CN102523682A - Circuit board assembly and electronic apparatus - Google Patents
Circuit board assembly and electronic apparatus Download PDFInfo
- Publication number
- CN102523682A CN102523682A CN2011104090253A CN201110409025A CN102523682A CN 102523682 A CN102523682 A CN 102523682A CN 2011104090253 A CN2011104090253 A CN 2011104090253A CN 201110409025 A CN201110409025 A CN 201110409025A CN 102523682 A CN102523682 A CN 102523682A
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- circuit board
- connecting hole
- electrically connected
- component
- component pads
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Abstract
The embodiment discloses a circuit board assembly which comprises a circuit board and an element pad arranged at a first surface of the circuit board. The element pad is used for welding an electronic component. The first surface is opened with a connection hole. The connection hole is used for electrically connecting the first surface with another surface of the circuit board, or is used for electrically connecting the first surface with an internal part of the circuit board. A hole wall of the connection hole is covered with a conductor layer. The element pad is in contact with a conductor layer of a port of the connection hole, and the element pad is electrically contacted with the conductor layer. The invention also discloses an electronic apparatus, through employing a technical scheme of the present invention, high density PCB layout can be realized, further, by employing the electronic apparatus of the technical scheme, decoupling or filtering performance of the electronic apparatus to a signal can be enhanced, and signal quality is raised.
Description
Technical field
The present invention relates to electronic technology field, relate in particular to a kind of circuit board assemblies and electronic installation.
Background technology
Along with electronic equipment to high speed, microminiaturization, lightening, system integration and the develop rapidly of powerfulization direction; Distance is dwindled thereupon between the electronic component; The signal transmitting speed then improves relatively; (Printed Circuit Board PCB) develops to high-speed and high-density PCB to promote printed circuit board (PCB).
And existing PCB design is like Fig. 1 and shown in Figure 2, when the electronic component 6 of two pins is welded on PCB1 when going up, and the component pads 2 of welding with a pin of electronic component 6; Usually need through cabling 3, go up the porose disc 5 that a connecting hole 4 that is provided with is positioned at this PCB1 top layer with PCB1 and be connected, and; 2 of component pads are electrically connected with a connecting hole 4; At present, adopt the PCB of this design, be difficult to satisfy the requirement of circuit board high density layouts.
Summary of the invention
The main purpose of the embodiment of the invention is, the electronic building brick and the electronic installation that provide a kind of PCB of satisfying high density layouts to require.
To achieve these goals, the technical scheme of embodiment of the invention employing is following:
A kind of circuit board assemblies comprises: circuit board, and be arranged at the component pads of the first surface of said circuit board, said component pads is used for soldering of electronic components;
Said first surface offers connecting hole; Said connecting hole is used to be electrically connected another surface of said first surface and said circuit board; It is inner perhaps to be used to be electrically connected said first surface and circuit board; The hole wall of said connecting hole is coated with conductor layer, and said component pads contacts with the conductor layer of said connecting hole port, and is electrically connected.
A kind of electronic installation comprises: circuit board, and be arranged at the component pads and the electronic component of the first surface of said circuit board, said electronic component is welded on the said component pads;
Said first surface offers connecting hole; Said connecting hole is used to be electrically connected another surface of said first surface and said circuit board; It is inner perhaps to be used to be electrically connected said first surface and circuit board; The hole wall of said connecting hole is coated with conductor layer, and said component pads contacts with the conductor layer of said connecting hole port, and is electrically connected.
Adopt technical scheme of the present invention, can realize highdensity PCB layout, further, adopt the electronic installation of technical scheme of the present invention, can also the electronic installation enhancing to the decoupling or filtering performance of signal, thereby improved signal quality.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work property, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 be among the existing P CB electronic component through the be electrically connected sketch map of a pair of component pads with two connecting holes;
The design diagram that Fig. 2 is electrically connected with the conductor layer of connecting hole port for the surperficial a pair of component pads of existing PCB;
Be positioned at the sketch map of conductor layer integrated design of component pads and the connecting hole port of circuit board first surface in a kind of circuit board assemblies that Fig. 3 provides for the embodiment of the invention one;
Sectional view after AA ' blocks in Fig. 3 in a kind of circuit board assemblies that Fig. 4 provides for the embodiment of the invention one;
Sectional view after BB ' blocks in Fig. 3 in a kind of circuit board assemblies that Fig. 5 provides for the embodiment of the invention one;
Connecting hole in a kind of circuit board assemblies that Fig. 6 provides for the embodiment of the invention one adopts the sketch map of jack designs;
AA ' the schematic cross-section of a kind of electronic installation that Fig. 7 provides for the embodiment of the invention two;
BB ' the schematic cross-section of a kind of electronic installation that Fig. 8 provides for the embodiment of the invention two;
A kind of electronic installation that Fig. 9 provides for the embodiment of the invention two is positioned at a sketch map that component pads is electrically connected with the conductor layer of two connecting hole ports at least of circuit board first surface;
In Fig. 9, flow to sketch map on AA ' cross section when signal transmits through the galvanic circle in a kind of electronic installation that Figure 10 provides for the embodiment of the invention two;
Flow to sketch map on BB ' cross section in transit 9 when signal transmits through the galvanic circle in a kind of electronic installation that Figure 11 provides for the embodiment of the invention two.
Embodiment
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
Embodiment one
To shown in Figure 5, the embodiment of the invention one provides a kind of circuit board assemblies, comprising like Fig. 3: circuit board 21, and be arranged at the component pads 22 of the first surface of said circuit board 21, said component pads 22 is used for soldering of electronic components;
Said first surface offers connecting hole 23; Said connecting hole 23 is used to be electrically connected another surface of said first surface and said circuit board 21; Perhaps be used to be electrically connected said first surface and said circuit board 21 inside; The hole wall of said connecting hole 23 is coated with conductor layer, and said component pads 22 contacts with the conductor layer of said connecting hole 23 ports, and is electrically connected.
In the circuit board assemblies of present embodiment, contact and be electrically connected with the conductor layer of connecting hole port through making the component pads that is positioned at the circuit board first surface, promptly the conductor layer to component pads and connecting hole port carries out integrated design; Compare in the prior art; Component pads need be through covering the conductor layer that the copper cabling is electrically connected the connecting hole port, shortened the distance between the conductor layer of component pads and connecting hole port, and then saved arrangement space; Particularly; In the circuit board assemblies of present embodiment, because the integrated design of the conductor layer of component pads and connecting hole port makes that the spacing distance between the adjacent connecting hole is able to dwindle; Furthered distance (referring to Fig. 2 and Fig. 3) between the adjacent connecting hole helps realizing highdensity PCB layout.
Further, in the present embodiment, as shown in Figure 6; Be plugged with consent material 24 in the said connecting hole 23; Said connecting hole 23 adopts jack designs, can avoid tin sweat(ing) or other corrosive impurities etc. to get in the said connecting holes 23, and tin cream can not run off through said connecting hole 23 when guaranteeing welding.
Further, for uniformity and the full weight that guarantees consent, and satisfy environmental requirement, said consent material 24 can be unleaded resin material.
Embodiment two
Circuit board assemblies based on embodiment one; Extremely shown in Figure 8 like Fig. 7; The embodiment of the invention two provides a kind of electronic installation; Said electronic installation comprises: circuit board 21, and be arranged at the component pads 22 and electronic component 25 of the first surface of said circuit board 21, said electronic component 25 is welded on the said component pads 22;
Said first surface offers connecting hole 23; Said connecting hole 23 is used to be electrically connected another surface of said first surface and said circuit board 21; Perhaps be used to be electrically connected said first surface and said circuit board 21 inside; The hole wall of said connecting hole 23 is coated with conductor layer, and said component pads 22 directly contacts with the conductor that said connecting hole 23 is positioned at said first surface, and is electrically connected.
In the electronic installation of present embodiment,, the conductor layer of connecting hole port and the distance of component pads have been shortened through the conductor layer of connecting hole port and the integrated design between the component pads; Thereby saved arrangement space; Help realizing highdensity PCB layout, it will be appreciated by those skilled in the art that present embodiment can be applied to ball grid array structure (Ball Grid Array; BGA) in the circuit board; The BGA zone of an other side corresponding with bga chip place side, to realize highly dense layout, the non-BGA zone that can also be applied in other circuit board is to realize high density layouts.
Need to prove that said electronic component 25 can be electric capacity, or resistance, or element such as inductance.
In the present embodiment; As shown in Figure 9; Said component pads 22 can also contact and be electrically connected the conductor layer of plural at least said connecting hole 23 ports, so that respectively through the signal of plural at least said connecting hole 23 transmission, can be transferred in the said electronic component 25 that welds with said component pads 22; And utilize the signal of 25 pairs of plural at least said connecting hole 23 transmission of said electronic component to handle; Compare the signal demand of a connecting hole transmission in the prior art and handled by an electronic component, present embodiment can reduce number of electronic components, further improves the layout density of PCB; Persons skilled in the art should be known; Said component pads 22 shown in Figure 9 is connected an object lesson that is merely present embodiment with the conductor layer of two said connecting hole 23 ports, is not used in the restriction present embodiment, and said component pads 22 can also be carried out integrated design with the conductor layer of plural said connecting hole 23 ports.
In the present embodiment, further, when said electronic component 25 is electric capacity; Two pins of said electric capacity weld with two said component pads 22 respectively; One of them component pads is electrically connected with at least two said connecting holes 23, and another component pads is electrically connected with at least one said connecting hole 23, so that the said connecting hole 23 formation galvanic circles that said electric capacity and two said component pads 22 are electrically connected respectively; Said electric capacity can be used for the signal of the said galvanic circle of flowing through is decoupled or filtering; When the electronic product transmission voltage of high-frequency high-speed or current signal, owing to can produce interference in the place of voltage or current signal sudden change, in order to improve signal quality; Elements such as needs employing electric capacity suppress this sudden change; And in practical application, actual capacitance is complicated more than ideal capacitance, considers the influence of stray inductance and resistance; Actual capacitance generally can be reduced to the equivalent model that is made up of equivalent series inductance (ESL), equivalent series resistance (ESR) and electric capacity (C) series connection, and its equiva lent impedance is:
Further, be plugged with the consent material in the said connecting hole 23, adopt jack designs, can avoid tin sweat(ing) or other corrosive impurities etc. to get in the said connecting holes, and tin cream can be through said connecting hole run off (referring to Fig. 6) when guaranteeing welding.
Further, for the uniformity and the full weight that guarantee consent and satisfy environmental requirement, said consent material can be unleaded resin material.
In the present embodiment; Said component pads is electrically connected the conductor that at least two said connecting holes are positioned at said first surface; So that, can be transferred in the electronic component that welds with said component pads, and utilize this electronic component that the signal of plural at least said connecting hole transmission is handled respectively through the signal of plural at least said connecting hole transmission; Thereby can reduce number of electronic components, further improve the PCB layout density.
It is understandable that the correlated characteristic reference each other among the foregoing description one and the embodiment two.
Be to be understood that; Specific embodiment described herein is merely general embodiment of the present invention, and is in order to restriction the present invention, not all within spirit of the present invention and principle; Any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. a circuit board assemblies is characterized in that, comprising: circuit board, and be arranged at the component pads of the first surface of said circuit board, said component pads is used for soldering of electronic components;
Said first surface offers connecting hole; Said connecting hole is used to be electrically connected another surface of said first surface and said circuit board; It is inner perhaps to be used to be electrically connected said first surface and circuit board; The hole wall of said connecting hole is coated with conductor layer, and said component pads contacts with the conductor layer of said connecting hole port, and is electrically connected.
2. circuit board assemblies as claimed in claim 1 is characterized in that, is plugged with the consent material in the said connecting hole.
3. circuit board assemblies as claimed in claim 2 is characterized in that, said consent material is unleaded resin material.
4. an electronic installation is characterized in that, comprising: circuit board, and be arranged at the component pads and the electronic component of the first surface of said circuit board, said electronic component is welded on the said component pads;
Said first surface offers connecting hole; Said connecting hole is used to be electrically connected another surface of said first surface and said circuit board; It is inner perhaps to be used to be electrically connected said first surface and circuit board; The hole wall of said connecting hole is coated with conductor layer, and said component pads contacts with the conductor layer of said connecting hole port, and is electrically connected.
5. electronic installation as claimed in claim 4 is characterized in that, said electronic component is an electric capacity, or resistance, or inductance.
6. electronic installation as claimed in claim 4 is characterized in that, the conductor layer of said component pads contact and the plural at least said connecting hole port of electrical connection.
7. electronic installation as claimed in claim 4; It is characterized in that; Said electronic component is an electric capacity; Two pins of said electric capacity weld with two said component pads respectively, and one of them component pads is electrically connected with at least two said connecting holes, and another component pads is electrically connected with at least one said connecting hole; So that said electric capacity constitutes the galvanic circle with the said connecting hole that two said component pads are electrically connected respectively, said electric capacity is used for the signal of the said galvanic circle of flowing through is decoupled or filtering.
8. like the arbitrary described electronic installation of claim 4 to 7, it is characterized in that, be plugged with the consent material in the said connecting hole.
9. electronic installation as claimed in claim 8 is characterized in that, said consent material is unleaded resin material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104090253A CN102523682A (en) | 2011-12-09 | 2011-12-09 | Circuit board assembly and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104090253A CN102523682A (en) | 2011-12-09 | 2011-12-09 | Circuit board assembly and electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102523682A true CN102523682A (en) | 2012-06-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104090253A Pending CN102523682A (en) | 2011-12-09 | 2011-12-09 | Circuit board assembly and electronic apparatus |
Country Status (1)
| Country | Link |
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| CN (1) | CN102523682A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103491720A (en) * | 2013-09-16 | 2014-01-01 | 华为技术有限公司 | Method for manufacturing printed circuit board and printed circuit board |
| CN110062526A (en) * | 2019-04-24 | 2019-07-26 | 南京工程学院 | A kind of PCB circuit board of the patch electronics element based on safety |
| CN113853055A (en) * | 2020-06-25 | 2021-12-28 | 华为数字能源技术有限公司 | Circuit board and energy transmission equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1993015A (en) * | 2005-12-27 | 2007-07-04 | 鸿富锦精密工业（深圳）有限公司 | Wiring architecture of printed circuit board |
| CN101471182A (en) * | 2007-11-29 | 2009-07-01 | Tdk株式会社 | Feedthrough capacitor mounted structure |
| CN101917187A (en) * | 2010-07-16 | 2010-12-15 | 中国兵器工业第二○六研究所 | Stepped frequency signal generation method based on frequency selective output of initialize switch of phase-locked loop |
| CN101917817A (en) * | 2009-09-25 | 2010-12-15 | 昆山市华升电路板有限公司 | Solder pad conduction structure of circuit board |
-
2011
- 2011-12-09 CN CN2011104090253A patent/CN102523682A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1993015A (en) * | 2005-12-27 | 2007-07-04 | 鸿富锦精密工业（深圳）有限公司 | Wiring architecture of printed circuit board |
| CN101471182A (en) * | 2007-11-29 | 2009-07-01 | Tdk株式会社 | Feedthrough capacitor mounted structure |
| CN101917817A (en) * | 2009-09-25 | 2010-12-15 | 昆山市华升电路板有限公司 | Solder pad conduction structure of circuit board |
| CN101917187A (en) * | 2010-07-16 | 2010-12-15 | 中国兵器工业第二○六研究所 | Stepped frequency signal generation method based on frequency selective output of initialize switch of phase-locked loop |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103491720A (en) * | 2013-09-16 | 2014-01-01 | 华为技术有限公司 | Method for manufacturing printed circuit board and printed circuit board |
| CN103491720B (en) * | 2013-09-16 | 2017-06-20 | 华为技术有限公司 | The preparation method and printed circuit board (PCB) of a kind of printed circuit board (PCB) |
| CN110062526A (en) * | 2019-04-24 | 2019-07-26 | 南京工程学院 | A kind of PCB circuit board of the patch electronics element based on safety |
| CN110062526B (en) * | 2019-04-24 | 2021-10-15 | 南京工程学院 | PCB circuit board based on safe paster electronic component |
| CN113853055A (en) * | 2020-06-25 | 2021-12-28 | 华为数字能源技术有限公司 | Circuit board and energy transmission equipment |
| CN113853055B (en) * | 2020-06-25 | 2023-10-13 | 华为数字能源技术有限公司 | Circuit board and energy transmission equipment |
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Application publication date: 20120627 |