CN107666767A - A kind of circuit board, circuit board via structure and the method for realizing circuit board via - Google Patents

A kind of circuit board, circuit board via structure and the method for realizing circuit board via Download PDF

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Publication number
CN107666767A
CN107666767A CN201710742806.1A CN201710742806A CN107666767A CN 107666767 A CN107666767 A CN 107666767A CN 201710742806 A CN201710742806 A CN 201710742806A CN 107666767 A CN107666767 A CN 107666767A
Authority
CN
China
Prior art keywords
conductive layer
circuit board
layer
board via
via structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710742806.1A
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Chinese (zh)
Inventor
王林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhengzhou Yunhai Information Technology Co Ltd
Original Assignee
Zhengzhou Yunhai Information Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhengzhou Yunhai Information Technology Co Ltd filed Critical Zhengzhou Yunhai Information Technology Co Ltd
Priority to CN201710742806.1A priority Critical patent/CN107666767A/en
Publication of CN107666767A publication Critical patent/CN107666767A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The invention provides a kind of circuit board, circuit board via structure and the method for realizing circuit board via, wherein described circuit board is based on described circuit board via structure with the method for realizing circuit board via.Described circuit board via structure, for being used for the signals layer of transmission signal with one group and being layered on top of each other setting for the circuit board for the ground plane being grounded, each described signals layer and described ground plane with least one；Described via structure is included along the insulating medium layer being axially distributed of via, the first conductive layer of different signals layers on connection circuit plate and the second conductive layer for being connected with the ground plane on the circuit board；Described the first conductive layer, the second conductive layer are parallel two-by-two with insulating medium layer, and described insulating medium layer is filled between described the first conductive layer and the second conductive layer.The present invention is used to simplify operation, saves the design space of via on circuit board, and for solving the discontinuous problem of former through hole impedance.

Description

A kind of circuit board, circuit board via structure and the method for realizing circuit board via
Technical field
The present invention relates to PCB fields, specifically a kind of circuit board, circuit board via structure and the side for realizing circuit board via Method.
Background technology
Via（via）Also referred to as plated through-hole.In dual platen and multilayer circuit board, led to connect the printing between each layer Line, a common aperture, i.e. via are bored in the intersection for the wire that each layer needs to connect.
Generally, reflux layer GND planes discontinuous situation when being changed layer for high-speed differential signal line, it will usually believe in difference Number line changes increase differential signal line layer-exchange hole-through at floor, to ensure the continuity of system link return flow path.
But in the prior art, being changed in differential signal line at layer increases in differential signal line layer-exchange hole-through, has both operated numerous It is trivial, again take design space, also because each via is the impedance discontinuity point on link increase link parasitic capacitance and Inductance, and then influence signal quality.This is the deficiencies in the prior art part.
The content of the invention
The technical problems to be solved by the invention are, in view of the shortcomings of the prior art, there is provided a kind of circuit board, circuit board mistake Pore structure and the method for realizing circuit board via, for simplifying operation, saving design space, and for solving former through hole impedance not The problem of continuous.
In order to solve the above technical problems, the invention provides a kind of circuit board via structure, for being used to pass with one group The signals layer of defeated signal and the circuit board with least one ground plane for being used to be grounded, each described signals layer and described connect Stratum is layered on top of each other setting；
Described via structure is included along the insulating medium layer being axially distributed of via, the different letters on connection circuit plate The first conductive layer and the second conductive layer for being connected with the ground plane on the circuit board of number floor；Described first is led Electric layer, the second conductive layer are parallel two-by-two with insulating medium layer, described insulating medium layer be filled in the first described conductive layer and Between second conductive layer.
Wherein, the axis direction of first conductive layer and the second conductive layer along via is design current direction, described Coupling distance between one conductive layer and the second conductive layer is less than signal line width corresponding to first conductive layer.
Wherein, the first described conductive layer and the second conductive layer are formed by plating mode.
In addition, present invention also offers a kind of circuit board, with one group of signals layer for being used for transmission signal and with least One ground plane for being used to be grounded, each described signals layer and described ground plane are layered on top of each other setting；
Described circuit board is provided with circuit board via structure as described above, the first conductive layer of the circuit board via structure The signals layer of the circuit board via fabric connectivity is electrically connected with, the second conductive layer of the circuit board via structure with it is above-mentioned Corresponding ground plane is connected.
Wherein, the first conductive layer of the circuit board via structure and the second conductive layer are formed by plating mode.
In addition, present invention also offers a kind of method for realizing circuit board via, described circuit board via is upper described Circuit board via structure, this realizes that the method for circuit board via includes：
Drilled on the circuit board for need layer-exchange hole-through, form rectangular channel；
Conductive layer is set respectively on two relative madial walls of the position of above-mentioned rectangular channel, is designated as the first conductive layer and second respectively Conductive layer；Wherein, the different signals layers that the first described conductive layer is used on connection circuit plate, the second described conductive layer are used It is connected in the ground plane on the circuit board；
Dielectric is filled between above-mentioned first conductive layer and the second conductive layer, formation is located at above-mentioned first conductive layer and second Insulating medium layer between conductive layer.
Wherein, the axis direction of first conductive layer and the second conductive layer along via is design current direction, described Coupling distance between one conductive layer and the second conductive layer is less than signal line width corresponding to first conductive layer.
Wherein, the first described conductive layer and the second conductive layer are formed by plating mode.
Wherein, by a diameter of D+1mil drill bit, drilled, formed described on the PCB for need layer-exchange hole-through Rectangular channel.
Compared with prior art, the advantage of the invention is that：
The present invention can realize that differential signal changes layer and backflow by a via, on the one hand reduce the design space of via, Second, because the first conductive layer, the second conductive layer are parallel to each other, the discontinuous problem of former through hole impedance is eliminated, and it is succinct efficient Easily realize, while add system design reliability.
As can be seen here, compared with prior art, with prominent substantive distinguishing features and significantly progressive, its implementation has the present invention Beneficial effect is also obvious.
Brief description of the drawings
Fig. 1 is the top view illustration of circuit board via structure of the present invention；
Fig. 2 is the sectional view schematic diagram of circuit board via structure of the present invention.
Wherein：1st, circuit board, 2, circuit board via structure, the 2.1, first conductive layer, 2.2, insulating medium layer, 2.3, second Conductive layer, 3, signals layer, 4, ground plane.
Embodiment
To make technical scheme and advantage clearer, below in conjunction with accompanying drawing, to technical scheme It is clearly and completely described.
As shown in Figure 1, 2, a kind of circuit board via structure of the invention, for being used for the signal of transmission signal with one group Layer 3 and the circuit board 1 with least one ground plane 4 for being used to be grounded, each described signals layer 3 and the described phase of ground plane 4 Mutually it is stacked.Described via structure is included along the insulating medium layer 2.2 being axially distributed of via, for connection circuit plate 1 On different signals layers 3 the first conductive layer 2.1 and second for being connected with the ground plane 4 on the circuit board 1 lead Electric layer 2.3.Described the first conductive layer 2.1, the second conductive layer 2.3 are parallel two-by-two with insulating medium layer 2.2, and described insulation is situated between Matter layer 2.2 is filled between described the first conductive layer 2.1 and the second conductive layer 2.3.
The present invention changes layer and backflow by what a via just realized differential signal, succinct efficiently easily to realize, on the one hand The quantity of via on circuit board 1 is reduced, reduces the design space of via, on the other hand because the first conductive layer 2.1, second Conductive layer 2.3 is parallel to each other, and eliminates the discontinuous problem of former through hole impedance, adds system design reliability.
Wherein, in the present embodiment, the first described conductive layer 2.1, the conductive layer 2.3 of insulating medium layer 2.2 and second One is formed using the hole depth of via as high cuboid, the length L of the first conductive layer 2.1 is signal line width.Wherein, in this reality Apply in mode, axis direction of the conductive layer 2.3 of the first conductive layer 2.1 and second along via is design current direction, described Coupling distance between first conductive layer 2.1 and the second conductive layer 2.3 is less than signal line width corresponding to first conductive layer 2.1 Degree.
In the present embodiment, the first described conductive layer 2.1 and the second conductive layer 2.3 are formed by plating mode, It is easily achieved.
In addition, present invention also offers a kind of circuit board, with one group of signals layer 3 for being used for transmission signal and with extremely Few one ground plane 4 for being used to be grounded, each described signals layer 3 and described ground plane 4 are layered on top of each other setting.On the circuit board Provided with circuit board via structure 2 as described above.In the circuit board, the first conductive layer 2.1 of the circuit board via structure 2 The signals layer 3 that the circuit board via structure 2 connects is electrically connected with, the second conductive layer 2.3 of the circuit board via structure 2 It is connected to above-mentioned corresponding ground plane 4.
In view of this circuit board employs circuit board via structure 2 as described above, it has circuit board via as described above The all advantages of structure 2, to simplify the structure of specification, it will not be repeated here.
In addition, in view of this circuit board employs circuit board via structure 2 as described above, those skilled in the art are based on upper State circuit board via structure 2 accompanying drawing and this specification in corresponding literature record, it is easy to this circuit board can be realized, This is repeated no more.
In addition, present invention also offers a kind of method for realizing circuit board via, described circuit board via is as above institute The circuit board via structure 2 stated, this realizes that the method for circuit board via includes：Bored on the circuit board for need layer-exchange hole-through Hole, forms rectangular channel, and groove depth is the thickness of circuit board；Set and lead respectively on two relative madial walls of the position of above-mentioned rectangular channel Electric layer, the first conductive layer 2.1 and the second conductive layer 2.3 are designated as respectively；Wherein, the first described conductive layer 2.1 is used to connect electricity Different signals layers 3 on the plate of road, the second described conductive layer 2.3 are used to be connected with the ground plane 4 on the circuit board；Upper State and dielectric is filled between the first conductive layer 2.1 and the second conductive layer 2.3, formed positioned at above-mentioned first conductive layer 2.1 and the Insulating medium layer 2.2 between two conductive layers 2.3.It can be seen that the circuit board mistake by the method realization for realizing circuit board via Hole, there is circuit board via structure 2 as described above, therefore the circuit board via realized by this method has circuit as described above The all advantages of plated-through-hole structure 2, to simplify the structure of specification, it will not be repeated here.
In the present embodiment, the groove width of the rectangular channel is between the conductive layer 2.3 of the first conductive layer 2.1 and second Coupling distance D, described flute length L be signal line width corresponding to first conductive layer 2.1, first conductive layer 2.1 It is design current direction with axis direction of second conductive layer 2.3 along via, the conductive layer of the first conductive layer 2.1 and second Coupling distance between 2.3 is less than signal line width corresponding to first conductive layer 2.1.
In the present embodiment, described insulating medium layer 2.2 uses insulating resin, the described He of the first conductive layer 2.1 Second conductive layer 2.3 is formed by plating mode, it is easy to accomplish.In the present embodiment, a diameter of D+1mil brill is passed through Head, drilled on the pcb board for need layer-exchange hole-through, form described rectangular channel.It can be seen that this realizes the side of circuit board via Method is easily achieved, more practical.
To sum up, the present invention designs the stratum of signal backflow while completing signal and changing layer, adds differential signal and changes The continuity of signal reflux layer after layer, so as to add system signal integrality；And the present invention is only just realized by a via The quantity changed layer and backflow, on the one hand reduce via on circuit board of differential signal, is avoided because of the quantity using via Design space wastes caused by excessive, on the other hand because the first conductive layer 2.1, the second conductive layer 2.3 are parallel to each other, removes Former through hole impedance discontinuous problem, adds system design reliability.And simple easily realization.
Embodiment of above is merely illustrative of the technical solution of the present invention, rather than its limitations；Although with reference to foregoing implementation The present invention is described in detail mode, it will be understood by those within the art that：It still can be to foregoing each Technical scheme described in embodiment is modified, or carries out equivalent substitution to which part technical characteristic；And these are repaiied Change or replace, the essence of appropriate technical solution is departed from the scope of each embodiment technical scheme of the present invention.

Claims (9)

  1. A kind of 1. circuit board via structure, for being used for the signals layer of transmission signal with one group（3）With with least one use In the ground plane of ground connection（4）Circuit board（1）, each described signals layer（3）With described ground plane（4）It is layered on top of each other setting； It is characterized in that：
    Described via structure includes the insulating medium layer being axially distributed along via（2.2）, for connection circuit plate（1）On Different signals layers（3）The first conductive layer（2.1）And for the circuit board（1）On ground plane（4）Connected Two conductive layers（2.3）；The first described conductive layer（2.1）, the second conductive layer（2.3）And insulating medium layer（2.2）It is parallel two-by-two, Described insulating medium layer（2.2）It is filled in the first described conductive layer（2.1）With the second conductive layer（2.3）Between.
  2. 2. circuit board via structure according to claim 1, it is characterised in that：First conductive layer（2.1）With second Conductive layer（2.3）Axis direction along via is design current direction, first conductive layer（2.1）With the second conductive layer （2.3）Between coupling distance be less than first conductive layer（2.1）Corresponding signal line width.
  3. 3. circuit board via structure according to claim 1 or 2, it is characterised in that：The first described conductive layer（2.1）With Second conductive layer（2.3）Formed by plating mode.
  4. 4. a kind of circuit board, there is one group of signals layer for being used for transmission signal（3）And with least one ground connection for being used to be grounded Layer（4）, each described signals layer（3）With described ground plane（4）It is layered on top of each other setting；It is characterized in that：
    Described circuit board（1）It is provided with circuit board via structure as claimed in claim 1 or 2（2）, the circuit board via Structure（2）The first conductive layer（2.1）By the circuit board via structure（2）The signals layer of connection（3）It is electrically connected with, the electricity Road plated-through-hole structure（2）The second conductive layer（2.3）To above-mentioned corresponding ground plane（4）It is connected.
  5. 5. circuit board according to claim 4, it is characterised in that：The circuit board via structure（2）The first conductive layer （2.1）With the second conductive layer（2.3）Formed by plating mode.
  6. A kind of 6. method for realizing circuit board via, it is characterised in that described circuit board via is as claimed in claim 1 Circuit board via structure（2）, this realizes that the method for circuit board via includes：
    Needing the circuit board of layer-exchange hole-through（1）On drilled, formed rectangular channel；
    Conductive layer is set respectively on two relative madial walls of the position of above-mentioned rectangular channel, is designated as the first conductive layer respectively（2.1） With the second conductive layer（2.3）；Wherein, the first described conductive layer（2.1）For connection circuit plate（1）On different signals layers （3）, described the second conductive layer（2.3）For with the circuit board（1）On ground plane（4）It is connected；
    In above-mentioned first conductive layer（2.1）With the second conductive layer（2.3）Between fill dielectric, formation is led positioned at above-mentioned first Electric layer（2.1）With the second conductive layer（2.3）Between insulating medium layer（2.2）.
  7. 7. the method according to claim 6 for realizing circuit board via, it is characterised in that：First conductive layer（2.1） With the second conductive layer（2.3）Axis direction along via is design current direction, first conductive layer（2.1）It is conductive with second Layer（2.3）Between coupling distance be less than first conductive layer（2.1）Corresponding signal line width.
  8. 8. the method for realizing circuit board via according to claim 6 or 7, it is characterised in that：
    The first described conductive layer（2.1）With the second conductive layer（2.3）Formed by plating mode.
  9. 9. the method for realizing circuit board via according to claim 6 or 7, it is characterised in that：
    By a diameter of D+1mil drill bit, drilled on the PCB for need layer-exchange hole-through, form described rectangular channel.
CN201710742806.1A 2017-08-25 2017-08-25 A kind of circuit board, circuit board via structure and the method for realizing circuit board via Pending CN107666767A (en)

Priority Applications (1)

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CN201710742806.1A CN107666767A (en) 2017-08-25 2017-08-25 A kind of circuit board, circuit board via structure and the method for realizing circuit board via

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Application Number Priority Date Filing Date Title
CN201710742806.1A CN107666767A (en) 2017-08-25 2017-08-25 A kind of circuit board, circuit board via structure and the method for realizing circuit board via

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113163575A (en) * 2021-05-10 2021-07-23 西安频谱电子信息科技有限责任公司 Multilayer board microwave power circuit

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040251047A1 (en) * 2003-06-12 2004-12-16 International Business Machines Corporation Via structure for increased wiring on printed wiring boards
US6891272B1 (en) * 2002-07-31 2005-05-10 Silicon Pipe, Inc. Multi-path via interconnection structures and methods for manufacturing the same
US20070151753A1 (en) * 2005-12-29 2007-07-05 Thor Soo F Printed circuit board having plated through hole with multiple connections and method of fabricating same
TWI298993B (en) * 2004-06-17 2008-07-11 Advanced Semiconductor Eng A printed circuit board and its fabrication method
CN102724807A (en) * 2012-06-08 2012-10-10 加弘科技咨询(上海)有限公司 Printed circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6891272B1 (en) * 2002-07-31 2005-05-10 Silicon Pipe, Inc. Multi-path via interconnection structures and methods for manufacturing the same
US20040251047A1 (en) * 2003-06-12 2004-12-16 International Business Machines Corporation Via structure for increased wiring on printed wiring boards
TWI298993B (en) * 2004-06-17 2008-07-11 Advanced Semiconductor Eng A printed circuit board and its fabrication method
US20070151753A1 (en) * 2005-12-29 2007-07-05 Thor Soo F Printed circuit board having plated through hole with multiple connections and method of fabricating same
CN102724807A (en) * 2012-06-08 2012-10-10 加弘科技咨询(上海)有限公司 Printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113163575A (en) * 2021-05-10 2021-07-23 西安频谱电子信息科技有限责任公司 Multilayer board microwave power circuit
CN113163575B (en) * 2021-05-10 2023-09-26 西安频谱电子信息科技有限责任公司 Multilayer board microwave power circuit

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Application publication date: 20180206

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