CN107768861B - CQFP encapsulation form ageing socket with double location guide slot - Google Patents
CQFP encapsulation form ageing socket with double location guide slot Download PDFInfo
- Publication number
- CN107768861B CN107768861B CN201710801983.2A CN201710801983A CN107768861B CN 107768861 B CN107768861 B CN 107768861B CN 201710801983 A CN201710801983 A CN 201710801983A CN 107768861 B CN107768861 B CN 107768861B
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- China
- Prior art keywords
- socket
- lower cover
- positioning
- guide
- cqfp
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
- H01R13/631—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
Landscapes
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
A CQFP packaging type aging socket with double rows of positioning guide grooves is characterized in that an upper socket cover and a lower socket cover are connected through a connecting shaft sleeved with springs. The socket lower cover comprises a socket lower cover base body and four floating plates, the four floating plates are symmetrically arranged along the center of the socket lower cover base body, each floating plate is provided with a row of socket guide pins and two rows of socket positioning guide grooves, the number and the positions of the socket guide pins are in one-to-one correspondence with the guide legs of the circuit chip, each socket positioning guide groove in the two rows of socket positioning guide grooves corresponds to one socket guide pin, and the circuit guide pins are conveniently placed on the corresponding socket guide pins, so that dislocation phenomenon is avoided. The socket lower cover and the socket upper cover are fastened by fastening means. The invention adopts the double-row positioning guide groove mode, thereby avoiding the problem that the circuit leads are short-circuited to cause failure when the CQFP packaging type circuit with the lead spacing of 0.5mm is used in the socket, and improving the reliability of the aging socket.
Description
Technical Field
The invention relates to a CQFP (CQFP) packaging type aging socket with double rows of positioning guide grooves, and belongs to the technical field of aging socket structure improvement.
Background
In recent years, the integrated circuit industry developed in China develops rapidly, the integrated level of the integrated circuit is higher and higher, the number of the pins is more and more, the length of the pins is longer and longer, and the interval between the pins is smaller and smaller. Whereas the existing positioning system of the CQFP packaging type socket only comprises a point needle and a single-row positioning guide groove. The CQFP packaging type circuit with the spacing of the leads of 0.5mm is very easy to have the phenomenon of bridging short circuit of adjacent leads when the existing socket is used.
Disclosure of Invention
The technical solution of the invention is as follows: the CQFP packaging type aging socket with the double-row positioning guide grooves solves the problems that when a CQFP packaging type circuit with more guide legs, longer lead wires and a guide leg interval of 0.5mm is used, adjacent guide legs bridge and short circuit, avoids failure caused by short circuit among the guide legs of the circuit, and improves the reliability of the aging socket.
The technical scheme of the invention is as follows: a CQFP packaging type aging socket with double rows of positioning guide grooves comprises a socket upper cover and a socket lower cover;
the socket lower cover comprises a socket lower cover base body and four floating plates, wherein the four floating plates are symmetrically arranged in a cross shape along the center of the socket lower cover base body, a first row of socket positioning guide grooves, a second row of socket positioning guide grooves and socket guide pin grooves are sequentially formed in each floating plate along the direction away from the center of the socket lower cover base body, when a circuit chip is placed on the socket lower cover base body, guide pins on the socket guide pin grooves are in one-to-one correspondence with guide legs of the circuit chip, and guide grooves which are in one-to-one correspondence with the guide pins on the socket guide pin grooves are formed in the first row of socket positioning guide grooves and the second row of socket positioning guide grooves;
the upper socket cover and the lower socket cover are connected through a connecting shaft sleeved with a spring, the upper socket cover can rotate around the connecting shaft, and when the aging socket is closed, the upper socket cover and the lower socket cover are fastened.
The angle of rotation of the socket upper cover around the connecting shaft is more than or equal to 90 degrees.
The distance between the second row of socket positioning guide grooves and the first row of socket positioning guide grooves is 1-2 times of the distance between the second row of socket positioning guide grooves and the socket guide pin grooves.
The opposite sides of each floating plate are fixed on the lower cover base body through springs.
The center of the upper cover of the socket is provided with a through hole, the through hole is provided with a pressing plate, when the ageing socket is closed, the pressing plate and the floating plate are matched with each other, the circuit chip is ensured to be positioned on the same plane by pressing the pressing plate to press the circuit chip, and the circuit chip leads legs are in close contact with the guide pins on the guide pin grooves of the socket.
And the socket lower cover base body is provided with a positioning needle for fixing the circuit chip.
The number of the positioning pins is 3, and the positioning pins are used for fixing three positioning holes at the edge of the circuit chip, so that the position of the circuit chip can be conveniently adjusted.
The upper socket cover and the lower socket cover are square.
The fastening mode of the upper socket cover and the lower socket cover is as follows: a groove is formed in one end of the opening of the socket lower cover body, a fastening component is formed in one end of the opening of the socket upper cover body, a protrusion matched with the groove is formed in the fastening component, and when the socket is closed, the protrusion can be clamped in the groove to fasten the socket upper cover and the socket lower cover.
Compared with the prior art, the invention has the advantages that:
(1) According to the invention, due to the adoption of the double-row positioning guide groove mode, when the CQFP packaging type circuit chip with more guide legs, longer leads and a guide leg interval of 0.5mm is used for the socket of the type, the slightly deformed guide legs are positioned again through the other row positioning guide groove on the basis of positioning the positioning guide groove of the one row, so that the guide legs of the circuit are positioned in the guide groove, the guide legs are prevented from being deformed more effectively, the phenomenon of bypass short circuit between the adjacent guide legs of the circuit is prevented effectively, and the reliability and applicability of the aged socket are improved.
(2) The angle of rotation of the upper cover of the socket around the connecting shaft is more than or equal to 90 degrees, so that the included angle between the upper cover of the socket and the lower cover of the socket is more than or equal to 90 degrees when the aged socket is opened, and the discharging circuit chip is convenient to take out.
(3) According to the invention, the pressing plate is designed on the upper cover of the socket, the floating plate is designed on the lower cover of the socket, the floating plate is fixed through the spring, when the upper cover and the lower cover are fastened, the pressing plate is pressed down, and the circuit is ensured to be positioned on the same plane through the mutual matching of the pressing plate and the floating plate, so that the circuit guide legs are tightly contacted with the socket guide pins, and the effectiveness of the socket is further ensured.
(4) The socket lower cover seat body is provided with the locating pins, and the number of the locating pins is 3, and the locating pins are used for fixing three locating holes at the edge of the circuit chip, so that the position of the circuit can be conveniently adjusted.
Drawings
FIG. 1 is a perspective view of a socket according to the present invention;
fig. 2 is a perspective view of a socket cover according to the present invention;
FIG. 3 is a front perspective view of the socket bottom cover of the present invention;
fig. 4 is a rear perspective view of the socket lower cover of the present invention.
Detailed Description
As shown in fig. 1, the socket of the present invention is a perspective view, and is composed of a socket upper cover 1 and a socket lower cover 2.
As shown in fig. 2, in a perspective view of the socket upper cover of the present invention, the socket upper cover 1 is square and includes a socket upper cover base 14 and a pressing plate 13, a through hole is formed in the center of the socket upper cover base 14, and the pressing plate 13 is disposed in the through hole.
As shown in fig. 3 and 4, the socket lower cover 2 is square and includes a socket lower cover base 21 and four floating plates 22. The four floating plates 22 are symmetrically arranged in a cross shape along the center of the socket lower cover base 21, that is, two floating plates are located on the longitudinal axis of the socket lower cover base 21, and the other two floating plates are located on the transverse axis of the socket lower cover base 21. Each floating plate 22 is provided with a row of socket guide pin grooves 221 and two rows of socket positioning guide grooves, the first row of socket positioning guide grooves 222 are close to the center of the socket lower cover base 21, the second row of socket positioning guide grooves 223 are located between the first row of socket positioning guide grooves 222 and the socket guide pin grooves 221, when a circuit chip is placed on the socket lower cover base 21, guide pins on the socket guide pin grooves 221 are in one-to-one correspondence with guide pins of the circuit chip, guide grooves corresponding to the guide pins one-to-one are formed in the first row of socket positioning guide grooves and the second row of socket positioning guide grooves, and the circuit chip guide pins are placed on the corresponding socket guide pin grooves 221 conveniently, so that dislocation phenomenon is avoided.
The opposite sides of each floating plate 22 are arranged on the socket lower cover base 21 through springs, the pressing plates 13 and the floating plates 22 are matched with each other, when the socket lower cover 2 and the socket upper cover 1 are fastened, the circuit chips are pressed down through the pressing plates 13, the circuit chips are ensured to be positioned on the same plane, and the circuit chip guide legs are in tight contact with the socket guide pin grooves 221.
The distance between the second-row socket positioning guide grooves 223 and the first-row socket positioning guide grooves 222 is 1-2 times the distance between the second-row socket positioning guide grooves 222 and the socket pin grooves 221.
As shown in fig. 3, 3 positioning pins 213 are disposed on the socket lower cover base 21, and are used for fixing three positioning holes at the edge of the circuit chip, so as to facilitate adjusting the position of the circuit chip.
The upper socket cover 1 and the lower socket cover 2 are rotationally connected, and the specific implementation mode is as follows: two bulges are processed on one edge of the socket upper cover base body 14, a positioning hole 12 is formed in each bulge, two bulges are processed on the edge, connected with the socket upper cover base body, of the socket lower cover base body 21, a positioning hole 211 is formed in each bulge, the positioning hole 12 and the positioning hole 211 are placed on the same horizontal line, a connecting shaft penetrates through the positioning hole, and a spring is sleeved on the connecting shaft, so that connection of the upper cover and the lower cover is realized. The upper cover of the socket can rotate along the connecting shaft, and the rotating angle is more than or equal to 90 degrees, so that the circuit chip can be conveniently placed.
The socket lower cover seat body 21 is provided with a groove 212 at one open end, the socket upper cover seat body 14 is provided with a fastening component 11 at one open end, the fastening component 11 is provided with a protrusion, the protrusion is matched with the groove 212, and when the socket is closed, the protrusion 11 can be clamped in the groove 212, so that the socket upper cover 1 and the socket upper cover 2 can be fastened. In order to further facilitate the fastening, the grooves of the present invention are formed in the following manner: an inclined surface is formed on the upper half part of the opening end of the socket lower cover base 21, a groove 212 is formed below the inclined surface, and the function of the inclined surface is beneficial to convenient fastening.
The operation process of the invention comprises the following steps: the upper socket cover 1 is opened to rotate around the connecting shaft, so that the included angle between the upper socket cover 1 and the lower socket cover 2 is more than or equal to 90 degrees. The circuit chip pins are correspondingly placed into the socket positioning guide grooves and the socket guide pin grooves 221. Then the aging socket is closed, the fastening component 11 is pressed down, so that the upper socket cover 1 and the lower socket cover 2 are completely meshed, and the pressing plate 13 is pressed down at the moment, so that the circuit chip leads are tightly contacted with the socket guide pin grooves.
According to the invention, the two-position positioning guide grooves are adopted, and the slightly deformed guide legs are positioned again on the basis of the positioning of the second-position positioning guide groove, so that the guide legs of the circuit chip are positioned in the guide grooves, the guide legs are prevented from being deformed more effectively, and the bypass short circuit of the adjacent guide legs is prevented. The reliability and applicability of the aged socket are improved.
What is not described in detail in the present specification belongs to the known technology of those skilled in the art.
Claims (9)
1. A CQFP encapsulation form ageing socket with double location guide slot, its characterized in that: comprises a socket upper cover (1) and a socket lower cover (2);
the socket lower cover comprises a socket lower cover base body (21) and four floating plates (22), wherein the four floating plates (22) are symmetrically arranged in a cross shape along the center of the socket lower cover base body (21), a first row of socket positioning guide grooves (222), a second row of socket positioning guide grooves (223) and socket guide pin grooves (221) are sequentially formed in each floating plate (22) along the direction away from the center of the socket lower cover base body (21), when a circuit chip is placed on the socket lower cover base body (21), guide pins on the socket guide pin grooves (221) are in one-to-one correspondence with guide pins on the circuit chip, and guide grooves which are in one-to-one correspondence with the guide pins on the socket guide pin grooves are formed in the first row of socket positioning guide grooves (222) and the second row of socket positioning guide grooves (223);
the socket upper cover (1) is connected with the socket lower cover (2) through a connecting shaft sleeved with a spring, the socket upper cover (1) can rotate around the connecting shaft, and when the aging socket is closed, the socket upper cover (1) and the socket lower cover (2) are fastened;
the socket upper cover (1) and the socket lower cover (2) are connected through a connecting shaft sleeved with a spring, and the specific mode is as follows: two bulges are machined on one edge of the upper socket cover base body (14), a positioning hole (12) is formed in each bulge, two bulges are machined on the edge, connected with the upper socket cover base body, of the lower socket cover base body (21), a positioning hole (211) is formed in each bulge, the positioning hole (12) and the positioning hole (211) are placed on the same horizontal line, a connecting shaft penetrates through the positioning holes, and a spring is sleeved on the connecting shaft, so that connection of the upper cover and the lower cover is achieved.
2. The CQFP package form aging socket with double row positioning guide slots of claim 1, wherein: the angle of rotation of the socket upper cover (1) around the connecting shaft is more than or equal to 90 degrees.
3. The CQFP package form aging socket with double row positioning guide slots of claim 1, wherein: the distance between the second row of socket positioning guide grooves (223) and the first row of socket positioning guide grooves (222) is 1-2 times of the distance between the second row of socket positioning guide grooves (223) and the socket guide pin grooves (221).
4. The CQFP package form aging socket with double row positioning guide slots of claim 1, wherein: opposite sides of each floating plate (22) are fixed on the lower cover base (21) through springs.
5. The CQFP package format aging socket with double row positioning guide slots of claim 4, wherein: the center position of the socket upper cover (1) is provided with a through hole, the through hole is provided with a pressing plate (13), when the ageing socket is closed, the pressing plate (13) and the floating plate (22) are matched with each other, the circuit chip is ensured to be positioned on the same plane by pressing the chip down of the pressing plate (13), and the circuit chip guide legs are in close contact with guide pins on the socket guide pin grooves (221).
6. The CQFP package form aging socket with double row positioning guide slots of claim 1, wherein: the socket lower cover base body (21) is provided with a positioning needle (213) for fixing the circuit chip.
7. The CQFP package format aging socket with double row positioning guide slots of claim 6, wherein: the number of the positioning pins (213) is 3, and the positioning pins are used for fixing three positioning holes at the edge of the circuit chip, so that the position of the circuit chip can be conveniently adjusted.
8. The CQFP package form aging socket with double row positioning guide slots of claim 1, wherein: the socket upper cover (1) and the socket lower cover (2) are square.
9. The CQFP package form aging socket with double row positioning guide slots of claim 1, wherein: the socket upper cover (1) and the socket lower cover (2) are fastened in the following manner: a groove (212) is formed in one end of an opening of the socket lower cover base body (21), a fastening component (11) is arranged at one end of an opening of the socket upper cover (1), a protrusion matched with the groove (212) is formed in the fastening component (11), and when the socket is closed, the protrusion can be clamped in the groove (212) to fasten the socket upper cover (1) and the socket lower cover (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710801983.2A CN107768861B (en) | 2017-09-07 | 2017-09-07 | CQFP encapsulation form ageing socket with double location guide slot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710801983.2A CN107768861B (en) | 2017-09-07 | 2017-09-07 | CQFP encapsulation form ageing socket with double location guide slot |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107768861A CN107768861A (en) | 2018-03-06 |
| CN107768861B true CN107768861B (en) | 2023-08-29 |
Family
ID=61265486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710801983.2A Active CN107768861B (en) | 2017-09-07 | 2017-09-07 | CQFP encapsulation form ageing socket with double location guide slot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107768861B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111751703B (en) * | 2020-06-15 | 2022-11-01 | 北京时代民芯科技有限公司 | Aging test socket designed by limiting frame |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0435386U (en) * | 1990-07-20 | 1992-03-24 | ||
| JPH075228A (en) * | 1993-06-18 | 1995-01-10 | Tokyo Electron Ltd | Contactor for burn-in test |
| US5688128A (en) * | 1994-01-10 | 1997-11-18 | Texas Instruments Incorporated | Detachable socket for an IC chip |
| US5807104A (en) * | 1995-02-08 | 1998-09-15 | Texas Instruments Incorporated | Test socket for detachable IC chip |
| CN103323631A (en) * | 2013-06-28 | 2013-09-25 | 中国电子科技集团公司第四十研究所 | CQFP package part aging test socket with floating carriages |
| CN203965474U (en) * | 2014-06-13 | 2014-11-26 | 浙江长兴电子厂有限公司 | The test jack of tape insulation frame ageing |
| CN207542428U (en) * | 2017-09-07 | 2018-06-26 | 北京时代民芯科技有限公司 | A kind of CQFP packing forms burn-in sockets with double locating channel |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM376925U (en) * | 2009-08-18 | 2010-03-21 | Hon Hai Prec Ind Co Ltd | Electrical connector |
-
2017
- 2017-09-07 CN CN201710801983.2A patent/CN107768861B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0435386U (en) * | 1990-07-20 | 1992-03-24 | ||
| JPH075228A (en) * | 1993-06-18 | 1995-01-10 | Tokyo Electron Ltd | Contactor for burn-in test |
| US5688128A (en) * | 1994-01-10 | 1997-11-18 | Texas Instruments Incorporated | Detachable socket for an IC chip |
| US5807104A (en) * | 1995-02-08 | 1998-09-15 | Texas Instruments Incorporated | Test socket for detachable IC chip |
| CN103323631A (en) * | 2013-06-28 | 2013-09-25 | 中国电子科技集团公司第四十研究所 | CQFP package part aging test socket with floating carriages |
| CN203965474U (en) * | 2014-06-13 | 2014-11-26 | 浙江长兴电子厂有限公司 | The test jack of tape insulation frame ageing |
| CN207542428U (en) * | 2017-09-07 | 2018-06-26 | 北京时代民芯科技有限公司 | A kind of CQFP packing forms burn-in sockets with double locating channel |
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| Publication number | Publication date |
|---|---|
| CN107768861A (en) | 2018-03-06 |
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