CN107666776B - Double-sided flexible circuit board and preparation method thereof - Google Patents

Double-sided flexible circuit board and preparation method thereof Download PDF

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Publication number
CN107666776B
CN107666776B CN201710947282.XA CN201710947282A CN107666776B CN 107666776 B CN107666776 B CN 107666776B CN 201710947282 A CN201710947282 A CN 201710947282A CN 107666776 B CN107666776 B CN 107666776B
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circuit
preparing
circuit board
line
double
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CN107666776A (en
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邓明
黄大兴
徐青松
张子龙
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Akm Electronics Technology Suzhou Co ltd
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Akm Electronics Technology Suzhou Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The invention discloses a double-sided flexible circuit board which is characterized by comprising an insulating layer, a circuit and a solder mask layer positioned on the outermost side, wherein the solder mask layer is provided with a plurality of pad areas, the pad areas are connected and communicated with the circuit, and the upper surface of the circuit in the pad areas is provided with a surface treatment layer; the lines comprise a first line and a second line which are positioned on two sides of the insulating layer, at least one of the first line and the second line is embedded in the insulating layer, and the first line and the second line are electrically connected through a conductive line. The circuit in the double-sided flexible circuit board is embedded in the insulating layer, so that the width and the line distance of the circuit are further reduced on the premise of keeping high reliability, the product size is ultrathin, the bending property is good, the assembly property is good, and the short circuit risk of client side packaging can be reduced; the preparation method of the double-sided flexible circuit board is low in cost and high in reliability, is easy to realize, and can be used for batch production.

Description

Double-sided flexible circuit board and preparation method thereof
Technical Field
The invention belongs to the technical field of printed circuits, and particularly relates to a double-sided flexible circuit board and a preparation method thereof.
Background
With the continuous progress of science and technology, products in the consumer electronics industry such as mobile phones, pads and the like are rapidly developed, and the requirements on miniaturization and high resolution of display screens are more and more urgent, so that the requirement on the circuit confidentiality of the flexible printed circuit package carrier board is improved. In the prior art, the pitch (the distance between the central points of two adjacent circuits) manufactured in the traditional subtractive process is 60 μm at minimum, but the mass production is mainly 70 μm; the technological limit of the semi-additive method is 40 mu m, and the mass production can be realized by mainly 50 mu m, but the requirement of the market on a low-line-distance circuit board cannot be met.
Disclosure of Invention
In view of the above, in order to overcome the defects of the prior art, an object of the present invention is to provide a double-sided flexible printed circuit board with good flexibility and good assembly, which further reduces the width and the pitch of the circuit while maintaining high reliability.
In order to achieve the purpose, the invention adopts the following technical scheme:
a double-sided flexible circuit board comprises an insulating layer, a circuit and a solder mask layer positioned on the outermost side, wherein the solder mask layer is provided with a plurality of pad areas, the pad areas are connected and communicated with the circuit, and the upper surface of the circuit in the pad areas is provided with a surface treatment layer; the lines comprise a first line and a second line which are positioned on two sides of the insulating layer, at least one of the first line and the second line is embedded in the insulating layer, and the first line and the second line are electrically connected through a conductive line.
Preferably, the solder mask layer is made of ink or polyimide.
The invention also provides a preparation method of the double-sided flexible circuit board, which comprises the following steps: preparing a substrate, then carrying out pattern manufacturing to obtain a first circuit, then preparing an insulating layer, laminating a conductive material on the insulating layer, carrying out micro-etching on the substrate after board splitting, then manufacturing a conductive circuit to connect the first circuit and the conductive material, preparing a solder mask layer and a pad area after preparing the conductive material into a second circuit, and finally preparing a surface treatment layer on the upper surface of the circuit in the pad area.
Specifically, the method comprises the following steps:
1) preparing a base material: preparing a copper-clad plate;
2) manufacturing a first circuit: electroplating a designed first circuit on the surface of the copper-clad plate by using a pattern manufacturing process;
3) coating: coating operation is carried out on the copper-clad plate with the first circuit to prepare the insulating layer;
4) laminating: pressing the conductive material against the insulating layer;
5）FeCl3etching: carrying out FeCl on the copper-clad plate with the insulating layer3Etching;
6) selective etching: removing exposed iron on the circuit board, and reserving the circuit formed by electroplating and bottom copper on the circuit;
7) micro-etching: removing bare bottom copper above the first circuit in the circuit board, and reserving the first circuit formed by electroplating;
8) laser: performing laser on the conductive material to reach the first circuit to form a laser hole;
9) hole filling and electroplating: manufacturing a conductive line in the laser hole to connect the first line and the conductive material;
10) manufacturing a second circuit: preparing the conductive material into a second circuit by adopting a pattern manufacturing process;
11) preparing a solder mask layer: preparing the solder mask layer on the upper surface of the circuit board, and reserving the pad area;
12) preparing a surface treatment layer: and preparing a surface treatment layer on the upper surface of the circuit in the pad area to obtain the double-sided flexible circuit board.
Preferably, the copper-clad plate in the step 1) is copper-clad iron, and comprises an iron sheet positioned in the middle and a copper foil wrapping the iron sheet.
Preferably, the coating operation of step 3) comprises coating by using a coating device and drying and curing by using a baking device, wherein the drying condition is that the temperature is kept at 100-150 ℃ for 20-40 min; the curing condition is that the temperature is kept at 200 ℃ and 400 ℃ for 20-100 min.
More preferably, the coating liquid used in the coating operation in the step 3) is a polyimide glue solution, and the solid content of the polyimide glue solution is 10% -20%.
Preferably, the operation of preparing the solder mask layer in the step 11) is specifically: and printing solder mask ink at the position of the pad area removed from the upper surface of the circuit board to form an ink solder mask layer.
Preferably, the operation of preparing the solder mask layer in the step 11) is specifically: and (3) coating the upper surface of the circuit board again in the step 3) to form a polyimide solder mask.
More preferably, the step further includes a secondary laser step before the surface treatment layer is prepared in the step 12), specifically, the polyimide solder mask layer is subjected to laser to form a pad area.
Compared with the prior art, the invention has the beneficial effects that: the circuit in the double-sided flexible circuit board is embedded in the insulating layer, so that the width and the line distance of the circuit are further reduced on the premise of keeping high reliability, the product size is ultrathin, the bending property is good, the assembly property is good, and the short circuit risk of client side packaging can be reduced; the preparation method of the double-sided flexible circuit board is low in cost and high in reliability, is easy to realize, and can be used for batch production.
Drawings
FIG. 1 is a cross-sectional view of a double-sided flexible wiring board of the present invention;
FIG. 2 is a flow chart of a process for manufacturing a double-sided flexible printed circuit board according to a first embodiment;
FIG. 3 is a cross-sectional view of a copper-clad iron according to the first and second embodiments;
fig. 4 is a cross-sectional view of the first wiring in step S2 in the first and second embodiments after completion of the manufacturing;
fig. 5 is a cross-sectional view of the coating in step S3 in the first and second embodiments after the coating is completed;
fig. 6 is a cross-sectional view after the end of the lamination in step S4 in the first and second embodiments;
FIG. 7 shows FeCl of step S5 in the first and second embodiments3A cross-sectional view after the etching is finished;
fig. 8 is a cross-sectional view after the selective etching at step S5 in the first and second embodiments is completed;
fig. 9 is a cross-sectional view after the end of the microetching at step S7 in the first and second embodiments;
fig. 10 is a cross-sectional view of the laser in step S8 in the first and second embodiments after the end of the laser operation;
fig. 11 is a cross-sectional view of the hole-filling plating in step S9 in the first and second embodiments after completion;
fig. 12 is a sectional view after the end of the second line production in step S10 in the first and second embodiments;
fig. 13 is a cross-sectional view after the solder resist layer is prepared in step S11 in the first embodiment;
FIG. 14 is a flowchart illustrating a process for manufacturing a double-sided flexible printed circuit board according to a second embodiment;
fig. 15 is a cross-sectional view after the solder resist layer preparation in step S11 in the second embodiment is completed;
fig. 16 is a cross-sectional view of step S12 after the end of the second laser in the second embodiment;
in the drawings: the double-sided flexible printed circuit board comprises a double-sided flexible printed circuit board-1, an insulating layer-11, a first circuit-121, a second circuit-122, a conductive material-123, a solder resist-13, a pad area-14, a surface treatment layer-15, a laser hole-16, a conductive circuit-17, copper-clad iron-2, an iron sheet-21 and copper foil-22.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Example one
Referring to fig. 1 to 13, a double-sided flexible printed circuit board 1 of the present embodiment includes an insulating layer 11, a circuit, and a solder mask 13 located at the outermost side, the solder mask 13 has a plurality of pad regions 14, the pad regions 14 are connected to the circuit and are through, and the upper surface of the circuit in the pad regions 14 has a surface treatment layer 15. In this embodiment, the insulating layer 11 is made of Polyimide (PI), the solder resist layer 13 is made of solder resist ink, the surface treatment layer is a metal plating layer, and the metal plating layer, the palladium layer and the nickel layer are sequentially formed from top to bottom, and the thicknesses are sequentially 0.05-0.15 μm, 0.05-0.15 μm and 3-8 μm.
The wiring includes a first wiring 121 and a second wiring 122 on both sides of the insulating layer 11, at least one of the first wiring 121 and the second wiring 122 is buried in the insulating layer 11, and the first wiring 121 and the second wiring 122 are electrically connected with each other with a conductive wiring 17 therebetween. In this embodiment, the first line 121 is embedded in one side of the insulating layer 11, and the second line 122 is located on the surface of the other side of the insulating layer 11.
The embodiment also provides a preparation method of the double-sided flexible circuit board, which specifically comprises the following steps as shown in fig. 2:
step S1: preparing the material
And preparing the copper-clad plate. The copper-clad plate in the embodiment is copper-clad iron 2, as shown in fig. 3, and comprises an iron sheet 21 positioned in the middle and a copper foil 22 for cladding the iron sheet 21, and the manufacturing process is to electroplate 3 mu m copper on a pure iron sheet.
Step S2: making the first circuit
A first designed circuit 121 is plated on the surface of the iron-clad-copper 2 by a patterning process, as shown in fig. 4. The method specifically comprises the following steps: the method comprises the steps of carrying out photo-induced pretreatment on the upper surface of the copper-clad iron 2, then pasting a photosensitive film, exposing a designed circuit pattern by using exposure equipment, carrying out development treatment, removing an unexposed part completely, electroplating a designed first circuit 121 on the developed copper-clad iron 2, and then carrying out film stripping treatment.
Step S3: coating of
A coating operation is performed on the copper clad iron 2 having the first wiring 121 to prepare an insulating layer 11, as shown in fig. 5.
The coating operation in the embodiment comprises coating by adopting coating equipment and drying and curing by adopting baking equipment, wherein the drying condition is kept for 20-40min at 100-150 ℃; the curing condition is that the temperature is kept at 200 ℃ and 400 ℃ for 20-100 min. Preferably, the drying condition is 100 deg.C for 40 min; the curing conditions were 200 ℃ for 100 min.
The coating liquid used in the coating operation is polyimide glue solution, the solid content of which is 10% -20%, and in this embodiment, the solid content of the polyimide glue solution is preferably 10%.
Step S4: lamination of
The conductive material 123 is laminated on the lower surface of the insulating layer 11, and as shown in fig. 6, the conductive material 123 of the present embodiment is a copper foil 123.
Step S5: FeCl3Etching of
FeCl is carried out on the copper-clad iron 2 with the insulating layer 113Etching, the copper foil 22 not connected to the first wiring 121 and a part of the iron piece 21 are removed by controlling the etching amount by controlling the etching rate, as shown in fig. 7.
Step S6: selective etching
In FeCl3After etching, the selective etching is carried out continuously, and the selective etching liquid medicine is CuCl2Etching the remaining iron sheet 21 completely, and leaving the first wiring 121 formed by electroplating and the first wiring 1Bottom copper on 21 as shown in fig. 8.
Step S7: microetching method
The bottom copper exposed above the first circuit 121 in the circuit board is removed, and the first circuit 121 formed by electroplating remains, as shown in fig. 9.
Step S8: laser
Laser light is applied from the conductive material 123 to the first wiring 121 to form laser holes 16, as shown in fig. 10.
Step S9: hole-filling electroplating
Conductive traces 17 are formed in the laser via 16 using a fill-hole solution to connect the first trace 121 to the conductive material, as shown in fig. 11.
Step S10: making the second circuit
The second line 122 is prepared from the conductive material 123 using a patterning process, as shown in fig. 12.
Step S11: preparation of solder mask
Solder masks 13 are prepared on both upper and lower surfaces of the wiring board, and pad regions 14 are reserved, as shown in fig. 13. The specific operation in this embodiment is to print solder resist ink on both upper and lower surfaces of the wiring board at the positions where the pad areas 14 are removed, and form the ink solder resist layer 13.
Step S12: preparation of surface treatment layer
A surface treatment layer 15 is prepared on the upper surface of the wiring in the pad region 14, and a double-sided flexible wiring board 1 is obtained, as shown in fig. 1.
Example two
Referring to fig. 1 to 12 and 14 to 16, a double-sided flexible circuit board 1 of the present embodiment includes an insulating layer 11, a circuit, and a solder mask layer 13 located at the outermost side, the solder mask layer 13 has a plurality of pad regions 14, the pad regions 14 are connected to the circuit and penetrate through, and the upper surface of the circuit in the pad regions 14 has a surface treatment layer 15. In this embodiment, the insulating layer 11 is made of Polyimide (PI), the solder resist layer 13 is made of polyimide, the surface treatment layer is a metal plating layer, and the metal plating layer, the palladium plating layer and the nickel plating layer are sequentially formed from top to bottom, and the thicknesses are sequentially 0.05-0.15 μm, 0.05-0.15 μm and 3-8 μm.
The wiring includes a first wiring 121 and a second wiring 122 on both sides of the insulating layer 11, at least one of the first wiring 121 and the second wiring 122 is buried in the insulating layer 11, and the first wiring 121 and the second wiring 122 are electrically connected with each other with a conductive wiring 17 therebetween. In this embodiment, the first line 121 is embedded in one side of the insulating layer 11, and the second line 122 is located on the surface of the other side of the insulating layer 11.
The embodiment also provides a preparation method of the double-sided flexible circuit board, as shown in fig. 14, which specifically includes the following steps:
step S1: preparing the material
And preparing the copper-clad plate. The copper-clad plate in the embodiment is copper-clad iron 2, as shown in fig. 3, and comprises an iron sheet 21 positioned in the middle and a copper foil 22 for cladding the iron sheet 21, and the manufacturing process is to electroplate 3 mu m copper on a pure iron sheet.
Step S2: making the first circuit
A first designed circuit 121 is plated on the surface of the iron-clad-copper 2 by a patterning process, as shown in fig. 4. The method specifically comprises the following steps: the method comprises the steps of carrying out photo-induced pretreatment on the surface of the copper-clad iron 2, then pasting a photosensitive film, exposing a designed circuit pattern by using exposure equipment, carrying out development treatment, removing the unexposed part completely, electroplating a designed first circuit 121 on the developed copper-clad iron 2, and then carrying out film removal treatment.
Step S3: coating of
A coating operation is performed on the copper clad iron 2 having the first wiring 121 to prepare an insulating layer 11, as shown in fig. 5.
The coating operation in the embodiment comprises coating by adopting coating equipment and drying and curing by adopting baking equipment, wherein the drying condition is kept for 20-40min at 100-150 ℃; the curing condition is that the temperature is kept at 200 ℃ and 400 ℃ for 20-100 min. Preferably, the drying condition is 150 deg.C for 20 min; the curing conditions were 400 ℃ for 20 min.
The coating liquid used in the coating operation is polyimide glue solution, the solid content of which is 10% -20%, and in this embodiment, the solid content of the polyimide glue solution is preferably 20%.
Step S4: lamination of
The conductive material 123 is laminated on the lower surface of the insulating layer 11, and as shown in fig. 6, the conductive material 123 of the present embodiment is a copper foil 123.
Step S5: FeCl3Etching of
FeCl is carried out on the copper-clad iron 2 with the insulating layer 113Etching, the copper foil 22 not connected to the first wiring 121 and a part of the iron piece 21 are removed by controlling the etching amount by controlling the etching rate, as shown in fig. 7.
Step S6: selective etching
In FeCl3After etching, the selective etching is carried out continuously, and the selective etching liquid medicine is CuCl2The remaining iron piece 21 is completely etched, leaving the first wire 121 formed by electroplating and the bottom copper on the first wire 121, as shown in fig. 8.
Step S7: microetching method
The bottom copper exposed above the first circuit 121 in the circuit board is removed, and the first circuit 121 formed by electroplating remains, as shown in fig. 9.
Step S8: laser
Laser light is applied from the conductive material 123 to the first wiring 121 to form laser holes 16, as shown in fig. 10.
Step S9: hole-filling electroplating
Conductive material is filled in the laser hole 16 to form a conductive circuit 17 for connecting the first circuit 121 and the conductive material, as shown in fig. 11.
Step S10: making the second circuit
The second line 122 is prepared from the conductive material 123 using a patterning process, as shown in fig. 12.
Step S11: preparation of solder mask
Solder resists 13 are prepared on both the upper and lower surfaces of the wiring board. The specific operation in this embodiment is to form the polyimide solder resist layer 13 by performing the same coating operation as in step S3 again on both the upper and lower surfaces of the wiring board, as shown in fig. 15.
Step S12: secondary laser
The polyimide solder resist layer 13 is again subjected to laser operation to form the pad region 14, as shown in fig. 16.
Step S13: preparation of surface treatment layer
A surface treatment layer 15 is prepared on the upper surfaces of the first wiring 121 and the second wiring 122 in the pad region 14, and a double-sided flexible wiring board 1 is obtained, as shown in fig. 1.
The circuit in the double-sided flexible circuit board is embedded in the insulating layer, the width and the line distance of the circuit are further reduced on the premise of keeping high reliability, the line distance can reach 20 mu m at the lowest, the product size is also ultrathin, the bending property is good, the assembly property is good, and the risk of short circuit of client end packaging can be reduced; the preparation method of the double-sided flexible circuit board is low in cost and high in reliability, is easy to realize, and can be used for batch production.
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the content of the present invention and implement the invention, and not to limit the scope of the invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the scope of the present invention.

Claims (8)

1. A preparation method of a double-sided flexible circuit board is characterized by comprising the following steps: preparing a substrate, patterning to obtain a first circuit, preparing an insulating layer, laminating a conductive material on the insulating layer, and FeCl-coating the substrate3Selectively etching and micro-etching after etching, then manufacturing a conductive circuit to connect the first circuit and the conductive material, preparing a solder mask layer and a pad area after preparing the conductive material into a second circuit, and finally preparing a surface treatment layer on the upper surface of the circuit in the pad area;
the method specifically comprises the following steps:
1) preparing a base material: preparing a copper-clad plate;
2) manufacturing a first circuit: electroplating a designed first circuit on the surface of the copper-clad plate by using a pattern manufacturing process;
3) coating: coating operation is carried out on the copper-clad plate with the first circuit to prepare the insulating layer;
4) laminating: pressing the conductive material against the insulating layer;
5）FeCl3etching: carrying out FeCl on the copper-clad plate with the insulating layer3Etching;
6) selective etching: removing exposed iron on the circuit board, and reserving the circuit formed by electroplating and bottom copper on the circuit;
7) micro-etching: removing bare bottom copper above the first circuit in the circuit board, and reserving the first circuit formed by electroplating;
8) laser: performing laser on the conductive material to reach the first circuit to form a laser hole;
9) hole filling and electroplating: manufacturing a conductive line in the laser hole to connect the first line and the conductive material;
10) manufacturing a second circuit: preparing the conductive material into a second circuit by adopting a pattern manufacturing process;
11) preparing a solder mask layer: preparing the solder mask layer on the upper surface of the circuit board, and reserving the pad area;
12) preparing a surface treatment layer: preparing a surface treatment layer on the upper surface of the circuit in the pad area to obtain a double-sided flexible circuit board;
the copper-clad plate in the step 1) is copper-clad iron and comprises an iron sheet positioned in the middle and a copper foil wrapping the iron sheet.
2. The method for preparing a double-sided flexible circuit board according to claim 1, wherein the coating operation of step 3) comprises coating with a coating device and drying and curing with a baking device, wherein the drying condition is maintained at 100-150 ℃ for 20-40 min; the curing condition is that the temperature is kept at 200 ℃ and 400 ℃ for 20-100 min.
3. The method for preparing a double-sided flexible circuit board according to claim 2, wherein the coating liquid used in the coating operation of step 3) is a polyimide glue solution, and the solid content of the polyimide glue solution is 10-20%.
4. The method for preparing a double-sided flexible circuit board according to claim 1, wherein the operation of preparing the solder mask in step 11) is specifically: and printing solder mask ink at the position of the pad area removed from the upper surface of the circuit board to form an ink solder mask layer.
5. The method for preparing a double-sided flexible circuit board according to claim 1, wherein the operation of preparing the solder mask in step 11) is specifically: and (3) coating the upper surface of the circuit board again in the step 3) to form a polyimide solder mask.
6. The method for manufacturing a double-sided flexible circuit board according to claim 5, wherein the step further comprises a secondary laser step before the step 12) of manufacturing the surface treatment layer, specifically, performing laser on the polyimide solder mask layer to form a pad area.
7. A double-sided flexible wiring board prepared by the preparation method according to any one of claims 1 to 6, comprising an insulating layer, a wiring and a solder resist layer located at the outermost side, wherein the solder resist layer has a plurality of pad regions, the pad regions are connected with the wiring and run through, and the upper surface of the wiring in the pad regions has a surface treatment layer; the lines comprise a first line and a second line which are positioned on two sides of the insulating layer, at least one of the first line and the second line is embedded in the insulating layer, and the first line and the second line are electrically connected through a conductive line.
8. The double-sided flexible circuit board of claim 7, wherein the solder resist layer is made of ink or polyimide.
CN201710947282.XA 2017-10-12 2017-10-12 Double-sided flexible circuit board and preparation method thereof Active CN107666776B (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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CN107666776B true CN107666776B (en) 2020-05-05

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106376184A (en) * 2016-07-22 2017-02-01 深南电路股份有限公司 Manufacturing method of embedded line and packaging substrate
CN106409688A (en) * 2016-07-22 2017-02-15 深南电路股份有限公司 Processing method of ultrathin coreless package substrate and structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106376184A (en) * 2016-07-22 2017-02-01 深南电路股份有限公司 Manufacturing method of embedded line and packaging substrate
CN106409688A (en) * 2016-07-22 2017-02-15 深南电路股份有限公司 Processing method of ultrathin coreless package substrate and structure

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