CN107734845A - A kind of FPC and preparation method thereof - Google Patents
A kind of FPC and preparation method thereof Download PDFInfo
- Publication number
- CN107734845A CN107734845A CN201710947265.6A CN201710947265A CN107734845A CN 107734845 A CN107734845 A CN 107734845A CN 201710947265 A CN201710947265 A CN 201710947265A CN 107734845 A CN107734845 A CN 107734845A
- Authority
- CN
- China
- Prior art keywords
- circuit
- fpc
- solder mask
- preparation
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of FPC, including the circuit in insulating barrier, the embedment insulating barrier, there are some pad areas on the circuit, circuit upper surface in the pad area has surface-treated layer, and removing the circuit upper surface of the pad area and the upper surface of the insulating barrier has solder mask.Circuit embedment in a kind of FPC of the present invention further reduces the width and line-spacing of circuit on the premise of high reliability is kept in a insulating layer, and product size is also ultra-thin, and bending property is good, and assembling is good, can reduce client encapsulation short-circuit risks；A kind of preparation method cost of FPC of the present invention is low, and reliability is high, and this method is easily achieved, and can be mass.
Description
Technical field
The invention belongs to printed circuit technique field, and in particular to a kind of FPC and preparation method thereof.
Background technology
With the continuous progress of science and technology, the consumer electronics industry such as product such as mobile phone, Pad develops rapidly, to display screen
Miniaturization and high-resolution demand are more and more urgent, so as to improve the requirement to the fine and closely woven property of soft board encapsulating carrier plate circuit.It is existing
There is the pitch produced in traditional subtractive process technique in technology（The distance between adjacent two circuit central points）Minimum 60
μm, but the more based on 70 μm of volume production can be realized；40 μm of the semi-additive process limit, it can realize that the more of volume production are with 50 μm
It is main, but still can not meet the needs of in the market is to low line-spacing wiring board.
The content of the invention
In view of this, in order to overcome prior art the defects of, it is an object of the invention to provide a kind of FPC to protect
The width and line-spacing of circuit are further reduced on the premise of holding high reliability, and bending property is good, assembling is good.
In order to achieve the above object, the present invention uses following technical scheme：
A kind of circuit in FPC, including insulating barrier, the embedment insulating barrier, there are some pads on the circuit
Area, the circuit upper surface in the pad area have surface-treated layer, remove the circuit upper surface and the institute of the pad area
The upper surface for stating insulating barrier has solder mask.
Preferably, the material of the solder mask is ink or polyimides.
Present invention also offers a kind of preparation method of FPC, comprise the following steps：Figure is carried out after preparing base material
Shape obtains circuit, prepares insulating barrier afterwards, and carries out microetch after the base material is carried out into scoreboard, then prepares solder mask
And pad area is reserved, finally the circuit upper surface in the pad area prepares surface-treated layer.
Specifically, comprise the following steps：
1）Prepare base material：Prepare copper-clad plate；
2）Circuit makes：The circuit of design is electroplated out using graphic making technique to the surface of the copper-clad plate；
3）Coating：Painting work is carried out in the copper-clad plate with the circuit, prepares the insulating barrier；
4）Scoreboard：Scoreboard operation is carried out to the copper-clad plate with the insulating barrier, obtains two symmetrical wiring boards；
5）Microetch：Bottom copper exposed on wiring board is removed, retains the circuit that plating is formed；
6）Prepare solder mask：The upper surface of assist side prepares the solder mask, and reserves the pad area；
7）Prepare surface-treated layer：Circuit upper surface in the pad area prepares surface-treated layer, obtains FPC.
Preferably, step 1）In the copper-clad plate be separable copper foil, including vector resin positioned at centre, positioned at institute
State the inner side copper foil of vector resin upper and lower surface and positioned at outermost outside copper foil, the inner side copper foil with it is described
Also there is copper foil barrier layer between the copper foil of outside.
Preferably, step 3）The painting work includes being coated using coating apparatus and carrying out using roasting plant
Dry and solidify, wherein dry condition is to keep 20-40min at 100 DEG C -150 DEG C；The condition of solidification is at 200-400 DEG C
Keep 20-100min.
It is further preferred that step 3）Coating fluid used in the painting work is polyimides glue, its solid content
For 10%-20%.
Preferably, step 6）It is described prepare solder mask operation be specially：Described in being removed in the upper surface of the wiring board
The position printing solder mask of pad area, forms ink solder mask.
Preferably, step 6）It is described prepare solder mask operation be specially：Carried out again in the upper surface of the wiring board
Step 3）Painting work, formed polyimides solder mask.
It is further preferred that the step is additionally included in step 7）Radium-shine step before preparing surface-treated layer, it is specially
Radium-shine formation pad area is carried out to the polyimides solder mask.
Compared with prior art, the beneficial effects of the invention are as follows：Circuit embedment in a kind of FPC of the present invention
In a insulating layer, the width and line-spacing of circuit are further reduced on the premise of high reliability is kept, product size is also ultra-thin, curved
Folding endurance is good, and assembling is good, can reduce client encapsulation short-circuit risks；A kind of preparation method cost of FPC of the present invention
Low, reliability is high, and this method is easily achieved, and can be mass.
Brief description of the drawings
Fig. 1 is the sectional view of the FPC of the present invention；
Fig. 2 is the Making programme figure of FPC in embodiment one；
Fig. 3 is the sectional view that copper foil is separated in embodiment one and embodiment two；
Fig. 4 is the sectional view that step S2 circuits make after terminating in embodiment one and embodiment two；
Fig. 5 is that step S3 is coated with the sectional view after terminating in embodiment one and embodiment two；
Fig. 6 is the sectional view after step S4 scoreboards terminate in embodiment one and embodiment two；
Fig. 7 is the sectional view after step S5 microetch terminates in embodiment one and embodiment two；
Fig. 8 is that step S6 prepares the sectional view after solder mask terminates in embodiment one；
Fig. 9 is the Making programme figure of FPC in embodiment two；
Figure 10 is that step S6 prepares the sectional view after solder mask terminates in embodiment two；
Figure 11 is the sectional view after the radium-shine end of step S7 in embodiment two；
In accompanying drawing：FPC -1, insulating barrier -11, circuit -12, solder mask -13, pad area -14, surface-treated layer -15,
Separable copper foil -2, vector resin -21, inner side copper foil -22, copper foil barrier layer -23, outside copper foil -24.
Embodiment
The preferred embodiment of the present invention is described in detail below in conjunction with the accompanying drawings.
Embodiment one
Refer to Fig. 1 to Fig. 8, the line in a kind of FPC 1 of the present embodiment, including insulating barrier 11, buried insulating layer 11
Road 12, has some pad areas 14 on circuit 12, and the upper surface of circuit 12 in pad area 14 has surface-treated layer 15, except defluxing
The upper surface of circuit 12 in panel 14 and the upper surface of insulating barrier 11 have solder mask 13.The material of insulating barrier 11 is in the present embodiment
Polyimides（PI）, the material of solder mask 13 is solder mask, and surface-treated layer is the coat of metal, is from top to bottom followed successively by gold
Layer, palladium layers and nickel dam, thickness are followed successively by 0.05-0.15 μm, 0.05-0.15 μm, 3-8 μm.
The present embodiment additionally provides a kind of preparation method of FPC, as shown in Fig. 2 specifically including following steps：
Step S1：Prepare material
Prepare copper-clad plate.Copper-clad plate in the present embodiment is separable copper foil 2, as shown in figure 3, including the carrier tree positioned at centre
Fat 21, the inner side copper foil 22 positioned at the upper and lower surface of vector resin 21 and positioned at outermost outside copper foil 24, inner side
Also there is copper foil barrier layer 23 between copper foil 22 and outside copper foil 24.
Step S2：Circuit makes
The circuit of design is electroplated out using graphic making technique to the surface for separating copper foil 2, as shown in Figure 4.Specifically include with
Lower flow：Photosensitive film is sticked after carrying out photic pre-treatment to the surface for separating copper foil 2, design is exposed using exposure sources
Line pattern, development treatment is carried out, unexposed part is removed totally, electroplated on the separable copper foil 2 after development treatment
Go out the circuit 12 of design, carry out taking off film process afterwards.
Step S3：Coating
Painting work is carried out on the separable copper foil 2 with circuit 12, prepares insulating barrier 11, as shown in Figure 5.
Painting work in the present embodiment includes being coated using coating apparatus and being dried using roasting plant
And solidification, wherein dry condition is to keep 20-40min at 100 DEG C -150 DEG C；The condition of solidification is to be kept at 200-400 DEG C
20-100min.Preferable drying condition is to keep 40min at 100 DEG C；The condition of solidification is to keep 100min at 200 DEG C.
Coating fluid used in painting work is polyimides glue, and its solid content is 10%-20%, and the present embodiment is preferred
The solid content of polyimides glue is 10%.
Step S4：Scoreboard
Separable copper foil 2 with insulating barrier 11 is subjected to scoreboard operation, obtains two symmetrical wiring boards, as shown in Figure 6.
Step S5：Microetch
Bottom copper exposed on wiring board is removed, retains the circuit 12 that plating is formed, as shown in Figure 7.
Step S6：Prepare solder mask
The upper surface of assist side prepares solder mask 13, and reserves pad area 14, as shown in Figure 8.Specific behaviour in this implementation
Solder mask is printed in the position that upper surface as assist side removes pad area 14, forms ink solder mask 13.
Step S7：Prepare surface-treated layer
The upper surface of circuit 12 in pad area 14 prepares surface-treated layer 15, obtains FPC 1, as shown in Figure 1.
Embodiment two
Fig. 1 to Fig. 7 and Fig. 9 are referred to Figure 11, a kind of FPC 1 of the present embodiment, including insulating barrier 11, embedment insulation
Circuit 12 in layer 11, has some pad areas 14 on circuit 12, and the upper surface of circuit 12 in pad area 14, which has, to be surface-treated
Layer 15, removing the upper surface of circuit 12 of pad area 14 and the upper surface of insulating barrier 11 has solder mask 13.Insulated in the present embodiment
The material of layer 11 is polyimides（PI）, the material of solder mask 13 is polyimides, and surface-treated layer is the coat of metal, by upper
Under be followed successively by layer gold, palladium layers and nickel dam, thickness is followed successively by 0.05-0.15 μm, 0.05-0.15 μm, 3-8 μm.
The present embodiment additionally provides a kind of preparation method of FPC, as shown in figure 9, specifically including following steps：
Step S1：Prepare material
Prepare copper-clad plate.Copper-clad plate in the present embodiment is separable copper foil 2, as shown in figure 3, including the carrier tree positioned at centre
Fat 21, the inner side copper foil 22 positioned at the upper and lower surface of vector resin 21 and positioned at outermost outside copper foil 24, inner side
Also there is copper foil barrier layer 23 between copper foil 22 and outside copper foil 24.
Step S2：Circuit makes
The circuit of design is electroplated out using graphic making technique to the surface for separating copper foil 2, as shown in Figure 4.Specifically include with
Lower flow：Photosensitive film is sticked after carrying out photic pre-treatment to the surface for separating copper foil 2, design is exposed using exposure sources
Line pattern, development treatment is carried out, unexposed part is removed totally, electroplated on the separable copper foil 2 after development treatment
Go out the circuit 12 of design, carry out taking off film process afterwards.
Step S3：Coating
Painting work is carried out on the separable copper foil 2 with circuit 12, prepares insulating barrier 11, as shown in Figure 5.
Painting work in the present embodiment includes being coated using coating apparatus and being dried using roasting plant
And solidification, wherein dry condition is to keep 20-40min at 100 DEG C -150 DEG C；The condition of solidification is to be kept at 200-400 DEG C
20-100min.Preferable drying condition is to keep 20min at 150 DEG C；The condition of solidification is to keep 20min at 400 DEG C.
Coating fluid used in painting work is polyimides glue, and its solid content is 10%-20%, and the present embodiment is preferred
The solid content of polyimides glue is 20%.
Step S4：Scoreboard
Separable copper foil 2 with insulating barrier 11 is subjected to scoreboard operation, obtains two symmetrical wiring boards, as shown in Figure 6.
Step S5：Microetch
Bottom copper exposed on wiring board is removed, retains the circuit 12 that plating is formed, as shown in Figure 7.
Step S6：Prepare solder mask
The upper surface of assist side prepares solder mask 13.Concrete operations in this implementation are carried out again for the upper surface of assist side
With step S3 identical painting works, polyimides solder mask 13 is formed, as shown in Figure 10.
Step S7：It is radium-shine
Radium-shine formation pad area 14 is carried out to polyimides solder mask, as shown in figure 11.
Step S8：Prepare surface-treated layer
The upper surface of circuit 12 in pad area 14 prepares surface-treated layer 15, obtains FPC 1, as shown in Figure 1.
Circuit embedment in a kind of FPC of the present invention is entered on the premise of high reliability is kept in a insulating layer
One step reduces the width and line-spacing of circuit, and line-spacing is minimum to can reach 20 μm, and product size is also ultra-thin, and bending property is good, and assembling is good,
Client encapsulation short-circuit risks can be reduced；A kind of preparation method cost of FPC of the present invention is low, and reliability is high, and should
Method is easily achieved, and can be mass.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand present disclosure and implement according to this, and it is not intended to limit the scope of the present invention, all according to the present invention
The equivalent change or modification that Spirit Essence is made, it should all be included within the scope of the present invention.
Claims (10)
1. a kind of FPC, it is characterised in that including the circuit in insulating barrier, the embedment insulating barrier, on the circuit
With some pad areas, the circuit upper surface in the pad area has surface-treated layer, removes the line of the pad area
Road upper surface and the upper surface of the insulating barrier have solder mask.
2. a kind of FPC according to claim 1, it is characterised in that the material of the solder mask is ink or gathered
Acid imide.
3. a kind of preparation method of FPC, it is characterised in that comprise the following steps：Graphic making is carried out after preparing base material
Circuit is obtained, prepares insulating barrier afterwards, and microetch is carried out after the base material is carried out into scoreboard, solder mask is then prepared and reserves
Go out pad area, finally the circuit upper surface in the pad area prepares surface-treated layer.
4. the preparation method of a kind of FPC according to claim 3, it is characterised in that comprise the following steps：
1）Prepare base material：Prepare copper-clad plate；
2）Circuit makes：The circuit of design is electroplated out using graphic making technique to the surface of the copper-clad plate；
3）Coating：Painting work is carried out in the copper-clad plate with the circuit, prepares the insulating barrier；
4）Scoreboard：Scoreboard operation is carried out to the copper-clad plate with the insulating barrier, obtains two symmetrical wiring boards；
5）Microetch：Bottom copper exposed on wiring board is removed, retains the circuit that plating is formed；
6）Prepare solder mask：The upper surface of assist side prepares the solder mask, and reserves the pad area；
7）Prepare surface-treated layer：Circuit upper surface in the pad area prepares surface-treated layer, obtains FPC.
A kind of 5. preparation method of FPC according to claim 4, it is characterised in that step 1）In described cover
Copper coin is separable copper foil, including vector resin positioned at centre, positioned at the inner side of the vector resin upper and lower surface
Copper foil and also there is copper foil barrier layer between outermost outside copper foil, the inner side copper foil and the outside copper foil.
A kind of 6. preparation method of FPC according to claim 4, it is characterised in that step 3）The coating behaviour
Make to include being coated using coating apparatus and being dried and cured using roasting plant, wherein dry condition is 100
20-40min is kept at DEG C -150 DEG C；The condition of solidification is to keep 20-100min at 200-400 DEG C.
A kind of 7. preparation method of FPC according to claim 6, it is characterised in that step 3）The coating behaviour
Coating fluid used in work is polyimides glue, and its solid content is 10%-20%.
A kind of 8. preparation method of FPC according to claim 4, it is characterised in that step 6）It is described to prepare resistance
The operation of layer is specially：Solder mask is printed in the position that the pad area is removed in the upper surface of the wiring board, forms oil
Black solder mask.
A kind of 9. preparation method of FPC according to claim 4, it is characterised in that step 6）It is described to prepare resistance
The operation of layer is specially：Step 3 is carried out again in the upper surface of the wiring board）Painting work, formed polyimides resistance
Layer.
10. the preparation method of a kind of FPC according to claim 9, it is characterised in that the step also includes
In step 7）Radium-shine step before preparing surface-treated layer, radium-shine formed specially is carried out to the polyimides solder mask and is welded
Panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710947265.6A CN107734845A (en) | 2017-10-12 | 2017-10-12 | A kind of FPC and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710947265.6A CN107734845A (en) | 2017-10-12 | 2017-10-12 | A kind of FPC and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107734845A true CN107734845A (en) | 2018-02-23 |
Family
ID=61211153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710947265.6A Pending CN107734845A (en) | 2017-10-12 | 2017-10-12 | A kind of FPC and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107734845A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111915984A (en) * | 2019-05-09 | 2020-11-10 | 上海和辉光电有限公司 | Display device |
| WO2022022419A1 (en) * | 2020-07-31 | 2022-02-03 | 华为技术有限公司 | Circuit board assembly and processing method therefor, and electronic device |
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|---|---|---|---|---|
| CN103066048A (en) * | 2011-10-21 | 2013-04-24 | 欣兴电子股份有限公司 | Packaging substrate and packaging structure provided with supporting body and manufacture method thereof |
| CN106376184A (en) * | 2016-07-22 | 2017-02-01 | 深南电路股份有限公司 | Manufacturing method of embedded line and packaging substrate |
| CN106409688A (en) * | 2016-07-22 | 2017-02-15 | 深南电路股份有限公司 | Processing method of ultrathin coreless package substrate and structure |
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2017
- 2017-10-12 CN CN201710947265.6A patent/CN107734845A/en active Pending
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| CN103066048A (en) * | 2011-10-21 | 2013-04-24 | 欣兴电子股份有限公司 | Packaging substrate and packaging structure provided with supporting body and manufacture method thereof |
| CN106376184A (en) * | 2016-07-22 | 2017-02-01 | 深南电路股份有限公司 | Manufacturing method of embedded line and packaging substrate |
| CN106409688A (en) * | 2016-07-22 | 2017-02-15 | 深南电路股份有限公司 | Processing method of ultrathin coreless package substrate and structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111915984A (en) * | 2019-05-09 | 2020-11-10 | 上海和辉光电有限公司 | Display device |
| WO2022022419A1 (en) * | 2020-07-31 | 2022-02-03 | 华为技术有限公司 | Circuit board assembly and processing method therefor, and electronic device |
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Application publication date: 20180223 |