CN102492968A - Copper plating method on brass base material - Google Patents
Copper plating method on brass base material Download PDFInfo
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- CN102492968A CN102492968A CN2011104450174A CN201110445017A CN102492968A CN 102492968 A CN102492968 A CN 102492968A CN 2011104450174 A CN2011104450174 A CN 2011104450174A CN 201110445017 A CN201110445017 A CN 201110445017A CN 102492968 A CN102492968 A CN 102492968A
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Abstract
The invention discloses a copper plating method on a brass base material, comprising the following processes in order: (1) oil removing process which successively contains degreasing and oil-removing process, a first electrolytic degreasing process and a second electrolytic degreasing process; (2) pickling process which successively contains activation and pickling processes; (3) nickel preplating process; (4) nickel plating process; (5) copper plating process; (6) passivation process; and (7) coating processing. The technology provided by the invention is simple. By the adoption of the technology, mass production cost is reduced. The processed product copper coating is compact and tight, is wear resistant and impact resistant, and has good conductivity and ductility. In addition, as the brass base material is used to replace a titanium copper material, the cost and weight of the material are greatly reduced, and shelf-life of the product is long.
Description
Technical field
The present invention relates to a kind of electroplating technology, especially relate to a kind of on brass substrate copper-plated technology.
Background technology
At present, be the satisfied needs of using, and reduce cost; People can be employed in usually that copper-plated mode makes the brass device can have better mechanical property, conductivity etc. on the brass substrate, yet, existing on brass substrate the copper coating complex procedures; Energy consumption is big; Efficient is low, and the conjugation of especially this technology formation coating and substrate surface is not good, causes its compactness, wear resistance and impact resistance all poor.
Summary of the invention
The object of the present invention is to provide a kind of operation succinct, with low cost, and the good copper coating on brass substrate of product performance, thereby overcome deficiency of the prior art.
For realizing the foregoing invention purpose, the present invention adopts following technical scheme:
A kind of copper coating on brass substrate comprises the following operation of carrying out successively:
(1) oil removing operation comprises the degreasing degreasing operation of carrying out successively, electrolytic degreasing operation and electrolytic degreasing operation for the second time for the first time, wherein,
Said degreasing degreasing operation is: be under 30-80 ℃ the condition in temperature, the workpiece that will form with brass substrate is in the commercially available low bubble degreaser solution of 2-140g/L behind the dipping in concentration, clean once with water more than;
Said first time, the electrolytic degreasing operation was: be under 35-45 ℃ the condition, to be 3-12A/dm with workpiece in current density in temperature
2, concentration be in the commercially available electrolytic degreasing agent solution of 65-100g/L dipping 10s above after, clean once with water more than;
Said second time, the electrolytic degreasing operation was: be under 35-45 ℃ the condition, to be 3-12A/dm with workpiece in current density in temperature
2, concentration be in the commercially available electrolytic degreasing agent solution of 65-100g/L dipping 10s above after, clean once with water more than;
(2) pickling process comprises the following steps of carrying out successively:
Activation: be under 10-50 ℃ the condition in temperature, after workpiece is flooded in the sulphuric acid soln of 25wt%-35wt%, clean once with water more than;
Pickling: be under 10-50 ℃ the condition in temperature, after workpiece is flooded in the sulphuric acid soln of 25wt%-35wt%, clean once with water more than;
(3) nickel preplating operation: at temperature 15-40 ℃, cathode current density is 5-10A/dm
2Condition under, be negative electrode with the workpiece, the nickel plate is an anode, impregnated in to contain in 250-350g/L single nickel salt and the 200-300g/L vitriolic solution to carry out nickel preplating, then clean once with water more than;
(4) nickel plating process: at temperature 50-60 ℃, cathode current density is 5-10A/dm
2Condition under; With the workpiece is negative electrode; The nickel plate is an anode; Impregnated in pH value 3.0-4.5, and contain in the solution of 500-600g/L nickel sulfamic acid, 10-15g/L cl ions, 35-55g/L boric acid, the commercially available nickel additive of 0.12-0.2g/L, 0.1-0.25g/L nickel brightening agent and carry out nickel plating, then clean once with water more than;
(5) copper facing operation: at temperature 10-30 ℃, cathode current density is 5-10A/dm
2Condition under; Workpiece is filled and led up in the solution of agent, the commercially available copper brightening agent of 0.01-0.05g/L, the commercially available copper additives of 2-6ml/L and is carried out copper facing in containing 200-300g/L copper sulfate, 40-60ml/L sulfuric acid, 0.06-0.12ml/L hydrochloric acid, the commercially available copper of 0.02-0.08g/L, then clean once with water more than;
(6) passivation procedure: under temperature 10-40 ℃ condition, brass substrate in pH value 10-14, and is contained in the solution of the commercially available copper protective agent of 10-20ml/L behind the dipping, clean once with water more than;
(7) epithelium is handled: under temperature 40-50 ℃ condition, workpiece is flooded the back in the normal temperature air dried in the solution of being made up of water-soluble closed lacquer of the gloomy JSP-of the grace of weight ratio 1: 6.5-7.5 and water, under temperature 60-80 ℃ condition, dry.
As embodiment preferred, wherein:
Said first time, the electrolytic degreasing operation was: be under 35-45 ℃ the condition, to be 5-10A/dm with workpiece in current density in temperature
2, concentration be in the commercially available electrolytic degreasing agent solution of 80-100g/L dipping 10s above after, clean once with water more than;
Said second time, the electrolytic degreasing operation was: be under 35-45 ℃ the condition, to be 3-12A/dm with workpiece in current density in temperature
2, concentration is in the commercially available electrolytic degreasing agent solution of 65-100g/L after the dipping 10s-60s, clean once with water more than.
Further, in this technology, clean more than three times with tap water to be meant more than the water cleaning once.
Above-mentioned technological design makes the inventive method more simple, has reduced the mass production cost; According to its product processed, its coating copper layer associativity is good, and compactness is good; Wear and shock-resistant has excellent conducting performance and mechanical property, and its copper plate also has good ductility; Can match in excellence or beauty with titanium copper, and cost is more cheap.The material that this processes is come out; Owing to replaced pure copper material with brass substrate; Greatly reduce material cost and weight thereof; And the copper layer that its fine and close associativity is good also has and the same good even superior conductivity of pure copper material, owing to increased anti-epithelium treatment process, the coating of workpiece surface can be kept for a long time.
Embodiment
Below in conjunction with a preferred embodiment technical scheme of the present invention is further described.
The related copper coating on brass substrate of present embodiment comprises the following operation of carrying out successively:
(1) oil removing operation comprises the degreasing degreasing operation of carrying out successively, electrolytic degreasing operation and electrolytic degreasing operation for the second time for the first time, wherein,
Said degreasing degreasing operation is: be under 30-80 ℃ the condition in temperature, the workpiece that will form with brass substrate is in the commercially available low bubble degreaser solution of 2-140g/L behind the dipping in concentration, cleans three times with tap water;
Said first time, the electrolytic degreasing operation was: be under 35-45 ℃ the condition, to be 5-10A/dm with workpiece in current density in temperature
2, concentration be in the commercially available electrolytic degreasing agent solution of 80-100g/L dipping 10s above after, clean three times with tap water;
Said second time, the electrolytic degreasing operation was: be under 35-45 ℃ the condition, to be 3-12A/dm with workpiece in current density in temperature
2, concentration is in the commercially available electrolytic degreasing agent solution of 65-100g/L after the dipping 10s-60s, clean three times with tap water;
(2) pickling process comprises the following steps of carrying out successively:
Activation: be under 10-50 ℃ the condition in temperature, after workpiece is flooded in the sulphuric acid soln of 25wt%-35wt%, clean three times with tap water;
Pickling: be under 10-50 ℃ the condition in temperature, after workpiece is flooded in the sulphuric acid soln of 25wt%-35wt%, clean three times with tap water;
(3) nickel preplating operation: at temperature 15-40 ℃, cathode current density is 5-10A/dm
2Condition under, be negative electrode with the workpiece, the nickel plate is an anode, impregnated in to contain in 250-350g/L single nickel salt and the 200-300g/L vitriolic solution to carry out nickel preplating, then cleans three times with tap water;
(4) nickel plating process: at temperature 50-60 ℃, cathode current density is 5-10A/dm
2Condition under; With the workpiece is negative electrode; The nickel plate is an anode; Impregnated in pH value 3.0-4.5, and contain in the solution of 500-600g/L nickel sulfamic acid, 10-15g/L cl ions, 35-55g/L boric acid, the commercially available nickel additive of 0.12-0.2g/L, 0.1-0.25g/L nickel brightening agent and carry out nickel plating, then clean three times with tap water;
(5) copper facing operation: at temperature 10-30 ℃, cathode current density is 5-10A/dm
2Condition under; Workpiece is filled and led up in the solution of agent, the commercially available copper brightening agent of 0.01-0.05g/L, the commercially available copper additives of 2-6ml/L and carried out copper facing in containing 200-300g/L copper sulfate, 40-60ml/L sulfuric acid, 0.06-0.12ml/L hydrochloric acid, the commercially available copper of 0.02-0.08g/L, then clean three times with tap water;
(6) passivation procedure: under temperature 10-40 ℃ condition, workpiece in pH value 10-14, and is contained in the solution of the commercially available copper protective agent of 10-20ml/L behind the dipping, clean three times with tap water;
(7) epithelium is handled: under temperature 40-50 ℃ condition, workpiece is flooded the back in the normal temperature air dried in the solution of being made up of water-soluble closed lacquer of the gloomy JSP-of the grace of weight ratio 1: 6.5-7.5 and water, under temperature 60-80 ℃ condition, dry.
(8) QC check: detect coating film thickness, outward appearance etc. on the workpiece, and select qualified workpiece.
Need to prove:
Aforementioned low bubble degreaser can be selected the commercially available all kinds of degreasers that are suitable for cleaning the brass workpiece surface for use; As: the model that Dongguan City scape source environmentfriendly products ltd produces is the low natron property electrolytic degreasing powder of the low temperature of
EC-1123 LF; The model that the many Xiang metal finishing of Dongguan City Science and Technology Ltd. produces is the low bubble spray degreaser of H-631; " development of the low bubble of low alkali degreaser under the normal temperature " (" new technology novel process "; 2004 04 phases) mentioned low bubble degreaser; The model that Henan provincial highway purifying worker technology ltd produces is the low bubble of normal-temperature efficient degreaser of DC-6 or the like, but is not limited thereto.
Aforementioned electric is separated the commercially available all kinds of electrolytic degreasing agent that are suitable for cleaning the brass workpiece surface of the optional usefulness of degreaser; As: close that to be full of model that model that fine chemistry industry (Shenzhen) ltd produces produces for low-temperature electrolytic degreaser, the Australia general metal finishing Science and Technology Ltd. of
E-202 be the low bubble of the low temperature electrolytic degreasing agent of EC-1123LF, electrolytic degreasing agent of model WP-751 that the abundant full Industrial Co., Ltd. in Shenzhen produces or the like, but be not limited thereto.
The effect of aforementioned copper additives, nickel additive is to make surface hardening, good, the good stability of bright damp degree, and this is those skilled in the art's conventions.Therefore; The nickel additive can be selected commercially available all kinds of nickel additives for use; As: the model that Di Sien electroless plating (Shenzhen) ltd produces is the chemical nickel-plating plating solution of DSE-2; The HN chemical nickel-plating additive that the good prosperous chemical industry in Jinan is produced, XG-400ENT chemical nickel-plating additive that technology ltd in Changzhou rising sun light metallic surface produces or the like, but be not limited thereto.And copper additives can be selected commercially available all kinds of copper additives for use; The acid copper-plating midbody ZPS-ZPS (3-(benzothiazole-2-sulfydryl)-propane sulfonic acid sodium) that produces like the anti-specialization worker in: Wuhan hundred ltd; " acidic copper plating additive progress " (" electroplate and cover with paint, lacquer, colour wash, etc. "; 29 1 phases of volume) all kinds of organic copper additives of mentioning or the like, but be not limited thereto.
The main effect of aforementioned copper protective agent is to prevent the coating oxidation; It can adopt commercially available all kinds of copper protective agents, copper passivator etc.; The model of producing like atropic science and technology (ATOTECH) is that the model that copper protective agent, the Shanghai female edge Information technology ltd of SuperDip Cu 1000 sells is copper protective agent, " application of copper protective agent on the high-voltage electrical apparatus product " (" electroplating and environmental protection " of ENTEK CU-56; 2011 03 phases) copper protective agent of being addressed; The model that Haining Imtech of section produces is copper protective agent of Cupro Shield Cu18-IV or the like, but is not limited thereto.
Aforementioned nickel brightening agent can be selected commercially available all kinds of nickel brightening agents for use; As: " research of chemical nickel-plating brightener " (" material protection ";, the 6th phase in 2002) the nickel brightening agent of mentioning, the YZ-4 type brightener for chemical nickel plating that the long-range pharmaceutcal corporation, Ltd in Hubei etc. produce; Xmls-2 type brightener for chemical nickel plating that this electroless plating ltd of Lyceum Lay produces or the like, but be not limited thereto.
Aforesaid copper is filled and led up agent and can be selected for use commercially available all kinds of copper to fill and lead up agent; As: the Jiangsu dream gets the sour copper high-performance of electroplating chemical article ltd product and fills and leads up agent (CPSS); Akita 510 height that Japan Anhua becomes to produce are filled and led up the copper sulfate brightening agent; The sour copper additives of TRUMP (trump) that Germany VILUX company produces, the 910 serial acid bright copper plating additives that Dongguan one sail product chemical industry ltd produces etc., but be not limited thereto.
Aforesaid copper brightening agent can be selected commercially available all kinds of copper brightening agents for use; As: the sour bronzing agent of big sour bronzing agent 210 types of Japan with product; Sour copper ULTRA series brightening agent that the copper brightening agent that the precious refined grinding of Dongguan City Science and Technology Ltd. produces, U.S.'s Atotech are produced or the like, but be not limited thereto.
The workpiece that adopts processes of the present invention to come out, its copper coating layer and base material combine fastening densification, and have good wear resistance; Impact resistance and conductivity; The copper plate surface has good ductility, and greatly reduces material cost, and can match in excellence or beauty with titanium copper.Simultaneously, technology of the present invention has also reduced production cost, and shelf life of products is long, can be widely used in electron trade etc.
Although embodiment of the present invention are open as above; But for being familiar with those skilled in the art; Can easily realize other modification, therefore under the universal that does not deviate from claim and equivalency range and limited, the legend that the present invention is not limited to specific details and illustrates here and describe.
Claims (3)
1. a copper coating on brass substrate is characterized in that, it comprises the following operation of carrying out successively:
(1) oil removing operation comprises the degreasing degreasing operation of carrying out successively, electrolytic degreasing operation and electrolytic degreasing operation for the second time for the first time, wherein,
Said degreasing degreasing operation is: be under 30-80 ℃ the condition in temperature, the workpiece that will process with brass substrate is in the commercially available low bubble degreaser solution of 2-140g/L behind the dipping in concentration, clean once with water more than;
Said first time, the electrolytic degreasing operation was: be under 35-45 ℃ the condition, to be 3-12A/dm with workpiece in current density in temperature
2, concentration be in the commercially available electrolytic degreasing agent solution of 65-100g/L dipping 10s above after, clean once with water more than;
Said second time, the electrolytic degreasing operation was: be under 35-45 ℃ the condition, to be 3-12A/dm with workpiece in current density in temperature
2, concentration be in the commercially available electrolytic degreasing agent solution of 65-100g/L dipping 10s above after, clean once with water more than;
(2) pickling process comprises the following steps of carrying out successively:
Activation: be under 10-50 ℃ the condition in temperature, after workpiece is flooded in the sulphuric acid soln of 25wt%-35wt%, clean once with water more than;
Pickling: be under 10-50 ℃ the condition in temperature, after workpiece is flooded in the sulphuric acid soln of 25wt%-35wt%, clean once with water more than;
(3) nickel preplating operation: at temperature 15-40 ℃, cathode current density is 5-10A/dm
2Condition under, be negative electrode with the workpiece, the nickel plate is an anode, impregnated in to contain in 250-350g/L single nickel salt and the 200-300g/L vitriolic solution to carry out nickel preplating, then clean once with water more than;
(4) nickel plating process: at temperature 50-60 ℃, cathode current density is 5-10A/dm
2Condition under; With the workpiece is negative electrode; The nickel plate is an anode; Impregnated in pH value 3.0-4.5, and contain in the solution of 500-600g/L nickel sulfamic acid, 10-15g/L cl ions, 35-55g/L boric acid, the commercially available nickel additive of 0.12-0.2g/L, 0.1-0.25g/L nickel brightening agent and carry out nickel plating, then clean once with water more than;
(5) copper facing operation: at temperature 10-30 ℃, cathode current density is 5-10A/dm
2Condition under; Workpiece is filled and led up in the solution of agent, the commercially available copper brightening agent of 0.01-0.05g/L, the commercially available copper additives of 2-6ml/L and is carried out copper facing in containing 200-300g/L copper sulfate, 40-60ml/L sulfuric acid, 0.06-0.12ml/L hydrochloric acid, the commercially available copper of 0.02-0.08g/L, then clean once with water more than;
(6) passivation procedure: under temperature 10-40 ℃ condition, workpiece in pH value 10-14, and is contained in the solution of the commercially available copper protective agent of 10-20ml/L behind the dipping, clean once with water more than;
(7) epithelium is handled: under temperature 40-50 ℃ condition, flood in the solution of being made up of the water-soluble closed lacquer of the gloomy JSP-of the grace of weight ratio 1: 6.5-7.5 and water afterwards in the normal temperature air dried, under temperature 60-80 ℃ condition, dry.
2. copper coating on brass substrate according to claim 1 is characterized in that,
Said first time, the electrolytic degreasing operation was: be under 35-45 ℃ the condition, to be 5-10A/dm with workpiece in current density in temperature
2, concentration be in the commercially available electrolytic degreasing agent solution of 80-100g/L dipping 10s above after, clean once with water more than;
Said second time, the electrolytic degreasing operation was: be under 35-45 ℃ the condition, to be 3-12A/dm with workpiece in current density in temperature
2, concentration is in the commercially available electrolytic degreasing agent solution of 65-100g/L after the dipping 10s-60s, clean once with water more than.
3. copper coating on brass substrate according to claim 1 and 2 is characterized in that, in this technology, cleans more than three times to be meant more than the water cleaning once with tap water.
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103334151A (en) * | 2013-07-22 | 2013-10-02 | 苏州昕皓新材料科技有限公司 | Method for plating nickel by improving additive adding sequence |
| CN103343368A (en) * | 2013-06-22 | 2013-10-09 | 兰溪市卓越电子有限公司 | Electroplating pretreatment degreasing method |
| CN103388172A (en) * | 2013-07-22 | 2013-11-13 | 苏州昕皓新材料科技有限公司 | Rapid determining method for performances of an electroplating additive |
| CN106011838A (en) * | 2016-07-12 | 2016-10-12 | 扬州禾基塑业有限公司 | Novel copper belt production technology |
| CN109183087A (en) * | 2018-10-24 | 2019-01-11 | 尼尔金属(苏州)有限公司 | A method of the nickel plating on copper and copper alloy coiled material |
| CN109267127A (en) * | 2018-08-30 | 2019-01-25 | 扬州虹扬科技发展有限公司 | A kind of Copper base material treatment fluid and pretreating process |
| CN109881227A (en) * | 2019-03-27 | 2019-06-14 | 珠海市玛斯特锌镍加工有限公司 | A kind of rack plating product closing aftertreatment technology |
| CN109881228A (en) * | 2019-03-27 | 2019-06-14 | 珠海市玛斯特锌镍加工有限公司 | A kind of closing process of part |
| CN109957822A (en) * | 2019-05-05 | 2019-07-02 | 东莞市康圣精密合金材料有限公司 | Copper alloy electroplating technology |
| CN110029379A (en) * | 2019-05-05 | 2019-07-19 | 东莞市康圣精密合金材料有限公司 | Ultra-wide stainless steel materials nickel plating appearance optimization technique |
| CN112323107A (en) * | 2020-09-16 | 2021-02-05 | 歌尔科技有限公司 | Brass material with nano rare earth nickel coating and preparation method thereof |
| CN113373485A (en) * | 2021-04-19 | 2021-09-10 | 辉门环新（安庆）粉末冶金有限公司 | Powder metallurgy copper plating process |
| CN113463144A (en) * | 2021-06-29 | 2021-10-01 | 惠州市安泰普表面处理科技有限公司 | Method for plating nickel on surface of brass substrate |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103343368A (en) * | 2013-06-22 | 2013-10-09 | 兰溪市卓越电子有限公司 | Electroplating pretreatment degreasing method |
| CN103334151A (en) * | 2013-07-22 | 2013-10-02 | 苏州昕皓新材料科技有限公司 | Method for plating nickel by improving additive adding sequence |
| CN103388172A (en) * | 2013-07-22 | 2013-11-13 | 苏州昕皓新材料科技有限公司 | Rapid determining method for performances of an electroplating additive |
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| CN109267127B (en) * | 2018-08-30 | 2023-09-05 | 扬州虹扬科技发展有限公司 | Copper substrate treatment fluid and pretreatment process |
| CN109183087A (en) * | 2018-10-24 | 2019-01-11 | 尼尔金属(苏州)有限公司 | A method of the nickel plating on copper and copper alloy coiled material |
| CN109881227A (en) * | 2019-03-27 | 2019-06-14 | 珠海市玛斯特锌镍加工有限公司 | A kind of rack plating product closing aftertreatment technology |
| CN109881228A (en) * | 2019-03-27 | 2019-06-14 | 珠海市玛斯特锌镍加工有限公司 | A kind of closing process of part |
| CN109957822A (en) * | 2019-05-05 | 2019-07-02 | 东莞市康圣精密合金材料有限公司 | Copper alloy electroplating technology |
| CN110029379A (en) * | 2019-05-05 | 2019-07-19 | 东莞市康圣精密合金材料有限公司 | Ultra-wide stainless steel materials nickel plating appearance optimization technique |
| CN112323107A (en) * | 2020-09-16 | 2021-02-05 | 歌尔科技有限公司 | Brass material with nano rare earth nickel coating and preparation method thereof |
| CN113373485A (en) * | 2021-04-19 | 2021-09-10 | 辉门环新（安庆）粉末冶金有限公司 | Powder metallurgy copper plating process |
| CN113463144A (en) * | 2021-06-29 | 2021-10-01 | 惠州市安泰普表面处理科技有限公司 | Method for plating nickel on surface of brass substrate |
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Application publication date: 20120613 |