CN107768220A - A kind of encapsulating device of scanning coil, ESEM and scanning coil - Google Patents
A kind of encapsulating device of scanning coil, ESEM and scanning coil Download PDFInfo
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- CN107768220A CN107768220A CN201710859427.0A CN201710859427A CN107768220A CN 107768220 A CN107768220 A CN 107768220A CN 201710859427 A CN201710859427 A CN 201710859427A CN 107768220 A CN107768220 A CN 107768220A
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- scanning coil
- skeleton
- encapsulating device
- base
- scanning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
- H01J37/1472—Deflecting along given lines
- H01J37/1474—Scanning means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/261—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
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- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Insulating Of Coils (AREA)
Abstract
A kind of scanning coil of the present invention, the encapsulating device of ESEM and scanning coil, wherein scanning coil includes skeleton, the circuit board being arranged on the skeleton, the coil being fixed on the skeleton, also include the integral packing colloid layer of the skeleton, coil, circuit board package, and the terminals of the circuit board are stretched out outside the packing colloid layer.Packing colloid layer is integral by the skeleton, coil, circuit board package, and the scanning coil is structure as a whole, is arranged and fixed conveniently in lens barrel, higher relative to central axis rotational symmetry.Encapsulating device is provided with and the scanning coil is coaxially positioned, and makes the location structure of the axis and the axis coaxle of the encapsulation cavity of the skeleton of the scanning coil, can guarantee that the scanning coil after embedding has higher rotational symmetry relative to central axis.
Description
Technical field
The present invention relates to scanning coil encapsulation technology field, and in particular to a kind of scanning coil, ESEM and scan line
The encapsulating device of circle.
Background technology
ESEM is a kind of electronic optical instrument, is progressively scanned using electron beam is focused in sample surfaces, electronics
Beam bombardment sample surfaces produce secondary electron or backscattered electron, and its caused efficiency is related to sample surface morphology or material,
Secondary electron caused by sample surfaces or backscattered electron are collected, and by the position of sample surfaces electron beam scanning and production
Raw secondary electron or the quantity of backscattered electron is represented with the form of two dimensional image, that is, obtains the secondary electron figure of ESEM
Picture or backscattered electron image.The resolution ratio of scanning electron microscope image can reach nanoscale and be even better than 1.0 nanometers, new material,
The fields such as new energy, national defence, scientific research play irreplaceable effect.
ESEM is operated using the electron beam of electron gun transmitting, and sample is emitted by electron gun in electron beam
The path on product surface, we term it light path, the centre of light path is referred to as optical axis, and electron beam is sent by lens barrel most by electron gun
On the sample for reaching sample room afterwards, the scanning coil in lens barrel provides on sample surfaces and cloudy for incident beam
Scan synchronizing signal of the electron beam on fluorescent screen in extreme ray pipe, by changing the size of current of scanning coil, change scanning
Coil is to the size of electron beam active force, and so, scan amplitude of the incident beam on sample surfaces will be with scan line
The size of electric current in circle and change, with the scan image of enlargement ratio needed for acquisition.Scanning coil is in SEM
It is an important component, is generally placed upon the second half section of lens barrel.The job stability of scanning coil is to the quality of imaging to closing weight
Will.
Coil is wrapped on skeleton by traditional scanning coil by the way of hand wound, coil it is in irregular shape,
After the scanning coil is assembled in ESEM, the axiality of scanning coil and optical axis is poor, scanning coil component relative to
The rotational symmetry of central axis is poor.
The content of the invention
Therefore, the technical problem to be solved in the present invention is to overcome scanning coil component of the prior art relative to center
The defects of rotational symmetry of axis is poor, so as to provide a kind of scan line higher relative to central axis rotational symmetry
Circle.
The invention solves another technical problem be to overcome ESEM of the prior art due to scanning coil
Job stability it is relatively low and the defects of image quality is relatively low, so as to provide a kind of image quality higher ESEM.
The invention solves another technical problem be to provide a kind of encapsulating device for being packaged scanning coil,
Scanning coil after encapsulation can ensure the rotational symmetry relative to central axis.
In order to solve the above technical problems, a kind of scanning coil of the present invention, including skeleton, the electricity being arranged on the skeleton
Road plate, the coil being fixed on the skeleton, in addition to by the skeleton, coil, circuit board package one packing colloid layer,
And the terminals of the circuit board are stretched out outside the packing colloid layer, the packing colloid layer is coaxially disposed with the skeleton.
A kind of ESEM of the present invention, has described scanning coil.
A kind of encapsulating device of scanning coil of the present invention, including：
Base；
Frock matrix, it is arranged on the base, forms cavity thereon；
Top cover, it is arranged on the frock matrix, the top cover, the frock matrix, the base are integrally connected rear shape
Into there is the encapsulation cavity that encapsulates the scanning coil, the terminals of the circuit board are in outside the encapsulation cavity, and the base, institute
State top cover at least one of which to be provided with the encapsulation cavity, the scanning coil is coaxially positioned, make described
The location structure of the axis of the skeleton of scanning coil and the axis coaxle of the encapsulation cavity；
Embedding mouth, it is molded on the top cover, casting glue enters the encapsulation cavity in described by the embedding mouth
The scanning coil in encapsulation cavity carries out embedding.
The frock matrix is detachably connected after being coordinated with the base by fixing structure.
The frock matrix is detachably connected with the base by threaded fastener.
The first end that the location structure includes being arranged on the skeleton on the base to the scanning coil is carried out coaxially
First location structure of positioning, and be arranged on second coaxially positioned to the second end of the skeleton on the top cover and determine
Bit architecture.
First location structure is the protuberance being molded on the base, and the protuberance is suitably inserted into the skeleton
First end axis hole in.
The top cover is provided with pin shaft hole, and second location structure passes through the coaxial pins of the pin shaft hole, institute for one end
The one end for stating coaxial pins is suitably inserted into the axis hole at the second end of the skeleton.
The encapsulating device also includes being arranged in the space that the top cover, the frock matrix, the base surround
Easy mold release component, the encapsulation cavity are made up of the easy mold release component.
The easy mold release component includes
Cylinder is molded, is arranged on the inwall of the frock matrix；
Collet is molded, is connected between first end end and the base of the shaping cylinder；
Flange forming cavity, it is connected to the second end end of the shaping cylinder；
Cover, be arranged between the top cover and the flange forming cavity in shaping, cylinder, institute are molded with described after docking
State encapsulation cavity described in shaping collet.
The easy mold release component is made of non-adhesive material.
The non-adhesive material is polytetrafluoroethylene (PTFE).
The base, the frock matrix, the upper lid are made of metal material.
Exhaust structure is formed on the base.
The exhaust structure is included through the steam vent for being arranged on base and being connected with the axis hole of the skeleton.
The base is provided with the outlet for judging embedding situation, and the outlet is provided with screw.
The frock matrix is at least detachably connected by two sections of points of matrixes to be formed.
Connected between described point of matrix by threaded fastener.
Technical solution of the present invention, have the following advantages that：
1. a kind of scanning coil provided by the invention, packing colloid layer is integral by the skeleton, coil, circuit board package,
The packing colloid layer is coaxially disposed with the skeleton, and the scanning coil is structure as a whole, and is arranged and fixed conveniently in lens barrel, phase
It is higher for central axis rotational symmetry.
2. a kind of ESEM provided by the invention, there is described scanning coil, because scanning coil is consolidated in lens barrel
Fixed firm, the installation centering of scanning coil and job stability are higher, and the image quality of the ESEM is higher.
3. a kind of encapsulating device of scanning coil provided by the invention, on the base, the top cover at least one of which
Provided with the encapsulation cavity, the scanning coil is coaxially positioned, makes the axis of the skeleton of the scanning coil
With the location structure of the axis coaxle of the encapsulation cavity, it is higher to can guarantee that the scanning coil after embedding has relative to central axis
Rotational symmetry.
4. a kind of encapsulating device of scanning coil provided by the invention, the frock matrix passes through seam knot with the base
Structure is detachably connected after coordinating, easy to process, while conveniently will encapsulate integral scanning coil from the device after the completion of encapsulating
Middle taking-up.
5. a kind of encapsulating device of scanning coil provided by the invention, the location structure includes being arranged on the base
The first location structure coaxially positioned to the first end of the skeleton of the scanning coil, and be arranged on it is right on the top cover
The second location structure that second end of the skeleton is coaxially positioned, by being positioned the both ends of scanning coil to ensure
Scanning coil after encapsulation has higher rotational symmetry relative to central axis.
6. a kind of encapsulating device of scanning coil provided by the invention, the encapsulating device also includes being arranged on the top
The easy mold release component in space that lid, the frock matrix, the base surround, the encapsulation cavity is by the easy mold release component structure
Into convenience will encapsulate integral scanning coil and be taken out from encapsulating device after the completion of encapsulation.
7. a kind of encapsulating device of scanning coil provided by the invention, the easy mold release component uses non-adhesive material system
Into convenience will encapsulate integral scanning coil and be taken out from encapsulating device after the completion of encapsulation.
8. a kind of encapsulating device of scanning coil provided by the invention, the non-adhesive material is polytetrafluoroethylene (PTFE), the material
With high-lubricity, there is coefficient of friction minimum in known engineering material, and non-stick nature is notable, has in solid material
Minimum surface tension has good releasing property without adhering to any material between the material and electron pouring sealant,
It is very beneficial for completing the demoulding after package curing.
9. a kind of encapsulating device of scanning coil provided by the invention, the base, the frock matrix, the upper lid are adopted
It is made of metal material, it is ensured that the dimensional stability when package curing heats, it is unlikely to deform, it is reusable.
10. a kind of encapsulating device of scanning coil provided by the invention, exhaust structure is formed on the base, can be avoided
Seal gas expanded by heating when package curing heats in coil rack causes to damage to coil rack.
11. a kind of encapsulating device for scanning coil that invention provides, the frock matrix are at least removable by two sections of points of matrixes
Unload connection to be formed, convenient processing, integral scanning coil will be encapsulated after the completion of encapsulating by being also convenient for takes out from the device.
Brief description of the drawings
, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical scheme of the prior art
The required accompanying drawing used is briefly described in embodiment or description of the prior art, it should be apparent that, in describing below
Accompanying drawing is some embodiments of the present invention, for those of ordinary skill in the art, before creative work is not paid
Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation for the scanning coil that embodiments of the invention 1 provide；
Fig. 2 is the structural representation of the encapsulating device for the scanning coil that embodiments of the invention 3 provide；
Fig. 3 is that the encapsulating device shown in Fig. 2 is put into the structural representation after scanning coil component；
Accompanying drawing 4 is the structural representation and profile of unencapsulated scanning coil component.
Description of reference numerals：
1- skeletons；2- coils；3- circuit boards；
4- packing colloid layers；5- bases；6- divides matrix；
7- top covers；8- coaxial pins；9- is molded collet；
10- is molded cylinder；11- flange forming cavitys；Covered in 12- shapings；
13- steam vents；14- is exported；15- embedding mouths.
Embodiment
Technical scheme is clearly and completely described below in conjunction with accompanying drawing, it is clear that described implementation
Example is part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
In the description of the invention, it is necessary to explanation, term " " center ", " on ", " under ", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " interior ", " outer " be based on orientation shown in the drawings or position relationship, merely to
Be easy to the description present invention and simplify description, rather than instruction or imply signified device or element must have specific orientation,
With specific azimuth configuration and operation, therefore it is not considered as limiting the invention.In addition, term " first ", " second ",
" the 3rd " is only used for describing purpose, and it is not intended that instruction or hint relative importance.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection；Can be joined directly together, can also be indirectly connected by intermediary, Ke Yishi
The connection of two element internals.For the ordinary skill in the art, with concrete condition above-mentioned term can be understood at this
Concrete meaning in invention.
As long as in addition, technical characteristic involved in invention described below different embodiments non-structure each other
It is be combined with each other into conflict can.
Embodiment 1
A kind of embodiment of scanning coil of the invention as shown in Figure 1, including skeleton 1, are arranged on the bone
Circuit board 3 on frame 1, the coil 2 being fixed on the skeleton 1, in addition to the skeleton 1, coil 2, circuit board 3 are encapsulated one
The packing colloid layer 4 of body, and the terminals of the circuit board 3 are stretched out outside the packing colloid layer 4, the packing colloid layer 4 with
The skeleton 1 is coaxially disposed.
The skeleton 1, coil 2, circuit board 3 are encapsulated one by the packing colloid layer 4, and the scanning coil is integrated knot
Structure, it is arranged and fixed conveniently in lens barrel, it is higher relative to central axis rotational symmetry.
Embodiment 2
A kind of ESEM of the present invention, there is the scanning coil that above-described embodiment is provided, because scanning coil is in mirror
Fixation in cylinder, the installation centering of scanning coil and job stability are higher, and the image quality of the ESEM is higher.
Embodiment 3
A kind of embodiment of the encapsulating device of scanning coil as Figure 2-3, including base 5；Frock matrix,
It is arranged on the base 5, forms cavity thereon；Top cover 7, it is arranged on the frock matrix, the top cover 7, the work
Encapsulation cavity formed with the encapsulation scanning coil after dress matrix, the base 5 are integrally connected, the terminals of the circuit board 3
Outside the encapsulation cavity, and the base 5, at least one of which of the top cover 7 are provided with the encapsulation cavity, right
The scanning coil is coaxially positioned, and makes the axis and the axis coaxle of the encapsulation cavity of the skeleton 1 of the scanning coil
Location structure；Embedding mouth 15, it is molded on the top cover 7, casting glue enters the encapsulation cavity to place by the embedding mouth 15
Embedding is carried out in the scanning coil in the encapsulation cavity.Due to being set in the base 5, at least one of which of the top cover 7
Have in the encapsulation cavity, the scanning coil coaxially positioned, make the skeleton 1 of the scanning coil axis and
The location structure of the axis coaxle of the encapsulation cavity, it is higher to can guarantee that the scanning coil after embedding has relative to central axis
Rotational symmetry.
In the present embodiment, for convenience of the processing of the frock matrix and the base 5, while to be sealed after the completion of encapsulation
Dress up integral scanning coil to take out from the encapsulating device, as shown in Fig. 2 the frock matrix passes through only with the base 5
Mouth structure is connected after coordinating by threaded fastener.
In the present embodiment, as shown in figure 3, the location structure includes being arranged on the base 5 to the scanning
The first location structure that the first end of the skeleton 1 of coil is coaxially positioned, and be arranged on the top cover 7 to the skeleton
The second location structure that 1 the second end is coaxially positioned.First location structure is the protrusion being molded on the base 5
Portion, the protuberance are suitably inserted into the axis hole of the first end of the skeleton 1；The top cover 7 is provided with pin shaft hole, and described second
Location structure is the coaxial pins 8 that one end passes through the pin shaft hole, and one end of the coaxial pins 8 is suitably inserted into the of the skeleton 1
In the axis hole at two ends.Ensure the scanning coil after encapsulation relative to central axis by being positioned to the both ends of scanning coil
With higher rotational symmetry.
After the completion of embedding, it is necessary to by embedding is integral, surface has packing colloid layer 4 scanning coil from encapsulating device
Middle taking-up, because packing colloid layer has stronger viscosity, it is not easy to depart from from encapsulating device, post package is completed for convenience of encapsulation
Integral scanning coil takes out from encapsulating device, and as Figure 2-3, the encapsulating device also includes being arranged on the top cover
7th, the easy mold release component in the space that the frock matrix, the base 5 surround, the encapsulation cavity is by the easy mold release component structure
Into.The easy mold release component includes shaping cylinder 10, is arranged on the inwall of the frock matrix；Collet 9 is molded, is connected to institute
Between first end end and the base 5 of stating shaping cylinder 10；Flange forming cavity 11, it is connected to the shaping cylinder 10
Second end end；Lid 12 in shaping, be arranged between the top cover 7 and the flange forming cavity 11, after docking with it is described into
Type cylinder 10, the shaping collet 9 form the encapsulation cavity.In the present embodiment, the easy mold release component use is not glued
Material is made, it is preferred to use polytetrafluoroethylene (PTFE) is made, and the material has high-lubricity, has minimum in known engineering material rub
Coefficient is wiped, and non-stick nature is notable, has surface tension minimum in solid material without adhering to any material, therefore the material
There is good releasing property between material and electron pouring sealant, be very beneficial for completing the demoulding after package curing.
After scanning coil component shown in Fig. 4 is put into encapsulating device, casting glue flows into from the embedding mouth 15, into institute
State in encapsulation cavity, casting glue passing through scan lines circle surface, uniform encapsulation is formed between the surface of scanning coil and coil
Colloid layer, to judge embedding situation, as Figure 2-3, outlet 14 being provided with the base 5, the outlet 14 is provided with screw,
When there is casting glue from the outflow of outlet 14, illustrate that casting glue has reached the bottom of packaging system, avoid embedding bottom from going out
Existing hole.
After the completion of embedding, to be solidified, solidification process needs to heat encapsulating device, to avoid in heating process
Closed air expanded by heating in coil rack 1 is caused to damage to coil rack 1, and exhaust structure is formed on the base 5,
As Figure 2-3, exhaust structure is included through the steam vent 13 for being arranged on base 5 and being connected with the axis hole of the skeleton 1.
Manufacture is processed for convenience of frock matrix, in the present embodiment, the frock matrix is by two sections of points of 6 groups of matrixes
Into dividing described in two sections between matrix 6 and connected by threaded fastener, this setup is also convenient for be packaged into after the completion of encapsulation
The scanning coil of one takes out from the device.
When in use, first the base 5 is put well, the shaping collet 9, shaping cylinder 10 is placed on the base 5,
The frock matrix that matrix 6 forms after assembling will be divided to be installed to the top of base 5 by fixing structure described in two sections, and passed through
The scanning coil skeleton 1 is fixed threaded fastener, and the flange forming cavity 11 is connected into the shaping cylinder
10 the second end end, the scanning coil component shown in Fig. 4 is put into the encapsulation cavity, and the protuberance on the base 5 is inserted
In the axis hole for entering the first end of the scanning coil skeleton 1, lid 12 in the shaping, top cover 7 are placed, lid 12 is put in the shaping
Put between the top cover 7 and the flange forming cavity 11 and docked with the flange forming cavity 11, after top cover 7 fixes
The coaxial pins 8 are inserted in the pin shaft hole of the top cover 7, one end of the coaxial pins 8 is suitably inserted into the second of the skeleton 1
In the axis hole at end, so by the axialities at different levels for coordinating the central axis and rotation axis that ensure that scanning coil, also ensure
Axiality of the scanning coil in ESEM with optical axis.Embedding can be carried out after the completion of fixation, electron pouring sealant is from described
Flow into embedding mouth 15, flow through the encapsulation cavity, scanning coil component embedding is into a single integrated structure, embedding needed after completing into
Row is heating and curing, and can remove the coaxial pins 8, top cover 7, two sections of point matrixes 6, bases 5 after the completion of solidification successively, then will be easy
Demoulding component is taken away from scanning coil surface, and the integral scanning coil of embedding may be mounted in ESEM and use.
In interchangeable embodiment, the frock matrix passes through pin after coordinating with the base 5 by fixing structure
Connection or other dismountable connected mode connections.
In interchangeable embodiment, the frock matrix divides matrix 6 to form by 3 sections or more than 3 sections, described to divide base
Connected between body 6 by threaded fastener.
Obviously, above-described embodiment is only intended to clearly illustrate example, and is not the restriction to embodiment.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or
Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or
Among changing still in the protection domain of the invention.
Claims (18)
1. a kind of scanning coil, including skeleton, the circuit board being arranged on the skeleton, the coil being fixed on the skeleton,
Characterized in that, also include by the skeleton, coil, circuit board package one packing colloid layer, and the circuit board connects
Line end is stretched out outside the packing colloid layer, and the packing colloid layer is coaxially disposed with the skeleton.
2. a kind of ESEM, it is characterised in that there is scanning coil as claimed in claim 1.
A kind of 3. encapsulating device of scanning coil, it is characterised in that including：
Base；
Frock matrix, it is arranged on the base, forms cavity thereon；
Top cover, be arranged on the frock matrix, the top cover, the frock matrix, the base be integrally connected after formed with
The encapsulation cavity of the scanning coil is encapsulated, the terminals of the circuit board are in outside the encapsulation cavity, and the base, the top
Lid at least one of which is provided with the encapsulation cavity, and the scanning coil is coaxially positioned, makes the scanning
The location structure of the axis of the skeleton of coil and the axis coaxle of the encapsulation cavity；
Embedding mouth, it is molded on the top cover, casting glue enters the encapsulation cavity in the embedding by the embedding mouth
The scanning coil of intracavitary carries out embedding.
A kind of 4. encapsulating device of scanning coil according to claim 3, it is characterised in that the frock matrix with it is described
Base is detachably connected after being coordinated by fixing structure.
A kind of 5. encapsulating device of scanning coil according to claim 4, it is characterised in that the frock matrix with it is described
Base is detachably connected by threaded fastener.
6. the encapsulating device of a kind of scanning coil according to claim 3, it is characterised in that the location structure includes setting
The first location structure that the first end of the skeleton on the base to the scanning coil is coaxially positioned is put, and is set
The second location structure coaxially positioned to the second end of the skeleton on the top cover.
7. the encapsulating device of a kind of scanning coil according to claim 6, it is characterised in that first location structure is
The protuberance being molded on the base, the protuberance are suitably inserted into the axis hole of the first end of the skeleton.
8. the encapsulating device of a kind of scanning coil according to claim 6, it is characterised in that the top cover is provided with bearing pin
Hole, second location structure are the coaxial pins that one end passes through the pin shaft hole, and one end of the coaxial pins is suitably inserted into described
In the axis hole at the second end of skeleton.
A kind of 9. encapsulating device of scanning coil according to any one of claim 3-8, it is characterised in that the embedding
Device also includes the easy mold release component being arranged in the space that the top cover, the frock matrix, the base surround, the filling
Envelope chamber is made up of the easy mold release component.
A kind of 10. encapsulating device of scanning coil according to claim 9, it is characterised in that the easy mold release component bag
Include
Cylinder is molded, is arranged on the inwall of the frock matrix；
Collet is molded, is connected between first end end and the base of the shaping cylinder；
Flange forming cavity, it is connected to the second end end of the shaping cylinder；
Cover, be arranged between the top cover and the flange forming cavity in shaping, after docking with it is described shaping cylinder, it is described into
Encapsulation cavity described in type collet.
11. the encapsulating device of a kind of scanning coil according to claim 10, it is characterised in that the easy mold release component is equal
It is made of non-adhesive material.
12. the encapsulating device of a kind of scanning coil according to claim 11, it is characterised in that the non-adhesive material is poly-
Tetrafluoroethene.
13. the encapsulating device of a kind of scanning coil according to claim 11, it is characterised in that the base, the work
Dress matrix, the upper lid are made of metal material.
A kind of 14. encapsulating device of scanning coil according to any one of claim 3-8, it is characterised in that the bottom
Exhaust structure is formed on seat.
15. the encapsulating device of a kind of scanning coil according to claim 14, it is characterised in that the exhaust structure includes
Through the steam vent for being arranged on base and being connected with the axis hole of the skeleton.
A kind of 16. encapsulating device of scanning coil according to any one of claim 3-8, it is characterised in that the bottom
Seat is provided with the outlet for judging embedding situation, and the outlet is provided with screw.
A kind of 17. encapsulating device of scanning coil according to any one of claim 3-8, it is characterised in that the work
Dress matrix is at least detachably connected by two sections of points of matrixes to be formed.
A kind of 18. encapsulating device of scanning coil according to claim 17, it is characterised in that it is described divide between matrix lead to
Cross threaded fastener connection.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710859427.0A CN107768220B (en) | 2017-09-21 | 2017-09-21 | A kind of encapsulating device of scanning coil, scanning electron microscope and scanning coil |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710859427.0A CN107768220B (en) | 2017-09-21 | 2017-09-21 | A kind of encapsulating device of scanning coil, scanning electron microscope and scanning coil |
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| CN107768220A true CN107768220A (en) | 2018-03-06 |
| CN107768220B CN107768220B (en) | 2019-05-31 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113949229A (en) * | 2020-07-16 | 2022-01-18 | 中车永济电机有限公司 | Rotor shaft filling and sealing device and rotor shaft filling and sealing method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1904629A (en) * | 2005-07-29 | 2007-01-31 | 上海海事大学 | Three terminal type magnetic flow gate sensor |
| CN202134358U (en) * | 2011-06-01 | 2012-02-01 | 咸阳金山益昕电子科技有限公司 | Circular coil filling and sealing installation device |
| CN103406657A (en) * | 2013-08-09 | 2013-11-27 | 南京理工大学 | Electromagnetic deflection scanning coil for machining electron beam |
| US20150011870A1 (en) * | 2013-07-02 | 2015-01-08 | MRI Interventions, Inc. | Protective covers for rf coils and related rf coils, assemblies and methods |
| CN104465287A (en) * | 2013-09-14 | 2015-03-25 | 李征 | Scanning electronic microscope |
| US20150102813A1 (en) * | 2012-04-30 | 2015-04-16 | Children's Hospital Medical Center | Acoustic Noise Reducing RF Coil For Magnetic Resonance Imaging |
-
2017
- 2017-09-21 CN CN201710859427.0A patent/CN107768220B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1904629A (en) * | 2005-07-29 | 2007-01-31 | 上海海事大学 | Three terminal type magnetic flow gate sensor |
| CN202134358U (en) * | 2011-06-01 | 2012-02-01 | 咸阳金山益昕电子科技有限公司 | Circular coil filling and sealing installation device |
| US20150102813A1 (en) * | 2012-04-30 | 2015-04-16 | Children's Hospital Medical Center | Acoustic Noise Reducing RF Coil For Magnetic Resonance Imaging |
| US20150011870A1 (en) * | 2013-07-02 | 2015-01-08 | MRI Interventions, Inc. | Protective covers for rf coils and related rf coils, assemblies and methods |
| CN103406657A (en) * | 2013-08-09 | 2013-11-27 | 南京理工大学 | Electromagnetic deflection scanning coil for machining electron beam |
| CN104465287A (en) * | 2013-09-14 | 2015-03-25 | 李征 | Scanning electronic microscope |
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| CN113949229A (en) * | 2020-07-16 | 2022-01-18 | 中车永济电机有限公司 | Rotor shaft filling and sealing device and rotor shaft filling and sealing method |
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