CN107768220B - A kind of encapsulating device of scanning coil, scanning electron microscope and scanning coil - Google Patents
A kind of encapsulating device of scanning coil, scanning electron microscope and scanning coil Download PDFInfo
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- CN107768220B CN107768220B CN201710859427.0A CN201710859427A CN107768220B CN 107768220 B CN107768220 B CN 107768220B CN 201710859427 A CN201710859427 A CN 201710859427A CN 107768220 B CN107768220 B CN 107768220B
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- scanning coil
- skeleton
- scanning
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- encapsulating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
- H01J37/1472—Deflecting along given lines
- H01J37/1474—Scanning means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/261—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
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- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Insulating Of Coils (AREA)
Abstract
The encapsulating device of a kind of scanning coil of the invention, scanning electron microscope and scanning coil, wherein scanning coil includes skeleton, circuit board on the skeleton is set, the coil being fixed on the skeleton, further include by the skeleton, coil, circuit board package one packing colloid layer, and the terminals of the circuit board stretch out outside the packing colloid layer.By the skeleton, coil, circuit board package one, which is structure as a whole, is arranged and fixed conveniently in lens barrel packing colloid layer, higher relative to central axis rotational symmetry.Encapsulating device is equipped with and is coaxially positioned to the scanning coil, makes the location structure of the axis of the skeleton of the scanning coil and the axis coaxle of the encapsulation cavity, the scanning coil after can guarantee encapsulating is relative to central axis rotational symmetry with higher.
Description
Technical field
The present invention relates to scanning coil encapsulation technology fields, and in particular to a kind of scanning coil, scanning electron microscope and scan line
The encapsulating device of circle.
Background technique
Scanning electron microscope is a kind of electronic optical instrument, is progressively scanned using electron beam is focused in sample surfaces, electronics
Beam bombards sample surfaces and generates secondary electron or backscattered electron, and the efficiency generated is related to sample surface morphology or material,
Secondary electron or backscattered electron that sample surfaces generate are collected, and by the position of sample surfaces electronics beam scanning and production
The form of the quantity two dimensional image of raw secondary electron or backscattered electron indicates to arrive the secondary electron figure of scanning electron microscope
Picture or backscattered electron image.The resolution ratio of scanning electron microscope image can reach nanoscale and be even better than 1.0 nanometers, new material,
The fields such as new energy, national defence, scientific research play irreplaceable effect.
Scanning electron microscope is worked using the electron beam of electron gun transmitting, emits sample by electron gun in electron beam
The path on product surface, we term it optical path, the centre of optical path is referred to as optical axis, and electron beam is issued by lens barrel most by electron gun
On the sample for reaching sample room afterwards, the scanning coil being mounted in lens barrel provides on sample surfaces for incident beam and yin
Scan synchronizing signal of the electron beam on fluorescent screen in extreme ray pipe changes scanning by changing the size of current of scanning coil
Coil is to the size of electron beam active force, in this way, scan amplitude of the incident beam on sample surfaces will be with scan line
The size of electric current in circle and change, with obtain needed for enlargement ratio scan image.Scanning coil is in scanning electron microscope
It is an important component, is generally placed upon the second half section of lens barrel.The job stability of scanning coil is to the quality of imaging to Guan Chong
It wants.
Coil is wrapped on skeleton by traditional scanning coil by the way of hand wound, coil it is in irregular shape,
After the scanning coil is assembled in scanning electron microscope, the concentricity of scanning coil and optical axis is poor, scanning coil component relative to
The rotational symmetry of central axis is poor.
Summary of the invention
Therefore, the technical problem to be solved in the present invention is that overcoming scanning coil component in the prior art relative to center
The poor defect of the rotational symmetry of axis, to provide one kind relative to the higher scan line of central axis rotational symmetry
Circle.
The invention solves another technical problem be to overcome scanning electron microscope in the prior art due to scanning coil
Job stability is lower and the lower defect of image quality, to provide a kind of higher scanning electron microscope of image quality.
The invention solves another technical problem be to provide the encapsulating device that a kind of pair of scanning coil be packaged,
Scanning coil after encapsulation can guarantee the rotational symmetry relative to central axis.
In order to solve the above technical problems, a kind of scanning coil of the invention, including skeleton, the electricity on the skeleton is set
Road plate, the coil being fixed on the skeleton, further include by the skeleton, coil, circuit board package one packing colloid layer,
And the terminals of the circuit board stretch out outside the packing colloid layer, the packing colloid layer and the skeleton are coaxially disposed.
A kind of scanning electron microscope of the invention has the scanning coil.
A kind of encapsulating device of scanning coil of the invention, comprising:
Pedestal；
Tooling matrix, setting on the base, form cavity thereon；
Top cover is arranged on the tooling matrix, and the top cover, the tooling matrix, the pedestal are integrally connected rear shape
At there is the encapsulation cavity for encapsulating the scanning coil, the terminals of the circuit board are in outside the encapsulation cavity, and the pedestal, institute
It states top cover at least one of which to be equipped in the encapsulation cavity, the scanning coil is coaxially positioned, make described
The location structure of the axis coaxle of the axis of the skeleton of scanning coil and the encapsulation cavity；
Encapsulating mouth is molded on the top cover, and casting glue enters the encapsulation cavity in described by the encapsulating mouth
The scanning coil in encapsulation cavity is potted.
The tooling matrix is detachably connected after being cooperated with the pedestal by fixing structure.
The tooling matrix is detachably connected with the pedestal by threaded fastener.
The location structure includes that setting on the base carries out coaxially the first end of the skeleton of the scanning coil
First location structure of positioning, and be arranged on the top cover and determine the second end of the skeleton is coaxially positioned second
Bit architecture.
First location structure is the protrusion of molding on the base, and the protrusion is suitably inserted into the skeleton
First end axis hole in.
The top cover is equipped with pin shaft hole, and second location structure is the coaxial pins that one end passes through the pin shaft hole, institute
In the axis hole for the second end that the one end for stating coaxial pins is suitably inserted into the skeleton.
The encapsulating device further includes being arranged in the space that the top cover, the tooling matrix, the pedestal surround
Easy mold release component, the encapsulation cavity are made of the easy mold release component.
The easy mold release component includes
Cylinder is formed, is arranged on the inner wall of the tooling matrix；
Collet is formed, is connected between the first end end and the pedestal of the molding cylinder；
Flange forming cavity is connected to the second end end of the molding cylinder；
Form upper cover, be arranged between the top cover and the flange forming cavity, after docking with the molding cylinder, institute
State encapsulation cavity described in molding collet.
The easy mold release component is all made of non-adhesive material and is made.
The non-adhesive material is polytetrafluoroethylene (PTFE).
The pedestal, the tooling matrix, the upper cover are made of metal material.
Exhaust structure is formed on the pedestal.
The exhaust structure includes through the gas vent for being set on the base and being connected to the axis hole of the skeleton.
The pedestal is equipped with the outlet for judging encapsulating situation, and the outlet is equipped with screw.
The tooling matrix, which is at least detachably connected by two sections of points of matrixes, to be formed.
It is connected between described point of matrix by threaded fastener.
Technical solution of the present invention has the advantages that
1. a kind of scanning coil provided by the invention, packing colloid layer is integrated by the skeleton, coil, circuit board package,
The packing colloid layer and the skeleton are coaxially disposed, which is structure as a whole, is arranged and fixed conveniently in lens barrel, phase
It is higher for central axis rotational symmetry.
2. a kind of scanning electron microscope provided by the invention has the scanning coil, since scanning coil is solid in lens barrel
Fixed secured, the installation centering of scanning coil and job stability are higher, and the image quality of the scanning electron microscope is higher.
3. a kind of encapsulating device of scanning coil provided by the invention, on the pedestal, the top cover at least one of which
Equipped in the encapsulation cavity, the scanning coil is coaxially positioned, the axis of the skeleton of the scanning coil is made
With the location structure of the axis coaxle of the encapsulation cavity, the scanning coil after can guarantee encapsulating has higher relative to central axis
Rotational symmetry.
4. a kind of encapsulating device of scanning coil provided by the invention, the tooling matrix and the pedestal pass through seam allowance knot
It is detachably connected after structure cooperation, it is easy to process, while facilitating after the completion of encapsulating and will encapsulate integral scanning coil from the device
Middle taking-up.
5. a kind of encapsulating device of scanning coil provided by the invention, the location structure includes being arranged on the base
It is right on the top cover to the first location structure that the first end of the skeleton of the scanning coil is coaxially positioned, and setting
The second location structure that the second end of the skeleton is coaxially positioned, is positioned by the both ends to scanning coil to guarantee
Scanning coil after encapsulation is relative to central axis rotational symmetry with higher.
6. a kind of encapsulating device of scanning coil provided by the invention, the encapsulating device further includes being arranged on the top
The easy mold release component in space that lid, the tooling matrix, the pedestal surround, the encapsulation cavity is by the easy mold release component structure
At integral scanning coil will be encapsulated after the completion of encapsulation by facilitating takes out from encapsulating device.
7. a kind of encapsulating device of scanning coil provided by the invention, the easy mold release component is all made of non-adhesive material system
At integral scanning coil will be encapsulated after the completion of encapsulation by facilitating takes out from encapsulating device.
8. a kind of encapsulating device of scanning coil provided by the invention, the non-adhesive material is polytetrafluoroethylene (PTFE), the material
With high-lubricity, there is the smallest coefficient of friction in known engineering material, and non-stick nature is significant, has in solid material
The smallest surface tension has good releasing property without adhering to any substance between the material and electron pouring sealant,
It is very beneficial for completing the demoulding after package curing.
9. a kind of encapsulating device of scanning coil provided by the invention, the pedestal, the tooling matrix, the upper cover are adopted
It is made of metal material, it is ensured that the dimensional stability in package curing heating is unlikely to deform, reusable.
10. a kind of encapsulating device of scanning coil provided by the invention, exhaust structure is formed on the pedestal, can avoid
Seal gas expanded by heating in package curing heating in coil rack damages coil rack.
11. a kind of encapsulating device for scanning coil that invention provides, the tooling matrix are at least removable by two sections of points of matrixes
It unloads connection to be formed, facilitates processing, integral scanning coil will be encapsulated after the completion of encapsulating by also facilitating takes out from the device.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram for the scanning coil that the embodiment of the present invention 1 provides；
Fig. 2 is the structural schematic diagram of the encapsulating device for the scanning coil that the embodiment of the present invention 3 provides；
Fig. 3 is that encapsulating device shown in Fig. 2 is put into the structural schematic diagram after scanning coil component；
Attached drawing 4 is the structural schematic diagram and sectional view of unencapsulated scanning coil component.
Description of symbols:
1- skeleton；2- coil；3- circuit board；
4- packing colloid layer；5- pedestal；6- divides matrix；
7- top cover；8- coaxial pins；9- forms collet；
10- forms cylinder；11- flange forming cavity；12- forms upper cover；
13- gas vent；The outlet 14-；15- encapsulating mouth.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
As long as in addition, the non-structure each other of technical characteristic involved in invention described below different embodiments
It can be combined with each other at conflict.
Embodiment 1
A kind of specific embodiment of scanning coil of the invention as shown in Figure 1, including skeleton 1 are arranged in the bone
Circuit board 3 on frame 1, the coil 2 being fixed on the skeleton 1 further include by the skeleton 1, coil 2, the encapsulation of circuit board 3 one
The packing colloid layer 4 of body, and the terminals of the circuit board 3 stretch out outside the packing colloid layer 4, the packing colloid layer 4 with
The skeleton 1 is coaxially disposed.
The skeleton 1, coil 2, circuit board 3 are encapsulated one by the packing colloid layer 4, which is integrated knot
Structure is arranged and fixed conveniently in lens barrel, higher relative to central axis rotational symmetry.
Embodiment 2
A kind of scanning electron microscope of the invention has scanning coil provided by above-described embodiment, since scanning coil is in mirror
Fixation in cylinder, the installation centering of scanning coil and job stability are higher, and the image quality of the scanning electron microscope is higher.
Embodiment 3
A kind of specific embodiment of the encapsulating device of scanning coil as Figure 2-3, including pedestal 5；Tooling matrix,
It is arranged on the pedestal 5, forms cavity thereon；Top cover 7 is arranged on the tooling matrix, the top cover 7, the work
Dress matrix, the pedestal 5 are formed with the encapsulation cavity for encapsulating the scanning coil, the terminals of the circuit board 3 after being integrally connected
Outside the encapsulation cavity, and the pedestal 5,7 at least one of which of the top cover are equipped in the encapsulation cavity, right
The scanning coil is coaxially positioned, and the axis of the skeleton 1 of the scanning coil and the axis coaxle of the encapsulation cavity are made
Location structure；Encapsulating mouth 15 is molded on the top cover 7, and casting glue enters the encapsulation cavity to place by the encapsulating mouth 15
It is potted in the scanning coil in the encapsulation cavity.Due to being set in the pedestal 5,7 at least one of which of the top cover
Have in the encapsulation cavity, the scanning coil coaxially positioned, make the skeleton 1 of the scanning coil axis and
The location structure of the axis coaxle of the encapsulation cavity, the scanning coil after can guarantee encapsulating are with higher relative to central axis
Rotational symmetry.
In the present embodiment, for convenience of the processing of the tooling matrix and the pedestal 5, while to be sealed after the completion of encapsulation
It dresses up integrated scanning coil to take out from the encapsulating device, as shown in Fig. 2, the tooling matrix and the pedestal 5 pass through only
It is connected after mouth structure cooperation by threaded fastener.
In the present embodiment, as shown in figure 3, the location structure includes being arranged on the pedestal 5 to the scanning
The first location structure that the first end of the skeleton 1 of coil is coaxially positioned, and be arranged on the top cover 7 to the skeleton
The second location structure that 1 second end is coaxially positioned.First location structure is the protrusion being molded on the pedestal 5
Portion, the protrusion are suitably inserted into the axis hole of the first end of the skeleton 1；The top cover 7 be equipped with pin shaft hole, described second
Location structure is the coaxial pins 8 that one end passes through the pin shaft hole, and one end of the coaxial pins 8 is suitably inserted into the of the skeleton 1
In the axis hole at two ends.It is positioned by the both ends to scanning coil to guarantee the scanning coil after encapsulation relative to central axis
Rotational symmetry with higher.
After the completion of encapsulating, the integral, surface by encapsulating is needed to have the scanning coil of packing colloid layer 4 from encapsulating device
Middle taking-up, since packing colloid layer has stronger viscosity, it is not easy to be detached from from encapsulating device, complete post package for convenience of encapsulation
Integral scanning coil takes out from encapsulating device, and as Figure 2-3, the encapsulating device further includes being arranged in the top cover
7, the easy mold release component in the space that the tooling matrix, the pedestal 5 surround, the encapsulation cavity is by the easy mold release component structure
At.The easy mold release component includes molding cylinder 10, is arranged on the inner wall of the tooling matrix；Collet 9 is formed, institute is connected to
Between the first end end and the pedestal 5 for stating molding cylinder 10；Flange forming cavity 11 is connected to the molding cylinder 10
Second end end；Form upper cover 12, be arranged between the top cover 7 and the flange forming cavity 11, after docking with it is described at
Type cylinder 10, the molding collet 9 form the encapsulation cavity.In the present embodiment, the easy mold release component, which is all made of, does not glue
Material is made, it is preferred to use polytetrafluoroethylene (PTFE) is made, which has high-lubricity, has the smallest in known engineering material rub
Coefficient is wiped, and non-stick nature is significant, with the smallest surface tension in solid material without adhering to any substance, therefore the material
There is good releasing property between material and electron pouring sealant, be very beneficial for completing the demoulding after package curing.
After scanning coil component shown in Fig. 4 is put into encapsulating device, casting glue is flowed into from the encapsulating mouth 15, into institute
It states in encapsulation cavity, casting glue passing through scan lines circle surface, forms uniform encapsulation between the surface and coil of scanning coil
Colloid layer as Figure 2-3, is equipped with outlet 14 to judge encapsulating situation on the pedestal 5, and the outlet 14 is equipped with screw,
When there is casting glue from 14 outflow of outlet, illustrates that casting glue has reached the bottom of packaging system, encapsulating bottom is avoided to go out
Existing hole.
After the completion of encapsulating, to be solidified, solidification process needs to heat encapsulating device, to avoid in heating process
Closed air expanded by heating in coil rack 1 damages coil rack 1, forms exhaust structure on the pedestal 5,
As Figure 2-3, exhaust structure includes through the gas vent 13 for being arranged on pedestal 5 and being connected to the axis hole of the skeleton 1.
It is fabricated for convenience of tooling matrix, in the present embodiment, the tooling matrix is by two sections points 6 groups of matrix
At, divide described in two sections between matrix 6 by threaded fastener connect, this setup also facilitate encapsulation after the completion of will be packaged into
The scanning coil of one takes out from the device.
When in use, first the pedestal 5 is put well, the molding collet 9, molding cylinder 10 is placed on the pedestal 5,
The tooling matrix formed after matrix 6 being divided to assemble described in two sections is installed to 5 top of pedestal by fixing structure, and passes through
The scanning coil skeleton 1 is fixed threaded fastener, and the flange forming cavity 11 is connected to the molding cylinder
Scanning coil component shown in Fig. 4 is put into the encapsulation cavity by 10 second end end, and the protrusion on the pedestal 5 is inserted
In the axis hole for entering the first end of the scanning coil skeleton 1, the molding upper cover 12, top cover 7 are placed, the molding upper cover 12 is put
It sets between the top cover 7 and the flange forming cavity 11 and is docked with the flange forming cavity 11, after top cover 7 fixes
The coaxial pins 8 are inserted into the pin shaft hole of the top cover 7, one end of the coaxial pins 8 is suitably inserted into the second of the skeleton 1
In the axis hole at end, it ensure that the concentricity of the central axis and rotation axis of scanning coil by cooperations at different levels in this way, also guarantee
Scanning coil in scanning electron microscope with the concentricity of optical axis.It can be potted after the completion of fixation, electron pouring sealant is from described
Flow into encapsulating mouth 15, flow through the encapsulation cavity, scanning coil component encapsulating is into a single integrated structure, encapsulating needed after completing into
Row is heating and curing, and the coaxial pins 8, top cover 7, two sections of point matrixes 6, pedestals 5 can be successively removed after the completion of solidification, then will be easy
Demoulding component is taken away from scanning coil surface, and the integral scanning coil of encapsulating may be mounted in scanning electron microscope and use.
In interchangeable embodiment, the tooling matrix and the pedestal 5 are by passing through pin after fixing structure cooperation
Connection or other dismountable connection type connections.
In interchangeable embodiment, the tooling matrix divides matrix 6 to form by 3 sections or 3 sections or more, described to divide base
It is connected between body 6 by threaded fastener.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (18)
1. a kind of scanning coil is used for scanning electron microscope, including skeleton, the circuit board on the skeleton is arranged in, it is fixed on described
Coil on skeleton, which is characterized in that further include by the skeleton, coil, circuit board package one packing colloid layer, and institute
The terminals for stating circuit board stretch out outside the packing colloid layer, and the packing colloid layer and the skeleton are coaxially disposed.
2. a kind of scanning electron microscope, which is characterized in that have scanning coil as described in claim 1.
3. a kind of encapsulating device of scanning coil characterized by comprising
Pedestal；
Tooling matrix, setting on the base, form cavity thereon；
Top cover is arranged on the tooling matrix, and the top cover, the tooling matrix, the pedestal are formed with after being integrally connected
The encapsulation cavity of the scanning coil is encapsulated, the scanning coil includes skeleton, the circuit board being arranged on the skeleton, is fixed on
The terminals of coil on the skeleton, the circuit board are in outside the encapsulation cavity, and the pedestal, the top cover at least its
In one be equipped in the encapsulation cavity, the scanning coil is coaxially positioned, the bone of the scanning coil is made
The location structure of the axis coaxle of the axis of frame and the encapsulation cavity；
Encapsulating mouth is molded on the top cover, and casting glue enters the encapsulation cavity in the encapsulating by the encapsulating mouth
The intracavitary scanning coil is potted.
4. a kind of encapsulating device of scanning coil according to claim 3, which is characterized in that the tooling matrix with it is described
Pedestal is detachably connected after being cooperated by fixing structure.
5. a kind of encapsulating device of scanning coil according to claim 4, which is characterized in that the tooling matrix with it is described
Pedestal is detachably connected by threaded fastener.
6. a kind of encapsulating device of scanning coil according to claim 3, which is characterized in that the location structure includes setting
Set the first location structure that the first end of the skeleton to the scanning coil on the base is coaxially positioned, and setting
The second location structure that the second end of the skeleton is coaxially positioned on the top cover.
7. a kind of encapsulating device of scanning coil according to claim 6, which is characterized in that first location structure is
The protrusion of molding on the base, the protrusion are suitably inserted into the axis hole of the first end of the skeleton.
8. a kind of encapsulating device of scanning coil according to claim 6, which is characterized in that the top cover is equipped with pin shaft
Hole, second location structure are the coaxial pins that one end passes through the pin shaft hole, and one end of the coaxial pins is suitably inserted into described
In the axis hole of the second end of skeleton.
9. a kind of encapsulating device of scanning coil according to any one of claim 3-8, which is characterized in that the encapsulating
Device further includes the easy mold release component being arranged in the space that the top cover, the tooling matrix, the pedestal surround, the filling
Envelope chamber is made of the easy mold release component.
10. a kind of encapsulating device of scanning coil according to claim 9, which is characterized in that the easy mold release component packet
It includes
Cylinder is formed, is arranged on the inner wall of the tooling matrix；
Collet is formed, is connected between the first end end and the pedestal of the molding cylinder；
Flange forming cavity is connected to the second end end of the molding cylinder；
Form upper cover, be arranged between the top cover and the flange forming cavity, after docking with the molding cylinder, it is described at
Encapsulation cavity described in type collet.
11. a kind of encapsulating device of scanning coil according to claim 10, which is characterized in that the easy mold release component is equal
It is made of non-adhesive material.
12. a kind of encapsulating device of scanning coil according to claim 11, which is characterized in that the non-adhesive material is poly-
Tetrafluoroethene.
13. a kind of encapsulating device of scanning coil according to claim 11, which is characterized in that the pedestal, the work
Dress matrix, the upper cover are made of metal material.
14. a kind of encapsulating device of scanning coil according to any one of claim 3-8, which is characterized in that the bottom
Exhaust structure is formed on seat.
15. a kind of encapsulating device of scanning coil according to claim 14, which is characterized in that the exhaust structure includes
Through the gas vent for being set on the base and being connected to the axis hole of the skeleton.
16. a kind of encapsulating device of scanning coil according to any one of claim 3-8, which is characterized in that the bottom
Seat is equipped with the outlet for judging encapsulating situation, and the outlet is equipped with screw.
17. a kind of encapsulating device of scanning coil according to any one of claim 3-8, which is characterized in that the work
Dress matrix, which is at least detachably connected by two sections of points of matrixes, to be formed.
18. a kind of encapsulating device of scanning coil according to claim 17, which is characterized in that it is described divide between matrix lead to
Cross threaded fastener connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710859427.0A CN107768220B (en) | 2017-09-21 | 2017-09-21 | A kind of encapsulating device of scanning coil, scanning electron microscope and scanning coil |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710859427.0A CN107768220B (en) | 2017-09-21 | 2017-09-21 | A kind of encapsulating device of scanning coil, scanning electron microscope and scanning coil |
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| Publication Number | Publication Date |
|---|---|
| CN107768220A CN107768220A (en) | 2018-03-06 |
| CN107768220B true CN107768220B (en) | 2019-05-31 |
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| CN113949229B (en) * | 2020-07-16 | 2023-03-31 | 中车永济电机有限公司 | Rotor shaft filling and sealing device and rotor shaft filling and sealing method |
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