CN107650009A - A kind of novel wafer polisher lapper - Google Patents

Abstract

A kind of novel wafer polisher lapper, including support and rotating disk, described support include guidance panel and operating desk；The rotating disk pedestal for placing rotary disk is provided with described operating desk；Described rotating disk pedestal axle center is provided with axle sleeve；Described rotating disk is formed by stacking up and down by the roundel and big disk of concentric setting, great circle tray bottom axle center is provided with the rotating shaft being rotatably connected with axle sleeve, running through at roundel axle center has the mozzle led to for rough lapping liquid stream, and mozzle upper port is not less than roundel top planes；The a plurality of rotating disk intake chute run through from mozzle to roundel outer is distributed with the bottom of described roundel；The sample tray being matched therewith can be placed on described rotating disk；Described sample tray includes inner disc and external disk, and wherein inner disc bottom surface contacts with roundel top surface, and external disk bottom surface contacts with big disk top surface；The present invention can synchronously realize the polishing of chip difference grinding and polishing degree, time saving and energy saving.

Description

A kind of novel wafer polisher lapper

Technical field

The invention belongs to grinding and polishing device technical field, and in particular to a kind of novel wafer polisher lapper.

Background technology

Wafer material is usually required before opto-electronic device is prepared into by processes such as cutting, grinding, polishing and plated films It is processed into the shape of needs and reaches the required surface optical uniformity of application.Wherein, the effect of grinding is thickness to be eliminated Purpose with the deviation of flatness, and polishing is then to reach required surface smoothness.

In order that chip reaches the optical homogeneity of application requirement, need to typically multiple grinding and polishing operation be carried out to chip. , it is necessary to configure varigrained grounds travel according to chip smoothness requirements during wafer grinding polishes.Existing routine is done Method is by using varigrained grounds travel（Such as white fused alumina micro mist）The lapping liquid of configuration, realize that the different degrees of grinding of chip is thrown Light.When realizing the different degrees of grinding and polishing of chip using existing apparatus, chip need to be carried out to repeat grinding and polishing operation in batches, Time and effort consuming.

In summary, it is to be highly desirable to design a kind of polishing machine that can synchronously realize chip difference grinding and polishing degree 's.

The content of the invention

The invention provides a kind of novel wafer polisher lapper, can synchronously realize the different degrees of grinding and polishing of chip, It is time saving and energy saving.

To achieve these goals, the technical solution adopted by the present invention is：

A kind of wafer grinding polishing machine, including support and rotating disk, described support include guidance panel and operating desk；Described behaviour Make to be provided with the rotating disk pedestal for placing rotary disk on platform；The side of described rotating disk pedestal is provided with waste liquid tap hole, rotating disk Base perimeter is provided with only liquid platform, for preventing lapping liquid from outflowing；Described rotating disk pedestal axle center is provided with axle sleeve；Described turns Disk is formed by stacking up and down by the roundel and big disk of concentric setting, and great circle tray bottom axle center is provided with to be rotatably connected with axle sleeve Rotating shaft, rotating disk is rotated under the driving of external motor, at roundel axle center through have for rough lapping liquid stream lead to water conservancy diversion Pipe, and mozzle upper port is not less than roundel top planes, ensures that the fine lapping liquid at the top of roundel may not flow into mozzle； The a plurality of rotating disk intake chute run through from mozzle to roundel outer is distributed with the bottom of described roundel, for by rough lapping Liquid is guided at the top of big disk；The sample tray being matched therewith can be placed on described rotating disk；Described sample tray includes inner disc And external disk, wherein inner disc bottom surface contact with roundel top surface, external disk bottom surface contacts with big disk top surface；Described inner disc axle center is passed through The 2# feed tubes led to for fine lapping liquid stream are installed with, the 1# feed liquors led to for rough lapping liquid stream are coaxially nested with inside 2# feed tubes Pipe, and 1# feed liquors infratubal port is not less than mozzle upper port, 1# feed liquor infratubal ports diameter is less than mozzle upper port diameter, 1# feed tubes can be made to be nested in mozzle, ensure that rough lapping liquid may not flow into the roundel top planes of rotating disk, 1# feed tubes It is connected with 2# feed tubes by contiguous block；Described 1# feed tubes and 2# feed tubes upper port are not less than the top horizontal of sample tray Face, and 1# feed tubes upper port is not less than 2# feed tube upper ports, ensures to be fade-in when injecting rough lapping liquid to 1# feed tubes 2# feed tubes, 1# feed tubes and 2# feed tubes upper port outer, are easy to lapping liquid smoothly to inject feed tube；Described inner disc edge Its axle center circular array is provided through multiple 1# load samples holes for being used to assign viscous sample dish；Adjacent two 1# in described inner disc bottom 1# eddy flow grooves are connected between load sample hole；Described inner disc bottom is provided with along the tangential 1# intake chutes in 1# load samples hole；Described Inner disc bottom is provided with connection 1# load samples hole and the 1# circulation grooves of 2# feed tubes；Described external disk is passed through along its axle center circular array Wear and be equipped with multiple 2# load samples holes for being used to assign viscous sample dish；Described outer tray bottom is connected with 2# between adjacent two 2# load samples hole Eddy flow groove；Described outer tray bottom is provided with along the tangential 2# intake chutes in 2# load samples hole；Described outer tray bottom is provided with connection 2# load samples hole and the 2# circulation grooves of external disk interior edge；Support shank is provided with the alien invasion of described sample tray；Described support shank On be provided with fixing hole；The side of described operating desk is provided with support bar；Fix bar is slidably connected on described support bar, Fix bar end set has the fixed pin being engaged with fixing hole, and fixed pin is inserted in fixing hole and can be used for keeping sample tray to consolidate It is fixed；The liquid pipe for injecting rough lapping liquid and fine lapping liquid to 1# feed tubes and 2# feed tubes respectively is provided with described operating desk.

Described viscous sample dish are prior art, and the base plane of viscous sample dish is used to be bonded crystalline substance to be ground or polished Piece, viscous sample dish can assign in 1# load samples hole and 2# load samples hole respectively as needed, glue sample dish and 1# load samples hole and 2# load samples hole Between can form the minimum gap of tolerance and coordinate, viscous sample dish can rotate wherein, again can lower slider vertically.

Described waste liquid tap hole is circumscribed with for discharging the grinding either sewer pipe of chip or waste liquid caused by polishing, The sewer pipe is prior art；

Two described liquid pipes are circumscribed with for providing thick, fine lapping liquid feed pathway respectively, and the feed pathway is existing skill Art；

Described guidance panel is prior art, and switch, rotational speed regulation button and milling time are provided with guidance panel Button, scram button.

Preparation before wafer grinding：

（1）Rotating disk is placed on rotating disk pedestal, and rotating shaft is nested in axle sleeve, sample tray is positioned on rotating disk, and enters 1# Liquid pipe lower port is nested in mozzle upper port, and fixed pin is inserted in fixing hole, ensures that sample tray is fixed, makes turntable rotation When, rotating disk produces relative motion to sample tray, so as to effectively be ground to the chip for gluing sample dish bottom bonding.

（2）Pass through varigrained grounds travel（Such as white fused alumina micro mist）Lapping liquid is configured, is rough lapping liquid in the present invention With fine lapping liquid.

（3）This polisher lapper can be once ground simultaneously to the chip of two kinds of different grinding demands, as chip A and Chip B（Chip A roughness is more than chip B）, chip A and chip B are bonded in respectively using rosin or other bonding agents Viscous sample dish bottom, viscous sample dish bottom same in the present invention can be bonded multi-disc consistency of thickness, chip similar in roughness.

The viscous sample dish for gluing chip A are assigned in the 2# load samples hole of external disk, the viscous sample dish for gluing chip B are assigned into In the 1# load samples hole of disk, switch is opened, sets rotating speed and milling time, rough lapping liquid and fine lapping liquid are distinguished by liquid pipe 1# feed tubes and 2# feed tubes, the rotation of external motor driving rotating disk are injected, rotating disk produces relative motion, turntable rotation to sample tray During, the fine lapping liquid injected in 2# feed tubes is released slowly into the roundel top platform of rotating disk by 1# circulation grooves, and It is evenly dispersed to by the 1# eddy flow grooves between 1# load samples hole at each 1# load samples hole, passes through lapping liquid on chip B and rotating disk The purpose of grinding or polishing is realized in friction, and chip or waste liquid can pass through under the influence of centrifugal force caused by grinding or polishing 1# intake chutes discharge, the waste liquid can along sample tray external disk inwall flow into rotating disk big disk top platform, the waste liquid or with The external disk for sample tray continues to grind or throws away sample tray by 2# intake chutes；It is brilliant while being ground to chip B Piece A is also being ground, and the rough lapping liquid injected in 1# feed tubes is uniform by mozzle, rotating disk intake chute and 2# circulation grooves Be distributed at each 2# load samples hole, realize the purpose of grinding or polishing by the friction of lapping liquid on chip A and rotating disk, grinding or Chip caused by polishing or waste liquid can throw away sample tray, final chip or useless by 2# intake chutes under the influence of centrifugal force Liquid is concentrated in only liquid platform and excluded by waste liquid tap hole.

Advantages of the present invention：

The invention provides a kind of novel wafer polisher lapper, can synchronously realize the polishing of chip difference grinding and polishing degree, Time saving and energy saving, its specific advantage is as follows：

（1）Thick, fine lapping liquid can be accomplished source separation, can be realized that chip is different degrees of simultaneously by the present invention using double feed tubes Grinding and polishing, it is time saving and energy saving；

（2）The setting of 1# eddy flows groove and 2# eddy flow grooves so that lapping liquid can be uniformly distributed more rapidly, substantially increase grinding for chip Grind efficiency；

（3）Only the setting of liquid platform can prevent lapping liquid from outflowing, while be greatly improved the security of operating personnel, prevent sample tray Fly and human body is damaged；

（4）In fix bar insertion fixing hole, ensure the steadiness of sample tray, prevent ground

Sample tray flies out in journey, is further ensured that the safety of operating personnel.

Brief description of the drawings

Accompanying drawing 1 is the schematic perspective view of polisher lapper of the present invention；Accompanying drawing 2 does not place load to be of the present invention The schematic perspective view of the polisher lapper of sample dish；Accompanying drawing 3 is the schematic perspective view of sample tray of the present invention；Accompanying drawing 4 is this The top view of the described sample tray of invention；Accompanying drawing 5 is the upward view of sample tray of the present invention；Accompanying drawing 6 is of the present invention Sample tray schematic perspective view；Accompanying drawing 7 is the dimensional structure diagram of rotating disk of the present invention；Accompanying drawing 8 is institute of the present invention The top view for the rotating disk stated；Accompanying drawing 9 is the front view of rotating disk of the present invention；Accompanying drawing 10 is viscous sample dish of the present invention Structural representation；

Wherein, 1 is 2# intake chutes, and 2 be operating desk, and 3 be rotating disk pedestal, and 4 be support shank, and 5 be support bar, and 6 be fix bar, and 7 are Liquid pipe, 8 be 1# feed tubes, and 9 be 2# feed tubes, and 10 be 1# load samples hole, and 11 be 2# load samples hole, and 12 be sample tray, and 13 be waste liquor stream Portal, liquid platform untill 14,15 be support, and 16 be guidance panel, and 17 be fixing hole, and 18 be contiguous block, and 19 be inner disc, and 20 be outer Disk, 21 be 1# intake chutes, and 22 be 1# circulation grooves, and 23 be 2# eddy flow grooves, and 24 be 1# eddy flow grooves, and 25 be axle sleeve, and 26 be rotating disk drain Groove, 27 be rotating disk, and 28 be rotating shaft, and 29 be 2# circulation grooves, and 30 be mozzle, and 31 be fixed pin, and 32 be viscous sample dish, and 33 be roundlet Disk, 34 be big disk.

Embodiment

A kind of wafer grinding polishing machine, including support 15 and rotating disk 27, described support 15 include guidance panel 16 and behaviour Make platform 2；The rotating disk pedestal 3 for placing rotary disk 27 is provided with described operating desk 2；The side of described rotating disk pedestal 3 is set Waste liquid tap hole 13 is equipped with, the periphery of rotating disk pedestal 3 is provided with only liquid platform 14；The described axle center of rotating disk pedestal 3 is provided with axle sleeve 25； Described rotating disk 27 is formed by stacking by the roundel 33 and big disk of concentric setting about 34, and the bottom axle center of big disk 34 is set There is the rotating shaft 28 being rotatably connected with axle sleeve 25, running through at the axle center of roundel 33 has the mozzle 30 led to for rough lapping liquid stream, and The upper port of mozzle 30 is not less than the top planes of roundel 33；The bottom of described roundel 33 is distributed with a plurality of by mozzle 30 The rotating disk intake chute 26 run through to the outer of roundel 33；The sample tray 12 being matched therewith can be placed on described rotating disk 27；Institute The sample tray 12 stated includes inner disc 19 and external disk 20, and the wherein bottom surface of inner disc 19 contacts with the top surface of roundel 33, the bottom surface of external disk 20 with The top surface of big disk 34 contacts；The described axle center of inner disc 19, which is run through, the 2# feed tubes 9 led to for fine lapping liquid stream, 2# feed tubes 9 It is internal to be coaxially nested with the 1# feed tubes 8 led to for rough lapping liquid stream, and the lower port of 1# feed tubes 8 is not less than the upper end of mozzle 30 Mouthful, the lower port diameter of 1# feed tubes 8 is less than the upper port diameter of mozzle 30, and 1# feed tubes 8 pass through contiguous block 18 with 2# feed tubes 9 Connection；Described 1# feed tubes 8 and the upper port of 2# feed tubes 9 are not less than the top planes of sample tray 12, and on 1# feed tubes 8 Port is not less than the upper port of 2# feed tubes 9,1# feed tubes 8 and the upper port of 2# feed tubes 9 outer；Described inner disc 19 is along its axle Heart circular array is provided through multiple 1# load samples holes 10 for being used to assign viscous sample dish 31；The described bottom of inner disc 19 adjacent two 1# eddy flows groove 24 is connected between 1# load samples hole 10；The described bottom of inner disc 19 is provided with along the tangential 1# drains in 1# load samples hole 10 Groove 21；The described bottom of inner disc 19 is provided with connection 1# load samples hole 10 and the 1# circulation grooves 22 of 2# feed tubes 9；Described external disk 20 Multiple 2# load samples holes 11 for being used to assign viscous sample dish 31 are provided through along its axle center circular array；The described bottom of external disk 20 2# eddy flows groove 23 is connected between adjacent two 2# load samples hole 11；The described bottom of external disk 20 is provided with tangential along 2# load samples hole 11 2# intake chutes 1；The described bottom of external disk 20 is provided with connection 2# load samples hole 11 and the 2# circulation grooves 29 of the interior edge of external disk 20；Described Support shank 4 is provided with the alien invasion of sample tray 12；Fixing hole 17 is provided with described support shank 4；Described operating desk 2 Side is provided with support bar 5；Fix bar 6 is slidably connected on described support bar 5, the end set of fix bar 6 has and fixing hole 17 fixed pins 31 being engaged, fixed pin 31 is inserted in fixing hole 17 and can be used for keeping sample tray 12 to fix；Described operation The liquid pipe 7 for injecting rough lapping liquid and fine lapping liquid to 1# feed tubes 8 and 2# feed tubes 9 respectively is provided with platform 2.

Claims (2)

1. A kind of 1. novel wafer polisher lapper, it is characterised in that：Including support（15）And rotating disk（27）, described support（15） Including guidance panel（16）And operating desk（2）；Described operating desk（2）On be provided with for placing rotary disk（27）Rotating disk pedestal （3）；Described rotating disk pedestal（3）Side be provided with waste liquid tap hole（13）, rotating disk pedestal（3）Periphery is provided with only liquid platform （14）；Described rotating disk pedestal（3）Axle center is provided with axle sleeve（25）；Described rotating disk（27）By the roundel of concentric setting （33）And big disk（34）It is formed by stacking up and down, big disk（34）Bottom axle center is provided with and axle sleeve（25）The rotating shaft of rotatable connection （28）, roundel（33）Running through at axle center has the mozzle led to for rough lapping liquid stream（30）, and mozzle（30）Upper port is not Less than roundel（33）Top planes；Described roundel（33）Bottom be distributed with it is a plurality of by mozzle（30）To roundel （33）The rotating disk intake chute that outer is run through（26）；Described rotating disk（27）On can place the sample tray being matched therewith（12）；Institute The sample tray stated（12）Including inner disc（19）And external disk（20）, wherein inner disc（19）Bottom surface and roundel（33）Top surface contacts, outside Disk（20）Bottom surface and big disk（34）Top surface contacts；Described inner disc（19）Axle center, which is run through, has the 2# led to for fine lapping liquid stream to enter Liquid pipe（9）, 2# feed tubes（9）It is internal to be coaxially nested with the 1# feed tubes led to for rough lapping liquid stream（8）, and 1# feed tubes（8） Lower port is not less than mozzle（30）Upper port, 1# feed tubes（8）Lower port diameter is less than mozzle（30）Upper port diameter, 1# Feed tube（8）With 2# feed tubes（9）Pass through contiguous block（18）Connection；Described 1# feed tubes（8）With 2# feed tubes（9）Upper port It is not less than sample tray（12）Top planes；Described inner disc（19）Multiple use are provided through along its axle center circular array In assigning viscous sample dish（31）1# load samples hole（10）；Described inner disc（19）The adjacent two 1# load samples hole in bottom（10）Between be connected with 1# eddy flow grooves（24）；Described inner disc（19）Bottom is provided with along 1# load samples hole（10）Tangential 1# intake chutes（21）；Described Inner disc（19）Bottom is provided with connection 1# load samples hole（10）With 2# feed tubes（9）1# circulation grooves（22）；Described external disk（20） It is provided through along its axle center circular array multiple for assigning viscous sample dish（31）2# load samples hole（11）；Described external disk （20）The adjacent two 2# load samples hole in bottom（11）Between be connected with 2# eddy flow grooves（23）；Described external disk（20）Bottom is provided with along 2# Load sample hole（11）Tangential 2# intake chutes（1）；Described external disk（20）Bottom is provided with connection 2# load samples hole（11）With external disk （20）The 2# circulation grooves of interior edge（29）；Described sample tray（12）Alien invasion on be provided with support shank（4）；Described support shank （4）On be provided with fixing hole（17）；Described operating desk（2）Side be provided with support bar（5）；Described support bar（5）On Slidably connect fix bar（6）, fix bar（6）End set has and fixing hole（17）The fixed pin being engaged（31）, by fixation Pin（31）Insert fixing hole（17）In can be used for keep sample tray（12）It is fixed；Described operating desk（2）On be provided with respectively to 1# feed tubes（8）With 2# feed tubes（9）Inject the liquid pipe of rough lapping liquid and fine lapping liquid（7）.
2. 2. novel wafer polisher lapper according to claim 1, it is characterised in that：Described 1# feed tubes（8）Upper end Mouth is not less than 2# feed tubes（9）Upper port, 1# feed tubes（8）With 2# feed tubes（9）Upper port outer.