CN107768861A - A kind of CQFP packing forms burn-in sockets with double locating channel - Google Patents
A kind of CQFP packing forms burn-in sockets with double locating channel Download PDFInfo
- Publication number
- CN107768861A CN107768861A CN201710801983.2A CN201710801983A CN107768861A CN 107768861 A CN107768861 A CN 107768861A CN 201710801983 A CN201710801983 A CN 201710801983A CN 107768861 A CN107768861 A CN 107768861A
- Authority
- CN
- China
- Prior art keywords
- socket
- lower cover
- locating channel
- sockets
- cqfp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
- H01R13/631—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
Landscapes
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
A kind of CQFP packing forms burn-in sockets with double locating channel, lid and socket lower cover are by being cased with the connection axis connection of spring on socket.Socket lower cover includes socket lower cover pedestal and four float plates, four float plates are centrosymmetrically arranged along socket lower cover pedestal, a plug socket guide pin and two plug socket locating channels are provided with each float plate, the lead leg of the quantity of socket guide pin, position and circuit chip corresponds, the corresponding socket guide pin of each socket locating channel in two plug socket locating channels, facilitate circuit lead leg to be placed into above respective socket guide pin, avoid that inconsistent phenomenon occurs.Lid is fastened by buckling clamping part on socket lower cover and socket.The present invention is due to by the way of double locating channel, it is relatively more to avoid lead leg, lead is long, and the CQFP that lead leg spacing is 0.5mm encapsulates the circuit of pattern when using the type socket, short circuit causes the problem of failure between circuit lead leg, improves the reliability of burn-in sockets.
Description
Technical field
The present invention relates to a kind of CQFP packing forms burn-in sockets with double locating channel, belong to burn-in sockets structure
Technical field of improvement.
Background technology
The integrated circuit industry that China developed in recent years is quickly grown, the integrated level more and more higher of integrated circuit, lead leg number
Measure more and more, lead leg length is increasingly longer, and lead leg spacing is less and less.And existing CQFP encapsulates determining for the socket of pattern
Position system a little position pin and single locating channel.Lead leg is relatively more, and lead is long, and the CQFP that lead leg spacing is 0.5mm is sealed
The circuit of pattern is filled when using existing socket, is very easy to the phenomenon for adjacent lead leg bridging short circuit occur.
The content of the invention
The technology of the present invention solves problem：Overcome the deficiencies in the prior art, there is provided a kind of with double locating channel
CQFP packing forms burn-in sockets, solve the CQFP encapsulation types that lead leg is relatively more, lead is long, lead leg spacing is 0.5mm
There is adjacent lead leg and put up a bridge the problem of short-circuit when in use in formula circuit, avoids failure caused by short circuit between circuit lead leg, improves
The reliabilities of burn-in sockets.
The present invention technical solution be：A kind of CQFP packing forms burn-in sockets with double locating channel, bag
Include lid and socket lower cover on socket；
Socket lower cover includes socket lower cover pedestal and four float plates, and four float plates are along socket lower cover pedestal center
It is arranged symmetrically into " ten " font, the first socket is disposed with along the direction away from socket lower cover pedestal center in each float plate
Seat locating channel, the second plug socket locating channel and socket guide pin slot, when circuit chip is placed on socket lower cover pedestal, institute
The lead leg for stating the guide pin on socket guide pin slot and circuit chip corresponds, and the first plug socket locating channel and the second plug socket are determined
It is machined with and the one-to-one guide groove of guide pin on socket guide pin slot on the guide groove of position；
Lid and socket lower cover are by being cased with the connection axis connection of spring on socket, and lid can turn around the connecting shaft on socket
It is dynamic, when burn-in sockets close, lid and the fastening of socket lower cover on socket.
Lid is more than or equal to 90 ° around the angle that connecting shaft rotates on the socket.
The distance between the second plug socket locating channel and the first plug socket locating channel are the positioning of the second plug socket
1-2 times of distance between guide groove and socket guide pin slot.
Each relative both sides of float plate are fixed on lower cover pedestal by spring.
Lid center position is provided with through hole on socket, and pressing plate is provided with through hole, described to press when burn-in sockets close
Pressing plate and float plate are cooperated, and circuit chip is pushed by pressing plate, are ensured that circuit chip is in the same plane, are made circuit
Chip lead leg is in close contact with the guide pin on socket guide pin slot.
Pilot pin is provided with the socket lower cover pedestal, for permanent circuit chip.
The pilot pin has 3, for three positioning holes at permanent circuit chip edge, facilitates adjustment circuit chip
Position.
Lid and socket lower cover are square on the socket.
Lid and the mode of socket lower cover fastening are on the socket：The processing of socket lower cover pedestal open at one end is fluted, inserts
Cover gab one end is machined with buckling clamping part on seat, and the projection with groove match is machined with buckling clamping part, when socket closes,
The projection can block the fastening in a groove, realizing lid and socket lower cover on socket.
The present invention compared with prior art the advantages of be：
(1) present invention is due to by the way of double locating channel, when lead leg is relatively more, lead is long, lead leg spacing
For 0.5mm CQFP encapsulate pattern circuit chip using the type socket when, on the location base of row's locating channel,
The lead leg being slightly distorted is repositioned by another row's locating channel so that the lead leg of circuit is all in guide groove, more effectively
Prevent lead leg from deforming, so as to effectively prevent the generation of bridging short circuit phenomenon between the adjacent lead leg of circuit, improve burn-in sockets
Reliability and and applicability.
(2) lid is more than or equal to 90 ° around the angle that connecting shaft rotates on socket of the present invention, when ensureing that burn-in sockets are opened, inserts
Angle on seat between lid and socket lower cover is more than or equal to 90 °, so as to conveniently pick and place circuit chip.
(3) present invention devises pressing plate on socket on lid, devises float plate on lid under socket, float plate passes through
Spring is fixed, and when upper and lower covers fasten, pressing plate pushes, and is cooperated by pressing plate and float plate, ensures circuit positioned at same
In one plane, circuit lead leg is in close contact with socket guide pin, further ensure the validity of socket.
(4) pilot pin is provided with socket lower cover pedestal, and pilot pin quantity is 3, for permanent circuit chip edge
Three positioning holes at place, facilitate the position of adjustment circuit.
Brief description of the drawings
Fig. 1 is the socket stereogram of the present invention；
Fig. 2 is lid stereogram on the socket of the present invention；
Fig. 3 is the socket lower cover isometric front view of the present invention；
Fig. 4 is the socket lower cover rear isometric view of the present invention.
Embodiment
As shown in figure 1, for the socket stereogram of the present invention, it is made up of lid on socket 1 and socket lower cover 2.
As shown in Fig. 2 being lid stereogram on the socket of the present invention, lid 1 is square on socket, including socket upper cover base body 14
With pressing plate 13, the center position of socket upper cover base body 14 is provided with through hole, and through hole is provided with pressing plate 13.
As shown in Figure 3 and Figure 4, it is the socket lower cover stereogram of the present invention, socket lower cover 2 is square, including socket lower cover
21, four float plates 22 of pedestal.Four float plates 22 are arranged symmetrically along the center of socket lower cover pedestal 21 into " ten " font, i.e., wherein
Two float plates are located on the longitudinal axis of socket lower cover pedestal 21, and another two float plate is located at the transverse direction of socket lower cover pedestal 21
On axis.A plug socket guide pin slot 221 and two plug socket locating channels, and the first plug socket are provided with each float plate 22
Locating channel 222 is located at the first plug socket locating channel close to the center of socket lower cover pedestal 21, the second plug socket locating channel 223
Between 222 and socket guide pin slot 221, when circuit chip is placed on socket lower cover pedestal 21, leading on socket guide pin slot 221
The lead leg of pin and circuit chip corresponds, be machined with the first plug socket locating channel and the second plug socket locating channel with
The one-to-one guide groove of guide pin, facilitates circuit chip lead leg to be placed into above respective socket guide pin slot 221, avoids that mistake occurs
Position phenomenon.
Each relative both sides of float plate 22 are arranged on socket lower cover pedestal 21 by spring, pressing plate 13 and float plate
22 cooperate, and after lid 1 fastens on socket lower cover 2 and socket, push circuit chip by pressing plate 13, ensure circuit chip
It is in the same plane, circuit chip lead leg is in close contact with socket guide pin slot 221.
The distance between second plug socket locating channel 223 and first plug socket locating channel 222 are that the second plug socket is determined
1-2 times of distance between position guide groove 222 and socket guide pin slot 221.
As shown in figure 3,3 pilot pins 213 are provided with socket lower cover pedestal 21, at permanent circuit chip edge
Three positioning holes, facilitate the position of adjustment circuit chip.
Lid 1 and socket lower cover 2 are rotatablely connected on socket, and specific implementation is：Add in a line of socket upper cover base body 14
Work has two projections, setting positioning hole 12 in each projection, on the side that socket lower cover pedestal 21 is connected with socket upper cover base body phase
Also two projections are machined with, positioning hole 211 is set in each projection, positioning hole 12 and positioning hole 211 are placed on same level
On line, connecting shaft passes through above-mentioned positioning hole, and spring is cased with connecting shaft, so as to realize the connection of upper and lower covers.Energy is covered on socket
Enough to be rotated along the connecting shaft, rotational angle is more than or equal to 90 °, convenient placement circuit chip.
The open at one end of socket lower cover pedestal 21 processing fluted 212, the open at one end of socket upper cover base body 14 is machined with fastening
Part 11, projection is machined with buckling clamping part 11, the projection and groove 212 are matched, and when socket closes, projection 11 can be stuck in
In groove 212, the fastening of lid 2 on lid 1 and socket on socket is realized.In order to further facilitate fastening, the formation of groove of the present invention
Mode is：Inclined-plane is machined with the open at one end top half of socket lower cover pedestal 21, inclined-plane groove 212 formed below, inclined-plane
Effect helps conveniently to fasten.
The operating process of the present invention：Lid on socket 1 is opened, it is rotated around connecting shaft, makes on socket under lid 1 and socket
The angle of lid 2 is more than or equal to 90 °.Circuit chip pin is correspondingly placed into socket locating channel and socket guide pin slot 221.Then
Burn-in sockets are closed, buckling clamping part 11 is pressed, is fully engaged against lid 1 and socket lower cover 2 on socket, now pressing plate 13 pushes,
Ensure that circuit chip lead leg is in close contact with socket guide pin slot.
The present invention uses two row's locating channels, on the location base of second row locating channel, to the lead leg being slightly distorted
Reposition so that the lead leg of circuit chip more effectively prevents lead leg from deforming all in guide groove, so as to prevent adjacent lead leg
Bridging short circuit.Improve the reliability and applicability of burn-in sockets.
The content not being described in detail in description of the invention belongs to the known technology of professional and technical personnel in the field.
Claims (9)
- A kind of 1. CQFP packing forms burn-in sockets with double locating channel, it is characterised in that：Including on socket cover (1) and Socket lower cover (2)；Socket lower cover includes socket lower cover pedestal (21) and four float plates (22), and four float plates (22) are along socket lower cover Pedestal (21) center is arranged symmetrically into " ten " font, along the side away from socket lower cover pedestal (21) center on each float plate (22) To being disposed with the first plug socket locating channel (222), the second plug socket locating channel (223) and socket guide pin slot (221), When circuit chip is placed on socket lower cover pedestal (21), guide pin and circuit chip on the socket guide pin slot (221) Lead leg corresponds, and is machined with the first plug socket locating channel (222) and the second plug socket locating channel (223) and socket The one-to-one guide groove of guide pin on guide pin slot；(1) and socket lower cover (2) are covered on socket by being cased with the connection axis connection of spring, lid (1) can be around the connection on socket Axle is rotated, and (1) and socket lower cover (2) fastening are covered when burn-in sockets close, on socket.
- 2. a kind of CQFP packing forms burn-in sockets with double locating channel according to claim 1, its feature exist In：(1) is covered on the socket and is more than or equal to 90 ° around the angle that connecting shaft rotates.
- 3. a kind of CQFP packing forms burn-in sockets with double locating channel according to claim 1, its feature exist In：The distance between the second plug socket locating channel (223) and the first plug socket locating channel (222) are the second plug sockets 1-2 times of distance between locating channel (223) and socket guide pin slot (221).
- 4. a kind of CQFP packing forms burn-in sockets with double locating channel according to claim 1, its feature exist In：Each relative both sides of float plate (22) are fixed on lower cover pedestal (21) by spring.
- 5. a kind of CQFP packing forms burn-in sockets with double locating channel according to claim 4, its feature exist In：(1) center position is covered on socket and is provided with through hole, pressing plate (13) is provided with through hole, it is described when burn-in sockets close Pressing plate (13) and float plate (22) are cooperated, and circuit chip is pushed by pressing plate (13), ensure circuit chip positioned at same In one plane, circuit chip lead leg is set to be in close contact with the guide pin on socket guide pin slot (221).
- 6. a kind of CQFP packing forms burn-in sockets with double locating channel according to claim 1, its feature exist In：Pilot pin (213) is provided with the socket lower cover pedestal (21), for permanent circuit chip.
- 7. a kind of CQFP packing forms burn-in sockets with double locating channel according to claim 5, its feature exist In：The pilot pin (213) has 3, for three positioning holes at permanent circuit chip edge, facilitates adjustment circuit chip Position.
- 8. a kind of CQFP packing forms burn-in sockets with double locating channel according to claim 1, its feature exist In：(1) is covered on the socket and socket lower cover (2) is square.
- 9. a kind of CQFP packing forms burn-in sockets with double locating channel according to claim 1, its feature exist In：Lid (1) and the mode of socket lower cover (2) fastening are on the socket：Socket lower cover pedestal (21) open at one end is machined with recessed Groove (212), lid (1) open at one end is machined with buckling clamping part (11) on socket, is machined with buckling clamping part (11) and groove (212) The projection to match, when socket closes, the projection can be stuck in groove (212), realized and covered on socket under (1) and socket Cover the fastening of (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710801983.2A CN107768861B (en) | 2017-09-07 | 2017-09-07 | CQFP encapsulation form ageing socket with double location guide slot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710801983.2A CN107768861B (en) | 2017-09-07 | 2017-09-07 | CQFP encapsulation form ageing socket with double location guide slot |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107768861A true CN107768861A (en) | 2018-03-06 |
| CN107768861B CN107768861B (en) | 2023-08-29 |
Family
ID=61265486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710801983.2A Active CN107768861B (en) | 2017-09-07 | 2017-09-07 | CQFP encapsulation form ageing socket with double location guide slot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107768861B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111751703A (en) * | 2020-06-15 | 2020-10-09 | 北京时代民芯科技有限公司 | Aging test socket designed by limiting frame |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0435386U (en) * | 1990-07-20 | 1992-03-24 | ||
| JPH075228A (en) * | 1993-06-18 | 1995-01-10 | Tokyo Electron Ltd | Contactor for burn-in test |
| US5688128A (en) * | 1994-01-10 | 1997-11-18 | Texas Instruments Incorporated | Detachable socket for an IC chip |
| US5807104A (en) * | 1995-02-08 | 1998-09-15 | Texas Instruments Incorporated | Test socket for detachable IC chip |
| US20110045682A1 (en) * | 2009-08-18 | 2011-02-24 | Hon Hai Precision Industry Co., Ltd. | Burn-in socket connector |
| CN103323631A (en) * | 2013-06-28 | 2013-09-25 | 中国电子科技集团公司第四十研究所 | CQFP package part aging test socket with floating carriages |
| CN203965474U (en) * | 2014-06-13 | 2014-11-26 | 浙江长兴电子厂有限公司 | The test jack of tape insulation frame ageing |
| CN207542428U (en) * | 2017-09-07 | 2018-06-26 | 北京时代民芯科技有限公司 | A kind of CQFP packing forms burn-in sockets with double locating channel |
-
2017
- 2017-09-07 CN CN201710801983.2A patent/CN107768861B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0435386U (en) * | 1990-07-20 | 1992-03-24 | ||
| JPH075228A (en) * | 1993-06-18 | 1995-01-10 | Tokyo Electron Ltd | Contactor for burn-in test |
| US5688128A (en) * | 1994-01-10 | 1997-11-18 | Texas Instruments Incorporated | Detachable socket for an IC chip |
| US5807104A (en) * | 1995-02-08 | 1998-09-15 | Texas Instruments Incorporated | Test socket for detachable IC chip |
| US20110045682A1 (en) * | 2009-08-18 | 2011-02-24 | Hon Hai Precision Industry Co., Ltd. | Burn-in socket connector |
| CN103323631A (en) * | 2013-06-28 | 2013-09-25 | 中国电子科技集团公司第四十研究所 | CQFP package part aging test socket with floating carriages |
| CN203965474U (en) * | 2014-06-13 | 2014-11-26 | 浙江长兴电子厂有限公司 | The test jack of tape insulation frame ageing |
| CN207542428U (en) * | 2017-09-07 | 2018-06-26 | 北京时代民芯科技有限公司 | A kind of CQFP packing forms burn-in sockets with double locating channel |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111751703A (en) * | 2020-06-15 | 2020-10-09 | 北京时代民芯科技有限公司 | Aging test socket designed by limiting frame |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107768861B (en) | 2023-08-29 |
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