CN107592738A - A kind of flexible PCB and preparation method thereof, electronic equipment - Google Patents

A kind of flexible PCB and preparation method thereof, electronic equipment Download PDF

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Publication number
CN107592738A
CN107592738A CN201710815063.6A CN201710815063A CN107592738A CN 107592738 A CN107592738 A CN 107592738A CN 201710815063 A CN201710815063 A CN 201710815063A CN 107592738 A CN107592738 A CN 107592738A
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China
Prior art keywords
layer
protection film
film layer
conductive
flexible
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Pending
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CN201710815063.6A
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Chinese (zh)
Inventor
胡在成
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201710815063.6A priority Critical patent/CN107592738A/en
Publication of CN107592738A publication Critical patent/CN107592738A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a kind of flexible PCB and preparation method thereof, electronic equipment, the preparation method of the flexible PCB includes：One single-layer flexible conductive base is provided；Wherein, single-layer flexible conductive base includes the substrate and conductive layer being stacked；The first protection film layer is made in side of the substrate away from conductive layer, and the second protection film layer is made in side of the conductive layer away from substrate.By the above-mentioned means, on the one hand flexible PCB provided by the invention has more preferable pliability, bending, distortion are advantageously implemented, on the other hand with more preferable intensity, is not easy to be torn.

Description

A kind of flexible PCB and preparation method thereof, electronic equipment
Technical field
The present invention relates to flexible PCB technical field, more particularly to a kind of flexible PCB and preparation method thereof, electricity Sub- equipment.
Background technology
Flexible PCB (Flexible Printed Circuit, abbreviation FPC) be using polyimides or polyester film as It is a kind of made of base material that there is height reliability, excellent flexible printed circuit.It is high, in light weight, thick with Distribution density Spend the characteristics of thin, bending property is good.
But just because of above-mentioned in light weight, thickness of thin, bending property is good the features such as, cause flexible PCB assembling and tieing up It is easily torn when repairing so that yield reduces electronic product in process of production, cost increase.
The content of the invention
In order to solve the above technical problems, one aspect of the present invention is：A kind of system of flexible PCB is provided Make method, the preparation method includes：One single-layer flexible conductive base is provided；Wherein, single-layer flexible conductive base is set including stacking The substrate and conductive layer put；The first protection film layer is made in side of the substrate away from conductive layer, and in conductive layer away from base The side of plate makes the second protection film layer.
In order to solve the above technical problems, one aspect of the present invention is：A kind of flexible PCB is provided, this is soft Property circuit board include the first protection film layer, single-layer flexible conductive base and the second protection film layer that are stacked；Wherein, individual layer Compliant conductive base material includes the substrate and conductive layer being stacked.
In order to solve the above technical problems, one aspect of the present invention is：A kind of electronic equipment, the electronics are provided Equipment includes the flexible PCB that preparation method described above makes, or the electronic equipment includes flexible PCB described above.
Brief description of the drawings
Fig. 1 is the structural representation of the embodiment of flexible PCB one provided by the invention；
Fig. 2 is the structural representation of another embodiment of flexible PCB provided by the invention；
Fig. 3 is the schematic flow sheet of the embodiment of preparation method one of flexible PCB provided by the invention；
Fig. 4 be flexible PCB provided by the invention another embodiment of preparation method in step 32 schematic flow sheet；
Fig. 5 is the schematic flow sheet of the preparation method another embodiment of flexible PCB provided by the invention；
Fig. 6 be flexible PCB provided by the invention preparation method another embodiment in step 52 schematic flow sheet；
Fig. 7 is the structural representation of the embodiment of electronic equipment one provided by the invention；
Fig. 8 is the structural representation of flexible PCB in another embodiment of electronic equipment provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation describes.It is understood that specific embodiment described herein is only used for explaining the present invention, rather than the limit to the present invention It is fixed.It also should be noted that for the ease of description, part related to the present invention illustrate only in accompanying drawing and not all knot Structure.Based on the embodiment in the present invention, what those of ordinary skill in the art were obtained under the premise of creative work is not made Every other embodiment, belongs to the scope of protection of the invention.
Term " first ", " second " in the present invention etc. are to be used to distinguish different objects, rather than specific suitable for describing Sequence.In addition, term " comprising " and " having " and their any deformations, it is intended that cover non-exclusive include.Such as comprising The step of process of series of steps or unit, method, system, product or equipment are not limited to list or unit, and It is alternatively also to include the step of not listing or unit, or alternatively also includes for these processes, method, product or equipment Intrinsic other steps or unit.
Referenced herein " embodiment " is it is meant that the special characteristic, structure or the characteristic that describe can wrap in conjunction with the embodiments In at least one embodiment of the present invention.Each position in the description occur the phrase might not each mean it is identical Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and Implicitly understand, embodiment described herein can be combined with other embodiments.
Electronic equipment provided in an embodiment of the present invention can be mobile phone, tablet personal computer, Intelligent worn device etc., these electronics Typically all include flexible PCB in equipment.
Flexible PCB (Flexible Printed Circuit, abbreviation FPC) be using polyimides or polyester film as It is a kind of made of base material that there is height reliability, excellent flexible printed circuit.It is high, in light weight, thick with Distribution density Spend the characteristics of thin, bending property is good.
It should be understood that in the production and supply chain of flexible PCB, the assembly enterprise purchase of electronic equipment is only Compliant conductive base material, that is, include the substrate and conductive layer being stacked, for example, flexible copper clad base material (Flexible Copper Clad Laminate, abbreviation FCCL), FCCL mainly includes individual layer FCCL and double-deck FCCL, and individual layer FCCL includes what is be stacked Substrate and conductive layer, double-deck FCCL include the first conductive layer, substrate and the second conductive layer being stacked.
, it is necessary to carry out patterned process shape to the conductive layer on FCCL in the manufacture craft for carrying out FPC is processed to FCCL The processing that comes to the surface is carried out into circuit, and to FCCL.For example, by taking individual layer FCCL as an example, figure is carried out in the conductive layer to individual layer FCCL After caseization processing, layer protecting film can be covered on the electrically conductive, for another example by taking double-deck FCCL as an example, to the of double-deck FCCL After one conductive layer and/or the second conductive layer carry out patterned process, it can distinguish on the surface of the first conductive layer and the second conductive layer Covering protection film.
In actual applications, flexible PCB can bend, distort in use, be made using above-mentioned individual layer FCCL Flexible PCB, intensity is not high, is easily torn during bending, distortion, and uses what above-mentioned double-deck FCCL made Flexible PCB, due to not high with two conductive layers, pliability, it is difficult to used in bending, distortion.
Refering to Fig. 1, Fig. 1 is the structural representation of the embodiment of flexible PCB one provided by the invention, the flexible PCB Including the first protection film layer 11, the protection film layer 13 of single-layer flexible conductive base 12 and second being stacked.
Wherein, single-layer flexible conductive base 12 includes the substrate 121 and conductive layer 122 being stacked.
It should be understood that single-layer flexible conductive base 12 therein can be the former material made that supplier provides Material, i.e., substrate 121 made with conductive layer 122 together with, alternatively, it is also possible to purchase baseplate material and conductive material, and Make to obtain above-mentioned single-layer flexible conductive base 12 using coating process.
Wherein, substrate 121 can use polyimides (PI) or PET (PET) to make, its thickness It can be 5 μm -150 μm.
Wherein, conductive layer 122 can use electrolytic copper foil or rolled copper foil to make, and its thickness can be 5 μm -70 μm.
Wherein, the first protection film layer 11 and the second protection film layer 13 are also cover layer, are typically made using polyimides (PI) Make.
It should be understood that between the first protection film layer 11 and single-layer flexible conductive base 12 and single-layer flexible is conductive Between the protection film layer 13 of base material 12 and second, in addition to the adhesive for pasting, specifically, it is with the first protection film layer 11 Example, a layer of adhesive can be first coated in the lower surface of single-layer flexible conductive base 12, then be protected by way of pressing by first Cuticular layer 11 is pressed together on the lower surface of single-layer flexible conductive base 12, can be first soft in individual layer by taking the second protection film layer 13 as an example Property conductive base 12 upper surface coating a layer of adhesive, then the second protection film layer 13 is pressed together on individual layer by way of pressing The upper surface of compliant conductive base material 12.
Therefore, as shown in Fig. 2 in another embodiment of flexible PCB provided by the invention, the flexible PCB can With including the first protection film layer 21, first adhesive phase 22, substrate 23, conductive layer 24, the second adhesive phase 25 that are stacked And second protection film layer 26.
Below with six kinds of specific examples, book is illustrated to the thickness of each layer of flexible PCB in the present embodiment：
In first example, the thickness of the first protection film layer 21 is 12.5 μm, and the thickness of first adhesive phase 22 is 25 μm, The thickness of substrate 23 is 25 μm, and the thickness of conductive layer 24 is 12 μm, and the thickness of second adhesive phase 25 is 25 μm, the second protection The thickness of film layer 26 is 12.5 μm.The gross thickness of the flexible PCB is 112 μm.
In second example, the thickness of the first protection film layer 21 is 12.5 μm, and the thickness of first adhesive phase 22 is 25 μ M, the thickness of substrate 23 is 20 μm, and the thickness of conductive layer 24 is 12 μm, and the thickness of second adhesive phase 25 is 25 μm, and second protects The thickness of cuticular layer 26 is 12.5 μm.The gross thickness of the flexible PCB is 107 μm.
In third example, the thickness of the first protection film layer 21 is 12.5 μm, and the thickness of first adhesive phase 22 is 20 μ M, the thickness of substrate 23 is 25 μm, and the thickness of conductive layer 24 is 12 μm, and the thickness of second adhesive phase 25 is 20 μm, and second protects The thickness of cuticular layer 26 is 12.5 μm.The gross thickness of the flexible PCB is 102 μm.
In fourth example, the thickness of the first protection film layer 21 is 12.5 μm, and the thickness of first adhesive phase 22 is 20 μ M, the thickness of substrate 23 is 20 μm, and the thickness of conductive layer 24 is 12 μm, and the thickness of second adhesive phase 25 is 20 μm, and second protects The thickness of cuticular layer 26 is 12.5 μm.The gross thickness of the flexible PCB is 97 μm.
In fifth example, the thickness of the first protection film layer 21 is 12.5 μm, and the thickness of first adhesive phase 22 is 15 μ M, the thickness of substrate 23 is 25 μm, and the thickness of conductive layer 24 is 12 μm, and the thickness of second adhesive phase 25 is 15 μm, and second protects The thickness of cuticular layer 26 is 12.5 μm.The gross thickness of the flexible PCB is 92 μm.
In the 6th example, the thickness of the first protection film layer 21 is 12.5 μm, and the thickness of first adhesive phase 22 is 15 μ M, the thickness of substrate 23 is 20 μm, and the thickness of conductive layer 24 is 12 μm, and the thickness of second adhesive phase 25 is 15 μm, and second protects The thickness of cuticular layer 26 is 12.5 μm.The gross thickness of the flexible PCB is 87 μm.
It is different from the situation of prior art, the first protection film layer that the flexible PCB of the present embodiment includes being stacked, Single-layer flexible conductive base and the second protection film layer；Wherein, single-layer flexible conductive base include the substrate that is stacked and Conductive layer.By the above-mentioned means, the flexible PCB of the present embodiment adds the flexible circuit of single layer protection film compared to individual layer FCCL Plate has higher intensity, is advantageous to anti-tear, while adds the flexible PCB of double shielding film to have compared to double-deck FCCL More preferable pliability, it is advantageously implemented bending, distortion.
Refering to Fig. 3, Fig. 3 is the schematic flow sheet of the embodiment of preparation method one of flexible PCB provided by the invention, should Method includes：
Step 31：One single-layer flexible conductive base is provided；Wherein, single-layer flexible conductive base includes the substrate being stacked And conductive layer.
It should be understood that single-layer flexible conductive base therein is the raw material made that supplier provides, i.e., Together with substrate has been made with conductive layer.The method of the present embodiment is that single-layer flexible conductive base is further added Work processing.
Optionally, substrate can use polyimides (PI) or PET (PET) to make, its thickness It can be 5 μm -150 μm.Conductive layer can use electrolytic copper foil or rolled copper foil to make, and its thickness can be 5 μm -70 μm.
Optionally, in one embodiment, the single-layer flexible conductive base is flexible copper clad base material, and it includes what is be stacked Substrate and copper foil.
Step 32：The first protection film layer is made in side of the substrate away from conductive layer, and in conductive layer away from substrate Side makes the second protection film layer.
Optionally, wherein, the first protection film layer and the second protection film layer are also cover layer, typically using polyimides (PI) Make.
Optionally, as shown in figure 4, in another embodiment, step 32 can specifically include：
Step 321：First adhesive phase is coated in side of the substrate away from conductive layer, and in conductive layer away from substrate Side coats second adhesive phase.
It should be understood that being not construed as limiting in substrate side and in the order of conductive layer side application of adhesive, certainly, also may be used To be coated in both sides simultaneously.
Step 322：The first protection film layer is pasted in first adhesive phase, and second is pasted in second adhesive phase Protection film layer.
It should be understood that the order for pasting the second protection film layer of the first protection film layer and stickup is not construed as limiting, certainly, also may be used To be pasted in both sides simultaneously.
Optionally, the first protection film layer is pasted in step 322 and the second protection film layer of stickup specifically can be by pressing Mode.
Refering to Fig. 5, Fig. 5 is the schematic flow sheet of the preparation method another embodiment of flexible PCB provided by the invention, This method includes：
Step 51：One single-layer flexible conductive base is provided；Wherein, single-layer flexible conductive base includes the substrate being stacked And conductive layer.
It should be understood that single-layer flexible conductive base therein is the raw material made that supplier provides, i.e., Together with substrate has been made with conductive layer.The method of the present embodiment is that single-layer flexible conductive base is further added Work processing.
Optionally, substrate can use polyimides (PI) or PET (PET) to make, its thickness It can be 5 μm -150 μm.Conductive layer can use electrolytic copper foil or rolled copper foil to make, and its thickness can be 5 μm -70 μm.
Optionally, in another embodiment, single-layer flexible conduction can also be made using baseplate material and conductive material Base material.Specifically, there is provided a substrate；Conductive layer is made on substrate using coating process.Wherein it is possible to the side using plating Formula, alternatively, it is also possible to be made by the way of calendering.
Step 52：Patterned process is carried out to conductive layer, to form conducting wire.
Optionally, as shown in fig. 6, step 52 can specifically include：
Step 521：Photoresist is coated on the electrically conductive.
Step 522：Using the light shield irradiation light photoresist of UV light permeability setting pattern.
Step 523：Photoresist after illumination is partially stripped.
Wherein, photoresist is also known as photoresist, and by photosensitive resin, sensitizer, (and solvent three kinds of main components form Photosensitive mixing liquid.After illumination, in exposure region photocuring reaction can soon occur for photosensitive resin so that this material Significant change occurs for the physical property of material, particularly dissolubility, affinity etc..Handled through appropriate solvent, dissolve soluble portion Point, obtain required image.
Step 524：Conductive layer is etched.
It should be understood that the light shield of the setting pattern in above-mentioned steps 522 has drawn out circuitous pattern, therefore in step Remaining photoresist is circuitous pattern after photoresist lift off in 523, and conductive layer is etched in step 524, The part for not having photoresist to cover on conductive layer can all be etched away, retain the part of photoresist covering, that is, ultimately form Conducting wire.
Wherein, the method for etching typically uses wet etching, in other examples, can also use the side of dry ecthing Formula, for example, being etched using special gas to exposed conductive layer.
Step 525：Remove remaining photoresist.
Step 53：First adhesive phase is coated in side of the substrate away from conductive layer, and in conductive layer away from substrate Side coats second adhesive phase.
Step 54：The first protection film layer is pasted in first adhesive phase, and second is pasted in second adhesive phase Protection film layer.
Optionally, wherein, the first protection film layer and the second protection film layer are also cover layer, typically using polyimides (PI) Make.
Optionally, the present embodiment can be entered by the way of pressing after pressing by 150-200 DEG C of high temperature The row solidification of one hour.
Step 55：Through hole is made in the second protection film layer, to expose partially electronically conductive circuit.
It should be understood that separated time road needs to carry out grafting or welding with external component in the middle part of conducting wire, with welding Exemplified by, it is necessary to make pad in conducting wire, therefore, through hole can be opened up in the second protection film layer, be led what is exposed Electric line part can carry out the making of pad, can be nickel gold processing specifically.
In addition, step 54 and step 55 can also carry out following replace：The first relevant position system in the second protection film layer Make through hole, retell the second protection film layer and be pasted onto in second adhesive phase.It should be understood that the second protection film layer is pre-production Alright, therefore, the second protection film layer has all pre-seted through hole, so, in the Making programme of flexible PCB, it is only necessary to according to The flow of step 54 carries out the stickup of the second protection film layer.
Flexible PCB in the present embodiment, two layers of diaphragm is made in the top and bottom of existing single-layer flexible conductive base Layer, the flexible PCB for adding single layer protection film compared to individual layer FCCL has higher intensity, is advantageous to anti-tear, compares simultaneously Add the flexible PCB of double shielding film that there is more preferable pliability in double-deck FCCL, be advantageously implemented bending, distortion.
Refering to Fig. 7, Fig. 7 is the structural representation of the embodiment of electronic equipment one provided by the invention, and the electronic equipment 70 wraps Include flexible PCB 71.
Optionally, with continued reference to Fig. 7, by taking mobile phone as an example, the flexible PCB 71 can apply to cell phone mainboard 72 and hand The circuit connected between pusher side key 73.
It should be understood that because mobile phone side key 73 is installed on mobile phone side, therefore, cell phone mainboard 72 and mobile phone side key are connected Flexible PCB 71 between 73 can bend in installation process, distort, so, the flexible circuit of connection mobile phone side key 73 Plate 71 is higher to intensity, flexible requirement.
Flexible PCB 71 in the present embodiment can include the first protection film layer, the single-layer flexible conductive base being stacked Material and the second protection film layer；Wherein, single-layer flexible conductive base includes the substrate and conductive layer being stacked.
It should be understood that as shown in figure 8, the flexible PCB 71 in the present embodiment is curved due to needing in use Folding, therefore, reinforcer 711 can be set at the edge for the part that flexible PCB 71 needs to bend.
Optionally, reinforcer can be respectively provided with the edge for the part that the needs of two sides of flexible PCB 71 are bent 711。
Specifically, in one embodiment, can be by the first protection film layer and the second protection film layer in the portion that needs are bent The edge divided sets more to thicken；In another embodiment, the first protection film layer and the second protection film layer can also made Afterwards, reinforcer 711 is set in addition at the edge for the part that the first protection film layer and the second protection film layer need to bend.
Wherein, the material of reinforcer 711 can be identical with the first protection film layer and the second protection film layer, for example, it may be Polyimides (PI).
It should be understood that flexible PCB and the flexible PCB of above-mentioned offer in the electronic equipment that the present embodiment provides It is no longer superfluous here and the structure of the flexible PCB in the embodiment of the preparation method of flexible PCB is similar with preparation method State.
Embodiments of the present invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this The equivalent structure or equivalent flow conversion that description of the invention and accompanying drawing content are made, or directly or indirectly it is used in other correlations Technical field, it is included within the scope of the present invention.

Claims (10)

  1. A kind of 1. preparation method of flexible PCB, it is characterised in that including：
    One single-layer flexible conductive base is provided；Wherein, the single-layer flexible conductive base includes the substrate being stacked and led Electric layer；
    The first protection film layer is made in side of the substrate away from the conductive layer, and in the conductive layer away from the base The side of plate makes the second protection film layer.
  2. 2. preparation method according to claim 1, it is characterised in that
    It is described to make the first protection film layer in side of the substrate away from the conductive layer, and in the conductive layer away from institute The step of stating side the second protection film layer of making of substrate, including：
    First adhesive phase is coated in side of the substrate away from the conductive layer, and in the conductive layer away from the base The side coating second adhesive phase of plate；
    The first protection film layer is pasted in the first adhesive phase, and the second protection is pasted in the second adhesive phase Film layer.
  3. 3. preparation method according to claim 2, it is characterised in that
    After the step of one single-layer flexible conductive base of the offer, in addition to：
    Patterned process is carried out to the conductive layer, to form conducting wire.
  4. 4. preparation method according to claim 3, it is characterised in that
    It is described that the first protection film layer is pasted in the first adhesive phase, and paste second in the second adhesive phase After the step of protection film layer, in addition to：
    Through hole is made in second protection film layer, to expose the part conducting wire.
  5. 5. preparation method according to claim 3, it is characterised in that
    It is described that patterned process is carried out to the conductive layer, the step of to form conducting wire, including：
    Photoresist is coated on the conductive layer；
    The photoresist is irradiated using the light shield of UV light permeability setting pattern；
    Photoresist after illumination is partially stripped；
    The conductive layer is etched；
    Remove remaining photoresist.
  6. 6. preparation method according to claim 1, it is characterised in that
    The step of one single-layer flexible conductive base of the offer, including：
    One substrate is provided；
    Conductive layer is made using coating process on the substrate.
  7. A kind of 7. flexible PCB, it is characterised in that including be stacked the first protection film layer, single-layer flexible conductive base with And second protection film layer；
    Wherein, the single-layer flexible conductive base includes the substrate and conductive layer being stacked.
  8. 8. flexible PCB according to claim 7, it is characterised in that
    The conductive layer is copper foil.
  9. 9. flexible PCB according to claim 7, it is characterised in that
    First protection film layer and second protection film layer are made using polyimide material.
  10. 10. a kind of electronic equipment, it is characterised in that the electronic equipment includes the making as described in claim any one of 1-6 The flexible PCB that method makes, or the electronic equipment include the flexible PCB as described in claim any one of 7-9.
CN201710815063.6A 2017-09-11 2017-09-11 A kind of flexible PCB and preparation method thereof, electronic equipment Pending CN107592738A (en)

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Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710815063.6A CN107592738A (en) 2017-09-11 2017-09-11 A kind of flexible PCB and preparation method thereof, electronic equipment

Publications (1)

Publication Number Publication Date
CN107592738A true CN107592738A (en) 2018-01-16

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110504050A (en) * 2018-05-18 2019-11-26 汉能移动能源控股集团有限公司 Conductive film and manufacturing method thereof, semi-finished conductive film, electronic assembly and electronic product
CN111954377A (en) * 2020-07-14 2020-11-17 深圳安博电子有限公司 Chip card, packaging method and packaging equipment thereof
CN113161694A (en) * 2021-04-20 2021-07-23 维沃移动通信有限公司 Battery connection circuit board, battery pack and electronic equipment
CN114340141A (en) * 2021-12-09 2022-04-12 昆山国显光电有限公司 Flexible circuit board, touch screen structure and terminal
WO2024021184A1 (en) * 2022-07-27 2024-02-01 瑞声光电科技(常州)有限公司 Flexible circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009147129A (en) * 2007-12-14 2009-07-02 Fujikura Ltd Wiring board and manufacturing method thereof
CN202503811U (en) * 2012-03-15 2012-10-24 广东技术师范学院 Flexible printed circuit board with reinforcing liner plates pasted at both surfaces
CN203574930U (en) * 2013-10-23 2014-04-30 特新微电子（东莞）有限公司 Flexible circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009147129A (en) * 2007-12-14 2009-07-02 Fujikura Ltd Wiring board and manufacturing method thereof
CN202503811U (en) * 2012-03-15 2012-10-24 广东技术师范学院 Flexible printed circuit board with reinforcing liner plates pasted at both surfaces
CN203574930U (en) * 2013-10-23 2014-04-30 特新微电子（东莞）有限公司 Flexible circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110504050A (en) * 2018-05-18 2019-11-26 汉能移动能源控股集团有限公司 Conductive film and manufacturing method thereof, semi-finished conductive film, electronic assembly and electronic product
CN111954377A (en) * 2020-07-14 2020-11-17 深圳安博电子有限公司 Chip card, packaging method and packaging equipment thereof
CN113161694A (en) * 2021-04-20 2021-07-23 维沃移动通信有限公司 Battery connection circuit board, battery pack and electronic equipment
CN114340141A (en) * 2021-12-09 2022-04-12 昆山国显光电有限公司 Flexible circuit board, touch screen structure and terminal
WO2024021184A1 (en) * 2022-07-27 2024-02-01 瑞声光电科技(常州)有限公司 Flexible circuit board

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