanings, arrived the reason is that one three-dimensional article finished product of construction will expend a few houres Several days, method and the size and complexity of model used by being specifically dependent upon.It is known in rapid prototyping field The method of use has many kinds.It is layered object manufacture(LOM)It is rapid prototyping(RP)One form of which, be related to will scribble it is viscous Paper, plastics or the metal laminate plate of mixture stack gradually, and are then in turn bonded together them and with cutter or laser Cutting machine cutting forming.
LOM is similar to other rapid prototyping technologies, generally involves the three-dimensional using object/part to be manufactured(3D)Meter Calculation machine Computer Aided Design(CAD), thus generate stereolithography in CAD software bag(STL)The file of file or other suitable forms. Stl file is handled, also, practically along Z axis at the thickness that the thickness with used base material matches This document is cut.A series of cross sections of the part are so just formd, also, each cross section is at any specific height It is respectively provided with simple two dimension(2D)Profile.It can draw 2D profiles using profiling or cutting equipment and thus be cut on slice raw material Cut out shape.In LOM, each individually thin slice self can be stacked and bonded, to generate 3D object finished products.It is more being formed After individual medium object layer, profiling and layer binder-treatment are performed.Multiple layers are bonded together, and are then carried out profiling or are removed Journey, it includes removing unwanted backing material in stacking from print media to show 3D printing objects.Profiling, stacking and bonding The order of technique can exchange.Each layer can also use conventional 2D printing technology to be printed.These layers can be Single or double printing, and with monochrome(Such as use black ink)Printing, or printed with multiple color.Furthermore, it is possible to Use more coloured paper.
In LOM manufactures, generally, 3D objects finished product is formed by the stacking of single dielectric layer, and the single dielectric layer is by group Close with profiling to form desired final geometry.It can print before the Assembly Phase of manufacture or handle each Jie in addition Matter layer.
Therefore, multiple 3D objects dielectric layers can be printed to think to form 3D printing object finished product and prepare.3D printing thing The whole layer of body, which stacks, offline in print module to be printed in advance, afterwards can be by the stacked load of printing to profiling and layer Bond in module, wherein each printable layer can complete the manufacture of 3D printing object by profiling with bonding.
The alignment of the image printed on the opposite side of print media layer, to prepare to sort and be assembled into final 3D objects Aspect, it is possible that problem.If the order for the printed sheet that the input as 3-D printers provides is incorrect, it is also possible to goes out Existing problem.Some printers can be used for manufacturing coloured part.In one approach, it is, for example, possible to use ticker tape.In another kind In method, for example, colored ink can be printed onto on every paper, or can be by image printing to every paper, Ran Houke Printed sheet to be loaded into the part that the generation of printer is cut and bonded.
It should be appreciated that the use of ticker tape and/or colored ink and the printing of image may further increase 3D The complexity of printer and/or 3D printing process.
The Consideration of selection 3D printer includes speed, the selection of material and color capabilities, the quality of final products, beats Print precision.
The cost of raw material is reduced using paper in SDL, but is changed as needed there is still a need for developing one kind and having Operating efficiency, precision, the printer of flexibility entered, and the color body for improving quality is provided.
Therefore, it is necessary to solve some problems present in the 3D printing process and system of rapid prototyping.The application is intended to A kind of improved method for manufacturing colored objects is provided.This specification is also directed to a kind of improved 3D printing system.
The content of the invention
A kind of method from multiple dielectric layers manufacture 3D objects is provided according to specification, including:
To limit the layer of 3D objects, the processing includes-processing dielectric layer:
Dielectric layer is cut with the profile of confining layers;
Print media layer is with the color of confining layers;
Wherein processing includes, and the cutting and printing of dielectric layer are completed in common reference plane,
Wherein, multiple dielectric layers are processed and combined to form object in structure position.
In one arrangement, print media layer includes the one side of print media layer.Print media layer includes applying in ink To the upper surface of dielectric layer.In one arrangement, print media layer includes, and is being joined with cutting dielectric layer with limiting profile identical Examine in plane and apply ink to dielectric layer.
Advantageously, the processing of dielectric layer is cut and printed including the use of one group of common reference point or a common reference point Dielectric layer.The processing of dielectric layer is included in structure opening position In situcut and printing is applied to the last dielectric layer of construction. Correspondingly, dielectric layer cutting and printing can be completed in single reference planes.Party's law regulation, structure can be added to Each dielectric layer is handled on the position of construction in room successively.Printing can include applying ink relative to the cutting of profile. Ink can be applied to dielectric layer on the same plane that profile is cut.This method, which may further include, is cutting and is printing Dielectric layer is attached to construction before dielectric layer.The processing of profiling, cutting and bonding including application can be in a reference Completed in plane.The processing, which may further include, applies adhesive to dielectric layer.Adhesive can be with cutting and printing It is applied in identical reference planes on dielectric layer.Cutting may include to cut exterior contour.Cutting also includes cutting in-profile.
Advantageously, all paper layer profiling operations are carried out in a common reference planes(That is, adhesive is applied Add, colour print, shape cutting, paper laminate and waste paper remove).This provides the multiple processes relevant with sheet-fed, then Continue executing with the multiple processes relevant with lower a piece of paper.
Applying ink to dielectric layer includes applying ink to the selected part of dielectric layer.Apply ink to dielectric layer Surface including being in a first direction dielectric layer(The surface of X-Y plane/face-up)Upper application ink.Dielectric layer is included by medium The longitudinal cross-section of the surface restriction of layer and the lateral cross limited by the thickness or depth of dielectric layer.The application of ink is can Control to control the amount and depth of the ink in the first longitudinal direction of dielectric layer or direction and/or the second transverse direction.Ink can be by Apply to limit ink layer on the direction of the plane in dielectric layer or the plane parallel to dielectric layer.Apply ink to Jie Matter layer, which is included in the second direction at a right angle substantially with first direction, applies ink.Applying ink to dielectric layer includes inciting somebody to action Ink is applied to the cut edge of dielectric layer.Apply ink with the lateral cross of dielectric layer(Through depth or thickness or depth A part for degree or thickness)Upper limit stand oil ink ribbon.Applying ink to dielectric layer may include that control is applied to the specific of dielectric layer Or position and the amount of the ink of selected part.This method also includes change ink and/or change medium to change printing and color. In an arrangement, the trap of dielectric layer is changed.In another arrangement, the property of ink is changed.In fact, printing can be with Controlled and changed to realize final products according to color requirement.
In an arrangement, method is additionally included in the selected part of dielectric layer or position forms barrier layer.Applied by control Barrier material or reflecting material is added to form barrier layer.Apply epoxide resin material by controlling to form barrier layer.Preferably It is that barrier layer or reflecting layer are adjacent to ink layer.Selection and the ink on control dielectric layer and the relative position of barrier layer as needed Put, to produce the final object with color and outward appearance.Method can also include applying a surfactant to dielectric layer.Method can Also include the medium that offer is pre-processed with surfactant.Method can also include applying transparency processing so that the dielectric layer of object Selected part it is transparent.Handled by spraying or being immersed in transparent material by object to apply transparency.Barrier layer defines Boundary layer and resulting borderline region.
In one arrangement, barrier layer defines the barrier to transparency processing.In another kind is arranged, transparency processing It is configured as penetrating the desired depth of one or more dielectric layers.
Layer exterior contour can confining layers part to be printed.The part to be printed of the in-profile confining layers of layer.
Multiple dielectric layers are included according to the 3D objects that the method for specification manufactures, and dielectric layer defines the outside of object Layer or outer surface, in this case, ink is printed or is applied on the surface of dielectric layer.Or during dielectric layer limits Interbed so that only the marginal portion of dielectric layer limits the surface of object, in this case, ink is applied or printed to close Outwardly and inwardly in a part for the dielectric layer of profile.
In one arrangement, each dielectric layer can be from roll form(in roll form)Cut on the medium of offer. In this case in a kind of arrangement, the exterior contour of only dielectric layer is cut from media roll.In another kind is arranged, Ke Yicong Exterior contour fringing is cut on media roll.When cutting dielectric layer from the medium provided in roll form, medium is transmitted for Waste material, surplus material or medium are removed, and allows to cut next dielectric layer from medium.The size and form of each dielectric layer Can according to object form and/or by cutting profile limited and change.Which advantageously provide the reduction of waste material.This is favourable Ground additionally provides the reduction of the processing to dielectric layer because only those.
It is understood that in alternative arrangement, dielectric layer can be cut from the medium provided with sheet form.This In the case of preferred arrangement in, the exterior contour of dielectric layer is cut from piece, and waste material by from structure position convey.Another In kind arrangement, exterior contour fringing can be cut from medium.The size and form of each dielectric layer can be according to objects Form and/or by cutting profile limited and change.
Preferably, 3D objects are deposited by selective layering(SDL)To be formed.
Advantageously, the method for this specification provides each dielectric layer of object and located respectively successively in structure position Reason.It is favourable that the control related to once individually handling each dielectric layer and processing requirement, which are reduced,.Decreasing to be presented Time of the layer to be handled.The thing followed is the raising of quality and precision.
It is used to handle multiple individually dielectric layers to form three-dimensional according to one kind is on the other hand provided(3D)The 3D of object is beaten Print system,
The system includes structure module, and structure module defines processing dielectric layer to form the structure position of object layer,
Wherein, system includes
Cutter device, in the profile of structure position cutting dielectric layer, and
Printing equipment, in structure position print media layer in the form of limiting object layer and color,
Adhesive bringing device, dielectric layer is applied adhesive in structure opening position,
Wherein, each dielectric layer, the common reference plane of the structure position restriction processing dielectric layer are handled in structure position.
Preferably, 3D objects are deposited by selective layering(SDL)To be formed.
The system also includes adhering device, for dielectric layer to be bonded into structure object, adhering device bag in structure position Rubbing board or roller.
The system provides multiple dielectric layers successively or continuously in structure opening position, to limit the multiple of the object built Layer.
The system may include conveying device, for medium to be transported into structure position, to cut the wheel of dielectric layer from medium It is wide.
Cutter device is configured to cut the exterior contour of dielectric layer.The system includes adaptive construction device, wherein, from Jie The exterior contour of the dielectric layer of matter cutting depends on the size of object layer built and form and adaptively changed.Cutting Device is configured to the in-profile from medium cutting dielectric layer.Building module also includes being used for the root at the selected part of dielectric layer The barrier bringing device of barrier layer is formed according to needing.The system can also include controller, controlling profile and/or printing and/or Barrier layer is formed in dielectric layer.Printing equipment can be configured in a first direction print media layer to apply ink to dielectric layer In the part on surface.Printing equipment, which can be configured to print in the second direction at a right angle substantially with the surface of dielectric layer, to be situated between Matter layer.Printing equipment can be configured to the cut edge of print media layer.Surface can print in a first direction, and cut edge Print in a second direction.The system is can configure, so that handling each dielectric layer successively in structure position to limit object layer Shape and/or form and/or color.
According on the other hand, there is provided a kind of side for being constructed by the 3D objects for handling multiple individually dielectric layers and manufacturing Method,
Handling each dielectric layer includes
Equipment of-the offer as any one of preceding claims
Medium is transported to structure object by the-structure opening position in room is built
- medium is pressed onto on structure object using heating plate or pressure roll is applied with the previous of adhesive so that medium to be adhered to On dielectric layer N,
- dielectric layer N+1 profile is cut in media as well
- apply adhesive to dielectric layer N+1
Each dielectric layer of object is reprocessed, wherein handling each dielectric layer in common reference plane.
Print media layer N+1 can also be included by handling each dielectric layer.
This method can also include applying transparency processing 850 so that the selected part of the dielectric layer of object is transparent.
Handle each dielectric layer and can be additionally included in dielectric layer and form barrier layer.Barrier layer can be defined to transparency processing Barrier.
In another setting, transparency processing can be configured to the desired depth through a dielectric layer or multiple dielectric layers.
3D objects are deposited by selective layering(SDL)To be formed.
Medium 401 may include medium in roll form, and the profile for cutting dielectric layer may include to cut medium from medium The exterior contour of layer.It is different according to the profile of object layer from the profile of each dielectric layer of medium cutting.This method can provide Adaptive structure, each dielectric layer are cut to limit the profile of object layer.
In the profile from medium cutting dielectric layer(Or profile fringing)Afterwards, the remaining waste material of medium is cut from structure Room is transported away-structure room is transported to be cut as the print media floor N+1 of dielectric layer new portion.
On on the other hand, there is provided a kind of method of manufacture 3D objects, 3D objects include multiple dielectric layers, wherein handling Each dielectric layer to limit the layer of object,
Each dielectric layer is handled to limit the layer of object, including:
- layer is bonded to preceding layer or the basic unit of object
The profile of-incised layer
- apply adhesive
Reprocess each pantostrat, until forming object, and also include applying transparency handle so that one of object or Multiple layers of selected part is transparent.
On on the other hand, there is provided a kind of 3D objects to be handled so that the selected portion of one or more layers of object Divide at least partly transparent method, the 3D objects include multiple paper material dielectric layers, and methods described includes:
Transparency processing material is applied to at least selected part of object, transparency processing material is configured to penetrate Jie The desired depth of matter layer or multiple dielectric layers, wherein as transparency processing material is absorbed into dielectric layer, the dielectric layer is set to be in It is existing transparent.
Transparency processing material may include index-matching material.Transparency processing material may include triglycerides base oil, Such as dryness, edible, nut, citrus, medicinal oil.Transparency processing material include synthetic polymer sill such as acrylic compounds and Polyurethane.
The refractive index of transparency processing material is preferably as close possible to cellulose refractive index(It is 1.55 in 592nm).
This method can also include the penetration depth that control transparency processing material is absorbed into object.It is controllable to penetrate depth Degree builds the white point of model object with keep completing, and provides CMYK color as needed.
This method can also include forming barrier or boundary layer to limit penetrating for transparency processing material.This method can enter one Step includes being formed boundary layer including applying reflecting material or barrier material.Reflection or barrier material can be applied to each layer.
In further, 3D objects are handled so that the selected part of one or more layers of object at least Partially transparent method, 3D objects include multiple paper material dielectric layers, and methods described includes:Transparency processing material is applied It is added at least selected part of object, transparency processing material is configured to penetrate the predetermined of a dielectric layer or multiple dielectric layers Depth, wherein as transparency processing material is absorbed into dielectric layer, dielectric layer is presented transparent.
Transparency processing material may include high molecular weight material, and it preferably has as close possible to cellulose refractive index( 592nm is 1.55)Refractive index.
Transparency processing material may include synthetic polymer sill such as acrylic compounds, polyurethane and epoxy resin.In ring In the case of oxygen tree fat, it may be necessary to single hardener/crosslinker material.
This method also includes the penetration depth that control transparency processing material is absorbed into object.Controllable penetration depth To keep the white point for the structure model object completed, and CMYK color is provided as needed.
The control of penetration depth can be realized by rapid curing solution, such as UV solidifications.The curing does not include environment Solvent evaporates, and material can be dried in time shorter the time required to than solvent-based resin & adhesives under uv lamps.Except Outside fast curing times, UV bases resin is free of VOC(Volatile organic solvent), therefore the processing solution being more prone to can be obtained.
This method can also include forming barrier or boundary layer to limit penetrating for transparency processing material.Method can be further Include applying reflecting material or barrier material including forming boundary layer.Reflection or barrier material can be applied to each layer.
Barrier layer may include epoxy resin.Barrier material may also include crosslinking agent.
In method, print media layer can also be included to limit the layer of object by handling each dielectric layer to limit the layer of object Color.
According on the other hand, there is provided a kind of method for forming transparent 3D objects, this method include:
- 3D objects are provided, the 3D objects include multiple dielectric layers, combined to form the object, wherein, dielectric layer is Porous material;
- transparency processing emulsion is provided;
- by transparency processing emulsion be applied to object or object part so that the part of object or object present it is transparent.
Dielectric layer can be paper.The porous material that it is not paper that dielectric layer, which can be,.Transparency processing emulsion can be configured to impreg Material.The porous material of dielectric layer can be configured to the support for being used as transparency processing emulsion so that transparency processing emulsion can Absorb and the property of impregnated material is presented.Transparency processing emulsion can be configured to penetrate one or more dielectric layers of object Desired depth.The characteristic of object or object dielectric layer is controlled to control transparency processing emulsion to enter the trap of object.It is controllable The property of object or object dielectric layer processed is penetrated with controlling transparency to handle emulsion to object.Transparency processing emulsion can pass through Transparency processing emulsion is ejected on object, or emulsion is handled to apply by the way that object is immersed into transparency.
According on the other hand, there is provided a kind of method for forming at least partly transparent 3D objects for including multiple dielectric layers, Each dielectric layer is wherein handled to limit the layer of object, handles each dielectric layer to limit the layer of object, including:
The profile of-incised layer
- apply adhesive
- layer is bonded to preceding layer or the basic unit of object
Each pantostrat is reprocessed, until forming object, its dielectric layer includes porous material,
Also include applying transparency processing emulsion so that the selected part of one or more layers of object is transparent.
Dielectric layer is paper or dielectric layer not to be the porous material of paper;And the porous material of dielectric layer is configured to use Make the support of transparency processing emulsion so that the property of impregnated material can be presented in transparency processing emulsion.Transparency processing breast Agent is configured to impregnated material.Transparency processing emulsion is configured to penetrate the desired depth of one or more dielectric layers of object. Transparency can be handled to the selected part that emulsion is applied to object or object after object has been built up.Controllable object or thing The characteristic of body dielectric layer is to control:
- transparency processing emulsion enters the trap of object, or
- transparency processing emulsion penetrates to object.
The property of control object or object dielectric layer is penetrated with controlling transparency to handle emulsion to object.Transparency processing Emulsion can be by spraying applying mode or by the way that object is immersed into emulsion to apply.
According on the other hand, a kind of method of processing 3D objects, the 3D objects include multiple paper wood bed of materials, so that object The selected part of one or more layers is at least partly transparent,
This method includes:
3D printing object and transparency processing emulsion are provided;
Transparency processing emulsion is applied to at least selected part of object, transparency processing emulsion is configured to penetrate the object A dielectric layer or multiple dielectric layers desired depth, wherein when transparency processing emulsion be absorbed into dielectric layer when, be situated between Matter layer or part thereof becomes transparent.
The transparency processing material of above-mentioned aspect can include index-matching material.Transparency processing material may include glycerine Three ester groups oil, such as dryness, edible, nut, citrus, medicinal oil.Transparency processing material may include synthetic polymer sill Such as acrylic compounds and polyurethane.The refractive index of transparency processing material is as close possible to cellulose refractive index(It is in 592nm 1.55).
The method of above-mentioned aspect can also include the penetration depth that control transparency processing material is absorbed into object.It is controllable Penetration depth processed builds the white point of model object with keep completing, and provides CMYK color as needed.The side of above-mentioned aspect Method can also include forming barrier layer or boundary layer to limit penetrating for transparency processing material.Forming boundary layer may include to apply instead Penetrate material or barrier material.Reflection or barrier material are applied to the part of selected layer or layer.Barrier layer may include epoxy resin. Barrier layer may also include crosslinking agent.Handle each dielectric layer is also included with limiting the layer of object, and print media layer is to limit object Layer color.
According on the other hand, there is provided a kind of 3D objects manufactured in object manufacturing process is layered, layer is by passing through bonding The porous material of agent bonding is formed, wherein handling material process object so that thing using the transparency caning absorb in porous material Body or part thereof becomes transparent.3D objects can manufacture during SDL.
Brief description of the drawings
The application is now described with reference to the drawings, wherein:
Figure 1A is the block diagram according to the printing device of this teaching embodiment;Figure 1B is to show the method according to this teaching embodiment The flow chart of possible step;First method is related to handles each layer to form 3D objects in structure opening position;Second method It is related to transparency processing, so that at least part presentation of 3D objects is transparent, 3D objects are by multiple dielectric layers(Such as paper)Composition;
Fig. 2 is according to the cross-sectional side view of the 3D desktop printing devices of this specification embodiment, and it includes fixation or removable Dynamic heating plate;
Fig. 3 is the 3D desktop printing device bags according to the cross-sectional side view of the 3D desktop printing devices of this specification embodiment Include roller;
Fig. 4 is the amplification cross-sectional side view for the multiple dielectric layers for showing the structure object according to this specification embodiment, especially Show the border of dielectric layer and the edge of dielectric layer;
Fig. 5 A, 5B, Fig. 5 C and 5D are that the amplification for the multiple dielectric layers for showing the structure object according to this specification embodiment is transversal The diagram of face view, particularly illustrates ink and/or barrier or how reflecting material is controllably applied to one or more Jie The exemplary arrangement of matter layer and dielectric layer edge;With reference to figure 5A, in shown exemplary arrangement, barrier/reflecting layer is applied in In pad-ink areas adjacent;Fig. 5 B are by applying barrier layer/reflecting layer the diagram of " frontier district " that is formed, to prevent Lightness processing solution(trans solution)Penetrate all the way after the post processing;With reference to figure 5C, another example is shown Property arrangement, in the exemplary arrangement, barrier/reflecting layer is applied to the region including pad-ink;Fig. 5 D are to pass through application Barrier layer/reflecting layer and form the diagram of " frontier district ", to prevent transparency processing solution(trans solution)Rear Penetrated all the way after processing step;
Fig. 6 is the diagram for the amplification cross-sectional side view for showing cutting dielectric layer, shows the printing at edge and especially shows The lateral cross across dielectric layer edge is gone out;And
Fig. 7 shows the view of printing device, and particularly illustrates the arrangement for providing adaptability structure operation.
Embodiment
The use selective layering according to this teaching will hereafter be deposited(SDL)Desktop printing device exemplary setting It is described, to understand the benefit of this teaching.These are set it will be appreciated that being the example for this kind equipment that can be provided that, not It is intended to this teaching being limited as any specific setting, can be to this paper institutes in the case where not departing from the scope of this teaching The setting stated carries out various modifications.
Present description provides the SDL desk devices of integrated colored or image printing and 3D printing.Equipment 100 is configured as Multiple individually dielectric layers are printed and combined to form three-dimensional(3D)Object or part.Under the background of this teaching, each medium Layer can be considered as different physical element or entity.In the context of this teaching, taken from the input including a roll of medium Go out or obtain each dielectric layer.
Refer to the attached drawing and first particularly Figure 1A, describe the desktop SDL equipment 100 according to this specification.Desktop SDL Equipment(3D printing equipment)100 include structure module 300, and structure module 300 is configured as handling and combines multiple individually Jie Matter layer is to form 3D objects.Building module 300 includes structure room 305 and structure plate 310.Structure module 300 includes adhering device. Adhering device can include fixed or movable heating plate 350 or roller 355.Structure module 300 is configured as multiple media Each layer in layer 405 is continuously bonded to part 450.Structure module 300 is additionally configured to cut the profiling of each dielectric layer To limit the layer of object or part.Structure module includes guided cutting apparatus 321 and adhesive bringing device 320.Build module 300 also include the printing equipment 200 with printhead 230.Printing equipment 200 is configured as print media layer, defines object Or the layer 405 of part 450.
The processing unit 300 of the exemplary arrangement includes printhead, cutting/copying device and adhesive bringing device, quilt It is arranged to move in the space around structure plate and operate wherein.It should be understood that suitable installation/defeated can be provided Send device, such as X-Y frame mountings.Printhead and/or cutting copying device and/or adhesive bringing device can be installed to general Logical multi-function head 322.It should be understood that alternative solution can be provided, for example, structure plate can be configured as relative to place Manage device movement.
In the description, structure module describes the module of 3D printing equipment, and object or part 450 are layered at the module It is processed and combines to form 3D objects.A variety of terms, structure module, sorting module, structure room, structure plate and structure module, SDL structure modules have been used to describe this feature.Similarly, term 3D printing and the manufacture of SDL and 3D objects by with In description 3D printing process.Term 3D objects, build object and part has been used for description shape during 3D printing or SDL Into object.
In operation, single dielectric layer 405 is provided to equipment 100 to form object.Dielectric layer 405 from be sent to structure It is removed in the medium 401 of plate 310.The object 450 being fabricated can be referred to as construction 440.Dielectric layer 405 is by successively Addition,(For example, see Fig. 4, it illustrates the zoomed-in view of layer arrangement)Layer N+1 is placed on layer N top, and layer N is placed on layer again N-1 top.Single dielectric layer is processed to form multiple layers of object 450 successively.Dielectric layer 405(N, N+1 etc.)In structure Build plate 310 and sentence that single or mode successively is processed or operation.
Dielectric layer 405 in described exemplary arrangement takes out from the medium 401 provided in the form of roller 400.Medium Layer is supplied to desk device 100 to be printed, profiling and bonding, so as to produce complete color 3D object or part.Preferred Arrangement in, each dielectric layer of 3D objects can be from roller input(roll input)Middle export.
Processing includes handling dielectric layer.Dielectric layer in exemplary arrangement is the shown paper wood with X-Y and Z sizes Material.Processing includes:Shape cutting, printing, bonding, apply adhesive be into dielectric layer-exemplary arrangement newest offer or Uppermost dielectric layer.Structure opening position of the dielectric layer in module is built is handled.Performed in the plane of dielectric layer each Kind processing operation.It is believed that processing dielectric layer is performed with forming or limiting the layer of object in single reference planes, or What person performed in the common reference plane using common reference point.The processing of dielectric layer may further include generation barrier Layer, including for example apply barrier material or reflecting material.Building module 300 includes cutter device, adhesive bringing device, bonding Device.Structure module can also include being used for the bringing device 330 for forming barrier layer, such as epoxy resin or barrier material or anti- Penetrate material application device.
Compared with the method for the prior art, the system and method for the application provide completes each in common reference plane The processing of layer.This in contrast to the prior art, paper can be printed on 2D printers in the prior art, be provided independently to cut Machine carries out profiling, then in single position grouping to form 3D objects.In such an arrangement, each dielectric layer may be Handled in 3 or 4 different occasions.Arrive once or twice printer-depend on dielectric layer be one side or it is two-sided Printing-arriving cutter again-is arrived reorganizer and bonded again.
The arrangement of the system and method for the present invention, there is provided each dielectric layer will be in single passage or in common reference Handle, reduce in multiple different disposal occasions the needs that operate and transmit dielectric layer, and reduce additional place in plane Reason and operation require.Although the method for prior art presents the arrangement of precision and risk-system and method for misalignment Solve these problems.
Dielectric layer is handled to limit the layer 405 of object in single passage or in common reference plane, it may include printing, Profiling, create boundary layer and apply adhesive.
In exemplary configuration, the common reference plane for handling dielectric layer wherein is the plane of dielectric layer or paper. In exemplary arrangement, dielectric layer to be processed can be glued to construction before treatment.
With reference to figure 4, the layer 405 of object 450 is handled by the surface treatment to each layer during structure(N, N+1 Deng).Dielectric layer can for example form the exterior layer of final object, and in this case, the relatively most of of the surface of layer 405 can With in final object.Or dielectric layer can for example form the intermediate layer of final object, in this case, only The lateral cross of cut edge or cut edge can be exposed in final object.The processing of dielectric layer 405 can be according to this Layer whether be object intermediate layer or exterior layer and controlled and changed.Different places is described in further detail below with reference to Fig. 5 Manage selection scheme.
Print module 200 is integrated into structure module 300.Print module 200 is configured as in structure opening position printing At least a portion of dielectric layer.Print module 200 can be configured as multiple color being applied in multiple individually dielectric layers It is one or more.Dielectric layer can be printed with single black ink 240, either with multiple color 240 or without color- That is white printing.Print module 200 can be further configured to dielectric layer from medium 401 cut or profiling after beat Print dielectric layer.Print module may include conventional 2D printers, be configured to apply ink to dielectric layer.2D printers can be mark Accurate ink-jet printer.Print module 200 may be configured to print on the first face of dielectric layer 405 or surface.Impression block Block can be configured as printing in the other surfaces of dielectric layer.
The image 600 being printed upon on dielectric layer N or dielectric layer 405 can be beaten according to the figure punch file previously generated Print, this document include image, profile and the colouring information for the 3D objects to be printed.This paper brief explanations previously generate numeral and beaten Step in the exemplary arrangement of printed text part, it is understood, however, that alternative can be provided.As known in the art As, since 3D data files, 3D data files represent the 3D objects to be printed for 3D printing.For example, set for 3D products The current industry standard file format of meter, STL and OBJ and VRML(For colored 3D printing)It can be used for this teaching, however, It is appreciated that suitable alternative solution can also be used.Then generate color and be applied to the mould represented in data file Type.The data in these files are read, and computer model is sliced into the printable layer suitable with thickness of dielectric layers.This number Generally carried out according to the generation of file on the PC or computing device for be connected to printer 100, but this is not construed as limiting System, because such processing can also occur in printing device 100.It is understood that in alternative arrangement, section can be with Perform in cloud, or performed on mobile device, tablet personal computer, phone.In addition, this teaching is not limited to above-mentioned file generated side Method, and any suitable method of generation 3D printing file can be used.
Starting print job and SDL operationsBefore, the file previously generated be provided or be otherwise loaded into beat Although printing apparatus 100-be not shown, printing device 100 includes processor or controller and loads the memory of mimeograph documents.
Figure punch file is quoted or read again by controller/processor.Figure punch file may include to be used for each Dielectric layer 405(N, N+1 etc., Figure 4 and 5)A series of images 600.The color image information of All Media layer is also contained in numeral In mimeograph documents.
Equally, there is provided a profiling file, including to cut with limit an object layer profile detailed letter Breath.It should be understood that layer may include outside or external margin profile.It should be understood that layer can further comprise inside one or more Edge contour.
In Fig. 1 exemplary arrangement, print module 200 and structure module 300 are positioned and are integrally disposed on and set jointly In standby 100, it can be fully processed so as to be transported to each dielectric layer of structure module in structure opening position.It is transported to structure mould The dielectric layer of block is by profiling and printing, the layer of the object built with restriction.Each dielectric layer structure opening position by profiling, Printing, arrange and bond.Structure module 300 also includes cutter device, adhering device and adhesive bringing device.
In Fig. 1-3 exemplary arrangement, the processing of dielectric layer includes:Cutting, printing and adhesive application be all Completed in the same reference planes of object.The each dielectric layer for adding or being bonded to construction is processed successively.In this theory The last dielectric layer added in the configuration of bright book is uppermost dielectric layer.Movable part-cutter device, printing equipment and Adhesive bringing device is configured to operate in common reference planes.Movable component is configured as in single reference planes Operation.It should be understood that provide the part for being configured to work in single or collective reference plane, there is provided improved essence Degree and improved treatment effeciency and control.
For example, if the printing and cutting of dielectric layer are carried out separately, then are required for carrying out position in each step Control, and be also required to present dielectric layer with handle twice-arrive printing equipment first, afterwards to cutter device.
The conveying device 160 of the exemplary means may further include one or more intake rollers and/or guiding piece.It is defeated Device 160 is sent to include one or more of sprocket wheel feed arrangement or roll, in order to being configured to sprocket wheel feeding or defeated The paper that send is used together.It should be appreciated that appropriate alternative solution can also be supplied to sprocket wheel feeding or roll.It should manage Solution, can provide the arrangement of different rollers and guiding piece, and can be provided together with conveying device 160 additional or replacement Guiding piece or roller, to transmit the medium of exemplary arrangement.It should be appreciated that selected position that can as needed on transport path Put place and additional driven roller, pinch roll, roll or guiding piece are set.The medium 401 of roller 400 in exemplary arrangement include by with It is set to the continuous roll form fed via sprocket wheel feed mechanism(roll form)Paper.It is understood that it can provide various The sprocket wheel feed paper of form, such as the paper with one or two edge, the paper are configured as the sprocket wheel by respective type Feed mechanism conveys.When using paper sprocket wheel feed rolls, it should be understood that feed mechanism can be used to The control of the placement and the alignment that pass through the medium of equipment 100 from the whole start to finish of transport path 140.
With reference to figure 1b flow chart, it illustrates the illustrative methods of this specification.
This specification additionally provides a kind of method for handling color 3D object, and it is included in system in exemplary arrangement Following processing in 100:
Dielectric layer is treated separately to limit the layer of object.
- dielectric layer 405 is transported to construction 450 at structure position 310
- dielectric layer is handled to form the layer of object.
- processing dielectric layer includes:
- shape cutting is to form the layer 405 of object or dielectric layer N(Figure 4 and 5).Dielectric layer is cut with the exterior contour of confining layers And/or one or more in-profiles
- print media layer 405(Dielectric layer N);
Print media layer-ink is applied to dielectric layer 405(Dielectric layer N);Apply ink to the characterizing portion of dielectric layer.
In fact, printing can be followed or is defined relative to shape cutting, shape cutting generally define it is internal and/ Or exterior contour or those parts in final object.
The method and system of specification provides the control to printing.
Printing can be defined as following shape cutting and include edge around shape cutting.Printing can be guided to layer First surface, such as face or the surface of top surface upward.Can be with other outer surfaces of printable layer, for example, cut edge.Printing can Change the presentation of the final color of object layer to control.For example, ink can be changed.Penetration degree of the ink in layer can become Change.When printing specific part, printing, which can be controlled to dielectric layer, applies more ink.Printing can be controlled to change medium The depth or quantity of ink of ink at a part for layer.Medium such as paper can be changed to change ink in layer or one portion Infiltration in point.Except or as the replacement that changes of ink, medium such as paper can be altered to ink being put into material In.Medium such as paper can be changed to, and layer or part thereof is transparent.Ink can modify to provide as needed The print result needed or degree or the infiltration as described above for being used to control ink.
The color of object is controllable.Color can be controlled by the position for controlling dielectric layer to print.Control can be passed through The amount or depth for making the ink applied control color.
Method also includes:
- dielectric layer is bonded on construction.
Dielectric layer is bonded into construction may include dielectric layer being bonded to substrate(First medium layer)Or dielectric layer is glued Tie in front medium layer.
When the layer is bonded to construction, processing is followed the steps below:
Advantageously provided according to the method for this specification and handle dielectric layer in single reference planes.
Single reference planes refer to the plane of dielectric layer.Processing forms an object and successively completed.Each dielectric layer Handle successively to limit the layer of object.Every layer of processing is completed in structure opening position completely.
Dielectric layer is positioned to construction, and the processing for including cutting and print then is performed in common plane.Cutting Processing with printing uses one group of general reference point.Effectively, including the processing of dielectric layer cutting and print can shown There is single reference planes and single reference point or datum mark in example property arrangement.This improves precision.It is included in common reference This processing cut and printed in plane also reduces processing load.
Dielectric layer is positioned and is located at the position of construction.In fact, dielectric layer is glued to construction to limit object Layer.The layer of the object is processed.
Dielectric layer effectively defines the reference planes for handling object layer.It has been noted that dielectric layer can show It is made up of in example property arrangement paper, in this case, according to the type of used paper, the depth of dielectric layer is limited. In the method for this specification, the superiors are rendered for handling.Moreover, the superiors are rendered for cutting, print, apply bonding Agent and bonding.Refer to the attached drawing, the surface of dielectric layer are presented in X-Y plane, and the depth of dielectric layer limits in z-direction.Cutting The depth or lateral cross section of layer are passed through with profiling.Printing can include along a first direction-to layer plane apply ink.Beat Print can include for example being applied to a controlled penetration depth with second direction.
In the prior art, dielectric layer is off-line printing.Therefore the alignment of printable layer be present and for cutting and bonding Each printable layer positioning it is relevant the problem of.
The present processes provide handles dielectric layer in single reference planes, and the processing includes cutting dielectric layer to limit The profile of given layer;Print media layer is with the color of confining layers.The processing also includes dielectric layer being bonded on object.
In the method for this specification, print media layer includes the one side of print media layer.In the method for this specification, Print media layer includes the cutting lateral edges of print media layer.
Further print media layer includes, with cutting dielectric layer to limit profile in identical reference planes to apply oil Ink.In the method for this specification, can using one group of common reference point or a common reference point come complete to include cutting and The processing of the dielectric layer of print media.
In exemplary arrangement, the processing of dielectric layer also includes the dielectric layer for applying adhesive to printing or profiling.
Construction 450 or structure plate 310(First medium layer)It is pressed into plate 350 or is bonded medium 401 by roller 355 To dielectric layer 405 before or it is applied with the structure plate 310 of adhesive(First medium layer).
The processing can further comprise generation layer or barrier layer 865 on the dielectric layer of object or object, post-process liquid Or processing can not pass through its absorption.
For form post processing liquid or the possible way of the nonabsorbable boundary layer of processing or barrier layer include it is following in One or more:
This method can further comprise:
Barrier material 830 is applied to dielectric layer
This method can further comprise:
Reflecting material 820 is applied to dielectric layer
This method can further comprise:
Epoxy resin 835 is applied to dielectric layer
This method may further include:
Formation processing can not have been retouched by the barrier layer 865 of its absorption on barrier layer, reflecting layer and epoxy resin layer State, it is to be understood that barrier can also be formed using other suitable combinations or alternative.
Ink 240, barrier material 830 and/or reflecting material 820 and/or epoxy resin 835 can be applied to Jie as needed Matter layer.
This method may further include, and as replacement or in addition to creating barrier layer, also apply transparency processing, Transparency processing is configured to have limited or predetermined depth or penetrates the degree of object.In this case, thoroughly Lightness processing can be configured as only absorbing desired depth or multiple depth from the outer surface of object.
For example, if dielectric layer limits the intermediate layer of object 450, wherein only cut edge is exposed(In the object of completion In), then ink can be applied to parallel in the peripheral edge of dielectric layer and/or the band of internal edge.Ink can also be applied It is added to cut edge.Barrier layer or reflecting layer can be applied in as the band parallel to ink band(See, for example, Fig. 5).Example Such as, if dielectric layer defines the exterior layer or outer surface of object(In the object of completion), then can be in the table of dielectric layer Apply ink on face.Ink can also be applied to cut edge.Barrier material or reflecting material can be applied on dielectric layer, The dielectric layer is located at the position adjacent with the surface for applying ink, such as next layer of lower surface in the final product(Referring to example Such as Fig. 5).
This method also includes:
Apply adhesive to dielectric layer
This method also includes:
It is transported to the medium 401 and ensuing dielectric layer 405 of structure position 310(Dielectric layer(N+1)Figure 4 and 5)It is combined, imitates Shape cutting etc..
It should be noted that first medium layer N can be provided to the structure plate 310 or basalis for being applied with adhesive. Succeeding layer N+1, N+2 etc. are continuously being built thereon.
It should be understood that as needed, the order of various processing steps can change.
This specification further provides the post-processing of structure object 450.
This method can further comprise:
- apply transparency processing
As described, it is detailed further below, transparency can be handled 850 and put on object to produce final expectation Color effects.
850 are handled using transparency, the selected portion for the object being not in " barrier or boundary layer " 865 is rendered as It is bright, and the selected part 865' of the object in barrier layer 865 does not present transparent, is to maintain depending on the color of dielectric layer White or other colors.This has the effect of the final visual effect of augmented color, because print area is relative to impermeable The background of bright selected part 860 highlights.
For example, processing may be configured to interact with the dielectric layer of object 450 405., can be with exemplary arrangement 850 are handled to cause paper from external surface of objects using translucent or transparent degree(Or the surface of layer)To barrier layer 865 or anti- It is translucent or transparent to penetrate layer, with the visual appearance and color of augmented.In fact, the surface of body surface or object layer To be exposed surface or cut edge.Can apply the processing come strengthen color/ink of application to the vision of user outside See.
The processing may further include produces layer or barrier layer 865 on object or dielectric layer, in the liquid of post-processing Body or processing can not be from its absorptions.
For form post processing liquid or the possible way of the nonabsorbable boundary layer of processing or barrier layer include it is following in One or more:
This method can further comprise:
Barrier material 830 is applied to dielectric layer
This method can further comprise:
Reflecting material 820 is applied to dielectric layer
This method can further comprise:
Epoxy resin 835 is applied to dielectric layer
This method may further include:
Formation processing can not have been retouched by the barrier layer 865 of its absorption on barrier layer, reflecting layer and epoxy resin layer State, it is to be understood that barrier can also be formed using other suitable combinations or alternative.
Ink 240, barrier material 830 and/or reflecting material 820 and/or epoxy resin 835 can be applied to Jie as needed Matter layer.
This method may further include, and as replacement or in addition to creating barrier layer, also apply transparency processing, The transparent processing is configured to have limited or predetermined depth or penetrates the degree of object.In this case, it is transparent Degree processing can be configured as only absorbing desired depth or multiple depth from the outer surface of object.
Referring to the drawings and especially Fig. 2, describe and beaten according to the Table top type colour 3D of the exemplary arrangement of this specification Printing apparatus 100.
Building module 300 includes structure plate 310, defines structure position.Medium 400 passes through the quilt of medium conveying apparatus 160 It is transported on the structure position at structure object 450 or structure plate 310, to provide the dielectric layer 405 of object, for example, layer N, N+ 1。
160 pumped (conveying) medium as needed of conveying device is positioned until it.Sensor 170 can be provided to indicate conveying dress Put 160 stoppings.In the preferred arrangement of accompanying drawing, conveying device 160 includes traction unit 165.
Such as N of dielectric layer before deposited adhesive thereon.Construction 450(Or including building at plate 310 The part 450 of dielectric layer 405)It is pressed into movable or static heating plate 350.Construction or part 450 return from heating plate 320 Return.
Layer N cutting profile is made into.
Then ink 240 and adhesive 340 are applied to the layer together with barrier material 830 and/or reflecting material 820 On.Instruction according to auto-correlation mimeograph documents are carried out applies ink 240 or prints the layer.
Then, structure plate 310 declines, and conveying device 160 allows medium 401 to index next position.Waste can It is transported to and tightens up roller 185 or simple feed bin with collection material.
Equipment 100 is configured to by SDL, passes through continuous media layer N, N+1 etc. arrangement, bonding, profiling and printing, there is provided The 2D printings and 3D printing or the manufacture of 3D printing object of continuous process.Dielectric layer is managed everywhere in structure module 300.As needed Each dielectric layer surface is handled to limit the layer of object.
Equipment 100 provides and defined the continuous conveying path 140 of medium to SDL modules 300.In addition, system 100 may be used also With including control device 180, for realizing the control to supply or conveying device 160.Sensing device further 170 can include one or Multiple sensors, such as it is configured as detecting the optical sensor of media location.The data detected by sensor can be provided that Or it is output to control device and the conveying for controlling medium.
Print module 200 includes printhead 230.In exemplary arrangement, printhead 230 be arranged in structure position or The upper surface of the top dielectric layer is printed on structure plate.Printhead can be configured as a part for printable layer.Printhead 230 The other surfaces of this layer, such as cut edge can be configured as printing.Printhead 230 can be ink jet-print head.
Arrange or build module 300 and pass through the structure that SDL provides 3D objects.Building module 300 includes structure plate 310, glues Mixture distributor 320, cutter device 321.Structure module 300 may further include heating plate 350 or other arrange or glued Tie device, such as roller 355.As described above, structure module also includes print module 200 and printhead 230.Object is being built completely Interior is processed, printed and builds.Each dielectric layer is handled as needed to limit object layer at structure room.Uppermost Jie Matter layer is processed.Building the processing of opening position includes surface treatment.
Dielectric layer is cut into the profile of the layer of object to be limited, dielectric layer is printed, bonded and carry out table as needed Face is handled.
Ink bringing device 230 can be controllable, to provide the printing depth for the dielectric layer being included at select location Control.In exemplary arrangement, in the amount or property of the ink that the specific location with paper sheet thickness of dielectric layer applies It can change, to change penetration depth or thickness of the dielectric layer in some opening positions, to penetrate the depth of dielectric layer or thickness A part.
As pointed out above in the method using SDL-read data in file and by computer model Cut into the printable layer equal with thickness of dielectric layers.System provides the basis successively printed.System control is printed to be situated between Required ink penetration is provided in the depth or thickness of matter layer.As described, this method additionally provides transparency processing, with root According to needing to make, the selected part presentation of the dielectric layer adjacent for example with printing is transparent.
Although in former arrangement, it is often necessary to which all dielectric layer is permeated to provide full color coating-this specification Use ink(Color)Application provide greater flexibility, control option and precision with reference to the method for transparent processing.
In preferable exemplary arrangement, adhesive dispensing device 320 and cutter device 321 can be installed to multi-function head 322.Adhesive dispensing device and cutter device installation and operation in the region above structure plate 310.Printhead 230 can be with class As install and operate in the region above structure plate 310.Adhesive dispensing device and cutter device for example can be according to need To be arranged on X-Y frameworks to be moved on structure plate 310.Printhead can be similarly attached on X-Y frameworks.Printhead 230 can be co-mounted to multi-function head 322 with cutting and adhesive dispensing head.It should be understood that can also use allow to bond The suitable alternative arrangement that agent distributor, cutter device and printhead operate above structure plate.Although it have been described that beat Print head, cutting/tracer head and adhesive dispensing head are arranged in the space around structure plate and move and operate, but can be with Alternative solution is provided without departing from the present invention, for example, structure plate can be configured to move relative to each head.
Moved between the first raised position and the second reduction position that structure plate 310 can be in system.As described above, As each dielectric layer 405 is sent to construction 450 so that new medium is laminated on construction, plate 310 and structure are built Thing 440(Or the object formed)Heating plate 350 can be raised to.When continuous dielectric layer(N, N+1, N+2 etc.)It is added To when building plate 310 to build object, structure plate 350 is lowered.
Cutter device 321 and adhesive dispensing device 321 are configured to provide the cutting of object form and by adhesive It is applied to the medium 400 to form object dielectric layer 405.Cutter device 321 is configured as cutting the outline portion of medium 401 to limit Determine dielectric layer 405.Cutter device 321 can be additionally configured to the dielectric layer 405 in the part that does not form final object 450 In part, the part for the layer that will be eliminated, a series of shade wire cuttings are carried out.First medium layer N can be provided to It is applied with structure plate 310 or other basic units of adhesive.Succeeding layer N+1, N+2 etc. are continuously being built thereon.
Conveying device 160 provides conveying of the medium 401 by equipment 100, for as needed transmitting dielectric layer from roller To structure module 300 and for cutting, applying adhesive and printing.
Reference picture 3, show another exemplary means 100 according to this specification.Fig. 3 device 100 is similar to Fig. 2 Device, and apply identical reference in appropriate place.The details of the various similar assemblies of not repeated description. In Fig. 3 exemplary arrangement, roller 355 can be provided, it is continuous for bonding to substitute fixed or moveable heating plate 350 Dielectric layer.In such an arrangement, when new layer N+1 to be sent to the position of the top of part 440, by the way that roller 355 is moved Onto new layer N+1 surface, and new layer is pasted to the preceding layer for the part 440 for being applied with adhesive(N)Upper surface.
Reference picture 4, show the amplification diagram of multiple dielectric layers of object.Layer n in shown cross-sectional view has deep Spend Z1 and width Yn.Layer n+2 in shown cross-sectional view has depth Z1 and width Yn+2.The dielectric layer of diagram is imitated Shape and show cut edge 410A.
Show the printing selected in the dielectric layer for " subtracting " color with CMYK.The name that CMYK " subtracts " color is because of them Realized by subtracting white light from paper.Do not have albomaculatus paper, color may appear to different.
Therefore, this specification further provides the further processing of object 450 or part after being built, so that selected Dielectric layer select or restriction or those dielectric layers of part present transparent to provide improved visual appearance and face to final products Color.
For example, the selected part of dielectric layer can by transparency handle material 850 present it is transparent.Transparency handles material 850 can apply in subsequent processing steps, such as by impregnating object 450 or spraying the surface of object 450.Transparency processing 850 can be absorbed into the layer of model, and because the absorbability of paper may may proceed to be absorbed in model.
If by applying transparency processing 850, model or object or part 450 can become fully transparent, then white point will It can reduce.
With reference to figure 5, the method for this specification further provide can deposit layer of reflective material 820 on the boundary layer or The application of spacer material layer 830, to prevent transparency processing 850 from entering layer 405(N)Deeper inside, more than Z-direction or X-direction Requirement.The deposition in reflecting layer 820 or barrier layer 830 can be effectively controlled, to control transparency processing 850 to be absorbed into model Degree or depth.This control that transparency handles 850 depth is used to keep the white point for building model 450 completed, and root According to need provide CMYK color.
In one arrangement, transparency processing 850 can include polymeric material of the acrylate copolymer in water and/or Colloidal materials and/or soliquid.
Reflecting material 820 or barrier material 830 can optionally be applied for example to limit the dielectric layer 405 of object 450 Border or barrier layer 865.
Reflecting material 820 or barrier material 830 for example can be applied in simultaneously with ink 240 or adhesive 340.It is optional Ground, reflecting material 820 or barrier material 830 can individually apply.Reflecting material 820 or barrier material 830 can be only applied in To the selected part of selected dielectric layer 405.Reflecting material 820 or barrier material 830 can be applied in such as dielectric layer With by the relative surface region of print surface.Alternatively, reflecting material 820 or barrier material 830 can be applied to by The surface for the medium or to be printed, such as it is spaced apart peace in the shape cutting with dielectric layer 405 or cut edge 410 In capable band.
If for example, as shown in figure 5, dielectric layer N+1 define the intermediate layer of object 450 and positioned at object centre, and And only this layer of N+1 marginal portion is visible in object is built, then in an exemplary arrangement, ink 240 can be applied The depth Z being added in around shape cuttingink1With width Yink1Take and be applied to edge 410A, and barrier material 830 or Reflecting material 820 can be applied in ink 240 with adjacent width Ybarrier1With depth Zbarrier1Take, and with layer N + 1 shape cutting alternate constant distance Yink1
With reference to figure 5A, Fig. 5 B, Fig. 5 C and Fig. 5 D, the exemplary arrangement in application barrier layer/reflecting layer is shown.
As shown in exemplary diagram 5A and 5B, barrier layer can be applied near print area.After transparency post processing, Show the result of the subsequent treatment for the object for being applied with ink and barrier/reflecting layer.In fact, as illustrated, this method quilt Control to provide barrier/reflecting layer 865 so that it produces " frontier district " 865' to prevent transparency processing solution (transparency solution)850 1 tunnels penetrate.When transparency processing 850 is absorbed, the part 870 of object is by wash with watercolours Contaminate to be transparent.
Reference picture 5C and 5D, in the optional illustrative methods according to this specification, select as needed or in the method Select, barrier layer/reflecting layer can be applied to ink layer.
Effectively, borderline region 865' is formed, blank sheet of paper is enclosed into inside and prevents blank sheet of paper bleach.
This method, which further provides for surfactant 840, can be applied to one or more dielectric layers 405.In a kind of cloth In putting, surfactant 840 can be included in ink 240 or adhesive 340.In another kind is arranged, surface can be lived Property agent 840 is applied directly to dielectric layer, such as by being directly injected to the surface of medium 401.In other situations, medium 401 such as paper can be pre-processed with surfactant 840.
As needed, by controlling various key element-ink 240, and reflecting material 820 or barrier material 830, Yi Jibiao The application and positioning of face activating agent 840, and further by the transparency processing 850 for the dielectric layer 405 for controlling object 450, can To control the final visual appearance and color appearance of object 450.
Although in Fig. 5 exemplary arrangement, obstruct or reflecting material 830/820 has been described and illustrated for and ink Separately apply, but it is to be understood that in alternative arrangement, ink can include barrier or reflecting material.
It is understood that transparency processing 850 can refer to the processing of the object after object 450 is formed.
It is understood that transparency processing can put on layering object, formed by different device-for example using Such as the system described in other patent applications of same applicant.
The final color of object is limited by the reasonable processing to each layer of object.Ink and/or barrier and/or Reflecting material can be applied on each layer of part.After object is manufactured, subsequent treatment can be carried out to object to carry For final color.
Indeed, it is possible to think that ink 240 can apply in the first direction relative to dielectric layer.For example, in a first direction Ink apply can effectively include ink is ejected into the plane of dielectric layer upper surface.Ink can further relative to Dielectric layer applies in second direction, that is, is applied to cut edge 410, and the ink is at shape cutting across the laterally horizontal of dielectric layer Section applies.As further described above, the quantity of ink in any part application of dielectric layer can be controlled so that be applied to medium Ink in a part for layer can be applied to surface or penetrate the depth of the layer of specific location.
Similarly, as pointed by barrier material 820 or reflecting material 830, it can apply and carry out limited boundary layer BL 865.For example, if a layer defines intermediate layer, boundary layer 865 can be the band for the lateral cross part for limiting dielectric layer. If for example, a layer defines the outer layer of object, boundary layer can also be the layer parallel with the principal plane of dielectric layer or surface. Any dielectric layer of object may include shape cutting outwardly and inwardly, and reflection 820 or 830 materials of barrier can also be applied to example It is taking for constant interval or depth such as with outside or inside shape cutting.
Fairshaped one side print procedure is related to an extra subsequent processing steps, makes paper translucent, and obtains complete Color 3D models.The opacity of paper is due to light scattering excessive caused by the refractive index between its main component mismatches.It is dry The hole and cavity of paper are filled with the air that refractive index is 1.Hole wall is made up of cellulose, and cellulose is transparent in itself, but has There is about 1.55 refractive index.This mismatch can cause the increase of scattering events, because individually the path of photon becomes no order Sequence.When using index matching liquid, the medium of hole is replaced by has the liquid closer to cellulose refractive index than air Body.Which reduce the track of photon, and then reduce the scattering properties of paper.
In exemplary arrangement, transparency processing material 850 can include index-matching material, and it can include glycerine Three ester groups oil, such as dryness, edible, nut, citrus, medicinal oil.Synthetic polymer sill such as acrylic compounds and polyurethane It can be used as transforming agent.Such material advantageously relatively low cost, it is environmentally friendly, it is safe to use and with as close possible to Cellulose(It is 1.55 in 592nm)Refractive index.
In another exemplary arrangement, a kind of processing 3D objects are so that one or more layers the selected part at least portion of object Divide transparent method, the 3D objects include multiple dielectric layers of paper material, and methods described includes:Transparency is handled into material Material is applied at least in selected part of object, and transparency processing material is configured as penetrating a dielectric layer or multiple dielectric layers Desired depth, wherein with transparency processing material be absorbed into dielectric layer, make the dielectric layer transparent.
The option of transparency processing material includes herein below:
Transparency processing material includes high molecular weight material, and it preferably will have as close possible to cellulose(It is in 592nm 1.55)Refractive index.
Transparency processing material can include synthetic polymer sill, such as acrylic resin, polyurethane and asphalt mixtures modified by epoxy resin Fat.In the case of epoxy resins, it may be necessary to single hardener/crosslinker material.
This method can also include the penetration depth that control transparency processing material is absorbed into object.It can control and wear Saturating depth builds the white point of model object with keep completing, and provides CMYK color as needed.
The control of penetration depth can be realized by such as UV solidifications of rapid curing solution.The curing is not related to environment Solvent evaporates, and material can be dried under uviol lamp, the time much less spent than solvent-based resin and adhesive.Except Outside fast curing times, UV bases resin is free of VOC(Volatile organic solvent), therefore the processing solution being more prone to can be obtained.
This method can also include forming barrier layer or boundary layer to limit the infiltration of transparency processing material.This method can To further comprise being formed boundary layer, including apply reflecting material or barrier material.Reflection or barrier material can be applied to Each layer.
Reference picture 4, show the amplification diagram of multiple dielectric layers of object.Layer n has depth Z1 and in viewgraph of cross-section In the width Yn that shows.The width Yn+2 that layer n+2 has depth Z1 and shown in a cross section view.The dielectric layer of diagram is By profiling and show cut edge 410A.
Printing in the selection of dielectric layer for " subtracting " color with CMYK is shown.The name that CMYK " subtracts " color is because of them Realized by subtracting white light from paper.The white point of paper is to maintain the indispensable part of model colour gamut.If thoroughly Bright dose(transparicising agent)Penetrate too many layer, it will the white substrate for having deficiency makes to reflect/be scattered back light User, this will reduce color intensity and causes poor 3D models.For this reason, subsequent treatment material must be designed to Only make the superiors of model transparent.Ideally, the difference between the top layer color of printing and unprinted bottom should be kept In minimum.System for calculating aberration is International Organization for standardization(CIE)L*a*b* color systems, this is a kind of by color table It is shown as the international standard of numerical value.The change of color or Δ E values should be sufficiently low so that the color change between layer is that naked eyes can not Discover.For most people, this point is generally, it is considered that Δ E values are 4 or smaller.
Therefore, this specification further provides the further processing of object 450 or part after being built, to cause Choosing or the presentation of the part of the dielectric layer limited or those dielectric layers are transparent, to provide improved visual appearance and face to final products Color.
Make the selected part presentation of dielectric layer transparent for example, handling material 850 by transparency.Transparency handles material 850 can apply in subsequent processing steps, such as by impregnating object 450 or spraying the surface of object 450.Transparency processing 850 can be absorbed into the layer of model and because the absorbability of paper can continue to be absorbed into model.
Described system and method include following arrangement, including:Barrier layer 865 is formed on object, subsequent treatment Transparency processing or liquid 850 can not be absorbed by barrier layer 865;Or the processing of configuration transparency or the material of liquid 850 so that It is dried/hardened too fast and can not penetrate through the desired depth of dielectric layer or dielectric layer.Preceding baffle system can lead to Cross with such as reflectivity, barrier or the suitable material treatment of paper surfaces of epoxy material 820,830 or 835 or other and hole Volume is realized, to provide identical result, that is, repels subsequent treatment liquid or transparency processing 850.
Material described in application changes the hydrophobicity of a phase to repel another.
Latter system can be realized in exemplary arrangement by applying the material of such as epoxy resin 835.These Polymer is quick-drying, nontoxic and have sufficiently high viscosity so that they have been just before plurality of layers is penetrated for they Initially form solid film.Another advantage of these materials be their drying/crosslinking time can by make they with it is another Kind crosslinking agent(Typically amine reagent)React and greatly increase.The Δ E values are caused to be using the initial results of this interconnected system 3.5, this is just in target zone.
If by applying transparency processing 850, model or object or part 450 can become fully transparent, then white point will It is reduced.
It should be understood that if desired, it this method provide the method for manufacture transparent substance.Using may include to be specific Using generation object, such as transparent substance.
It should be understood that the layering object manufactured using different system can also be carried out using transparency subsequent treatment Subsequent treatment, so that the part presentation of object is transparent.
In the description, 3D objects operation or processing include will processing material be applied to object.This in the description by Referred to as transparency treatment liquid or formula or material or emulsion 850.Transparency processing emulsion be applied to object or part thereof with Make its transparent material.During construction transparency processing can be carried out to object.Transparency processing can be applied to the part of object On.Transparency handles emulsion or material 850 and can be applied on each layer of object or part thereof.For example it can be hindered with reference to application Barrier material or epoxy resin control the application to layer or part thereof.As described above, transparency handles material wearing in object It can also be controlled thoroughly by the preparation of control process.
As described above, the dielectric layer of object is porous material.Transparency processing material 850 is configured to impregnated material.Medium The porous material of layer can be constructed with exemplary arrangement, to serve as the support of transparency processing material 850 so that it can inhale Receive impregnated material.
Specification includes making paper transparent and/or partially transparent processing method
The method for make it that paper is transparent and/or partially transparent is provided substantially in the method for specification method.These methods master To be applied to one side to print, refer here to print coloured image in the one side of paper and then make its visible on opposing sides Process.
In further set, there is provided method in addition, it is including the use of wetability liquid(Referred to herein as Priming coat), emulsion and polymeric liquid based on polymer(Referred to herein as top coat/processing preparation/transparency processing Preparation)For handling paper or 3D forms made of quires layer so that applying the region of processing becomes transparent or partially transparent.
Priming coat can be any colourless liquid, or priming coat can have excellent surface tension force to be used for by some The means of wetting paper are made colourless.Preferred class priming coat includes reactivity and non-reactive silicone oil series and liquid silica gel (LSR)Series(A kind of and two kinds of components systems).These any suitable mixture can be used to combine.
Top coat can be any material for having favorable optical performance, favorable optical performance include transparency and with fibre The close refractive index of cellulose fiber refractive index.Suitable polymeric system for top coat include but is not limited to liquid silica gel and Resin system, acrylic compounds, polyurethane and epoxy-resin systems, they are in the form of neat liquid or as emulsion it should be understood that can To use any suitable mixture of these polymeric systems to combine well.
This specification additionally provides another method, the system including the use of the polymeric system being dispersed in wetability liquid Agent or emulsion handle paper or 3D forms made of quires layer so that applying the region of processing becomes transparent or partially transparent.
Foregoing preparation or emulsion can include any wetability liquid and polymeric system(As described above)Or this A little any suitable mixture combinations.
Paper is porous media, and it is made up of the network of cellulose fibre array, and the cellulose fibre array passes through auxiliary Coating treatment is to assign user's selection function, including machinery and optical characteristics.In general, mechanical performance is mainly by cellulose Network of fibers controls, and assistant coating provides optics/aesthetic properties.Especially, anaclasis/scattering in paper delivery medium is applied by auxiliary The form of layer and paper delivery medium(Such as porosity)Influence/control.The quality for the coloured image being printed upon on paper is by the latter's The influence of anaclasis/scattering.
This specification includes the method for anaclasis/scattering of control/manipulation paper delivery medium.These methods are printed upon for control The quality of colour of coloured image on paper.These methods are primarily adapted for use in one side printing, refer here to the one side in paper Then upper printing coloured image makes its visible process on opposing sides.
The method of specification includes the transparency based on control paper to change the color matter for the coloured image being printed upon on paper The method of amount.Specifically, demonstration paper can be made into transparent or partially transparent so that the colour printed on one side thereof Image is visible on the opposite side.Similarly, the face of the cross section of the pre-printed quires layer of identical method is passed through Chromaticness amount is visible.
This method is included using fluent material dipping paper or quires layer, change/control its anaclasis/scattering properties.Can To be deposited using such as selective layering(SDL)With other suitable layering object manufactures(LOM)Any 3D objects of technology etc. Manufacturing process forms quires layer.
For example sprayed, impregnated using any liquid application process, dip-coating, brushing, distribution or the combination of these any methods, Dipping can be realized.Dipping can be realized in one or more applications of impregnated material.
In specification(Illustrative methods A)A kind of arrangement in, paper uses wetability liquid medium first(It is referred to herein as bottom Coating)Dipping.Then the second coating made of the polymer emulsion being dispersed in wetability liquid is applied(Referred to here as table applies Layer/transparency handles preparation).This alternate dipping process is repeated until reaching required quality of colour.Although emulsion includes As the fountain solution of decentralized medium, but it will be readily understood that can use using emulsion made of other decentralized media.Can Further to use transparent/clear liquid fluoropolymer resin to be used as top coat.
Example
Printed for example, Fig. 1 exemplary arrangement is the one side for example impregnated using simple brushing or other suitable methods 3D objects.Used priming coat is silicone oil, and top coat(Handle preparation/transparency processing preparation)It is water-based adhesive second Alkene-acetate ethylene copolymer(EVA)The emulsion of latex, it is dispersed in the blend of silicone oil/propane diols as carrier intermediate In.
In another exemplary method, illustrative methods B, it is convenient to omit ground coat step, and directly using being dispersed in The emulsion of transparent polymer in wetability liquid is impregnated.Repeated impregnations process is until reaching required quality of colour. Any of above method can be used alone, or is applied in combination with illustrative methods A, and this is preferable method, because priming coat moistens Wet liquid is top coat(Handle preparation/transparency processing preparation)Provide and further support to penetrate into gauze network.
Specification regulation priming coat and top coat are provided separately with combined treatment preparation offer or both.
Impregnated material
Base coating material:Paper wet material
Any colourless liquid can be used or there is excellent surface tension force for making its colourless by way of soaking paper some. When applying top coat, this liquid is temporarily kept in the top surface network of fibers of paper, is then finally absorbed in paper delivery medium.Separately Outer this liquid should be non-fading.Preferred class paper wetting liquid includes active and inactive silicone oil series in this demonstration And liquid silica gel(LSR)Series(A kind of and two kinds of components systems).Or nonionic surfactant can be used(Liquid or Solid(It is dissolved in carrier intermediate)), because the main purpose of coating be wetting paper and promote top coat absorb/be adsorbed onto paper Top coat in.
Top coat materials:Paper transparent material
The effect of top coat materials is absorbed in the top layer of paper, and fills up the porous network of paper.In addition, the material There must be good optical property, it includes transparency and the refractive index close with cellulose fibre refractive index.For table The suitable polymeric system of coating includes(But it is not limited to)In the form of neat liquid or the silicon rubber as emulsion, silicones, third Olefin(e) acid resin and polyurethane.The demonstration uses the acrylic polymer emulsion being dispersed in priming coat liquid vehicle.But can Will be readily understood that, the polymeric system of neat liquid form can also be used.Furthermore, it is possible to used in alternate coatings based on pure The combination of the system of liquid and emulsion.
Reference picture 6, shows in exemplary arrangement, with dielectric layer N+1 etc. be cut, blade shear action it After produce burr.
This burr tend to by the cut edge 410A of object,(Medium 401)410B is lifted up.Cut edge 410A, 410B this motion upwards cause the injection of ink to reach the cut surface 410A of dielectric layer.Instantly a piece of paper is put When lower(Layer(n + 2)It is not shown)And be pressed/roll, this makes burr flatten before being cut on+2 layers of N.
Ink is ejected into cut surface 410A improved color effects are provided on the surface of object 450.
Printing after shape cutting advantageously allow ink penetration into otch.
With reference to figure 7, it illustrates the exemplary arrangement according to this specification.It is noted that system 100 can further provide for The adaptive structure of object 450.Continuous media layer 405 according to the outside cutting profile of particular medium layer 405 in roll form 400 from Medium 401 is effectively cut, to limit the layer of object.Each cutting 405 further defines cut away 405'.Dielectric layer 405 it is big Small will be different from a dielectric layer to next dielectric layer according to contour of object.Only required size or required size+ The dielectric layer at edge needs to cut from medium.Correspondingly, the system 100 of this specification and method provide subtracting for processing requirement It is few, the part for building opposite exterior lateral sides to the exterior contour of object layer of object is removed for example, being related to, and reduce the wave of material Take.The cut medium of dielectric layer defines the waste material 402 from the conveying of structure position.
Provided the advantage that according to the adaptive structure of the system of this specification arrangement, including-speed is improved, subtract Waste is lacked, there is provided directly apply ink-relative to the improvement of object color to cut edge.
With reference to the exemplary arrangement of Fig. 7 according to this specification, it is described in further detail according to the exemplary of this specification In terms of the adaptive structure of system.
The configuration of this specification advantageously comprises offer:
- all paper layer profiling operations are carried out in a common reference planes(Apply adhesive, colour print, imitate Shape cutting, paper laminate and waste paper remove).
Selective binder deposition between -3D object areas and scrap area.
- final paper laminate is carried out before waste paper removal.
Material is handled using transparency the color of paper or 3D objects is presented.
- use epoxy resin or other appropriate materials to create penetration depth barrier layer for paper transparency material.Barrier Layer and paper transparency processing material can be UV, moisture and/or heat cure.
Carry out handling of paper transparency material using epoxy resin or other appropriate materials.These paper transparencies handle material Material can be UV, moisture and/or heat cure.
The use of epoxy resin or other appropriate materials is that paper transparency material creates penetration depth barrier layer.Barrier layer Can be UV, moisture and/or heat cure with paper transparency processing material.
Carry out handling of paper transparency material using epoxy resin or other appropriate materials.These paper transparencies handle material Material can be UV, moisture and/or heat cure.
The arrangement of specification is including the use of light-setting(photo-setting)Material produces barrier layer, or for holding Row paper, the processing of 3D object transparencies.
The arrangement of the system of this specification for supporting adaptively to build provides the advantage that:
- when using paper, whole paper needs to be processed, and how small has regardless of this part.Therefore, if making one 20 milli The wide widget of rice, then must use the whole A4 pages.The shortcomings that handling whole paper includes:
- increase waste material
- reduce speed
- be more difficult to remove(Monoblock needs to remove, the widget until reaching the inside)
- still, when using a coil paper, we can use adaptive structure, it means that around our processing component Waste material(Even simply part is in itself), rather than whole paper.This has many advantages:
- reduce waste material(All waste materials can be removed in the case of some geometry)
- increase structure speed(Because only that adaptability part needs cutting, glued and bonding)
- be easier to remove waste material, because seldom needing to remove(In some cases without any removal)
The size of-waste material cutting changes also with by the structure process of construction, reflects the geometric form manufactured The change of shape
This method includes herein below:
- with Y1 directions by the medium into web-like be transported to structure room/structure plate
The exterior contour of-the dielectric layer 405 for limiting the object layer built is cut from roll medium, leaves cut away 405'
- medium is fed forward, and dielectric layer 405 is maintained on construction and waste material is removed
Although the system of the exemplary arrangement of described accompanying drawing uses the single dielectric layer drawn from roller input to be used as input, It will be understood that in suitable alternative arrangement, these layers can by sheet form or other it is suitable in the form of provide.
Processing dielectric layer as needed, including bonding, printing, profiling, transparency processing.
The improvement that the configuration of this specification advantageously provides for building 3D objects is handled.The setting of this specification enters one Step provides the improvement control to printing and the improvement to object color controls.
When the upper and lower surface of independent printing objects, often there is the first side and the second side of the dielectric layer on 3D printing On image between alignment the problem of.The improved desktop 3D printing equipment of the configuration provides of this specification.The equipment is favourable Ground is configured as providing the 2-D printings and 3-D printings of medium with integrating process.As described herein, in the exemplary of this specification In arrangement, medium to be printed, paper, equipment is supplied in the form of sheet material or volume, paper is transported to the structure for SDL processing Plate is to be printed, profiling and bonding.
The arrangement of this specification can be advantageously used for but be not limited to the 3D printing of such as photo or contour map.Pass through The object of 3D printing manufacture has accurate color in whole object layer.The method provided is high-precision, and 3D things Body has improved quality.
Therefore, the system of patent specification provides improved color effects in 3D printing.
This specification additionally provides the 3D objects according to caused by described method and system.
The 3D objects according to caused by described method by the operation of system, including be situated between by the multilayer of adhesive bonding The layering object of matter.Each layer is all cut to limit the profile of object layer.Each layer can be printed to limit the face of object layer Color.These layers are paper in exemplary arrangement.Adhesive can be water-based adhesive.The object is advantageously manufactured into high accuracy Standard.Each layer is all handled in a common reference planes.Thus these layers accurately align and combined.Thing The part of body layer is printed on the side of layer surface.Cut edge is also printed.The part of object layer can include limiting barrier The barrier of layer or reflecting material or epoxy resin.The part of object layer is probably transparent.By applying transparent material, can make The part of object layer becomes transparent.3D objects with printing and transparent part are by with overall coloured surface treatment (colour finish).Transparent part is located at printing portion nearby together to be worked with printing portion, to provide final face Color is presented.As needed, transparent part and printing portion provide color presentation in the object of completion.
The method of specification also provides a transparent object.The object includes multiple media by adhesive bonding Layer.Each layer is all cut to limit the profile of object layer.Each layer is all printed to limit the color of object layer.Layer is showing It is paper in exemplary embodiment.Adhesive can be water-based adhesive.These layers can by transparency handle material come handle with Make object transparent.
Conventionally, as needs wait is printed in advance until the paper for print job, so carrying out It is possible that hysteresis in offset printing print procedure during disposable print job.
The configuration of this specification advantageously provides
- printed after white paper is adhered on construction
- this eliminates the pre-print stage
- this eliminates requirement when using pre-print image to placing in high precision.
This eliminates the demand in 2D printing stages two-sided to high accuracy
Printed after the completion of-cutting(This can make ink penetration into cutting)
- in order to seeing ink in bottom surface, there is provided following option
- by making paper become translucent in subsequent processing stage addition coating.
- control the infiltration of coating alternately through adding barrier coat during structure
- alternatively add more ink to paper
- alternatively change paper to be introduced into material rather than change ink by ink
- the equipment that this specification can be operated using the paper of various thickness, including be than other may be deemed applicable to The thinner paper of the paper of system.
The arrangement of this specification provides effective process.
When in this manual in use, including word be used to specify stated feature, entirety, step or component In the presence of, but it is not excluded for the presence or increase of other one or more features, entirety, step, component or its combination.

Claims (125)

1. a kind of method from multiple dielectric layers manufacture 3D objects, including:
Dielectric layer is handled to limit the layer of 3D objects, the processing includes:
Dielectric layer is cut with the profile of confining layers;
Print media layer is with the color of confining layers;
Apply adhesive to dielectric layer,
Wherein, including dielectric layer cutting and printing and apply adhesive to the processing of dielectric layer, be to be put down in common reference Completed in face;And each dielectric layer wherein is handled in structure opening position, the structure position restriction is used to handle dielectric layer Common reference plane;
Wherein, multiple dielectric layers are processed and combined to form object in structure position;
This method also includes applying transparency processing to dielectric layer or object, to cause the partially transparent or partially transparent of processing.
2. according to the method for claim 1, wherein print media layer includes the one side of print media layer.
3. method according to claim 1 or 2, wherein print media layer include the upper table for applying ink to dielectric layer Face.
4. according to the method described in any preceding claims, wherein printing, which is included in the one side of dielectric layer, prints cromogram Picture.
5. according to the method described in any preceding claims, transparent processing is carried out to the dielectric layer of one side printing makes printing from another It is simultaneously visible.
6. according to the method described in claim 1-5, wherein, print media layer includes, with cutting dielectric layer to limit profile Apply ink to dielectric layer in identical reference planes.
7. according to the method described in claim 1-6, wherein the processing of the dielectric layer including the use of one group of common reference point or One common reference point is cut and print media layer.
8. according to the method described in claim 1-7, the processing of its dielectric layer is included in structure opening position In situcut and beaten Print is applied to the last dielectric layer of construction.
9. according to the method described in any preceding claims, wherein cutting includes cutting exterior contour.
10. according to the method described in any preceding claims, wherein cutting also includes cutting in-profile.
11. according to the method described in any preceding claims, wherein applying ink to dielectric layer includes applying ink to The selected part of dielectric layer.
12. according to the method described in any preceding claims, wherein applying ink to dielectric layer is included in a first direction i.e. Apply ink on the surface of dielectric layer.
13. according to the method described in any preceding claims, wherein applying ink to be limited on the direction of medium layer plane Ink layer.
14. according to the method described in any preceding claims, it is included in substantially with wherein applying ink to dielectric layer Apply ink in the second direction at a right angle of one direction.
15. according to the method described in any preceding claims, wherein applying ink to dielectric layer includes applying ink to The cut edge of dielectric layer.
16. according to the method described in any preceding claims, wherein applying ink with the lateral cross upper limit of dielectric layer Stand oil ink ribbon.
17. according to the method described in any preceding claims, wherein apply ink to dielectric layer is applied to Jie including control The position of the ink of the specific part of matter layer and amount.
18. according to the method described in any preceding claims, in addition to change ink and/or change medium with change printing and Color.
19. according to the method described in any preceding claims, the trap of dielectric layer is changed.
20. according to the method described in any preceding claims, the property of ink is changed.
21. according to the method described in any preceding claims, barrier layer is formed in the selected part of dielectric layer or position.
22. according to the method for claim 21, wherein applying barrier material or reflecting material by controlling to form barrier Layer.
23. according to the method for claim 21, wherein applying epoxide resin material by controlling to form barrier layer.
24. according to the method described in any preceding claims, in addition to neighbouring ink layer forms barrier layer or reflecting layer.
25. according to the method described in any preceding claims, the application of wherein ink is controllable to control dielectric layer First longitudinal direction or direction and/or the amount and depth of the ink in the second transverse direction.
26. according to the method for claim 25, its dielectric layer includes the longitudinal cross-section limited by the surface of dielectric layer With the lateral cross limited by the thickness or depth of dielectric layer.
27. according to the method described in any preceding claims, wherein as needed selection and ink on control dielectric layer and The relative position of barrier layer, to produce the final object with color and outward appearance.
28. according to the method described in any preceding claims, in addition to apply a surfactant to dielectric layer.
29. according to the method described in any preceding claims, in addition to the medium that offer is pre-processed with surfactant.
30. according to the method described in any preceding claims, in addition to apply transparency and handle so that the dielectric layer of object Selected part is transparent.
31. according to the method described in any preceding claims, wherein by object is sprayed or is immersed in transparent material come Apply transparency processing.
32. according to the method described in any preceding claims, wherein barrier layer defines the barrier to transparency processing.
33. according to the method described in any preceding claims, wherein transparency processing is configured as penetrating one or more Jie The desired depth of matter layer.
34. according to the method described in any preceding claims, the part to be printed of the exterior contour confining layers in its middle level.
35. according to the method described in any preceding claims, the part to be printed of the in-profile confining layers in its middle level.
36. according to the method described in any preceding claims, wherein 3D objects include multiple dielectric layers, and its dielectric layer The exterior layer or outer surface of object are defined, ink is applied on the surface of dielectric layer.
37. according to the method described in any preceding claims, wherein 3D objects include multiple dielectric layers, and its dielectric layer Limit intermediate layer so that only the marginal portion of dielectric layer limits the surface of object, applies ink to approach and outwardly and inwardly takes turns In a part for wide dielectric layer.
38. according to the method described in any preceding claims, wherein each dielectric layer is from roll form(in roll form) Cut on the medium of offer.
39. according to the method for claim 38, wherein the exterior contour of only dielectric layer is cut from volume.
40. according to the method described in any preceding claims, wherein each dielectric layer is from sheet form(in sheet form) Cut on the medium of offer.
41. according to the method for claim 40, wherein the exterior contour of only dielectric layer is cut from piece.
42. according to the method described in any preceding claims, wherein the size and form of each dielectric layer are according to object form And/or by cutting profile limited and change.
43. according to the method described in any preceding claims, wherein when cutting dielectric layer from the medium provided in roll form When, pumped (conveying) medium with remove waste material and allow next dielectric layer is cut from medium.
44. according to the method described in any preceding claims, wherein 3D objects are deposited by selective layering(SDL)Carry out shape Into.
45. according to the method described in any preceding claims, wherein each dielectric layer of object is divided successively in structure position Manage in other places.
46. one kind is used to handle multiple individually dielectric layers to form three-dimensional(3D)The 3D printing system of object,
The system includes structure module, and structure module defines processing dielectric layer to form the structure position of object layer,
Wherein, system includes
Cutter device, in the profile of structure position cutting dielectric layer, and
Printing equipment, in structure position print media layer in the form of limiting object layer and color,
Adhesive bringing device, dielectric layer is applied adhesive in structure opening position,
Wherein, each dielectric layer, the common reference plane of the structure position restriction processing dielectric layer are handled in structure position.
47. system according to claim 46, wherein 3D objects are deposited by selective layering(SDL)To be formed.
48. the system according to claim 46 or 47, including adhering device, for being bonded to dielectric layer in structure position Object is built, adhering device includes plate or roller.
49. according to the system described in claim 46-48, wherein in the structure multiple dielectric layers of position continuous processing to limit Multiple layers of the object of structure.
50. according to the system described in claim 46-49, including conveying device, for medium to be transported into structure position, with from Medium cuts the profile of dielectric layer.
51. according to the system described in claim 46-50, wherein cutter device is configured to cut the exterior contour of dielectric layer.
52. according to the system described in claim 46-51, including adaptive construction device, wherein, from the dielectric layer of medium cutting Exterior contour depend on the size of object layer built and form and adaptively change.
53. according to the system described in claim 46-52, cutter device is configured to the in-profile from medium cutting dielectric layer.
54. according to the system described in claim 46-53, wherein structure module also includes being used at the selected part of dielectric layer The barrier bringing device of barrier layer is formed as needed.
55. according to the system described in claim 46-54, in addition to controller, controlling profile and/or printing and/or in medium Barrier layer is formed in layer.
56. according to the system described in claim 46-55, wherein printing equipment be configured in a first direction print media layer with Apply ink in a part for dielectric layer surface.
57. according to the system described in claim 46-56, wherein printing equipment be configured to substantially with the surface of dielectric layer into Print media layer in the second direction at right angle.
58. according to the system described in claim 46-57, wherein printing equipment is configured to the cut edge of print media layer.
59. according to the system described in claim 46-58, wherein handling each dielectric layer successively in structure position to limit object The shape and/or form and/or color of layer.
60. a kind of method for being constructed by the 3D objects 450 for handling multiple individually dielectric layers 405 and manufacturing,
Handling each dielectric layer includes
Equipment as any one of preceding claims is provided
Medium 401 is transported to structure object by the structure opening position in room 310 is built
Medium is pressed onto on structure object using heating plate 320 or pressure roll 330 and is applied with adhesive so that medium 401 to be adhered to Previous dielectric layer N on,
Dielectric layer N+1 profile is cut in media as well
Apply adhesive to dielectric layer N+1
Each dielectric layer of object is reprocessed, wherein handling each dielectric layer in common reference plane.
61. the method for structure 3D objects 450 according to claim 60, handling each dielectric layer also includes print media layer N+1。
62. the method for the structure 3D objects 450 according to claim 60-61, in addition to apply transparency processing 850 so that The selected part of the dielectric layer of object is transparent.
63. the method for the structure 3D objects 450 according to claim 60-62, wherein processing is additionally included in shape in dielectric layer Into barrier layer.
64. the method for structure 3D objects 450 according to claim 63, wherein barrier layer are defined to transparency processing Barrier.
65. the processing of the method for the structure 3D objects 450 according to claim 60-62, wherein transparency is configured to pass through one The desired depth of individual dielectric layer or multiple dielectric layers.
66. the method for the structure 3D objects 450 according to claim 60-65, wherein 3D objects are sunk by selective layering Product(SDL)To be formed.
67. the method for the structure 3D objects 450 according to claim 60-66, wherein medium 401 include Jie in roll form Matter, and the profile for wherein cutting dielectric layer includes the exterior contour from medium cutting dielectric layer.
68. the method for the structure 3D objects 450 according to claim 60-67, wherein each dielectric layer from medium cutting Profile it is different according to the profile of object layer.
69. the method for the structure 3D objects 450 according to claim 60-68, wherein method provide adaptive structure, each Dielectric layer is cut to limit the profile of object layer.
70. the method for the structure 3D objects 450 according to claim 60-69, the profile from medium cutting dielectric layer it Afterwards, the remaining waste material cutting of medium is transported away-is transported to as the print media floor N+1 of dielectric layer new portion from structure room Room is built to be cut.
A kind of 71. method for forming the color 3D object for including multiple dielectric layers, wherein handling each dielectric layer to limit object Layer,
Each dielectric layer is handled to limit the layer of object, including:
Layer is bonded to preceding layer or the basic unit of object
The profile of incised layer
Apply adhesive
Reprocess each pantostrat, until forming object, and also include applying transparency handle so that one of object or Multiple layers of selected part is transparent.
72. a kind of handled 3D objects so that at least partly transparent side of the selected part of one or more layers of object Method, the 3D objects include multiple paper wood bed of materials, and methods described includes:
Transparency processing material is applied to at least selected part of object, transparency processing material is configured to penetrate Jie The desired depth of matter layer or multiple dielectric layers, wherein as transparency processing material is absorbed into dielectric layer, the dielectric layer is set to be in It is existing transparent.
73. the method according to claim 71 or 72, transparency processing material includes index-matching material.
74. according to the method described in claim 71-73, transparency processing material includes triglycerides base oil, such as dryness, food With, nut, citrus, medicinal oil.
75. according to the method described in claim 71-74, transparency processing material includes synthetic polymer sill such as acrylic acid Class and polyurethane.
76. according to the method described in claim 71-75, the refractive index of transparency processing material reflects as close possible to cellulose Rate(It is 1.55 in 592nm).
77. according to the method described in claim 1 or claim 71-76 any one, transparency processing material has Optical property, it includes transparency and the refractive index close with cellulose fibre refractive index.
78. according to the method described in claim 1 or claim 71-77 any one, transparency processing material includes Polymeric system, it includes in the form of neat liquid or fluid silicone rubber and resin system as emulsion, acrylic resin, poly- One or more in urethane and epoxy-resin systems.
79. according to the method described in claim 1 or claim 71-77 any one, transparency processing material includes The emulsion for the polymeric system being dispersed in fountain solution.
80. wearing in object is absorbed into according to the method described in claim 71-79, in addition to control transparency processing material Saturating depth.
81. according to the method described in claim 71-80, wherein controlling penetration depth to keep the structure model object of completion White point, and CMYK color is provided as needed.
82. according to the method described in claim 71-81, wherein transparency processing material is comprising with high molecular weight material and to the greatest extent It may be close to cellulose refractive index(It is 1.55 in 592nm)Refractive index.
83. according to the method described in claim 71-82, transparency processing material includes synthetic polymer sill such as acrylic acid Resin, polyurethane and epoxy resin.
84. the method according to claim 83, wherein the material include epoxy resin and provide single curing agent/ Crosslinker material.
85. according to the method described in claim 77-84, wherein penetration depth is by fast using UV curing solutions or UV base resins etc. The step of fast curing solution and solidification, controls.
86. the method according to claim 85, wherein curing schedule eliminate ambient solvent evaporation so that material can be Dried under UV lamp in the time shorter the time required to than solvent-based resin & adhesives.
87. according to the method described in claim 85-86, wherein UV- bases resin does not contain VOC(Volatile organic solvent).
88. according to the method described in claim 71-87, in addition to barrier layer or boundary layer are formed to limit transparency processing material Material penetrates.
89. the method according to claim 88, wherein forming boundary layer includes applying reflecting material or barrier material.
90. the method according to claim 89, wherein reflection or barrier material are applied to each layer.
91. the method according to claim 87, wherein barrier layer include epoxy resin.
92. the method according to claim 88, wherein barrier material also include crosslinking agent.
93. according to the method described in claim 71-89, handling each dielectric layer to limit the layer of object also includes print media Layer is to limit the color of the layer of object.
94. a kind of method for forming transparent 3D objects, this method include:
3D objects are provided, the 3D objects include multiple dielectric layers, combined to form the object, wherein, dielectric layer is Porous material;
Transparency processing emulsion is provided;
Transparency processing emulsion is applied to the part of object or object so that the presentation of the part of object or object is transparent.
95. the method according to claim 94, its dielectric layer is paper.
96. the method according to claim 94, the porous material that it is not paper that its dielectric layer, which is,.
97. according to the method described in claim 94-97, wherein transparency processing emulsion is configured to impregnated material.
98. according to the method described in claim 94-97, the porous material of its dielectric layer is configured for transparency processing The support of emulsion so that transparency processing emulsion can absorb and the property of impregnated material is presented.
99. according to the method described in claim 94-98, wherein transparency processing emulsion be configured to penetrate one of object or The desired depth of multiple dielectric layers.
100. according to the method described in claim 94-99, wherein the characteristic of control object or object dielectric layer is transparent to control Degree processing emulsion enters the trap of object.
101. according to the method described in claim 94-100, wherein the property of control object or object dielectric layer is transparent to control Degree processing emulsion penetrates to object.
102. according to the method described in claim 94-101, wherein transparency processing emulsion is by the way that transparency is handled into emulsion It is ejected on object, or emulsion is handled to apply by the way that object is immersed into transparency.
A kind of 103. method for forming at least partly transparent 3D objects for including multiple dielectric layers, wherein handling each dielectric layer To limit the layer of object,
Each dielectric layer is handled to limit the layer of object, including:
The profile of incised layer
Apply adhesive
Layer is bonded to preceding layer or the basic unit of object
Each pantostrat is reprocessed, until forming object, its dielectric layer includes porous material,
Also include applying transparency processing emulsion so that the selected part of one or more layers of object is transparent.
104. the method according to claim 103, its dielectric layer is paper or dielectric layer not to be the porous material of paper; And the porous material of dielectric layer is configured for the support of transparency processing emulsion so that transparency, which handles emulsion, to be in The property of existing impregnated material.
105. the method according to claim 103 or 104, transparency processing emulsion is configured to impregnated material.
106. according to the method described in claim 103-105, transparency processing emulsion be configured to penetrate one of object or The desired depth of multiple dielectric layers.
107. according to the method described in claim 103-106, wherein controlling the characteristic of object or object dielectric layer to control:
- transparency processing emulsion enters the trap of object, or
- transparency processing emulsion penetrates to object.
108. according to the method described in claim 103-107, the property of object or object dielectric layer is controlled to control transparency Processing emulsion penetrates to object.
109. according to the method described in claim 103-108, wherein transparency is handled into emulsion after object has been built up It is applied to the selected part of object or object.
110. according to the method described in claim 103-109, wherein transparency processing emulsion be by spray applying mode or Person by object by immersing emulsion to apply.
111. a kind of method of processing 3D objects, the 3D objects include multiple paper wood bed of materials, so that one or more layers of object Selected part it is at least partly transparent,
This method includes:
3D printing object and transparency processing emulsion are provided;
Transparency processing emulsion is applied to at least selected part of object, transparency processing emulsion is configured to penetrate the object A dielectric layer or multiple dielectric layers desired depth, wherein when transparency processing emulsion be absorbed into dielectric layer when, be situated between Matter layer or part thereof becomes transparent.
112. according to the method described in claim 94-101, transparency processing material includes index-matching material.
113. according to the method described in claim 94-112, transparency processing material includes triglycerides base oil, such as dryness, Edible, nut, citrus, medicinal oil.
114. according to the method described in claim 94-113, transparency processing material includes synthetic polymer sill such as propylene Acids and polyurethane.
115. according to the method described in claim 94-114, the refractive index of transparency processing material is rolled over as close possible to cellulose Penetrate rate(It is 1.55 in 592nm).
116. it is absorbed into according to the method described in claim 94-115, in addition to control transparency processing material in object Penetration depth.
117. according to the method described in claim 94-116, wherein controlling penetration depth to keep the structure model object completed White point, and provide CMYK color as needed.
118. according to the method described in claim 94-117, in addition to barrier layer or boundary layer are formed to limit transparency processing Material penetrates.
119. the method according to claim 118, wherein forming boundary layer includes applying reflecting material or barrier material.
120. the method according to claim 118 or 119, wherein reflection or barrier material are applied to the portion of selected layer or layer Point.
121. according to the method described in claim 118-120, wherein barrier layer includes epoxy resin.
122. according to the method described in claim 118-121, wherein barrier layer also includes crosslinking agent.
123. according to the method described in any one in claim 94-122, each dielectric layer is handled to limit the layer of object also Including, print media layer to limit the color of the layer of object.
124. a kind of 3D objects manufactured in object manufacturing process is layered, layer is by the porous material structure by adhesive bonding Into wherein handling material process object so that object or part thereof becomes using the transparency caning absorb in porous material It is bright.
125. a kind of method from multiple dielectric layers manufacture 3D objects, including:
To limit the layer of 3D objects, the processing includes-processing dielectric layer:
Dielectric layer is cut with the profile of confining layers;
Print media layer is with the color of confining layers;
Processing including cutting and the printing of dielectric layer is completed in common reference plane,
Plurality of dielectric layer is processed and combined to form object in structure position.
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JP6948268B2 (en) 2021-10-13
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