CN202816920U - TO-252 packaging lead frame structure - Google Patents

TO-252 packaging lead frame structure Download PDF

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Publication number
CN202816920U
CN202816920U CN 201220350782 CN201220350782U CN202816920U CN 202816920 U CN202816920 U CN 202816920U CN 201220350782 CN201220350782 CN 201220350782 CN 201220350782 U CN201220350782 U CN 201220350782U CN 202816920 U CN202816920 U CN 202816920U
Authority
CN
China
Prior art keywords
frame structure
lead frame
pins
pin
framework
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 201220350782
Other languages
Chinese (zh)
Inventor
侯友良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Red Microelectronics Co ltd
Original Assignee
Wuxi Red Microelectronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Red Microelectronics Co ltd filed Critical Wuxi Red Microelectronics Co ltd
Priority to CN 201220350782 priority Critical patent/CN202816920U/en
Application granted granted Critical
Publication of CN202816920U publication Critical patent/CN202816920U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

The utility model provides a TO-252 encapsulation lead frame structure, its reinforcing plastic-sealed body's gas tightness has improved performance stability and reliability, has prolonged the life of device. The TO-252 frame comprises three pins, a central pin and two side pins, and is characterized in that: and the frame parts of the pins at the two sides are respectively provided with a circular flow guide hole.

Description

A kind of TO-252 packaging lead frame structure
Technical field
The utility model relates to the technical field of encapsulation, is specially a kind of TO-252 packaging lead frame structure.
Background technology
The framework of existing TO-252, three pins are arranged, be respectively middle part pin, both sides pin, the go between pin of framework of the upper a slice chip of placing of single Ji Dao, the pad of chip, the frame part of both sides pin is combined air-tightness with plastic-sealed body not strong, under the high temperature wet environment, steam can be invaded on the plastic-sealed body inside chip, causes the oxidation of chip surface bonding wire ball, cause to come off or loose contact electrical property early failure.
Summary of the invention
For the problems referred to above, the utility model provides a kind of TO-252 packaging lead frame structure, and the air-tightness that it strengthens plastic-sealed body has improved stability and reliability, has prolonged the useful life of device.
A kind of TO-252 packaging lead frame structure, its technical scheme is such: it comprises the TO-252 framework, described TO-252 framework comprises three pins, is respectively center pin, the both sides pin, it is characterized in that: the frame part of described both sides pin have a circular pod apertures.
After adopting the utility model, since the frame part of the both sides pin of TO-252 framework have a circular pod apertures, itself so that during plastic packaging plastic-sealed body can flow through circular pod apertures and make nead frame top and bottom, both sides in conjunction with good, increased the contact area of plastic-sealed body and framework, thereby improve the sealing property of plastic-sealed body, strengthen the air-tightness of plastic-sealed body, improved stability and reliability, prolonged the useful life of device; In addition, the circular pod apertures of setting so that plastic-sealed body has reduced copper material, reduces manufacturing cost.
Description of drawings
Fig. 1 is front view structural representation of the present utility model.
Embodiment
See Fig. 1, it comprises the TO-252 framework, the TO-252 framework comprises three pins, be respectively center pin 2, left side pin 1, right side pin 3, chip 5 on the base island 4 connects frame part corresponding to pin by lead-in wire 6, the frame part 7 of left side pin 1 has circular pod apertures 8, and the frame part 9 of right side pin 3 has circular pod apertures 8.

Claims (1)

1. TO-252 packaging lead frame structure, it comprises the TO-252 framework, described TO-252 framework comprises three pins, is respectively center pin, the both sides pin, it is characterized in that: the frame part of described both sides pin have a circular pod apertures.
CN 201220350782 2012-07-19 2012-07-19 TO-252 packaging lead frame structure Expired - Lifetime CN202816920U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220350782 CN202816920U (en) 2012-07-19 2012-07-19 TO-252 packaging lead frame structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220350782 CN202816920U (en) 2012-07-19 2012-07-19 TO-252 packaging lead frame structure

Publications (1)

Publication Number Publication Date
CN202816920U true CN202816920U (en) 2013-03-20

Family

ID=47875760

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220350782 Expired - Lifetime CN202816920U (en) 2012-07-19 2012-07-19 TO-252 packaging lead frame structure

Country Status (1)

Country Link
CN (1) CN202816920U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102760716A (en) * 2012-07-19 2012-10-31 无锡红光微电子有限公司 TO-252 package lead frame structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102760716A (en) * 2012-07-19 2012-10-31 无锡红光微电子有限公司 TO-252 package lead frame structure

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C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20130320