CN107527848A - A kind of grasping means of mechanical arm and substrate - Google Patents
A kind of grasping means of mechanical arm and substrate Download PDFInfo
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- CN107527848A CN107527848A CN201610443457.9A CN201610443457A CN107527848A CN 107527848 A CN107527848 A CN 107527848A CN 201610443457 A CN201610443457 A CN 201610443457A CN 107527848 A CN107527848 A CN 107527848A
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- mechanical arm
- adsorbent equipment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
- B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides the grasping means of a kind of mechanical arm and substrate, i.e., picks and places the substrate in substrate storage area by the mechanical arm.Wherein, the manipulator includes：Mechanical setting stick, the engagement pad being arranged on the mechanical setting stick and adsorbent equipment, also, when the mechanical arm picks and places substrate, the thickness of the mechanical arm in substrate storage area is the thickness of mechanical setting stick and the thickness sum of engagement pad.Compared with existing mechanical arm, mechanical arm provided by the invention needs the space of occupancy smaller, so as on the basis of the original precision of mechanical arm is not changed, reduce the risk for causing scratch to substrate when picking and placeing substrate in substrate storage area.
Description
Technical field
The present invention relates to technical field of semiconductors, the crawl side of more particularly to a kind of mechanical arm and substrate
Method.
Background technology
Corresponding move is instructed and can be performed according to the instruction received because mechanical arm can receive
Make, therefore in the manufacturing field of semiconductor, generally use mechanical arm is in substrate storage area and adds
Substrate is transmitted between construction equipment, to realize automated production.
For example, in the process to wafer, the wafer is placed in cassette (cassette),
And grasping silicon wafer and the wafer is sent to using mechanical arm in cassette in process equipment.Fig. 1
It is located at the structural representation of the wafer in cassette for the crawl of mechanical arm in the prior art, as shown in figure 1,
The cassette 30 is provided with multiple necks 31 for being used to carry wafer when mechanical arm 20 is picking and placeing wafer
When, the gap that need to be aligned between two neighboring neck 31, and be moved in the gap to pick and place wafer.
However, due in cassette 10 the distance between two neighboring neck 31 a it is smaller, and mechanical arm
20 also have certain thickness b, and therefore, the mechanical arm 20 can allow to produce when picking and placeing wafer
Raw offset deviation is limited in scope, and when the offset deviation of mechanical arm is excessive, then machine easily occurs
The problem of tool arm scratch wafer.Especially, as the development of semicon industry, the size of cassette become
In reduction, and this also will further increase the risk of mechanical arm scratch wafer.Simultaneously as
The limitation of thickness, the use of existing mechanical arm will be also extremely limited.
The content of the invention
It is an object of the invention to provide the grasping means of a kind of mechanical arm and substrate, to improve machinery
Arm is when picking and placeing substrate the problem of scratch substrate.
In order to solve the above technical problems, the present invention provides a kind of mechanical arm, pass through the mechanical arm
The substrate in substrate storage area is picked and placeed, wherein, the manipulator includes：Mechanical setting stick, set
The engagement pad and adsorbent equipment being placed on the mechanical setting stick, the engagement pad are used for supporting substrate, institute
State adsorbent equipment to be used to adsorb fixed substrate, when the mechanical arm picks and places substrate, deposited positioned at substrate
The thickness for putting the mechanical arm in region is the thickness of mechanical setting stick and the thickness sum of engagement pad.
Optionally, the adsorbent equipment is removable adsorbent equipment, and substrate is picked and placeed in the mechanical arm
When, the adsorbent equipment is moved to the outside of the substrate storage area.
Optionally, the adsorbent equipment includes at least one sucker and for driving the sucker to move
Drive device, the sucker is moved to the marginal position of substrate to adsorb fixed substrate.
Optionally, the adsorbent equipment includes two suckers, when adsorbing fixed substrate, two suckers
It is located at the upper and lower surface of substrate respectively.
Optionally, the shape of the sucker is set according to the shape of substrate.
Optionally, the substrate is circle, and the sucker is shaped as circular arc.
Optionally, the contact area of the sucker and substrate is from the edge of substrate to center
2mm~5mm.
Optionally, the adsorbent equipment is fixedly installed on mechanical setting stick, and by under sorbing substrate
Surface with fixed substrate, wherein, the thickness of the adsorbent equipment is less than the thickness of engagement pad.
Optionally, the adsorbent equipment includes a sucker.
Optionally, there is at least one passage on the sucker and taken out very by the passage and one
Empty device connection.
Optionally, the engagement pad is rectangle, circle or ellipse.
Optionally, the thickness of the engagement pad is 1mm~2mm.
Another object of the present invention is to provide a kind of grasping means of substrate, including：
One mechanical arm as described above is provided, moved in the mechanical arm to substrate storage area,
The thickness of mechanical arm wherein in substrate storage area is the thickness and engagement pad of mechanical setting stick
Thickness sum, and the substrate is supported using engagement pad；
Fixed substrate is adsorbed using adsorbent equipment.
Optionally, the adsorbent equipment is removable adsorbent equipment, and substrate is supported by mechanical arm
And during removing substrate storage area, the mobile adsorbent equipment to the position of substrate simultaneously adsorbs solid
The fixed substrate.
Optionally, the adsorbent equipment is fixedly installed on mechanical setting stick, and the adsorbent equipment
Thickness is less than the thickness of engagement pad, the lower surface of the adsorbent equipment absorption fixed substrate.
In mechanical arm provided by the invention, by an adsorbent equipment fixed substrate, to ensure that substrate can
It is supported in by firm on mechanical arm.Also, when picking and placeing substrate using the mechanical arm, institute
State the presence of adsorbent equipment and can't increase mechanical arm and deposited in substrate with putting shared sky in region
Between, make the gross thickness only thickness including mechanical setting stick of mechanical arm in the substrate storage area with
And the thickness of engagement pad, that is, space-consuming of the mechanical arm in substrate storage area is reduced, and then
Make the mechanical arm that the scope of caused offset deviation can be allowed bigger, can so not change machinery
On the basis of the original precision of arm, reduce the risk that scratch is caused to substrate.
Further, due to the mechanical arm provided by the invention space shared when picking and placeing substrate compared with
It is small, thus it is less in the space of substrate storage area in the case of, such as the less cassette of size,
Mechanical arm provided by the invention can be coordinated to pick and place substrate, safety is picked and placeed with ensure substrate.
Brief description of the drawings
Fig. 1 is the structural representation of wafer of the mechanical arm crawl in cassette in the prior art；
Fig. 2 is the structural representation that mechanical arm carries wafer in the prior art；
Fig. 3 is the structural representation of the mechanical arm in the embodiment of the present invention one；
Fig. 4 is the structural representation of the mechanical arm bearing substrate in the embodiment of the present invention one
Fig. 5 is the structural representation of the mechanical arm in the embodiment of the present invention two；
Fig. 6 is the schematic flow sheet of the grasping means of substrate provided by the invention；
Fig. 7 is the structural representation of the substrate in cassette using mechanical arm provided by the invention crawl
Figure.
Embodiment
As stated in the Background Art, in semicon industry, generally use mechanical arm is in substrate storage area
Substrate is picked and placeed in domain.Such as in the process to wafer, the wafer is typically placed in cassette,
And wafer is picked and placeed in cassette by mechanical arm.However, due to by two cards adjacent in cassette
The thickness b of spacing a and mechanical arm between groove limitation, mechanical arm easily occurs and is picking and placeing
During wafer the problem of scratch wafer.Therefore, it is of course possible to the thickness by directly cutting down mechanical arm,
It can allow the scope of caused offset deviation to increase the mechanical arm, and then reduce mechanical arm and scrape
Hinder the risk of substrate.But on the basis of the construction of mechanical arm is not changed, the mechanical arm
Thickness unconfined can not cut down.
Accordingly, by taking the mechanical arm of grasping silicon wafer as an example, Fig. 2 is mechanical arm of the prior art
The structural representation of wafer is carried, with reference to shown in figure 2, the mechanical arm includes a mechanical setting stick 21
And the support block 22 on the mechanical setting stick 21 is arranged at, there is a concave station in the support block 22,
The concave station constitutes plane 22a and plane 22b, the plane 22a for supporting wafer 10, institute
Plane 22b is stated to be used to block wafer 10 to prevent wafer from shaking.As shown in Fig. 2 the machinery
Setting stick 21 need to have certain thickness b1 to guarantee the weight of carrying whole wafer 10；Secondly,
In the range of the deformation quantity of wafer 10, to ensure during wafer 10 is supported, the wafer
10 central area will not contact with mechanical setting stick 21, then the support block 22 also needs to possess certain
Thickness b2.In this way, on the basis of the structure of mechanical arm 20 is not changed, it is difficult to again to manipulator
The thickness of arm 20 is cut down.
Therefore, present inventor provides a kind of mechanical arm, the mechanical arm is guaranteeing
On the basis of being enough supported to substrate and being fixed, mechanical arm can be improved and cause scratch to ask substrate
Topic.
To mechanical arm proposed by the present invention and its substrate is captured below in conjunction with the drawings and specific embodiments
Method is described in further detail.According to following explanation and claims, advantages of the present invention and spy
Sign will become apparent from.It should be noted that accompanying drawing using very simplified form and using it is non-accurately
Ratio, only for the purpose of facilitating and clarifying the purpose of the embodiments of the invention.
Embodiment one
Fig. 3 is the structural representation of the mechanical arm in the embodiment of the present invention one, and Fig. 4 is real for the present invention
The structural representation of mechanical arm bearing substrate in example one is applied, in the present embodiment, substrate is wafer.
With reference to shown in Fig. 3 and Fig. 4, the mechanical arm 200 includes：Mechanical setting stick 210, it is arranged at machine
Engagement pad 220 and adsorbent equipment 230 on tool setting stick 210.Wherein, the mechanical setting stick 210 is held
The weight of whole substrate 100 is carried, it has certain thickness c1；The engagement pad 220 and substrate 100
Contact and supporting substrate is to reduce the contact area of substrate 100 and mechanical setting stick 210, and considering
To on the basis of the deformation quantity of substrate 100, the engagement pad 220 equally also needs possess certain thickness
c2；The adsorbent equipment 230 is used to adsorb fixed substrate 100, prevents substrate from shaking.Also,
When the mechanical arm 200 picks and places substrate 100 in substrate storage area, positioned at substrate storage area
The thickness c of mechanical arm in domain is the thickness c1 of mechanical setting stick and the thickness c2 sums of engagement pad.
Compared with prior art, when picking and placeing substrate using mechanical arm provided by the invention, positioned at base
The thickness c of mechanical arm 200 in plate storage area only including mechanical setting stick 210 thickness c1 and
The thickness c2 of engagement pad, so as to reduce space-consuming of the mechanical arm 200 in substrate storage area,
And then make the mechanical arm 200 that the scope of caused offset deviation can be allowed bigger, so can be not
On the basis of changing 200 original precision of mechanical arm, reduce the risk that scratch is caused to substrate 100.
Further, due to the mechanical arm 200 provided by the invention sky shared when picking and placeing substrate 100
Between it is smaller, therefore it is less in the space of substrate storage area in the case of, it is such as less for size
Cassette, you can coordinate mechanical arm provided by the invention to pick and place substrate, further to ensure taking for substrate
Put safety.In addition, in mechanical arm 200 provided by the invention, realized by an adsorbent equipment 230
Fixation to substrate 100, avoid substrate from being produced in transmit process and rock, i.e. be provided by the invention
The supporting substrate that mechanical arm can consolidate, and can enough reduce the mechanical arm and scraped when choosing substrate
Hinder the risk of substrate.
In the present embodiment, the mechanical setting stick 210 can be y-type structure, in three of y-type structure
Engagement pad 220 is provided with summit, also, is provided with adsorbent equipment 230 on a summit wherein.
With continued reference to shown in Fig. 3 and Fig. 4, the adsorbent equipment 230 is that may move adsorbent equipment, institute
Adsorbent equipment 230 is stated to move along the direction of motion relative to mechanical arm 200, i.e., in the present embodiment,
When the mechanical arm 200 moves along the positive direction of X-axis, then the corresponding edge of adsorbent equipment 230
The negative direction movement of X-axis.When picking and placeing substrate using the mechanical arm 200, adsorbed by mobile
The position of device 230, so that the adsorbent equipment 230 is always positioned at the outside of substrate storage area,
So as to space-consuming of the adsorbent equipment 230 to mechanical arm 200 in substrate storage area of forgoing
Influence.
Further, the adsorbent equipment 230 includes at least one sucker 231 and for driving
State the drive device 232 of the movement of sucker 231.After bearing substrate 100 on mechanical arm 200,
The drive device 232 drives the sucker 231 to be moved to the marginal position of substrate 100 to inhale immediately
Attached fixed substrate 100.In the present embodiment, the adsorbent equipment 230 has two suckers 231, is inhaling
During attached fixed substrate, two suckers 231 are located at the upper and lower surface of substrate respectively.Enter one
Step, there is at least one passage, and take out very on the sucker 231 by the passage and one
Empty device (not shown) connection, i.e. the vacuum extractor is extracted by passage is located at institute
The gas between sucker 231 and substrate 100 is stated, makes formation one between sucker 231 and substrate 100 true
The absorption of dummy status and then realization to substrate is fixed.Preferably, the shape of the sucker 231 with it is described
Basic shape matches.For example, in the present embodiment, the mechanical arm 200 is used to pick and place crystalline substance
Circle, i.e. substrate are shaped as circle, then the shape of the corresponding sucker 231 can be circular arc.
As shown in figure 3, edge of the sucker 231 of circular arc along substrate 100 and in admissible region model
Interior absorption fixed substrate 100 is enclosed, wherein, the contact area g of the sucker 231 and substrate 100 can
Think in the range of 2~5mm of the edge of substrate 100 to center, so as to avoid in substrate 100
Effective coverage impacts, and wherein effective coverage is, for example, the region for being used to be formed chip in wafer.
With continued reference to shown in Fig. 3 and Fig. 4, in the present embodiment, set on the mechanical setting stick 210
There are four engagement pads 220, by four engagement pads 220 in four positions of substrate 100
Supporting substrate, so as to avoid substrate 100 from being contacted with mechanical setting stick 210, to prevent manipulator disk 210
Occur to rub and scratch substrate with the lower surface of substrate.Wherein, the engagement pad 220 can be any
Shape, for example, rectangle, circle or ellipse etc..In the present embodiment, the engagement pad 220 is circle
Shape, it is preferred that the diameter range of the circular engagement pad 220 can be 8~12mm, its reason
It is, if the area of engagement pad 220 is too small, the position contacted in substrate 100 with engagement pad 220
Put, larger contact stress can be produced, and then increase the forming amount of substrate 100；If engagement pad
220 area is excessive, then can increase its contact area with substrate 100 accordingly.Preferably, exist
On the basis of the deformation quantity of substrate, the thickness of the engagement pad 220 can be 1~2mm, i.e.
The engagement pad 220 has certain thickness, so as to avoid making substrate due to the deformation of substrate
Intermediate region touches mechanical setting stick 210, and the problem of by mechanical 210 scratch of setting stick.In addition,
For improve due to the friction between engagement pad 220 and substrate and may scratch substrate the problem of, it is described to connect
Touch pad 220 can be made of polyether-ether-ketone resin (Peek).On the one hand, Peek materials have well
Compressive property, thus be not in engagement pad 220 due to compressive deformation and can not supporting substrate the problem of；
On the other hand, Peek materials also have self-lubricating effect, therefore engagement pad 220 made of Peek
There is relatively low coefficient of friction between substrate, so as to reduce the risk of the scratch substrate of engagement pad 220.
Embodiment two
Fig. 5 is the structural representation of the mechanical arm in the embodiment of the present invention two.As shown in figure 5, with
The difference of embodiment one is, in the present embodiment, the adsorbent equipment 230 ' is fixedly installed on manipulator
On disk 210, and by the lower surface of sorbing substrate 100 to realize the fixation to substrate 100, wherein
The thickness of the adsorbent equipment 230 ' is less than the thickness of engagement pad 220.That is, in the present embodiment, due to
The adsorbent equipment 230 ' is used for the lower surface of sorbing substrate 100, when the supporting substrate 100 of engagement pad 220
When, then the adsorbent equipment 230 ' is also located at the lower section of substrate 100 accordingly simultaneously, therefore, will inhale
Adsorption device 230 ' is directly fixed on still to be able to realize the adsorption function to substrate 100 on mechanical setting stick 210,
So that the structure of mechanical arm 200 ' is more simple.Further, since the thickness of adsorbent equipment 230 ' is small
The machinery can't be influenceed in the presence of the thickness of engagement pad 220, therefore the adsorbent equipment 230 '
The integral thickness of arm 200 ', when picking and placeing basic 100, the manipulator in substrate storage area
The thickness c of arm 200 ' remain as the thickness c1 of mechanical setting stick 210 and engagement pad 220 thickness c2 it
With.
Specifically, the adsorbent equipment 230 ' includes at least one sucker 231 ', it is similar with embodiment one,
The sucker 231 ' can also be connected with a vacuum extractor (not shown), and then can be by taking out
The mode of vacuum adsorbs fixed substrate 100.Accordingly, in the present embodiment, on the sucker 231 '
At least one passage 232 ' is may also set up, vacuum extractor extracts sucker by the passage 232 '
Gas between 230 ' and substrate.
In addition, in the present embodiment, due to the lower surface of the sorbing substrate of adsorbent equipment 230 ', and
Processing influence of the lower surface of usual substrate on substrate is smaller, such as in the process of wafer, substrate
Upper surface be main machining area when forming chip, therefore, the adsorbent equipment 230 ' is settable
In the arbitrary region of mechanical setting stick 210, such as the central area of mechanical setting stick 210 is may be disposed at, or
Person also can be similar with embodiment one, and the adsorbent equipment 230 ' is arranged at into Y type machineries setting stick 210
On one summit, and using with a kind of similar shape and size of embodiment etc..
Certainly, further to strengthen fixing intensity of the adsorbent equipment 230 ' to substrate 100, also may be used
Multiple suckers 231 ' are set on the mechanical setting stick 210, it is right respectively by multiple suckers 231 '
Substrate 100 carries out absorption fixation.Or it can also be strengthened pair by increasing the area of sucker 231 '
Fixing intensity of substrate 100 etc..
In addition, mechanical arm in accordance with the above, the present invention also provides a kind of method for capturing substrate.
Fig. 6 is the schematic flow sheet of the grasping means of substrate provided by the invention, as shown in fig. 6, the base
The grasping means of plate, including：
Step S01 a, there is provided mechanical arm as described above, the mobile mechanical arm to substrate are deposited
Put in region, wherein the thickness of the mechanical arm in substrate storage area is the thickness of mechanical setting stick
With the thickness sum of engagement pad, and substrate to be chosen is supported using the engagement pad in the mechanical arm；
Step S02, fixed substrate is adsorbed using adsorbent equipment.
Compared with the method for substrate is captured using traditional mechanical arm, substrate provided by the invention is grabbed
Take in method, the thickness for the mechanical arm being moved in substrate storage area only includes the thickness of mechanical setting stick
The thickness of degree and engagement pad, thus mechanical arm space shared in substrate storage area compared with
Small, i.e., can increase mechanical arm accordingly can allow the scope of offset deviation of generation when picking and placeing substrate,
So as in the case where not changing the positioning precision of mechanical arm, improve mechanical arm scratch substrate
Problem.In addition, in the grasping means of substrate provided by the invention, in addition to using adsorbent equipment absorption
Fixed substrate, to ensure the supporting substrate that can be consolidated in transmit process.
Below exemplified by capturing the substrate in cassette, the grasping means to substrate provided by the invention do into
One step describes in detail.Fig. 7 is the substrate in cassette using mechanical arm provided by the invention crawl
Structural representation.
With reference to shown in Fig. 6 and Fig. 7, in step S01, in movable mechanical arm 200 to cassette 30,
And the substrate is supported using engagement pad.Wherein, it is provided with the cassette 30 multiple for carrying base
The neck 31 of plate 100.Specifically, the mechanical arm 200 is moved to two neighboring card in X direction
In gap between groove 31, and mechanical arm 200 can be made by adjusting the height of mechanical arm 200
The upper contact of engagement pad 220 and supporting substrate.
As stated in the Background Art, as the development of semicon industry, the size of the cassette 30 tend to subtract
It is small, wherein, according to the distance between two neighboring neck 31 (neck spacing) in cassette 30, a is not
Together, at present with regard to existing a variety of different cassettes.For example, the cassette for storing wafer, at present extremely
The cassette that neck spacing a is 4.5mm and the cassette that neck spacing a is 7.5mm are there are less.And
For neck spacing a is 4.5mm cassette, carry out picking and placeing crystalline substance when using traditional mechanical arm
Bowlder, then the problem of easily causing its scratch substrate.Specifically refer to shown in Fig. 2, traditional machinery
Arm 20 can carry the weight of whole wafer for guarantee, and possess the work for supporting and fixing wafer
With, the mechanical setting stick 21 and support block 22 of the mechanical arm 20 all need have certain thickness, and
And when picking and placeing wafer, the mechanical setting stick 21 and support block 22 are both needed to enter in cassette 30.Its
In, the thickness of the mechanical setting stick 21 is usually 2mm, and the thickness of the support block 22 is usually
2.3mm, i.e., the gross thickness for the mechanical arm 20 that need to be entered in cassette 30 is 4.3mm.Thus may be used
See, for neck spacing a is only 4.5mm cassette, traditional mechanical arm 20 is taking
When putting wafer, it can allow the scope of caused offset deviation to be only 0.2mm, so inevitable easily to lead
The problem of causing the 20 scratch wafer of mechanical arm, meanwhile, also due to the thickness and precision of mechanical arm
Influence, and strongly limit neck spacing a be 4.5mm cassette utilization rate.
However, with continued reference to shown in Fig. 7, in the grasping means of substrate provided by the invention, enter
The thickness c of mechanical arm 200 in cassette 30 only includes the thickness c1 of mechanical setting stick 210 and connect
The thickness c2 of touch pad 220, then likewise, to guarantee the weight of carrying whole wafer, the machine
The thickness c1 of tool setting stick 210 is set as that 2mm, the thickness c2 of the engagement pad 220 may be set to
1mm, i.e., the gross thickness c of the mechanical arm 200 in cassette 30 is only 3mm.In this way, then
For neck spacing a be 4.5mm cassette for, the mechanical arm 200 when capturing substrate,
The scope of offset deviation is 1.5mm caused by can allowing, and this using traditional mechanical arm with capturing base
Plate is compared, and shared space is smaller in the gap between two neighboring neck, and then makes the machine
Tool arm can allow to produce larger range of offset deviation on the basis of existing aligning accuracy, from
And the risk that scratch is caused to substrate can be reduced.
In step S02, fixed substrate is adsorbed using adsorbent equipment.Specifically, the adsorbent equipment can
To be removable adsorbent equipment, or can also directly be fixedly installed on mechanical setting stick.
Wherein, when the adsorbent equipment is removable adsorbent equipment, then in the mechanical arm 200
On be supported by substrate and remove cassette 30 during, then the adsorbent equipment is moved to the side of substrate
Edge position, to carry out absorption fixation to substrate；When the adsorbent equipment is to be fixedly installed on mechanical arm
When upper and lower surface by sorbing substrate is with fixed substrate, then the adsorbent equipment can connect in engagement pad
Absorption fixation is carried out to substrate while touching simultaneously supporting substrate.
Each embodiment is described by the way of progressive in this specification, what each embodiment stressed
All it is the difference with other embodiment, identical similar portion is mutually referring to i.e. between each embodiment
Can.
Foregoing description is only the description to present pre-ferred embodiments, not to any of the scope of the invention
Limit, any change, the modification that the those of ordinary skill in field of the present invention does according to the disclosure above content,
Belong to the protection domain of claims.
Claims (15)
1. a kind of mechanical arm, the substrate in substrate storage area is picked and placeed by the mechanical arm,
Characterized in that, the manipulator includes：Mechanical setting stick, the contact being arranged on the mechanical setting stick
Pad and adsorbent equipment, the engagement pad are used for supporting substrate, and the adsorbent equipment is used to adsorb fixed base
Plate, when the mechanical arm picks and places substrate, the thickness of the mechanical arm in substrate storage area
The thickness sum of thickness and engagement pad for mechanical setting stick.
2. mechanical arm as claimed in claim 1, it is characterised in that the adsorbent equipment is removable
Dynamic adsorbent equipment, when the mechanical arm picks and places substrate, the adsorbent equipment is moved to the substrate
The outside of storage area.
3. mechanical arm as claimed in claim 2, it is characterised in that the adsorbent equipment is included extremely
A few sucker and the drive device for driving the sucker movement, the sucker is moved to described
The marginal position of substrate fixes the substrate to adsorb.
4. mechanical arm as claimed in claim 3, it is characterised in that the adsorbent equipment includes two
Individual sucker, when adsorbing fixed substrate, two suckers respectively positioned at the substrate upper surface and
Lower surface.
5. mechanical arm as claimed in claim 3, it is characterised in that the shape of the sucker and institute
The shape for stating substrate matches.
6. mechanical arm as claimed in claim 5, it is characterised in that the substrate is circular, institute
That states sucker is shaped as circular arc.
7. mechanical arm as claimed in claim 3, it is characterised in that the sucker and substrate connect
It is from the edge of substrate to center 2mm~5mm to touch region.
8. mechanical arm as claimed in claim 1, it is characterised in that the adsorbent equipment is fixed and set
It is placed on mechanical setting stick, and by adsorbing the lower surface of the substrate with the fixation substrate, wherein,
The thickness of the adsorbent equipment is less than the thickness of engagement pad.
9. mechanical arm as claimed in claim 8, it is characterised in that the adsorbent equipment includes one
Individual sucker.
10. the mechanical arm as described in one of claim 3 or 9, it is characterised in that described
There is at least one passage on sucker and be connected by the passage with a vacuum extractor.
11. mechanical arm as claimed in claim 1, it is characterised in that the engagement pad be rectangle,
Circular or ellipse.
12. mechanical arm as claimed in claim 1, it is characterised in that the thickness of the engagement pad
For 1mm~2mm.
A kind of 13. grasping means of substrate, it is characterised in that including：
One mechanical arm as claimed in claim 1, the mobile mechanical arm to substrate storage area are provided
In domain, wherein the thickness of mechanical arm in substrate storage area for mechanical setting stick thickness with connecing
The thickness sum of touch pad, and the substrate is supported using engagement pad；
Fixed substrate is adsorbed using adsorbent equipment.
14. the grasping means of substrate as claimed in claim 13, it is characterised in that the absorption
Device is removable adsorbent equipment, and substrate is supported by mechanical arm and removes substrate storage area
During, the mobile adsorbent equipment to the position of substrate simultaneously adsorbs the fixed substrate.
15. the grasping means of substrate as claimed in claim 13, it is characterised in that the absorption
Device is fixedly installed on mechanical setting stick, and the thickness of the adsorbent equipment is less than the thickness of engagement pad,
The lower surface of the adsorbent equipment absorption fixed substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610443457.9A CN107527848B (en) | 2016-06-20 | 2016-06-20 | Mechanical arm and substrate grabbing method |
| TW105137687A TWI610397B (en) | 2016-06-20 | 2016-11-17 | Mechanical arm and a method for gripping a substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610443457.9A CN107527848B (en) | 2016-06-20 | 2016-06-20 | Mechanical arm and substrate grabbing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107527848A true CN107527848A (en) | 2017-12-29 |
| CN107527848B CN107527848B (en) | 2020-12-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610443457.9A Active CN107527848B (en) | 2016-06-20 | 2016-06-20 | Mechanical arm and substrate grabbing method |
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| CN (1) | CN107527848B (en) |
| TW (1) | TWI610397B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108393850A (en) * | 2018-02-05 | 2018-08-14 | 武汉华星光电技术有限公司 | A kind of base positioner and substrate feeding system |
| CN112542412A (en) * | 2020-12-07 | 2021-03-23 | 长江存储科技有限责任公司 | Mechanical arm and wafer grabbing device |
| CN113543940A (en) * | 2019-02-27 | 2021-10-22 | 应用材料公司 | Replaceable end effector contact pad, end effector and maintenance method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11315823B2 (en) * | 2019-12-27 | 2022-04-26 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate suction-holding structure and substrate transfer robot |
| CN113733143A (en) * | 2020-05-29 | 2021-12-03 | 深超光电（深圳）有限公司 | Vacuum adsorption device |
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| JPS6236247A (en) * | 1985-08-05 | 1987-02-17 | Toshiba Mach Co Ltd | Wafer transport device |
| JPS63142829A (en) * | 1986-12-05 | 1988-06-15 | Nippon Telegr & Teleph Corp <Ntt> | Substrate attracting and clamping device |
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| JP2007221021A (en) * | 2006-02-20 | 2007-08-30 | Seiko Instruments Inc | Transferring equipment |
| CN101226893A (en) * | 2007-01-11 | 2008-07-23 | 应用材料股份有限公司 | High temperature robot end effector |
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| US6322312B1 (en) * | 1999-03-18 | 2001-11-27 | Applied Materials, Inc. | Mechanical gripper for wafer handling robots |
| TWI345283B (en) * | 2007-11-23 | 2011-07-11 | Au Optronics Corp | Transfer machine and receiving cassette thereof |
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- 2016-11-17 TW TW105137687A patent/TWI610397B/en active
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| JPS6236247A (en) * | 1985-08-05 | 1987-02-17 | Toshiba Mach Co Ltd | Wafer transport device |
| JPS63142829A (en) * | 1986-12-05 | 1988-06-15 | Nippon Telegr & Teleph Corp <Ntt> | Substrate attracting and clamping device |
| JPH0778860A (en) * | 1993-09-06 | 1995-03-20 | Dainippon Screen Mfg Co Ltd | Substrate transfer device |
| JP2007221021A (en) * | 2006-02-20 | 2007-08-30 | Seiko Instruments Inc | Transferring equipment |
| CN101226893A (en) * | 2007-01-11 | 2008-07-23 | 应用材料股份有限公司 | High temperature robot end effector |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108393850A (en) * | 2018-02-05 | 2018-08-14 | 武汉华星光电技术有限公司 | A kind of base positioner and substrate feeding system |
| CN108393850B (en) * | 2018-02-05 | 2019-11-26 | 武汉华星光电技术有限公司 | A kind of base positioner and substrate feeding system |
| CN113543940A (en) * | 2019-02-27 | 2021-10-22 | 应用材料公司 | Replaceable end effector contact pad, end effector and maintenance method |
| CN112542412A (en) * | 2020-12-07 | 2021-03-23 | 长江存储科技有限责任公司 | Mechanical arm and wafer grabbing device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI610397B (en) | 2018-01-01 |
| TW201801236A (en) | 2018-01-01 |
| CN107527848B (en) | 2020-12-18 |
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