CN107527848B - Mechanical arm and substrate grabbing method - Google Patents
Mechanical arm and substrate grabbing method Download PDFInfo
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- CN107527848B CN107527848B CN201610443457.9A CN201610443457A CN107527848B CN 107527848 B CN107527848 B CN 107527848B CN 201610443457 A CN201610443457 A CN 201610443457A CN 107527848 B CN107527848 B CN 107527848B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
- B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a mechanical arm and a substrate grabbing method, namely, a substrate in a substrate storage area is picked and placed through the mechanical arm. Wherein, the manipulator includes: the manipulator disc, the contact pad and the adsorption device are arranged on the manipulator disc, and when the manipulator takes and places the substrate, the thickness of the manipulator in the substrate storage area is the sum of the thickness of the manipulator disc and the thickness of the contact pad. Compared with the existing mechanical arm, the mechanical arm provided by the invention has the advantages that when the mechanical arm is used for taking and placing the substrate, the occupied space in the substrate storage area is smaller, so that the risk of scratching the substrate can be reduced on the basis of not changing the original precision of the mechanical arm.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a mechanical arm and a substrate grabbing method.
Background
In the field of semiconductor manufacturing, a robot arm is generally used to transfer a substrate between a substrate storage area and a processing apparatus to achieve automated production, since the robot arm can receive a command and perform a corresponding operation according to the received command.
For example, during processing of wafers, the wafers are placed in cassettes (cassettes), and a robot arm is used to pick up the wafers in the cassettes and transfer the wafers to the processing equipment. Fig. 1 is a schematic structural diagram of a prior art robot gripping a wafer in a cassette, and as shown in fig. 1, the cassette 30 is provided with a plurality of slots 31 for bearing the wafer, when the robot 20 is picking and placing the wafer, the wafer needs to be aligned with a gap between two adjacent slots 31 and moved into the gap to pick and place the wafer. However, since the distance a between two adjacent slots 31 in the cassette 10 is small and the robot 20 has a certain thickness b, the range of allowable displacement deviation is limited when the robot 20 picks up and places wafers, and when the displacement deviation of the robot is too large, the robot is likely to scratch the wafers. In particular, as the semiconductor industry advances, the size of the cassette tends to decrease, which further increases the risk of the robot scratching the wafer. Meanwhile, due to the limitation of thickness, the use of the existing mechanical arm is also greatly limited.
Disclosure of Invention
The invention aims to provide a mechanical arm and a substrate grabbing method, so as to solve the problem that the mechanical arm scratches a substrate when the mechanical arm takes and places the substrate.
In order to solve the above technical problem, the present invention provides a robot arm for picking and placing a substrate located in a substrate storage area, wherein the robot arm includes: the manipulator disc, the contact pad and the adsorption device are arranged on the manipulator disc, the contact pad is used for supporting a substrate, the adsorption device is used for adsorbing and fixing the substrate, and when the manipulator takes and places the substrate, the thickness of the manipulator in the substrate storage area is the sum of the thickness of the manipulator disc and the thickness of the contact pad.
Optionally, the adsorption device is a movable adsorption device, and when the robot arm picks and places the substrate, the adsorption device moves to the outside of the substrate storage area.
Optionally, the suction device includes at least one suction cup and a driving device for driving the suction cup to move, and the suction cup moves to an edge position of the substrate to suck and fix the substrate.
Optionally, the adsorption device includes two suction cups, and when the substrate is adsorbed and fixed, the two suction cups are respectively located on the upper surface and the lower surface of the substrate.
Optionally, the shape of the chuck is set according to the shape of the substrate.
Optionally, the substrate is circular, and the suction cup is arc-shaped.
Optionally, the contact area between the sucker and the substrate is 2-5 mm from the edge to the center of the substrate.
Optionally, the adsorption device is fixedly disposed on the robot disc, and fixes the substrate by adsorbing the lower surface of the substrate, wherein the thickness of the adsorption device is smaller than that of the contact pad.
Optionally, the suction device comprises a suction cup.
Optionally, the suction cup has at least one vent hole and is connected with a vacuum pumping device through the vent hole.
Optionally, the contact pad is rectangular, circular or elliptical.
Optionally, the thickness of the contact pad is 1mm to 2 mm.
Another object of the present invention is to provide a substrate grabbing method, including:
providing a mechanical arm as described above, moving the mechanical arm to the substrate storage area, wherein the thickness of the mechanical arm in the substrate storage area is the sum of the thickness of the mechanical arm disc and the thickness of the contact pad, and supporting the substrate by using the contact pad;
and adsorbing and fixing the substrate by adopting an adsorption device.
Optionally, the adsorption device is a movable adsorption device, and in the process that the substrate is supported on the mechanical arm and moved out of the substrate storage area, the adsorption device is moved to the position of the substrate and adsorbs and fixes the substrate.
Optionally, the adsorption device is fixedly disposed on the robot disc, and a thickness of the adsorption device is smaller than a thickness of the contact pad, and the adsorption device adsorbs a lower surface of the fixed substrate.
In the robot arm provided by the invention, the substrate is fixed through the adsorption device, so that the substrate can be stably supported on the robot arm. And when the mechanical arm is adopted to take and place the substrate, the existence of the adsorption device can not increase the space occupied by the mechanical arm in the substrate storage area, so that the total thickness of the mechanical arm in the substrate storage area only comprises the thickness of the mechanical arm disc and the thickness of the contact pad, namely, the occupied space of the mechanical arm in the substrate storage area is reduced, the allowable displacement deviation range of the mechanical arm is larger, and the risk of scratching the substrate can be reduced on the basis of not changing the original precision of the mechanical arm.
Furthermore, the robot arm provided by the invention occupies a smaller space when taking and placing the substrate, so that the robot arm provided by the invention can be matched with the robot arm to take and place the substrate under the condition that the space of the substrate storage area is smaller, for example, aiming at a cassette with a smaller size, so as to ensure the safety of taking and placing the substrate.
Drawings
FIG. 1 is a schematic diagram illustrating a wafer in a cassette grasped by a robot in the prior art;
FIG. 2 is a schematic view of a wafer carried by a robot in the prior art;
FIG. 3 is a schematic structural diagram of a robot according to a first embodiment of the present disclosure;
FIG. 4 is a schematic structural diagram of a robot carrying substrate according to an embodiment of the invention
FIG. 5 is a schematic structural diagram of a robot according to a second embodiment of the present disclosure;
fig. 6 is a schematic flow chart illustrating a substrate grabbing method according to the present invention;
fig. 7 is a schematic structural view illustrating a substrate in a cassette being grabbed by a robot according to the present invention.
Detailed Description
As discussed in the background, in the semiconductor industry, a robot is typically used to pick and place substrates in a substrate storage area. For example, during processing of wafers, the wafers are typically placed in cassettes and the wafers are picked and placed in the cassettes by a robot. However, due to the limitation of the distance a between two adjacent slots in the cassette and the thickness b of the robot arm, the robot arm is likely to scratch the wafer when picking and placing the wafer. For this reason, it is certainly possible to increase the range of the displacement deviation that the robot arm can allow to generate by directly reducing the thickness of the robot arm, thereby reducing the risk of the robot arm scratching the substrate. However, the thickness of the robot arm cannot be reduced without any limitation without changing the structure of the robot arm.
Correspondingly, taking a robot arm for grabbing a wafer as an example, fig. 2 is a schematic structural diagram of a robot arm in the prior art for carrying a wafer, and referring to fig. 2, the robot arm includes a robot disc 21 and a supporting block 22 disposed on the robot disc 21, the supporting block 22 has a concave platform thereon, the concave platform forms a plane 22a and a plane 22b, the plane 22a is used for supporting the wafer 10, and the plane 22b is used for clamping the wafer 10 to prevent the wafer from shaking. As shown in fig. 2, the robot disc 21 has a certain thickness b1 to ensure that the whole wafer 10 can be loaded; next, within the range of the deformation amount of the wafer 10, in order to ensure that the central region of the wafer 10 does not contact the robot disc 21 during the process of supporting the wafer 10, the supporting block 22 also has a certain thickness b 2. In this way, it is difficult to reduce the thickness of the robot arm 20 without changing the structure of the robot arm 20.
Therefore, the inventor of the application provides a mechanical arm, and the mechanical arm can improve the problem that the mechanical arm scratches the substrate on the basis of ensuring that the substrate can be supported and fixed.
The robot and the method for gripping a substrate according to the present invention will be described in detail with reference to the accompanying drawings and embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Example one
Fig. 3 is a schematic structural diagram of a robot according to a first embodiment of the present invention, and fig. 4 is a schematic structural diagram of a substrate carried by the robot according to the first embodiment of the present invention. As shown in fig. 3 and 4, the robot arm 200 includes: a robot disc 210, a contact pad 220 disposed on the robot disc 210, and an adsorption device 230. Wherein the robot disc 210 bears the weight of the entire substrate 100 and has a certain thickness c 1; the contact pad 220 contacts and supports the substrate 100 to reduce the contact area between the substrate 100 and the robot disc 210, and the contact pad 220 also has a certain thickness c2 in consideration of the deformation of the substrate 100; the suction device 230 is used for sucking and fixing the substrate 100, and preventing the substrate from shaking. When the robot 200 takes and places the substrate 100 in the substrate storage area, the thickness c of the robot located in the substrate storage area is the sum of the thickness c1 of the robot disc and the thickness c2 of the contact pad.
Compared with the prior art, when the robot provided by the invention is used for picking and placing the substrate, the thickness c of the robot 200 in the substrate storage area only comprises the thickness c1 of the robot disc 210 and the thickness c2 of the contact pad, so that the occupied space of the robot 200 in the substrate storage area can be reduced, the allowable range of displacement deviation of the robot 200 is larger, and the risk of scratching the substrate 100 can be reduced on the basis of not changing the original precision of the robot 200. Furthermore, since the robot arm 200 provided by the present invention occupies a smaller space when picking and placing the substrate 100, the robot arm provided by the present invention can be used to pick and place the substrate in cooperation with a smaller cassette, for example, to further ensure the safety of picking and placing the substrate. In addition, in the robot arm 200 provided by the present invention, the substrate 100 is fixed by the adsorption device 230, so as to prevent the substrate from shaking during the transferring process, i.e., the robot arm can stably support the substrate, and can reduce the risk of scratching the substrate when the robot arm selects the substrate.
In this embodiment, the robot disc 210 may have a Y-shaped structure, contact pads 220 are disposed on three vertices of the Y-shaped structure, and an adsorption device 230 is disposed on one of the vertices.
With continued reference to fig. 3 and 4, the suction device 230 is a movable suction device, and the suction device 230 moves along a moving direction relative to the robot arm 200, i.e. in this embodiment, when the robot arm 200 moves along a positive direction of the X-axis, the corresponding suction device 230 moves along a negative direction of the X-axis. When the robot 200 is used to pick and place the substrate, the position of the adsorption device 230 is moved so that the adsorption device 230 is always located outside the substrate storage area, thereby eliminating the influence of the adsorption device 230 on the occupied space of the robot 200 in the substrate storage area.
Further, the suction device 230 includes at least one suction cup 231 and a driving device 232 for driving the suction cup 231 to move. After the substrate 100 is loaded on the robot 200, the driving device 232 drives the chuck 231 to move to the edge position of the substrate 100 to fix the substrate 100. In this embodiment, the suction device 230 has two suction cups 231, and when the substrate is sucked and fixed, the two suction cups 231 are respectively located on the upper surface and the lower surface of the substrate. Further, the suction cup 231 has at least one vent hole and is connected to a vacuum pumping device (not shown in the figure) through the vent hole, that is, the vacuum pumping device pumps the gas between the suction cup 231 and the substrate 100 through the vent hole, so that a vacuum state is formed between the suction cup 231 and the substrate 100, and the substrate is sucked and fixed. Preferably, the shape of the suction cup 231 matches the basic shape. For example, in the embodiment, the robot 200 is used for picking and placing a wafer, that is, the substrate is circular, and the corresponding suction cup 231 may be circular arc. As shown in fig. 3, the circular arc-shaped chuck 231 sucks and fixes the substrate 100 along the edge of the substrate 100 within an allowable area range, wherein a contact area g between the chuck 231 and the substrate 100 may be within a range of 2-5 mm from the edge to the center of the substrate 100, so as to avoid affecting an effective area in the substrate 100, such as an area for forming chips in a wafer.
Referring to fig. 3 and 4, in the present embodiment, four contact pads 220 are disposed on the robot tray 210, and the four positions of the substrate 100 are supported by the four contact pads 220, so that the substrate 100 is prevented from contacting the robot tray 210, and the robot tray 210 is prevented from rubbing against the lower surface of the substrate to scratch the substrate. The contact pad 220 may have any shape, such as a rectangle, a circle, or an oval. In this embodiment, the contact pad 220 is circular, and preferably, the diameter of the circular contact pad 220 may be 8-12 mm, because if the area of the contact pad 220 is too small, a large contact stress is generated at a position of the substrate 100 contacting the contact pad 220, so that the formation amount of the substrate 100 is increased; if the contact pad 220 has an excessively large area, the contact area with the substrate 100 is correspondingly increased. Preferably, the thickness of the contact pad 220 may be 1-2 mm in consideration of the deformation amount of the substrate, that is, the contact pad 220 has a certain thickness, so that the problem that the middle area of the substrate contacts the robot disc 210 and is scratched by the robot disc 210 due to the deformation of the substrate can be avoided. In addition, to improve the problem that the substrate may be scratched due to friction between the contact pad 220 and the substrate, the contact pad 220 may be made of polyetheretherketone (Peek). On one hand, the Peek material has good compression resistance, so that the problem that the contact pad 220 cannot support the substrate due to compression deformation does not occur; on the other hand, the Peek material has a self-lubricating effect, so that the contact pad 220 made of Peek has a lower friction coefficient with the substrate, and the risk of scratching the substrate by the contact pad 220 can be reduced.
Example two
Fig. 5 is a schematic structural diagram of a robot according to a second embodiment of the present invention. As shown in fig. 5, the difference from the first embodiment is that, in the present embodiment, the adsorption device 230 'is fixedly disposed on the robot disc 210 and adsorbs the lower surface of the substrate 100 to fix the substrate 100, wherein the thickness of the adsorption device 230' is smaller than that of the contact pad 220. That is, in the embodiment, since the adsorption device 230 'is used for adsorbing the lower surface of the substrate 100, when the contact pad 220 supports the substrate 100, the adsorption device 230' is correspondingly located below the substrate 100, and therefore, the adsorption function of the substrate 100 can still be achieved by directly fixing the adsorption device 230 'on the robot disc 210, and the structure of the robot 200' is simpler. In addition, since the thickness of the suction device 230 'is less than the thickness of the contact pad 220, the presence of the suction device 230' does not affect the overall thickness of the robot 200 ', and the thickness c of the robot 200' in the substrate storage area is still the sum of the thickness c1 of the robot tray 210 and the thickness c2 of the contact pad 220 when the pick-and-place module 100 is taken and placed.
Specifically, the suction device 230 ' includes at least one suction cup 231 ', and the suction cup 231 ' may be connected to a vacuum device (not shown) to suck and fix the substrate 100 by vacuum, similar to the embodiment. Accordingly, in this embodiment, at least one vent hole 232 'may be formed in the chuck 231', and a vacuum pumping device may pump gas between the chuck 230 'and the substrate through the vent hole 232'.
In addition, in the embodiment, since the adsorption device 230 ' adsorbs the lower surface of the substrate, and generally the lower surface of the substrate has less influence on the processing of the substrate, for example, during the processing of the wafer, the upper surface of the substrate is the main processing area when the chip is formed, therefore, the adsorption device 230 ' may be disposed in any area of the robot disk 210, for example, in the central area of the robot disk 210, or, similarly to the embodiment, the adsorption device 230 ' may be disposed on one vertex of the Y-shaped robot disk 210, and may have a shape and a size similar to the embodiment.
Of course, in order to further enhance the fixing strength of the suction device 230 ' to the substrate 100, a plurality of suction pads 231 ' may be provided on the robot hand 210, and the substrate 100 may be sucked and fixed by the suction pads 231 '. Alternatively, the fixing strength to the substrate 100 may be enhanced by increasing the area of the suction pad 231'.
In addition, according to the mechanical arm, the invention also provides a method for grabbing the substrate. Fig. 6 is a schematic flow chart of a substrate grabbing method provided by the present invention, and as shown in fig. 6, the substrate grabbing method includes:
step S01, providing a robot arm as described above, moving the robot arm to the substrate storage area, wherein the thickness of the robot arm in the substrate storage area is the sum of the thickness of the robot disc and the thickness of the contact pad, and supporting the substrate to be selected by using the contact pad in the robot arm;
in step S02, the substrate is fixed by suction using a suction device.
Compared with the traditional method for grabbing the substrate by using the mechanical arm, in the grabbing method for the substrate provided by the invention, the thickness of the mechanical arm moving to the substrate storage area only comprises the thickness of the mechanical arm disc and the thickness of the contact pad, so that the space occupied by the mechanical arm in the substrate storage area is smaller, namely, the allowable displacement deviation range of the mechanical arm during substrate taking and placing can be correspondingly increased, and the problem that the mechanical arm scratches the substrate can be solved under the condition that the positioning accuracy of the mechanical arm is not changed. In addition, the substrate grabbing method further comprises the step of adsorbing and fixing the substrate by adopting an adsorption device so as to ensure that the substrate can be stably supported in the conveying process.
The substrate grabbing method provided by the present invention is further described in detail below by taking the substrate in the grabbing cassette as an example. Fig. 7 is a schematic structural view illustrating a substrate in a cassette being grabbed by a robot according to the present invention.
Referring to fig. 6 and 7, in step S01, the robot 200 is moved into the cassette 30 and the substrate is supported by the contact pads. The cassette 30 is provided with a plurality of card slots 31 for carrying the substrate 100. Specifically, the robot arm 200 moves along the X direction to the gap between two adjacent card slots 31, and the contact pad 220 on the robot arm 200 contacts and supports the substrate by adjusting the height of the robot arm 200.
As described in the background, the size of the cassette 30 tends to decrease with the development of the semiconductor industry, wherein there are many different cassettes according to the difference of the distance (slot pitch) a between two adjacent slots 31 in the cassette 30. For example, at least cassettes with a slot pitch a of 4.5mm and cassettes with a slot pitch a of 7.5mm exist for storing wafers. For the cassette with the slot pitch a of 4.5mm, when a traditional robot arm is used for picking and placing the wafer, the problem of scratching the substrate is easily caused. Specifically, referring to fig. 2, in order to ensure that the conventional robot 20 can bear the weight of the whole wafer and has the function of supporting and fixing the wafer, the robot disc 21 and the supporting block 22 of the robot 20 both have a certain thickness, and when picking and placing the wafer, the robot disc 21 and the supporting block 22 both need to enter the cassette 30. The thickness of the robot disc 21 is typically 2mm, and the thickness of the support block 22 is typically 2.3mm, i.e. the total thickness of the robot 20 to be inserted into the cassette 30 is 4.3 mm. Therefore, compared with the cassette with the slot pitch a of only 4.5mm, when the conventional robot arm 20 is used for picking and placing the wafer, the allowable range of the displacement deviation is only 0.2mm, which inevitably easily causes the problem that the wafer is scratched by the robot arm 20, and meanwhile, due to the influence of the thickness and the precision of the robot arm, the utilization rate of the cassette with the slot pitch a of 4.5mm is greatly limited.
However, with continued reference to fig. 7, in the substrate grabbing method provided by the present invention, the thickness c of the robot arm 200 entering the cassette 30 only includes the thickness c1 of the robot disc 210 and the thickness c2 of the contact pad 220, and similarly, to ensure that the entire weight of the wafer can be carried, the thickness c1 of the robot disc 210 is set to be 2mm, and the thickness c2 of the contact pad 220 may be set to be 1mm, that is, the total thickness c of the robot arm 200 in the cassette 30 is only 3 mm. So, then for the card casket that the draw-in groove interval a is 4.5mm, when snatching the base plate, robotic arm 200 can allow the displacement deviation's that produces scope to be 1.5mm, and this compares with adopting traditional robotic arm to snatch the base plate, and shared space is littleer in the clearance between two adjacent draw-in grooves, and then makes robotic arm can allow to produce displacement deviation on a wider range on the basis of current counterpoint precision to can reduce the risk of causing the scratch to the base plate.
In step S02, the substrate is sucked and fixed by a suction device. Specifically, the adsorption device may be a movable adsorption device, or may also be directly and fixedly disposed on the robot disc.
When the adsorption device is a movable adsorption device, the adsorption device is moved to the edge position of the substrate to adsorb and fix the substrate in the process of supporting the substrate on the mechanical arm 200 and moving out the cassette 30; when the adsorption device is fixedly arranged on the mechanical arm and adsorbs the lower surface of the substrate to fix the substrate, the adsorption device can adsorb and fix the substrate while the contact pad contacts and supports the substrate.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (10)
1. A robotic arm for accessing substrates located in a substrate storage area by the robotic arm, the robotic arm comprising: the substrate storage device comprises a manipulator disc, a plurality of contact pads and an adsorption device, wherein the contact pads are arranged on the manipulator disc and used for supporting a substrate, the adsorption device is used for adsorbing and fixing the substrate, when the manipulator takes and places the substrate, the thickness of the manipulator in a substrate storage area is the sum of the thickness of the manipulator disc and the thickness of the contact pads, and when the manipulator carries the substrate, the contact pads support the substrate from a plurality of different edge positions of the substrate; the adsorption device is movably arranged on the manipulator disc, and is used for horizontally moving the adsorption device to the outside of the substrate storage area in a direction away from the substrate when the manipulator takes and places the substrate, and horizontally moving the adsorption device to the edge of the substrate in a direction towards the substrate when the manipulator conveys the substrate, so as to adsorb and fix the substrate at the edge position of the substrate.
2. The robot of claim 1, wherein the suction device comprises at least one suction cup and a driving device for driving the suction cup to move, and the suction cup moves to an edge position of the substrate to suck and fix the substrate.
3. The robot arm as claimed in claim 2, wherein the suction device comprises two suction cups, and the two suction cups are respectively located on the upper surface and the lower surface of the substrate when the substrate is sucked and fixed.
4. The robot of claim 2, wherein said chuck has a shape that matches a shape of said substrate.
5. The robot of claim 4, wherein said base plate is circular and said chuck is circular in shape.
6. The robot of claim 2, wherein the contact area of the chuck with the substrate is 2mm to 5mm from the edge to the center of the substrate.
7. The robot as claimed in claim 2, wherein said suction cup has at least one vent hole therein and is connected to a vacuum pumping device through said vent hole.
8. The robot arm of claim 1, wherein the contact pad is rectangular, circular, or oval.
9. The robot arm of claim 1, wherein the contact pad has a thickness of 1mm to 2 mm.
10. A substrate gripping method, comprising:
providing a robot as claimed in claim 1, moving the robot into the substrate storage area, and moving the suction device outside the substrate storage area in a direction away from the substrate, wherein the thickness of the robot in the substrate storage area is the sum of the thickness of the robot plate and the thickness of the contact pads, and the substrate is supported from a plurality of different edge locations of the substrate using a plurality of contact pads;
and moving the substrate out of the substrate storage area by using the mechanical arm to convey the substrate, and moving the adsorption device to the substrate in a direction towards the substrate to adsorb and fix the substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610443457.9A CN107527848B (en) | 2016-06-20 | 2016-06-20 | Mechanical arm and substrate grabbing method |
| TW105137687A TWI610397B (en) | 2016-06-20 | 2016-11-17 | Mechanical arm and a method for gripping a substrate |
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| CN201610443457.9A CN107527848B (en) | 2016-06-20 | 2016-06-20 | Mechanical arm and substrate grabbing method |
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| CN107527848B true CN107527848B (en) | 2020-12-18 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108393850B (en) * | 2018-02-05 | 2019-11-26 | 武汉华星光电技术有限公司 | A kind of base positioner and substrate feeding system |
| US11600580B2 (en) * | 2019-02-27 | 2023-03-07 | Applied Materials, Inc. | Replaceable end effector contact pads, end effectors, and maintenance methods |
| US11315823B2 (en) * | 2019-12-27 | 2022-04-26 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate suction-holding structure and substrate transfer robot |
| CN113733143A (en) * | 2020-05-29 | 2021-12-03 | 深超光电（深圳）有限公司 | Vacuum adsorption device |
| CN112542412A (en) * | 2020-12-07 | 2021-03-23 | 长江存储科技有限责任公司 | Mechanical arm and wafer grabbing device |
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- 2016-11-17 TW TW105137687A patent/TWI610397B/en active
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| CN101226893A (en) * | 2007-01-11 | 2008-07-23 | 应用材料股份有限公司 | High temperature robot end effector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107527848A (en) | 2017-12-29 |
| TWI610397B (en) | 2018-01-01 |
| TW201801236A (en) | 2018-01-01 |
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