CN206118157U - Utensil electromagnetic shielding film's rigid -flex circuit board - Google Patents
Utensil electromagnetic shielding film's rigid -flex circuit board Download PDFInfo
- Publication number
- CN206118157U CN206118157U CN201620851552.8U CN201620851552U CN206118157U CN 206118157 U CN206118157 U CN 206118157U CN 201620851552 U CN201620851552 U CN 201620851552U CN 206118157 U CN206118157 U CN 206118157U
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- Prior art keywords
- rigid
- electromagnetic shielding
- shielding film
- flexible
- circuit board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to an utensil electromagnetic shielding film's rigid -flex circuit board, this utensil electromagnetic shielding film's rigid -flex circuit board, including the regional and flexible region of rigidity, the rigidity is regional including the first rigidity daughter board, bonding sheet, flexible daughter board, bonding sheet and the second rigidity daughter board that stack gradually, flexible region including the electromagnetic shielding film that stacks gradually, cover the membrane flexible daughter board, cover membrane and electromagnetic shielding film, electromagnetic shielding film is including stacking gradually the first from type membrane, insulating layer and electrically conductive viscose layer of setting. The utility model discloses an utensil electromagnetic shielding film's rigid -flex circuit board pastes electromagnetic shield layer through the flexible region at the rigid -flex circuit board to make the circuit board possess electromagnetic shielding function.
Description
Technical field
This utility model is related to printed wiring technical field, more particularly to a kind of rigid-flexible joint line of tool electromagnetic shielding film
Road plate.
Background technology
With PCB (Printed Circuit Board, printed circuit board) to small volume, it is lightweight, it is three-dimensional installation and
The direction of high connecting reliability is developed, and rigid printed circuit boards and flexible printed-circuit board start to rigid-flex combined board direction to send out
Exhibition, and as electronic product has higher and higher requirement to the complete transmission of communication signal, electromagnetic shielding film is attached to into flexible region
The rigid-flex combined board of upper and lower surface, while can meeting three-dimensional installation requirement, it is also possible to effectively prevent electromagnetic interference, protects
The integrity of card product signal transmission.
Existing common technique is first to complete rigid-flex combined board in PCB maker, using producer in order to avoid electromagnetism is dry
Disturb one layer of aluminium foil or Copper Foil can be pasted in flexible region upper and lower surface.It is poor that aluminium foil or Copper Foil compare Special electromagnetic screened film shield effectiveness,
And as bending property is poor, flexible region can be bent in rigid-flex board installation process causes aluminium foil or Copper Foil to fracture and affect electromagnetic screen
Effect is covered, while the operation of patch aluminium foil or Copper Foil inefficiency for using producer, it is impossible to realize batch production.
Utility model content
Based on this, the purpose of this utility model is to provide a kind of rigid-flexible combined circuit board of tool electromagnetic shielding film.
Specific technical scheme is as follows：
A kind of rigid-flexible combined circuit board of tool electromagnetic shielding film, including rigid region and flexure region, the rigid region
Including the first rigid daughter board, bonding sheet, flexible daughter board, bonding sheet and the second rigid daughter board that stack gradually, the flexible region
Domain includes electromagnetic shielding film, coverlay, the flexible daughter board, coverlay and the electromagnetic shielding film for stacking gradually.
Wherein in one embodiment, the electromagnetic shielding film includes the first mould release membrance, the insulating barrier being cascading
And conductive viscose layer, the conductive viscose layer adheres to the coverlay.
Wherein in one embodiment, the material of the insulating barrier is epoxy resin or polyurethane resin.
Wherein in one embodiment, the material of the conductive viscose layer is that copper is starched or silver paste.
Wherein in one embodiment, the thickness of the electromagnetic shielding film is 25-35 μm.
Wherein in one embodiment, first rigid daughter board and second rigid daughter board be single layer rigid plate or
Multilamellar rigid plate；The flexible daughter board is single layer flexible plate or Multilayer Flexible Board.
Advantage of the present utility model is as follows：
Compared with prior art, the rigid-flexible combined circuit board of a kind of tool electromagnetic shielding film of the present utility model, rigid-flexible
The flexure region of combined circuit board pastes electromagnetic shielding film to realize electromagnetic shielding, and the electromagnetic shielding film includes stacking gradually and sets
The first mould release membrance, insulating barrier and the conductive viscose layer put, is exposed by completing to take off lid in rigid-flex combined board manufacturing process
Behind flexible region, using the special auxiliary spacer for designing, (size is matched with the flexure region, and thickness is slightly larger than rigid region and scratches
The thickness difference in property region) make electromagnetic shielding film be under pressure well in bonding processes with heat to be reliably attached to flexibility
Area surface.
Description of the drawings
Fig. 1 is the structural representation of the rigid-flexible combined circuit board of embodiment tool electromagnetic shielding film；
Fig. 2 is the structural representation of an embodiment electromagnetic shielding film.
Description of reference numerals：
11st, has the rigid-flexible combined circuit board of electromagnetic shielding film；10th, the first rigid daughter board；20th, bonding sheet；30th, flexible son
Plate；40th, the second rigid daughter board；50th, coverlay；60th, electromagnetic shielding film；601st, the first mould release membrance；602nd, insulating barrier；603rd, it is conductive
Adhesive-layer；604th, the second mould release membrance.
Specific embodiment
It is understandable to enable the purpose of this utility model, feature and advantage to become apparent from, below to tool of the present utility model
Body embodiment is described in detail.Many details are elaborated in the following description in order to fully understand that this practicality is new
Type, but this utility model can be to be much different from other modes described here implementing, and those skilled in the art can be with
Similar improvement is done in the case of without prejudice to this utility model intension, therefore this utility model is not embodied as by following public
Restriction.
By the following examples the application is further elaborated.
With reference to Fig. 1, a kind of rigid-flexible combined circuit board 11 of tool electromagnetic shielding film, including rigid region 112 and flexure region
111, the first rigid daughter board 10 that the rigid region includes stacking gradually, bonding sheet 20, flexible daughter board 30, bonding sheet 20 and
Second rigid daughter board 40, electromagnetic shielding film 60 that the flexure region 111 includes stacking gradually, coverlay 50, the flexible son
Plate 30, coverlay 50 and electromagnetic shielding film 60；
The first mould release membrance 601 that the electromagnetic shielding film includes being cascading, insulating barrier 602, conductive viscose layer 603
And second mould release membrance 604.
The material of the insulating barrier is epoxy resin or polyurethane resin.
The material of the conductive viscose layer is that copper is starched or silver paste.
First rigid daughter board and second rigid daughter board are single layer rigid plate or multilamellar rigid plate；The flexibility
Daughter board is single layer flexible plate or Multilayer Flexible Board.
The thickness of the electromagnetic shielding film is 25-35 μm.
The preparation method of the rigid-flexible combined circuit board of above-mentioned tool electromagnetic shielding film, comprises the steps：
S1, obtain according to a conventional method the first rigid daughter board 10, flexible daughter board 30, bonding sheet 20, the second rigid daughter board 40, electricity
Magnetic shield film 60, coverlay 50 and pad；
S2, the flexible daughter board flexure region paste coverlay；It is corresponding with the flexure region on the bonding sheet
Region carry out fenestration procedure；Then according to the first rigid daughter board, bonding sheet, flexible daughter board, bonding sheet and the second rigidity
The order of plate is pressed after stacking gradually, and the operation that carries out uncapping of the wiring board after pressing is exposed flexure region；
The matching size of the size of the pad and the flexure region is closed, and the thickness of the pad is than the rigid region
The big 0.1-0.2mm with the thickness difference of the flexure region；
S3, by electromagnetic shielding film (untapped product, as shown in Fig. 2 a layer is also stained with the outside of conductive viscose layer
Two mould release membrances the second mould release membrance 604) adheres to the flexure region after removing, and then covers one on the electromagnetic shielding film
Layer pad, then carries out second pressing；
The parameter of second pressing is：Pressing pressure is 20-40kg/cm2, pressing-in temp is 170-190 DEG C, pressure
The conjunction time is 180-300s；
Drying-plate operation has been carried out after pressing for described second also, the parameter of the drying-plate operation is：110-130 DEG C of baking 1-
2h；
S4, rear operation making is carried out, obtain final product the rigid-flexible combined circuit board of the tool electromagnetic shielding film.
A kind of rigid-flexible combined circuit board of tool electromagnetic shielding film of the present embodiment, is by rigid-flex combined board manufacturing process
Complete to take off after lid exposes flexible region, using the auxiliary spacer of special design, (size is matched with the flexure region, and thickness is slightly larger than
The thickness difference of rigid region and flexure region) make electromagnetic shielding film can be under pressure well in bonding processes with heat and can
Flexible region surface is attached to by ground.
Each technical characteristic of embodiment described above arbitrarily can be combined, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more concrete and detailed,
But therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that for the common skill of this area
For art personnel, without departing from the concept of the premise utility, some deformations and improvement can also be made, these belong to
Protection domain of the present utility model.Therefore, the protection domain of this utility model patent should be defined by claims.
Claims (6)
1. it is a kind of tool electromagnetic shielding film rigid-flexible combined circuit board, it is characterised in that it is including rigid region and flexure region, described
Rigid region includes the first rigid daughter board, bonding sheet, flexible daughter board, bonding sheet and the second rigid daughter board for stacking gradually, institute
State electromagnetic shielding film, coverlay, the flexible daughter board, coverlay and electromagnetic shielding film that flexure region includes stacking gradually.
2. it is according to claim 1 tool electromagnetic shielding film rigid-flexible combined circuit board, it is characterised in that the electromagnetic shielding
Film includes the first mould release membrance, insulating barrier and the conductive viscose layer being cascading, and the conductive viscose layer adheres to described
Coverlay.
3. it is according to claim 2 tool electromagnetic shielding film rigid-flexible combined circuit board, it is characterised in that the insulating barrier
Material is epoxy resin or polyurethane resin.
4. it is according to claim 2 tool electromagnetic shielding film rigid-flexible combined circuit board, it is characterised in that the conductive viscose
The material of layer is that copper is starched or silver paste.
5. it is according to claim 2 tool electromagnetic shielding film rigid-flexible combined circuit board, it is characterised in that the electromagnetic shielding
The thickness of film is 25-35 μm.
6. according to any one of claim 1-5 tool electromagnetic shielding film rigid-flexible combined circuit board, it is characterised in that it is described
First rigid daughter board and second rigid daughter board are single layer rigid plate or multilamellar rigid plate；The flexible daughter board is scratched for monolayer
Property plate or Multilayer Flexible Board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620851552.8U CN206118157U (en) | 2016-08-08 | 2016-08-08 | Utensil electromagnetic shielding film's rigid -flex circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620851552.8U CN206118157U (en) | 2016-08-08 | 2016-08-08 | Utensil electromagnetic shielding film's rigid -flex circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206118157U true CN206118157U (en) | 2017-04-19 |
Family
ID=58512060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620851552.8U Expired - Fee Related CN206118157U (en) | 2016-08-08 | 2016-08-08 | Utensil electromagnetic shielding film's rigid -flex circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206118157U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106061107A (en) * | 2016-08-08 | 2016-10-26 | 广州杰赛科技股份有限公司 | Rigidity and flexibility combination circuit board possessing electromagnetic shielding film and manufacturing method thereof |
| CN107835561A (en) * | 2017-10-26 | 2018-03-23 | 深圳市中欧新材料有限公司 | A kind of wiring board comprising electromagnetic shielding film and preparation method thereof |
| CN111132531A (en) * | 2018-11-01 | 2020-05-08 | 江苏蓝沛新材料科技有限公司 | Wave-absorbing material and laminating process thereof |
-
2016
- 2016-08-08 CN CN201620851552.8U patent/CN206118157U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106061107A (en) * | 2016-08-08 | 2016-10-26 | 广州杰赛科技股份有限公司 | Rigidity and flexibility combination circuit board possessing electromagnetic shielding film and manufacturing method thereof |
| CN106061107B (en) * | 2016-08-08 | 2019-10-25 | 广州杰赛科技股份有限公司 | Has the rigid-flex circuit board and preparation method thereof of electromagnetic shielding film |
| CN107835561A (en) * | 2017-10-26 | 2018-03-23 | 深圳市中欧新材料有限公司 | A kind of wiring board comprising electromagnetic shielding film and preparation method thereof |
| CN107835561B (en) * | 2017-10-26 | 2020-03-27 | 深圳市中欧新材料有限公司 | Circuit board containing electromagnetic wave shielding film and manufacturing method thereof |
| CN111132531A (en) * | 2018-11-01 | 2020-05-08 | 江苏蓝沛新材料科技有限公司 | Wave-absorbing material and laminating process thereof |
| CN111132531B (en) * | 2018-11-01 | 2022-03-04 | 无锡蓝沛新材料科技股份有限公司 | Wave-absorbing material and laminating process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170419 Termination date: 20200808 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |