CN107645854A - A kind of method that multi-layer flexible circuit board forms via connection - Google Patents
A kind of method that multi-layer flexible circuit board forms via connection Download PDFInfo
- Publication number
- CN107645854A CN107645854A CN201710858786.4A CN201710858786A CN107645854A CN 107645854 A CN107645854 A CN 107645854A CN 201710858786 A CN201710858786 A CN 201710858786A CN 107645854 A CN107645854 A CN 107645854A
- Authority
- CN
- China
- Prior art keywords
- layer
- flexible circuit
- circuit board
- adhering
- pvc film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000007747 plating Methods 0.000 claims abstract description 24
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 19
- 239000000126 substance Substances 0.000 claims abstract description 18
- 238000005553 drilling Methods 0.000 claims abstract description 11
- 239000010410 layer Substances 0.000 claims description 64
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000011229 interlayer Substances 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- -1 silver-plated Chemical class 0.000 description 1
Abstract
The present invention relates to field of circuit boards, more particularly to a kind of method that multi-layer flexible circuit board forms via connection.The realization of the present invention comprises the following steps.Drilling；Place self-adhering-type PVC film；Chemical plating；Coat photoresist；Plating；Remove photoresist layer；Remove self-adhering-type PVC film.The method that multi-layer flexible circuit board of the present invention forms via connection has the following advantages that：Chemical deposit is formed between photoresist layer and self-adhering-type PVC film, and because self-adhering-type PVC film is easily separated without damaging flexible circuit from flexible circuit plate surface, so as to which when removing chemical deposit infringement will not be produced to flexible PCB.Therefore the reliable via connection for not damaging flexible circuitry can be obtained by the present processes.
Description
Technical field
The present invention relates to a kind of method that multi-layer flexible circuit board forms via connection.
Technical background
All it is come shape in the form of via to realize the electrical connection of interlayer circuit in multi-layer flexible circuit board field
Into electrical connection.Specific step includes drilling, chemical plating and plating.Under normal circumstances, the step of forming via is all to be formed
Before the step of line layer, chemical plating and plating in this case has an impact all without to line layer.But actually should
In, it is sometimes desirable to the multilayer circuit board for having formed line layer is drilled, the processing of chemical plating and plating.If according to
Traditional mode, chemical plating and plating will certainly have an impact to the All other routes around via.This requires to find a kind of resist
Plated film is protected to line layer.Traditional mode is all to be used as plating resist film using dry film, but dry film needs when removing
Strong base solution is used, this will necessarily damage flexible circuitry.Therefore the mode of traditional patch dry film is not suitable for layer flexible electricity
Road plate shape connects into via.
The content of the invention
In view of the above-mentioned deficiencies in the prior art, it is an object of the present invention to providing a kind of multi-layer flexible circuit board forms via connection
Method.
The realization of the present invention comprises the following steps.
（1）Drilling：Via is drilled out in the position of the join domain for needing to be formed interlayer electrical connection of multi-layer flexible circuit board.
Drilling uses machine drilling under normal circumstances, can also use the modes such as laser drill, ultraviolet drilling in addition.
（2）Place self-adhering-type PVC film：In position of the surface of multi-layer flexible circuit board in addition to join domain and via
Place self-adhering-type PVC film.
（3）Chemical plating：In one layer of conductive layer of surface chemical plating of multi-layer flexible circuit board.Chemical plating uses under normal circumstances
The mode of electroless copper, it can additionally use the metals such as silver-plated, golden, nickel.
（4）Coat photoresist：Photoresist layer is coated on the surface of the conductive layer above self-adhering-type PVC film.
（5）Plating：In the electroplating surface layer of metal layer of the conductive layer exposed.
（6）Remove photoresist layer：Photoresist layer is removed with stripper.
（7）Remove self-adhering-type PVC film：Self-adhering-type PVC film is removed, at the same time the conductive layer above self-adhering-type PVC film
Removed in the lump.
Compared with prior art, the method that multi-layer flexible circuit board of the present invention forms via connection has
The advantages of following：Chemical deposit is formed between photoresist layer and self-adhering-type PVC film, and due to self-adhering-type PVC film pole
Easily separated from flexible circuit plate surface without damaging flexible circuit, so that will not be to flexible PCB when removing chemical deposit
Produce infringement.Therefore the reliable via connection for not damaging flexible circuitry can be obtained by the present processes.
Brief description of the drawings
Fig. 1 is the schematic diagram of the multi-layer flexible circuit board after drilling.
Fig. 2 be place self-adhering-type PVC film after multi-layer flexible circuit board schematic diagram.
Fig. 3 is the schematic diagram of the multi-layer flexible circuit board after chemical plating.
Fig. 4 be coat photoresist after multi-layer flexible circuit board schematic diagram.
Fig. 5 is the schematic diagram of the multi-layer flexible circuit board after plating.
Fig. 6 be remove photoresist layer after multi-layer flexible circuit board schematic diagram.
Fig. 7 be remove self-adhering-type PVC film after multi-layer flexible circuit board schematic diagram.
Reference includes：
1- multi-layer flexible circuit boards, the join domain of 2- flexible circuit plate surfaces, the join domain of 3- flexible circuit intralamellar parts, 4-
Via, 5- adhesive linkages, 6- self-adhering-type PVC films, 7- conductive layers, 8- photoresist layers, 9- metal levels.
Embodiment
It is described in detail below in conjunction with realization of the specific embodiment to the present invention.
As shown in figs. 1-7, it is a preferred embodiment provided by the invention.Wherein to put it more simply, only illustrating three layers of flexibility
Circuit board.It is to be appreciated that the method for the present invention is equally applicable to other multi-layer flexible circuit boards.
The present embodiment comprises the following steps that：
（1）Drilling：As shown in figure 1, in the join domain 2 for needing to be formed interlayer electrical connection of multi-layer flexible circuit board 1 and connection
Via 4 is drilled out between region 3.
（2）Place self-adhering-type PVC film：As shown in Fig. 2 on the surface of multi-layer flexible circuit board 1 except join domain 2 and mistake
Place self-adhering-type PVC film 6 in position outside hole 4.
（3）Chemical plating：As shown in figure 3, in one layer of conductive layer 7 of surface chemical plating of multi-layer flexible circuit board 1.
（4）Coat photoresist：As shown in figure 4, coat photoetching on the surface of the conductive layer 7 above self-adhering-type PVC film 6
Glue-line 8.
（5）Plating：As shown in figure 5, in the electroplating surface layer of metal layer 9 of the conductive layer 7 exposed.
（6）Remove photoresist layer：As shown in fig. 6, remove photoresist layer 8 with stripper.
（7）Remove self-adhering-type PVC film：As shown in fig. 7, self-adhering-type PVC film 6 is removed, at the same time in self-adhering-type PVC film 6
The conductive layer 7 of side is also removed in the lump.
In the method that above-mentioned multi-layer flexible circuit board forms via connection, it has the following advantages that：Chemistry
Coating is formed between photoresist layer and self-adhering-type PVC film, and because self-adhering-type PVC film is easily from flexible PCB table
Face is separated without damaging flexible circuit, so as to produce infringement to flexible PCB when removing chemical deposit.Therefore it is logical
The reliable via connection for not damaging flexible circuitry can be obtained by crossing the present processes.
Claims (3)
1. a kind of method that multi-layer flexible circuit board forms via connection, comprises the following steps：
（1）Drilling：Via is drilled out in the position of the join domain for needing to be formed interlayer electrical connection of multi-layer flexible circuit board；
（2）Place self-adhering-type PVC film：Placed certainly in position of the surface of multi-layer flexible circuit board in addition to join domain and via
Viscous type PVC film；
（3）Chemical plating：In one layer of conductive layer of surface chemical plating of multi-layer flexible circuit board；
（4）Coat photoresist：Photoresist layer is coated on the surface of the conductive layer above self-adhering-type PVC film；
（5）Plating：In the electroplating surface layer of metal layer of the conductive layer exposed；
（6）Remove photoresist layer：Photoresist layer is removed with stripper；
（7）Remove self-adhering-type PVC film：Self-adhering-type PVC film is removed, at the same time the conductive layer above self-adhering-type PVC film is also by one
And remove.
2. the method that a kind of multi-layer flexible circuit board as claimed in claim 1 forms via connection, it is characterised in that drilling is adopted
It is machine drilling.
3. a kind of multi-layer flexible circuit board as described in claim 1 with 2 forms the method that via connects, it is characterised in that chemistry
Plating is using electroless copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710858786.4A CN107645854A (en) | 2017-09-21 | 2017-09-21 | A kind of method that multi-layer flexible circuit board forms via connection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710858786.4A CN107645854A (en) | 2017-09-21 | 2017-09-21 | A kind of method that multi-layer flexible circuit board forms via connection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107645854A true CN107645854A (en) | 2018-01-30 |
Family
ID=61113656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710858786.4A Pending CN107645854A (en) | 2017-09-21 | 2017-09-21 | A kind of method that multi-layer flexible circuit board forms via connection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107645854A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109019504A (en) * | 2018-06-22 | 2018-12-18 | 北京时代民芯科技有限公司 | A kind of new producing method of the adjustable interconnection through silicon via of resistance |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0169265A2 (en) * | 1984-07-21 | 1986-01-29 | Nippon Mektron, Ltd. | Process for making printed-circuit boards with plated through-holes |
| KR20050001029A (en) * | 2003-06-26 | 2005-01-06 | 영풍전자 주식회사 | Method for manufacturing double side a flexible printed circuit board |
| CN1729430A (en) * | 2002-12-20 | 2006-02-01 | 因芬尼昂技术股份公司 | Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer |
| CN102373492A (en) * | 2010-08-13 | 2012-03-14 | 北大方正集团有限公司 | Method for carrying out selective electroplating on surface of circuit board, and circuit board |
| CN103906360A (en) * | 2012-12-28 | 2014-07-02 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
-
2017
- 2017-09-21 CN CN201710858786.4A patent/CN107645854A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0169265A2 (en) * | 1984-07-21 | 1986-01-29 | Nippon Mektron, Ltd. | Process for making printed-circuit boards with plated through-holes |
| CN1729430A (en) * | 2002-12-20 | 2006-02-01 | 因芬尼昂技术股份公司 | Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer |
| KR20050001029A (en) * | 2003-06-26 | 2005-01-06 | 영풍전자 주식회사 | Method for manufacturing double side a flexible printed circuit board |
| CN102373492A (en) * | 2010-08-13 | 2012-03-14 | 北大方正集团有限公司 | Method for carrying out selective electroplating on surface of circuit board, and circuit board |
| CN103906360A (en) * | 2012-12-28 | 2014-07-02 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 姜政,丁桂甫,汪红,黎莉: "微加工厚光刻胶掩膜电镀工艺研究" * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109019504A (en) * | 2018-06-22 | 2018-12-18 | 北京时代民芯科技有限公司 | A kind of new producing method of the adjustable interconnection through silicon via of resistance |
| CN109019504B (en) * | 2018-06-22 | 2020-02-21 | 北京时代民芯科技有限公司 | Manufacturing method of interconnected silicon through hole with adjustable resistance |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180130 |
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| WD01 | Invention patent application deemed withdrawn after publication |