CN107722903A - Layer material is sticked in the anti-oxidant of electric adhesive tape - Google Patents

Layer material is sticked in the anti-oxidant of electric adhesive tape Download PDF

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Publication number
CN107722903A
CN107722903A CN201711084811.4A CN201711084811A CN107722903A CN 107722903 A CN107722903 A CN 107722903A CN 201711084811 A CN201711084811 A CN 201711084811A CN 107722903 A CN107722903 A CN 107722903A
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CN
China
Prior art keywords
layer material
component
hours
obtains
adhesive tape
Prior art date
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Pending
Application number
CN201711084811.4A
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Chinese (zh)
Inventor
张永宏
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Individual
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Individual
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Publication date
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Priority to CN201711084811.4A priority Critical patent/CN107722903A/en
Publication of CN107722903A publication Critical patent/CN107722903A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/04—Antistatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)

Abstract

The present invention provides a kind of the anti-oxidant of electric adhesive tape and sticks layer material, and preparation method is as follows：(1) polyvinyl chloride 5g, dimethicone 2g are added in bisphenol A type epoxy resin 25g, after stirring 2 hours, obtains first component；(2) nano silicon is preheated to 90 DEG C, it is added in pulverizer with coupling agent and mixed 20 minutes, be placed in drying box and dry 3 hours, drying temperature is 120 DEG C, obtains modified manometer silicon dioxide powder；(3) nano silica powder, toughener, stabilizer that step (2) obtains are weighed in proportion and adds curing agent, are stirred 3 hours at 65 DEG C, are obtained component B；(4) first component and component B are well mixed, obtain sticking layer material.The adhesion layer material adhesion of the present invention is strong, beneficial to elimination electrostatic.

Description

Layer material is sticked in the anti-oxidant of electric adhesive tape
Technical field
The present invention relates to Electrostatic Absorption film field, specifically, is related to a kind of the anti-oxidant of electric adhesive tape and sticks layer material.
Background technology
With the rapid development of electronic technology, integrated circuit physical size gradually reduces, the continuous improvement of integrated level, and More new high polymer material widely uses, and Electro-static Driven Comb increasingly becomes important, the problem of electrostatic protection also increasingly by More extensive concern.FPC so far is (referred to as：Flexible PCB) manufacturing process nearly all be using subtractive process (etching Method) processing, generally using copper coated foil plate as the material that sets out, using photoetching process formed resist layer, etching removing should not part copper Face forms circuit conductor, then HTHP pressing cover layer composition wiring board.Resistance to height is needed in this wiring board formation process Warm protection adhesive tape, is protected to its PI carrier layer, it was not pressed by the erosion of etching decoction and in cover layer Protect it from being destroyed in journey.Need to remove high temperature resistant protection adhesive tape after the laminating end of cover layer, shelled after high-temperature process It is easy to produce electrostatic from adhesive tape, caused accumulation of static electricity easily influences its performance being made after wiring board on PI faces；Therefore On the one hand require that High temperature-resistanadhesive adhesive tape has preferable heat-resisting quantity, i.e., peeled off after high temperature without cull；On the other hand, also require resistance to High temperature gummed tape has electrostatic-proof function.
At present, some high-temperature-resistant antistatic adhesive tapes on the market still have following problem：(1) to glue-line and the folder of base material Ionic additive is introduced in layer, its electrostatic conductive performance relies primarily on humidity in environment, in hot environment, will be unable to play just Normal anti-static electrification；(2) ionic additive is introduced into glue-line, because these ionic additives can directly connect with PI faces Touch, and the risk from migrate and being transferred on PI faces to film surface in glue-line be present, pollute PI faces；(3) into adhesive Conductive metal particles or high molecular particle are introduced, although its own can keep static conductive function, due to these conductive The introducing of grain, will have influence on some performances of adhesive in itself, such as reduce cohesive strength, abrasion resistance, acid-alkali-resistant degree.
The content of the invention
It is an object of the invention to provide a kind of the anti-oxidant of electric adhesive tape to stick layer material, to solve above-mentioned technical problem.
The present invention using following technical scheme in order to solve the above technical problems, realized：
Layer material is sticked in a kind of the anti-oxidant of electric adhesive tape, it is characterised in that preparation method is as follows：
(1) polyvinyl chloride 5g, dimethicone 2g are added in bisphenol A type epoxy resin 25g, after stirring 2 hours, obtained First component；
(2) nano silicon is preheated to 90 DEG C, it is added in pulverizer with coupling agent and mixed 20 minutes, is placed in dry Dried 3 hours in dry case, drying temperature is 120 DEG C, obtains modified manometer silicon dioxide powder；
(3) nano silica powder, toughener, stabilizer that step (2) obtains are weighed in proportion adds curing agent, Stirred 3 hours at 65 DEG C, obtain component B；
(4) first component and component B are well mixed, obtain sticking layer material.
The particle diameter 80-120nm of the nano silicon.
The beneficial effects of the invention are as follows：
The adhesion layer material adhesion of the present invention is strong, beneficial to elimination electrostatic.
Embodiment
In order that the technical means, the inventive features, the objects and the advantages of the present invention are easy to understand, tie below Specific embodiment is closed, the present invention is expanded on further, but following embodiments are only the preferred embodiments of the present invention, and it is not all. Based on the embodiment in embodiment, those skilled in the art obtain other realities on the premise of creative work is not made Example is applied, belongs to protection scope of the present invention.Experimental method in following embodiments, it is conventional method unless otherwise specified, Material used, reagent etc., unless otherwise specified, are commercially obtained in following embodiments.
Embodiment 1
Layer material is sticked in a kind of the anti-oxidant of electric adhesive tape, and preparation method is as follows：
(1) polyvinyl chloride 5g, dimethicone 2g are added in bisphenol A type epoxy resin 25g, after stirring 2 hours, obtained First component；
(2) nano silicon is preheated to 90 DEG C, it is added in pulverizer with coupling agent and mixed 20 minutes, is placed in dry Dried 3 hours in dry case, drying temperature is 120 DEG C, obtains modified manometer silicon dioxide powder；
(3) nano silica powder, toughener, stabilizer that step (2) obtains are weighed in proportion adds curing agent, Stirred 3 hours at 65 DEG C, obtain component B；
(4) first component and component B are well mixed, obtain sticking layer material.
General principle, principal character and the advantages of the present invention of the present invention has been shown and described above.The technology of the industry For personnel it should be appreciated that the present invention is not limited to the above embodiments, that described in above-described embodiment and specification is only the present invention Preference, be not intended to limit the present invention, without departing from the spirit and scope of the present invention, the present invention also have it is various Changes and improvements, these changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by institute Attached claims and its equivalent thereof.

Claims (2)

1. layer material is sticked in a kind of the anti-oxidant of electric adhesive tape, it is characterised in that preparation method is as follows：
(1) polyvinyl chloride 5g, dimethicone 2g are added in bisphenol A type epoxy resin 25g, after stirring 2 hours, obtains first group Part；
(2) nano silicon 5g is preheated to 90 DEG C, it is added in pulverizer with coupling agent 6g and mixed 20 minutes, is placed in dry Dried 3 hours in dry case, drying temperature is 120 DEG C, obtains modified manometer silicon dioxide powder；
(3) nano silica powder, toughener, stabilizer that step (2) obtains are weighed in proportion and adds curing agent, at 65 DEG C Lower stirring 3 hours, obtains component B；
(4) first component and component B are well mixed, obtain sticking layer material.
2. layer material is sticked in the anti-oxidant of electric adhesive tape according to claim 1, it is characterised in that the nano silicon Particle diameter 80-120nm.
CN201711084811.4A 2017-11-07 2017-11-07 Layer material is sticked in the anti-oxidant of electric adhesive tape Pending CN107722903A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711084811.4A CN107722903A (en) 2017-11-07 2017-11-07 Layer material is sticked in the anti-oxidant of electric adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711084811.4A CN107722903A (en) 2017-11-07 2017-11-07 Layer material is sticked in the anti-oxidant of electric adhesive tape

Publications (1)

Publication Number Publication Date
CN107722903A true CN107722903A (en) 2018-02-23

Family

ID=61222741

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711084811.4A Pending CN107722903A (en) 2017-11-07 2017-11-07 Layer material is sticked in the anti-oxidant of electric adhesive tape

Country Status (1)

Country Link
CN (1) CN107722903A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101553546A (en) * 2006-10-06 2009-10-07 蒂萨股份公司 Heat-activable adhesive tape particularly for bonding electronic components and conductor tracks

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101553546A (en) * 2006-10-06 2009-10-07 蒂萨股份公司 Heat-activable adhesive tape particularly for bonding electronic components and conductor tracks

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Application publication date: 20180223

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