CN107793944A - A kind of organic silica gel static-free glue band - Google Patents
A kind of organic silica gel static-free glue band Download PDFInfo
- Publication number
- CN107793944A CN107793944A CN201711079300.3A CN201711079300A CN107793944A CN 107793944 A CN107793944 A CN 107793944A CN 201711079300 A CN201711079300 A CN 201711079300A CN 107793944 A CN107793944 A CN 107793944A
- Authority
- CN
- China
- Prior art keywords
- silica gel
- organic silica
- silicon dioxide
- static
- glue band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of organic silica gel static-free glue band, including：PET film thick 0.025mm, PET film surface is dispersed in organic silica gel to have nanometer silicon dioxide particle coated with organic silica gel thick 0.02mm, and silver ion is adsorbed with the hole of nanometer silicon dioxide particle.Adhesive tape prepared by the present invention has acid and alkali-resistance, wear-resisting and antistatic function concurrently, can be used under various Different climate damp conditions, and high financial profit, cost is low, service life length.
Description
Technical field：
The present invention relates to tape technology field, more particularly to a kind of organic silica gel static-free glue band.
Background technology：
With the rapid development of electronic technology, integrated circuit physical size gradually reduces, the continuous improvement of integrated level, and
More new high polymer material widely uses, and Electro-static Driven Comb increasingly becomes important, the problem of electrostatic protection also increasingly by
More extensive concern.FPC so far is (referred to as：Flexible PCB) manufacturing process nearly all be using subtractive process (etching
Method) processing, generally using copper coated foil plate as the material that sets out, using photoetching process formed resist layer, etching removing should not part copper
Face forms circuit conductor, then HTHP pressing cover layer composition wiring board.Resistance to height is needed in this wiring board formation process
Warm protection adhesive tape, is protected to its PI carrier layer, it was not pressed by the erosion of etching decoction and in cover layer
Protect it from being destroyed in journey.Need to remove high temperature resistant protection adhesive tape after the laminating end of cover layer, shelled after high-temperature process
It is easy to produce electrostatic from adhesive tape, caused accumulation of static electricity easily influences its performance being made after wiring board on PI faces；Therefore
On the one hand require that High temperature-resistanadhesive adhesive tape has preferable heat-resisting quantity, i.e., peeled off after high temperature without cull；On the other hand, also require resistance to
High temperature gummed tape has electrostatic-proof function.
At present, some high-temperature resistant silicone glue static-free glue bands on the market still have following problem：(1) to glue-line with
Ionic additive is introduced in the interlayer of base material, its electrostatic conductive performance relies primarily on humidity in environment, in hot environment, by nothing
The anti-static electrification that method is brought into normal play；(2) ionic additive is introduced into glue-line, because these ionic additives can be with PI faces
Directly contact, and the risk from migrate and being transferred on PI faces to film surface in glue-line be present, pollute PI faces；(3) to glue
Conductive metal particles or high molecular particle are introduced in glutinous agent, although its own can keep static conductive function, due to these
The introducing of conductive particle, some performances of adhesive in itself will be had influence on, such as reduce cohesive strength, abrasion resistance, acid-alkali-resistant degree.
The content of the invention：
It is good that the technical problems to be solved by the invention are to provide a kind of feature of environmental protection, is easy to industrial organic silica gel and prevents
Electrostatic adhesive tape.
In order to solve the above technical problems, the present invention uses following technical scheme：
A kind of organic silica gel static-free glue band, it is characterised in that including：PET film thick 0.025mm, PET film surface
It is dispersed in organic silica gel to have nanometer silicon dioxide particle, nano silicon coated with the thick organic silica gels of 0.02mm
Silver ion is adsorbed with the hole of grain.
The nanometer silicon dioxide particle size is 30-80nm.
The beneficial effects of the invention are as follows：Adhesive tape prepared by the present invention has acid and alkali-resistance, wear-resisting and antistatic function concurrently, can be
Used under various Different climate damp conditions, high financial profit, cost is low, service life length.
Embodiment：
In order that the technical means, the inventive features, the objects and the advantages of the present invention are easy to understand, tie below
Specific embodiment is closed, the present invention is expanded on further.
Embodiment 1
A kind of organic silica gel static-free glue band, it is characterised in that including：PET film thick 0.025mm, PET film surface
It is dispersed in organic silica gel to have nanometer silicon dioxide particle, nano silicon coated with the thick organic silica gels of 0.02mm
Silver ion is adsorbed with the hole of grain.
Embodiment 2
A kind of organic silica gel static-free glue band, it is characterised in that including：PET film thick 0.025mm, PET film surface
It is dispersed in organic silica gel to have nanometer silicon dioxide particle, nano silicon coated with the thick organic silica gels of 0.02mm
Silver ion is adsorbed with the hole of grain；Nanometer silicon dioxide particle size is 30-80nm.
It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, above-described embodiment and explanation
Merely illustrating the principles of the invention described in book, without departing from the spirit and scope of the present invention, the present invention also have
Various changes and modifications, these changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention
By appended claims and its equivalent thereof.
Claims (2)
- A kind of 1. organic silica gel static-free glue band, it is characterised in that including：PET film thick 0.025mm, PET film surface apply It is covered with the thick organic silica gels of 0.02mm, it is dispersed in organic silica gel to have nanometer silicon dioxide particle, nanometer silicon dioxide particle Hole in be adsorbed with silver ion.
- 2. organic silica gel static-free glue band according to claim 1, it is characterised in that：The nanometer silicon dioxide particle is big Small is 30-80nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711079300.3A CN107793944A (en) | 2017-11-06 | 2017-11-06 | A kind of organic silica gel static-free glue band |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711079300.3A CN107793944A (en) | 2017-11-06 | 2017-11-06 | A kind of organic silica gel static-free glue band |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107793944A true CN107793944A (en) | 2018-03-13 |
Family
ID=61549143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711079300.3A Pending CN107793944A (en) | 2017-11-06 | 2017-11-06 | A kind of organic silica gel static-free glue band |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107793944A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110423568A (en) * | 2019-07-03 | 2019-11-08 | 昆山博益鑫成高分子材料有限公司 | A kind of two-sided antistatic High temperature-resistanadhesive adhesive tape |
| CN112708391A (en) * | 2020-12-10 | 2021-04-27 | 晟大科技(南通)有限公司 | Special adhesive for Flexible Printed Circuit (FPC) and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102757757A (en) * | 2012-07-09 | 2012-10-31 | 苏州斯迪克新材料科技股份有限公司 | Micropore-type organic silicone adhesive |
| CN102876282A (en) * | 2012-09-13 | 2013-01-16 | 上海大学 | Preparation method of transparent organic silica glue for encapsulating nano SiO2 modified COB-LEDs |
| CN105295825A (en) * | 2015-11-11 | 2016-02-03 | 无锡英普林纳米科技有限公司 | Nanometer organic silica gel with color changing function |
-
2017
- 2017-11-06 CN CN201711079300.3A patent/CN107793944A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102757757A (en) * | 2012-07-09 | 2012-10-31 | 苏州斯迪克新材料科技股份有限公司 | Micropore-type organic silicone adhesive |
| CN102876282A (en) * | 2012-09-13 | 2013-01-16 | 上海大学 | Preparation method of transparent organic silica glue for encapsulating nano SiO2 modified COB-LEDs |
| CN105295825A (en) * | 2015-11-11 | 2016-02-03 | 无锡英普林纳米科技有限公司 | Nanometer organic silica gel with color changing function |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110423568A (en) * | 2019-07-03 | 2019-11-08 | 昆山博益鑫成高分子材料有限公司 | A kind of two-sided antistatic High temperature-resistanadhesive adhesive tape |
| CN112708391A (en) * | 2020-12-10 | 2021-04-27 | 晟大科技(南通)有限公司 | Special adhesive for Flexible Printed Circuit (FPC) and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180313 |