CN107557768A - Iron ecology copper facing water-based process material and its copper electroplating method - Google Patents
Iron ecology copper facing water-based process material and its copper electroplating method Download PDFInfo
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- CN107557768A CN107557768A CN201710611993.XA CN201710611993A CN107557768A CN 107557768 A CN107557768 A CN 107557768A CN 201710611993 A CN201710611993 A CN 201710611993A CN 107557768 A CN107557768 A CN 107557768A
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Abstract
The invention discloses a kind of iron ecology copper facing water-based process material, it is made up of the raw material of following mass percent：Wetting agent 0.1~5%, polarization agent 0.3~2%, neutral salt 6~15%, sulfate 5~10%, organic salt 5~15%, surplus are pure water；The formula of iron ecology copper facing water-based process material provided by the invention is reasonable, without external dc power supply, without heating source, using plated ironware as negative electrode, different potentials are there are using itself state, by way of ion exchange, so that the copper ion on liner copper drum dissociates into iron ecology copper facing water-based process material, and it is combined with plated ironware, to form one layer of fine and close copper plate on the surface of plated ironware, copper facing effect is good, and the thickness of copper plate is uniform, effectively lifts the combination property and service life of product；The processing step of other copper electroplating method is succinct, it is easy to accomplish, copper facing efficiency high, cost is low, energy-conserving and environment-protective, beneficial to wide popularization and application.
Description
Technical field
The present invention relates to ironware copper facing technical field, and in particular to a kind of iron ecology copper facing water-based process material and its copper facing
Method.
Background technology
Copper-plating technique has three, respectively cyanide electroplating, pyrophosphate copper plating and sulfuric acid in production using more at present
Salt copper-plating technique.
Cyanide copper plating is using earliest and widest copper-plating technique method.Plating solution is mainly by copper cyano complex and certain
The free cyanide composition of amount, in strong basicity.Because cyaniding root has very strong activation capacity and complexing power, so this plating
First feature of method is exactly that solution has certain deoil and activation capacity.Secondly as this plating solution applies complexing
Very capable cyanide, complex ion is set to be not easy to discharge, so, the cathodic polarization of tank liquor is very high, has excellent covering power
And covering power.But its consuming electric power is more, and cyanide copper plating there is toxicity it is larger the shortcomings that, while must also consider to give up
The processing of water and waste gas, is unfavorable for energy-conserving and environment-protective.
The composition of pyrophosphate copper plating liquid in pyrophosphate copper plating technique is simpler, and solution-stabilized, current efficiency is higher,
Dispersibility and covering power are good, and coating crystallization is careful, and can obtain thicker coating, and adoptable processing range is wider, nothing
Poison, exhausting is not required to, half bright coating can be obtained after adding brightener.Although its its current efficiency is very high, better than cyaniding
Copper-plated 70%, but easily there is burr in the coating after pyrophosphate copper plating, has influence on copper facing effect.
Acidiccopper plating has that composition is simple, the Surface flat of plating solution is good, current efficiency is high, sedimentation rate is fast, coating is flexible
It is bright and with other coat of metal adhesions are strong, work when nonirritant gas effusion etc. the advantages of.But it still needs outside
Power supply is connect, is unfavorable for energy-conserving and environment-protective.
The content of the invention
For above-mentioned deficiency, an object of the present invention is, there is provided one kind formula is reasonable, it is easy to accomplish, copper facing effect
It is good, the iron ecology copper facing water-based process material of energy-conserving and environment-protective.
The second object of the present invention is, there is provided a kind of energy quick Fabrication goes out above-mentioned iron ecology copper facing water-based process material
Copper electroplating method.The processing step of the copper electroplating method is succinct, it is easy to accomplish, copper facing efficiency high.
To achieve the above object, technical scheme provided by the present invention is：
A kind of iron ecology copper facing water-based process material, it is made up of the raw material of following mass percent：Wetting agent 0.1~
5%, polarization agent 0.3~2%, neutral salt 6~15%, sulfate 5~10%, organic salt 5~15%, surplus is pure water.
As a modification of the present invention, the wetting agent includes but are not limited to paregal O -15 or peregal O-25.
As a modification of the present invention, the polarization agent includes but are not limited to polyethylene glycol 400 or polyethylene glycol
2000。
As a modification of the present invention, the neutral salt includes but are not limited to sodium chloride, sodium sulphate or sodium nitrate.
As a modification of the present invention, the organic salt includes but are not limited to disodium EDTA or second two
Amine tetraacethyl tetrasodium salt.
A kind of copper electroplating method of above-mentioned iron ecology copper facing water-based process material, it comprises the following steps：
(1) preparation one uses liner copper drum made of copper product, and honeycomb hole is evenly distributed with the liner copper drum；
(2) copper-plated plated ironware will be needed to be put into liner copper drum；
(3) the liner copper drum equipped with plated ironware is put into described iron ecology copper facing water-based process material and soaked
Bubble, and constantly rotate liner copper drum so that plated ironware is constantly in contact with liner copper drum；And at this moment, plated ironware is
Negative electrode, itself state there are different potentials, by way of ion exchange so that the copper ion on liner copper drum dissociates
Into iron ecology copper facing water-based process material, and be combined with plated ironware, with formed on the surface of plated ironware one layer of densification,
Copper plate in uniform thickness.
Beneficial effects of the present invention are：The formula of iron ecology copper facing water-based process material provided by the invention is reasonable, does not have to
External dc power supply, without heating source, using plated ironware as negative electrode, different potentials are there are using itself state, by from
The mode that son exchanges so that the copper ion on liner copper drum dissociates into iron ecology copper facing water-based process material, and with being plated
Ironware is combined, and to form one layer of fine and close copper plate on the surface of plated ironware, copper facing effect is good, and the thickness of copper plate is equal
It is even, effectively lift the combination property and service life of product；The processing step of other copper electroplating method is succinct, it is easy to accomplish, copper facing
Efficiency high, cost is low, energy-conserving and environment-protective, beneficial to wide popularization and application.
With reference to embodiment, the present invention is further described.
Embodiment
Embodiment 1, a kind of iron ecology copper facing water-based process material that the present embodiment provides, it is by following mass percent
Raw material forms：Wetting agent 0.1%, polarization agent 1%, neutral salt 15%, sulfate 5%, organic salt 12%, pure water 66.9%.
In the present embodiment, preferably, the wetting agent is preferably paregal O -15 or peregal O-25.The polarization agent is excellent
Elect polyethylene glycol 400 or polyethylene glycol 2000 as.The neutral salt is preferably sodium chloride, sodium sulphate or sodium nitrate.It is described organic
Salt is preferably disodium EDTA or tetrasodium salt of EDTA.
A kind of copper electroplating method of above-mentioned iron ecology copper facing water-based process material, it comprises the following steps：
(1) preparation one uses liner copper drum made of copper product, and honeycomb hole is evenly distributed with the liner copper drum；
(2) copper-plated plated ironware will be needed to be put into liner copper drum；
(3) the liner copper drum equipped with plated ironware is put into described iron ecology copper facing water-based process material and soaked
Bubble, and constantly rotate liner copper drum so that plated ironware is constantly in contact with liner copper drum；And at this moment, plated ironware is
Negative electrode, itself state there are different potentials, by way of ion exchange so that the copper ion on liner copper drum dissociates
Into iron ecology copper facing water-based process material, and be combined with plated ironware, with formed on the surface of plated ironware one layer of densification,
Copper plate in uniform thickness.The processing step of overall copper electroplating method is succinct, it is easy to accomplish, copper facing efficiency high, cost is low, energy-conservation
Environmental protection.
Embodiment 2, a kind of the iron ecology copper facing water-based process material and its copper electroplating method that the present embodiment provides, itself and implementation
Example 1 is essentially identical, and distinctive points are, it is made up of the raw material of following mass percent：Wetting agent 4%, polarization agent 2% are neutral
Salt 6%, sulfate 8%, organic salt 15%, pure water 65%.
Embodiment 3, a kind of the iron ecology copper facing water-based process material and its copper electroplating method that the present embodiment provides, itself and implementation
Example 1 is essentially identical, and distinctive points are, it is made up of the raw material of following mass percent：Wetting agent 5%, polarization agent 0.3%, in
Property salt 12%, sulfate 10%, organic salt 5%, pure water 67.7%.
Embodiment 4, a kind of the iron ecology copper facing water-based process material and its copper electroplating method that the present embodiment provides, itself and implementation
Example 1 is essentially identical, and distinctive points are, it is made up of the raw material of following mass percent：Wetting agent 3%, polarization agent 1.5%, in
Property salt 10%, sulfate 7%, organic salt 14%, pure water 64.5%.
Embodiment 5, a kind of the iron ecology copper facing water-based process material and its copper electroplating method that the present embodiment provides, itself and implementation
Example 1 is essentially identical, and distinctive points are, it is made up of the raw material of following mass percent：Wetting agent 3.5%, polarization agent 1.8%,
Neutral salt 9%, sulfate 9%, organic salt 8%, pure water 68.7%.
Above-described embodiment is only the preferable embodiment of the present invention, and the present invention can not enumerate out whole embodiment party
Formula, all technical schemes using one of above-described embodiment, or the equivalent variations done according to above-described embodiment, protected in the present invention
In the range of shield.
The formula of iron ecology copper facing water-based process material provided by the invention is reasonable, without external dc power supply, without adding
Thermal source, using plated ironware as negative electrode, different potentials are there are using itself state, by way of ion exchange so that interior
Copper ion on lining copper drum dissociates into iron ecology copper facing water-based process material, and is combined with plated ironware, with plated
The surface of ironware forms one layer of fine and close copper plate, and copper facing effect is good, and the thickness of copper plate is uniform, effectively lifts the comprehensive of product
Performance and used life is closed, copper facing efficiency high, cost is low, energy-conserving and environment-protective.
The announcement and teaching of book according to the above description, those skilled in the art in the invention can also be to above-mentioned embodiment party
Formula is changed and changed.Therefore, the invention is not limited in embodiment disclosed and described above, to the present invention's
Some modifications and changes should also be as falling into the scope of the claims of the present invention.In addition, although used in this specification
Some specific terms, but these terms are merely for convenience of description, do not form any restrictions to the present invention.Such as the present invention
Described in above-described embodiment, using other materials obtained from same or similarity method and component and its copper electroplating method at this
In invention protection domain.
Claims (6)
1. a kind of iron ecology copper facing water-based process material, it is characterised in that it is made up of the raw material of following mass percent：Wetting
Agent 0.1~5%, polarization agent 0.3~2%, neutral salt 6~15%, sulfate 5~10%, organic salt 5~15%, surplus are pure
Water.
2. iron ecology copper facing water-based process material according to claim 1, it is characterised in that：The wetting agent is included but not
It is only limitted to paregal O -15 or peregal O-25.
3. iron ecology copper facing water-based process material according to claim 1, it is characterised in that：The polarization agent is included but not
It is only limitted to polyethylene glycol 400 or polyethylene glycol 2000.
4. iron ecology copper facing water-based process material according to claim 1, it is characterised in that：The neutral salt is included but not
It is only limitted to sodium chloride, sodium sulphate or sodium nitrate.
5. iron ecology copper facing water-based process material according to claim 1, it is characterised in that：The organic salt is included but not
It is only limitted to disodium EDTA or tetrasodium salt of EDTA.
6. the copper electroplating method of any described iron ecology copper facing water-based process material, its feature exist in a kind of Claims 1 to 5
In：It comprises the following steps：
(1) preparation one uses liner copper drum made of copper product, and honeycomb hole is evenly distributed with the liner copper drum；
(2) copper-plated plated ironware will be needed to be put into liner copper drum；
(3) the liner copper drum equipped with plated ironware is put into described iron ecology copper facing water-based process material and soaked,
And constantly rotate liner copper drum so that plated ironware is constantly in contact with liner copper drum；And at this moment, ironware is plated as the moon
Pole, itself state there are different potentials, by way of ion exchange so that the copper ion on liner copper drum dissociate to
In iron ecology copper facing water-based process material, and it is combined with plated ironware, to form one layer of densification, thickness on the surface of plated ironware
Spend uniform copper plate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710611993.XA CN107557768A (en) | 2017-07-25 | 2017-07-25 | Iron ecology copper facing water-based process material and its copper electroplating method |
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| CN201710611993.XA CN107557768A (en) | 2017-07-25 | 2017-07-25 | Iron ecology copper facing water-based process material and its copper electroplating method |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101328582A (en) * | 2007-06-22 | 2008-12-24 | 株式会社神户制钢所 | Copper plating method of wirelike material and coppered wire |
| CN101467281A (en) * | 2006-06-12 | 2009-06-24 | 松下电器产业株式会社 | Material for contact component or battery component, and battery using the same |
| CN101987359A (en) * | 2010-11-16 | 2011-03-23 | 蒋剑秋 | Preparation method of reduced copper coated iron composite powder by using wet method |
| CN102051606A (en) * | 2011-01-13 | 2011-05-11 | 山东大学 | Method for coating copper on surface of iron powder |
| CN201834999U (en) * | 2010-10-20 | 2011-05-18 | 北京中科三环高技术股份有限公司 | Rotary drum for surface treatment |
| CN102226274A (en) * | 2011-06-17 | 2011-10-26 | 山东大学 | Method of preparing anticorrosion coating for metallic ground grid |
-
2017
- 2017-07-25 CN CN201710611993.XA patent/CN107557768A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101467281A (en) * | 2006-06-12 | 2009-06-24 | 松下电器产业株式会社 | Material for contact component or battery component, and battery using the same |
| CN101328582A (en) * | 2007-06-22 | 2008-12-24 | 株式会社神户制钢所 | Copper plating method of wirelike material and coppered wire |
| CN201834999U (en) * | 2010-10-20 | 2011-05-18 | 北京中科三环高技术股份有限公司 | Rotary drum for surface treatment |
| CN101987359A (en) * | 2010-11-16 | 2011-03-23 | 蒋剑秋 | Preparation method of reduced copper coated iron composite powder by using wet method |
| CN102051606A (en) * | 2011-01-13 | 2011-05-11 | 山东大学 | Method for coating copper on surface of iron powder |
| CN102226274A (en) * | 2011-06-17 | 2011-10-26 | 山东大学 | Method of preparing anticorrosion coating for metallic ground grid |
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Application publication date: 20180109 |