CN108513515A - Housing unit and electronic device - Google Patents
Housing unit and electronic device Download PDFInfo
- Publication number
- CN108513515A CN108513515A CN201810597201.2A CN201810597201A CN108513515A CN 108513515 A CN108513515 A CN 108513515A CN 201810597201 A CN201810597201 A CN 201810597201A CN 108513515 A CN108513515 A CN 108513515A
- Authority
- CN
- China
- Prior art keywords
- chip
- shell
- extension
- housing unit
- receiving part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This application discloses a kind of housing unit, which includes：Shell forms radiating area on shell；Chip is set to by a circuit board on shell；Shielding case is located on shell, and shielding case includes multiple connecting plates, forms accommodating cavity in multiple connecting plates, chip is set in accommodating cavity, and straight slot is opened up on the connecting plate in shielding case；Heat pipe, heat pipe include receiving part and extension, and receiving part wears straight slot and connect with chip, extending part on shell towards extending to radiating area far from chip direction so that the heat that chip is sent out is transferred to extension by receiving part, and is transferred to radiating area by extension.The heat that the above structure enables chip to generate is transferred directly to receiving part, and extension is transferred to by receiving part, radiating area is transferred to by extension, and then the heat that chip generates is dispersed to the lower radiating area of temperature, to improve setting chip position temperature locally excessively high problem.It includes electronic device with upper housing component that the application, which also provides a kind of,.
Description
Technical field
This application involves structure-design technique fields, more particularly to a kind of housing unit and electronic device.
Background technology
With the continuous development of technology, the function of the electronic devices such as mobile phone is more and more at present so that electronic device is being transported
When some functions of row or multiple functions are run simultaneously, the working frequency of chip is higher and higher, and then is easy so that installation
The position temperature part of chip is higher.
Invention content
It is easy the higher technical problem of local temperature in setting chip position for electronic devices such as mobile phones, the application provides
A kind of housing unit and electronic device.
The application use a technical solution be：A kind of housing unit is provided comprising：
Shell forms radiating area on the shell；
Chip, the chip are set to by a circuit board on shell；
Shielding case is located on the shell, and the shielding case includes multiple connecting plates, is formed and is held in multiple connecting plates
Chamber is set, the chip is set in the accommodating cavity, and straight slot is opened up on the connecting plate in the shielding case；
Heat pipe, the heat pipe include receiving part and extension, and the receiving part wears the straight slot and connect with the chip,
The extending part on the shell towards extending to the radiating area far from the chip direction so that the chip was sent out
Heat is transferred to the extension by the receiving part, and is transferred to the radiating area by the extension.
The application also provides a kind of electronic device, including housing unit described above.
The shielding case that housing unit and electronic device in the application include shell, is arranged on shell by circuit board,
With the chip being set in shielding case, radiating area is formed on shell, shielding case includes multiple connecting plates, and multiple connecting plates, which enclose, sets shape
At accommodating cavity, chip is located in accommodating cavity, and straight slot is opened up on the connecting plate of shielding case.Heat pipe includes receiving part and extension, is connect
Receipts portion wears straight slot and is connect with chip so that heat pipe is directly contacted with chip.Simultaneously extending part on shell towards far from chip
Direction extends to radiating area, so that the heat that chip generates can be transferred directly to receiving part, and is transferred to by receiving part
Extension is transferred to radiating area by extension, and then the heat that chip generates is dispersed to the lower radiating area of temperature, to improve
Chip position temperature locally excessively high problem is set.
Description of the drawings
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present application, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.
Fig. 1 is the structural schematic diagram of one embodiment of the application electronic device；
Fig. 2 is the distributed architecture schematic diagram of one embodiment middle casing component critical piece of the application；
Fig. 3 is the partial cross-sectional structural diagram in one embodiment middle casing component thickness direction of the application；
Fig. 4 is the cross-sectional view of one angle of shielding case in one embodiment of the application；
Fig. 5 is the partial cross-sectional structural diagram in another embodiment middle casing component thickness direction of the application；
Fig. 6 is the structural schematic diagram at battery compartment bottom in one embodiment of the application；
Fig. 7 is the distributed architecture schematic diagram of another embodiment middle casing component critical piece of the application；
Fig. 8 is the distributed architecture schematic diagram of the another embodiment middle casing component critical piece of the application；
Fig. 9 is the distributed architecture schematic diagram of the application another embodiment middle casing component critical piece.
Specific implementation mode
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation describes.It is understood that specific embodiment described herein is only used for explaining the application, rather than the limit to the application
It is fixed.It also should be noted that illustrating only for ease of description, in attached drawing and the relevant part of the application and not all knot
Structure.Based on the embodiment in the application, those of ordinary skill in the art are obtained without creative efforts
Every other embodiment, shall fall in the protection scope of this application.
Term " first " in the application, " second ", " third " are used for description purposes only, and should not be understood as instruction or dark
Show relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " second ", " are defined as a result,
Three " feature can explicitly or implicitly include at least one of the features.In the description of the present application, the meaning of " plurality " is extremely
It is two few, such as two, three etc., unless otherwise specifically defined.The directional instruction of institute is (all in the embodiment of the present application
Such as up, down, left, right, before and after ...) it is only used for explaining the phase under a certain particular pose (as shown in the picture) between each component
To position relationship, motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes therewith
Become.In addition, term " comprising " and " having " and their any deformations, it is intended that cover and non-exclusive include.Such as comprising
The step of process of series of steps or unit, method, system, product or equipment are not limited to list or unit, and
It further includes the steps that optionally not listing or unit to be, or further includes optionally for these processes, method, product or equipment
Intrinsic other steps or unit.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
Referring to Fig. 1 to Fig. 3, housing unit 100 and electronic device 200 provided by the present application are mainly used for being produced chip
For raw heat transfer to the lower region of temperature or conducive to the region of heat dissipation, the position local temperature for improving setting chip is excessively high
The case where.The housing unit 100 includes shell 10, by circuit board connection shielding case 20 on the housing 10, be located at shielding case
Chip 30 in 20 and the heat pipe 40 being connect with chip 30.
Specifically, in an embodiment, shell 10 be used to carry as carrier the glass cover-plate of electronic device 200, display screen,
Circuit board and numerous electronic components etc..Specifically, in different embodiments, shell 10 can be electronic device 200 center,
One in battery cover or front housing, this is not specifically limited.Radiating area is formed on shell 10, specifically, radiating area is will not
Heat is generated, either generation heat is relatively low or is conducive to the region of heat dissipation, hereafter by different embodiments illustrate
It is bright.
Shielding case 20 is connected to by circuit board 50 on shell 10, and shielding case 20 includes multiple connecting plates 22, multiple connections
Plate 22, which encloses, to be set to form accommodating cavity 24, and chip 30 is set in accommodating cavity 24.It should be understood that chip 30 include CPU processor,
Gpu processors or audio frequency process etc., therefore can be according to different operative scenarios when the work of chip 30, such as swim online
Play, Online Video etc. adjust the working frequency of chip 30.The frequency multiplication of different working frequencies and the working frequency is possible to
Interference is generated to the communication signal of antenna, it is therefore desirable to a shielding case 20 be set, and chip 30 is set in shielding case 20.
In one embodiment, the accommodating cavity 24 in shielding case 20 is shield effectiveness of the closed space to reach as well as possible.Other are implemented
In example, some slots can also be opened up on shielding case 20 for housing the components such as capacitance.Specifically, in different embodiments, it is more
A connecting plate 22, which encloses, sets the shielding case 20 to be formed as cuboid, terrace with edge or other irregular shapes, this is not specifically limited.
In the present embodiment, straight slot 222 is opened up at least one of shielding case 20 connecting plate 22, as shown in Figure 3 and Figure 4,
Receiving part 42 of the straight slot 222 for heating tube 40 wears and then is connect with chip 30.In one embodiment, put down in shielding case 20
Row opens up straight slot in being opened up on a side connecting plate 22 of chip 30 on straight slot 222, that is, the bottom or top of shielding case 20
222, the receiving part 42 of such heat pipe 40 passes through straight slot 222 that can be connect with chip 30.Specifically, the application defines shielding case 20
In the connecting plate 22 parallel with 30 plane of chip be bottom and top, bottom is close to the display screen side of electronic device 200
Connecting plate 22, top are the connecting plate 22 that opposing floor portion is arranged far from display screen, and the connecting plate 22 for connecting bottom and top is screen
Cover the side wall of cover 20.In other embodiment, straight slot 222 can also be opened on the side wall of shielding case 20, as long as heat pipe 40 connects
Receipts portion 42 slightly turns round and can be connect with the plane of chip 30, this is not specifically limited.
Heat pipe 40 is used to the heat that chip 30 generates being partly delivered to radiating area.Specifically, in the present embodiment, heat pipe 40
Including receiving part 42 and extension 44, receiving part 42 wears straight slot 222 and is connect with chip 30.So that the receiving part of heat pipe 40
42 directly contact with chip 30 or with chip 30 very close to so that the heat that chip 30 generates can be quickly transferred to
Receiving part 42.Extension 44 is at least partially disposed on shell 10 and extends to radiating area towards far from 30 direction of chip so that chip
30 heats sent out are transferred to extension 44 by receiving part 42, and are transferred to radiating area by extension 44.Specifically, one implements
In, storage tank (not shown) is opened up on shell 10, storage tank forms extension 44 from 30 position of chip to the road of heat dissipation zone position
The extension 44 of diameter, heat pipe 40 is set in storage tank.
Using this structure design, the part of the receiving part 42 of heat pipe 40 as shielding case 20 so that chip 30 is produced
Raw heat can be directly passed to heat pipe 40 so that the heat that chip 30 generates faster, more passes to heat pipe 40, by heat
Pipe 40 is transferred to radiating area.
Optionally, in an embodiment receiving plane 42 of heat pipe 40 area be more than or equal to chip 30 area so that
The area bigger that heat pipe 40 is contacted with chip 30 transmits heat more faster.It should be understood that the area of chip 30 is chip 30
It is parallel to the area of 20 top side of shielding case.In other embodiment, the area of receiving part 42 might be less that the face of chip 30
Product, this is not specifically limited.
Referring to Fig. 5, in another embodiment, shell 10 includes center 10a and rear shell 10b, and circuit board 50 is arranged in center 10a
On, straight slot 222 is opened in shielding case 20 on the connecting plate 22 of rear shell 10b, and extension 44 is after circuit board 50 is distributed in
In shell 10b.The heat for enabling to chip 30 to generate using such structure setting can be successively by receiving part 42 and extension
It transmits rear shell 10b and is more advantageous to heat dissipation since the area of rear shell 10b is bigger in portion 44.
It should be understood that if receiving part 42 is in direct contact with chip 30, it is easy so that being deposited between receiving part 42 and chip 30
In narrow gap, cause between chip 30 and receiving part 42 be not it is seamless be fitted and connected, influence the transmission effect of heat.Into one
It walks, in an embodiment, soft heat-conducting piece 50 is set so that the company of receiving part 42 and chip 30 between receiving part 42 and chip 30
It connects more closely.Heat-conducting piece 50 is made of soft Heat Conduction Material, thus the setting of heat-conducting piece 50 receiving part 42 and chip 30 it
Between after by external force extruding can be generated deformation, two-sided seamless connects chip 30 and receiving part 42, so that chip 30 generates
Heat can be transferred to receiving part 42 faster and more.
Optionally, in an embodiment, heat-conducting piece 60 is at least one of estersil, silica gel or silicon chip, this does not do specifically
It limits.
By taking shell 10 is the center of mobile phone as an example, the battery compartment 14 for battery to be arranged, radiating area are provided on shell 10
For at least partly region of 14 position of battery compartment.Specifically, in an embodiment, battery compartment 14 includes orlop 142, by orlop 142
Remove a part away from battery side so that orlop 142 is made thinner, to form radiating area away from battery side in orlop 142.
Or orlop 142 removes a part of region and forms the slot 1422 (as shown in Figure 6) being interconnected with battery compartment 142, to be formed
Radiating area.One side battery only just will produce heat when charging, and the corresponding position of another aspect battery compartment has larger
Area, provide advantage to form larger radiating area.In the present embodiment, extension 44 is from receiving part 42 towards far from chip
30 directions extend to battery compartment 14 and deviate from battery side so that at least partly heat that chip 30 generates can be passed by heat pipe 40
14 corresponding position of battery compartment is passed, 30 position temperature of setting chip locally excessively high problem is improved.
Further, in an embodiment, the end of extension 44 includes extension 442 to increase heat pipe 40 in the face of radiating area
Product, so that heat being capable of the more uniform dispersedly radiating area at battery compartment 14.I.e. in the present embodiment in heat pipe 40
Between position be elongate in shape, the area at heat pipe both ends will be significantly greater than the area at 40 intermediate position of heat pipe.For example, the expansion of heat pipe 40
Exhibition portion 442 is sheet, or curves around structure, as shown in Figure 7.When optionally, extension 442 is sheet in an embodiment
Area is suitable with the area of orlop 142.Multiple slots 1422 are opened up in another embodiment in orlop 142 so that the formation of orlop 142
Engraved structure, as shown in fig. 6, the extension 442 of heat pipe 40 forms corresponding with hollow out shape structure, and by extension 442
In slot 1422.
Further, in order to improve electronic device 200 during the use in charging, the heat transfer of the generation of chip 30
To battery, the case where causing battery overheat to reduce charging rate.Thermal insulation layer 70 is set between heat pipe 40 and battery, as shown in Figure 3.
Specific thermal insulation layer 70 is located at orlop 142 far from battery side, is located between extension 442 and orlop 142.Optionally, no
With in embodiment, thermal insulation layer 70 can be foam, mineral wool or high silica wool etc., this is not specifically limited.
In one embodiment, thermal insulation layer 70 is engraved structure.Made using such structure, when battery charges, battery
The heat of generation can also be radiated by the part of hollow out.
Referring to Fig. 8, in another embodiment, radiating area is the side of shell 10, specifically, shell is front housing or center.
Shell 10 is rectangle, has two longer sides 16, therefore the heat for generating chip 30 in the present embodiment passes through heat pipe 40
It is transferred to the side 16 of shell 10, and then improves 30 position temperature of setting chip locally excessively high problem.
Further, extension 44 include the changeover portion 444 of 10 side of shell is transitioned into from chip 30, and with shell 10
The contact-segment 446 of the fitting setting of side 16.So that the side that the heat that chip 30 generates passes through contact-segment 446 and shell 10
16 close contact is transferred to 10 side of shell, 16 position, the partial heat generated with dispersed chip 30.
In one embodiment, when the side of shell 10 16 and very close battery, exist to improve electronic device 200
In charging during use, the heat transfer that chip 30 generates causes battery overheat to reduce the feelings of charging rate to battery
Condition.Positioned at 16 position of the side of shell 10, thermal insulation layer 70 is set, specific thermal insulation layer 70 is strip between heat pipe 40 and battery
Shape, between contact-segment 446 and battery.
Referring to Fig. 9, SIM card area 18 is set for SIM card to be arranged in another embodiment, on shell 10.Specifically, SIM card
On circuit boards by deck (not shown) setting, and then by circuit board setting on the housing 10.Specifically, being provided with
The region of SIM card is SIM card area 18, and since SIM card not will produce heat in use, SIM card area is opposite to be set
The position for setting chip is low-temperature space.Ennation 44 extends to the region of setting SIM card towards separate 30 direction of chip in the present embodiment,
So that the partial heat that chip 30 generates can be transferred to SIM card area 18 and be disperseed.Optionally, the end of extension 44
Extension 442 is formed, extension 442 is bonded setting with SIM card or deck, to increase the area that heat pipe 40 is located at SIM card area,
And then allow more heats that can transmit sub- SIM card location.Specifically, extension 442 can be sheet or curve around knot
Structure or engraved structure, this is not specifically limited.
In other embodiment, radiating area can also be rear shell (not shown) or electronic device 200 other empty regions,
This is not specifically limited.
In one embodiment, in the case where spatial position allows, the extension 44 of heat pipe 40 can be simultaneously to shell 10
At least two regions extend in side 16, at least partly region of 14 position of battery compartment or SIM card area 18 etc..So that core
The heat that piece 30 generates can share heat by multiple and different regions simultaneously.
With continued reference to Fig. 1, electronic device 200 provided by the present application includes housing unit described in any of the above embodiment
100.In different embodiments, which can be any one of multiple electronic equipments, and multiple electronic equipments include
But it is not limited to cellular phone, smart phone, other wireless telecom equipments, personal digital assistant, audio player, other media to broadcast
Put device, music recorder, video recorder, camera, other medium recorders, radio, Medical Devices, calculator, programmable distant
Control device, pager, netbook computer, personal digital assistant (PDA), portable media player (PMP), motion pictures expert
Group (MPEG-1 or MPEG-2) audio layer 3 (MP3) player, portable medical device and digital camera and combinations thereof.
With continued reference to Fig. 1-Fig. 3, in an embodiment, which further includes display screen 210, which sets
It is placed on shell 10, the interface that display screen 210 is interacted as electronic device 200 with user, for showing picture or video etc..
It should be understood that display screen 210 also will produce heat in use, in order to reduce heat transfer to electronic device 200
Front influences the touch sense of user.In the present embodiment, graphite linings 80 are also provided between display screen 210 and shell 10, the graphite
The heat that the setting of layer 80 enables to display screen 210 to generate radiates toward close to 10 side of shell as far as possible.
It should be understood that the area of graphite linings 80 can be big as the area of display screen 210, or only local location
Graphite linings 80 are set, this is not especially limited.Further, due to being difficult to ensure surface of the heat pipe 40 adjacent to 210 side of display screen
Flat even everywhere is possible to cause graphite linings 80 uneven if heat pipe 40 is in direct contact with graphite linings 80, and then having can
It can influence the display effect of display screen 210.Therefore, in the present embodiment, graphite linings 80 and the extension 44 of heat pipe 40 are spaced apart
Setting.Specifically, being to reserve a thin plate 90 on gapping interval setting or shell 10 by stone between graphite linings 80 and heat pipe 40
44 separation spacing of extension of layer of ink 80 and heat pipe 40 is arranged.
The housing unit 100 and electronic device 200 of the application on shielding case 20 by opening up straight slot 222, then heat pipe
40 receiving part 42 is connect across straight slot 222 with chip 30 so that the heat that chip 30 generates directly can quickly be transferred to heat
On the receiving part 42 of pipe 40, and be transferred to by the extension of heat pipe 40 44 and do not generate heat, either generate heat it is fewer or
It is the region for being conducive to heat dissipation.So that heat caused by chip 30 can be dispersed to low-temperature space, setting chip 30 is avoided
Position temperature is locally excessively high.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the claims of the application, every to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field includes similarly in the scope of patent protection of the application.
Claims (15)
1. a kind of housing unit, which is characterized in that including：
Shell forms radiating area on the shell；
Chip, the chip are set to by a circuit board on shell；
Shielding case is located on the shell, and the shielding case includes multiple connecting plates, is formed in multiple connecting plates accommodating
Chamber, the chip are set in the accommodating cavity, and straight slot is opened up on the connecting plate in the shielding case；
Heat pipe, the heat pipe include receiving part and extension, and the receiving part wears the straight slot and connect with the chip, described
Extending part on the shell towards extending to the radiating area far from the chip direction so that the heat that the chip is sent out
It is transferred to the extension by the receiving part, and the radiating area is transferred to by the extension.
2. housing unit according to claim 1, which is characterized in that the area of the receiving part is more than or equal to the chip
Area.
3. housing unit according to claim 1, which is characterized in that the shell includes center and rear shell, the circuit
Plate is set on the center, and the straight slot is located at the shielding case on the connecting plate of the rear shell side, the heat pipe
Extension be set in the rear shell.
4. housing unit according to claim 1, which is characterized in that the straight slot is opened in the shielding case and is parallel to
On the connecting plate of the chip-side.
5. housing unit according to claim 1, which is characterized in that be arranged between the receiving part and the chip soft
Heat-conducting piece so that the connection of the receiving part and the chip is more closely.
6. housing unit according to claim 5, which is characterized in that the heat-conducting piece is in estersil, silica gel or silicon chip
At least one.
7. housing unit according to claim 1, which is characterized in that the radiating area is the side of shell；Or it is described
Battery compartment is set on shell, and the radiating area is the battery compartment；Or SIM card area, the radiating area are set on the shell
For the SIM card area.
8. housing unit according to claim 7, which is characterized in that the radiating area is the SIM card area or the electricity
When the storehouse of pond, the end of the extension includes extension, and the end to increase the extension is located at SIM card area or battery compartment
Area.
9. housing unit according to claim 8, which is characterized in that sheet is in the extension or curves around knot
Structure.
10. housing unit according to claim 7, which is characterized in that further include the battery being set on the shell, institute
State radiating area be battery compartment or shell side when, thermal insulation layer is set between the heat pipe and the battery.
11. housing unit according to claim 10, which is characterized in that the thermal insulation layer is engraved structure.
12. housing unit according to claim 1, which is characterized in that storage tank is opened up on the shell, the heat pipe
Extension is set in the storage tank.
13. housing unit according to claim 1, which is characterized in that further include the display screen being set on the shell,
It is provided with graphite linings between the display screen and the shell.
14. housing unit according to claim 13, which is characterized in that between the graphite linings and the extension of the heat pipe
Every separately positioned.
15. a kind of electronic device, which is characterized in that including any one of the claim 1-14 housing units.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810597201.2A CN108513515B (en) | 2018-06-11 | 2018-06-11 | Shell assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810597201.2A CN108513515B (en) | 2018-06-11 | 2018-06-11 | Shell assembly and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108513515A true CN108513515A (en) | 2018-09-07 |
| CN108513515B CN108513515B (en) | 2020-10-02 |
Family
ID=63403214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810597201.2A Active CN108513515B (en) | 2018-06-11 | 2018-06-11 | Shell assembly and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108513515B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110234058A (en) * | 2019-05-23 | 2019-09-13 | 武汉华星光电技术有限公司 | A kind of liquid crystal display die set and mobile terminal |
| CN110278688A (en) * | 2019-06-18 | 2019-09-24 | Oppo广东移动通信有限公司 | Housing unit and electronic equipment |
| CN112639927A (en) * | 2018-09-14 | 2021-04-09 | 深圳市柔宇科技股份有限公司 | Flexible display device |
| WO2021190552A1 (en) * | 2020-03-24 | 2021-09-30 | 华为技术有限公司 | Mobile terminal and middle frame assembly |
| EP4181643A4 (en) * | 2021-09-28 | 2024-04-17 | Samsung Electronics Co Ltd | Electronic device comprising heat dissipation structure |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1731916A (en) * | 2005-08-22 | 2006-02-08 | 威盛电子股份有限公司 | Print circuit board with improved heat rejection structure and electronic device |
| CN201894030U (en) * | 2010-11-08 | 2011-07-06 | 吴哲元 | Structure for improving heat dissipation effect of heat conducting component |
| CN203596971U (en) * | 2013-10-12 | 2014-05-14 | 上海斐讯数据通信技术有限公司 | Circuit board having heat dissipation function |
| CN104813760A (en) * | 2014-03-18 | 2015-07-29 | 华为终端有限公司 | Heat radiation assembly and electric device |
| CN204796016U (en) * | 2015-07-14 | 2015-11-18 | 深圳Tcl新技术有限公司 | Heat abstractor and electron terminal |
| CN105340075A (en) * | 2014-03-20 | 2016-02-17 | 华为终端有限公司 | Mobile terminal |
| CN105472940A (en) * | 2014-08-20 | 2016-04-06 | 中兴通讯股份有限公司 | Terminal cooling device and mobile terminal |
| CN206181696U (en) * | 2016-10-28 | 2017-05-17 | 中科创达软件科技（深圳）有限公司 | Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure |
| WO2017142286A1 (en) * | 2016-02-18 | 2017-08-24 | 삼성전자주식회사 | Electronic device having heat collection/diffusion structure |
| CN107454737A (en) * | 2017-09-06 | 2017-12-08 | 广东欧珀移动通信有限公司 | A kind of electronic equipment and its circuit board assemblies |
| CN107484403A (en) * | 2017-09-19 | 2017-12-15 | 广东欧珀移动通信有限公司 | Radome, circuit board assemblies and electronic equipment |
| CN107546197A (en) * | 2016-06-24 | 2018-01-05 | 瑞昱半导体股份有限公司 | Electronic installation and its radiating and electromagnetic armouring structure |
-
2018
- 2018-06-11 CN CN201810597201.2A patent/CN108513515B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1731916A (en) * | 2005-08-22 | 2006-02-08 | 威盛电子股份有限公司 | Print circuit board with improved heat rejection structure and electronic device |
| CN201894030U (en) * | 2010-11-08 | 2011-07-06 | 吴哲元 | Structure for improving heat dissipation effect of heat conducting component |
| CN203596971U (en) * | 2013-10-12 | 2014-05-14 | 上海斐讯数据通信技术有限公司 | Circuit board having heat dissipation function |
| CN104813760A (en) * | 2014-03-18 | 2015-07-29 | 华为终端有限公司 | Heat radiation assembly and electric device |
| CN105340075A (en) * | 2014-03-20 | 2016-02-17 | 华为终端有限公司 | Mobile terminal |
| CN105472940A (en) * | 2014-08-20 | 2016-04-06 | 中兴通讯股份有限公司 | Terminal cooling device and mobile terminal |
| CN204796016U (en) * | 2015-07-14 | 2015-11-18 | 深圳Tcl新技术有限公司 | Heat abstractor and electron terminal |
| WO2017142286A1 (en) * | 2016-02-18 | 2017-08-24 | 삼성전자주식회사 | Electronic device having heat collection/diffusion structure |
| CN107546197A (en) * | 2016-06-24 | 2018-01-05 | 瑞昱半导体股份有限公司 | Electronic installation and its radiating and electromagnetic armouring structure |
| CN206181696U (en) * | 2016-10-28 | 2017-05-17 | 中科创达软件科技（深圳）有限公司 | Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure |
| CN107454737A (en) * | 2017-09-06 | 2017-12-08 | 广东欧珀移动通信有限公司 | A kind of electronic equipment and its circuit board assemblies |
| CN107484403A (en) * | 2017-09-19 | 2017-12-15 | 广东欧珀移动通信有限公司 | Radome, circuit board assemblies and electronic equipment |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112639927A (en) * | 2018-09-14 | 2021-04-09 | 深圳市柔宇科技股份有限公司 | Flexible display device |
| CN110234058A (en) * | 2019-05-23 | 2019-09-13 | 武汉华星光电技术有限公司 | A kind of liquid crystal display die set and mobile terminal |
| US11320685B2 (en) | 2019-05-23 | 2022-05-03 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Liquid crystal display module and mobile terminal |
| CN110278688A (en) * | 2019-06-18 | 2019-09-24 | Oppo广东移动通信有限公司 | Housing unit and electronic equipment |
| CN110278688B (en) * | 2019-06-18 | 2020-07-24 | Oppo广东移动通信有限公司 | Shell assembly and electronic equipment |
| WO2021190552A1 (en) * | 2020-03-24 | 2021-09-30 | 华为技术有限公司 | Mobile terminal and middle frame assembly |
| EP4117405A4 (en) * | 2020-03-24 | 2023-08-09 | Huawei Technologies Co., Ltd. | Mobile terminal and middle frame assembly |
| EP4181643A4 (en) * | 2021-09-28 | 2024-04-17 | Samsung Electronics Co Ltd | Electronic device comprising heat dissipation structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108513515B (en) | 2020-10-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108513515A (en) | Housing unit and electronic device | |
| EP3512318B1 (en) | Heat dissipation structure for electronic device, and electronic device | |
| US11202363B2 (en) | Heat transfer member and electronic device including the same | |
| CN110267499B (en) | Shell assembly, preparation method thereof and electronic equipment | |
| CN110730594B (en) | Vapor chamber and electronic equipment with same | |
| US9788409B2 (en) | Circuit board and method of manufacturing the same | |
| CN108770296B (en) | Shell assembly and electronic device | |
| CN108617159A (en) | Housing unit and electronic device | |
| CN110213947B (en) | Shell assembly, preparation method thereof and electronic equipment | |
| CN110402064B (en) | Heat radiating fin, preparation method thereof, shell assembly and electronic equipment | |
| WO2023179120A9 (en) | Electronic device | |
| CN105658021A (en) | Heat dissipation structure of wearable electronic device | |
| CN108667991A (en) | Housing unit and electronic device | |
| JP2022113758A (en) | Electronic apparatus | |
| CN204377305U (en) | A kind of heat abstractor, circuit board and terminal | |
| CN108551752A (en) | A kind of electronic device and a kind of circuit board assemblies | |
| CN112105223A (en) | Heat dissipation device for electronic equipment and electronic equipment | |
| CN110278688A (en) | Housing unit and electronic equipment | |
| EP2884671B1 (en) | Mobile terminal | |
| CN217116715U (en) | Chip heat radiation structure and electronic equipment | |
| CN102045992B (en) | User equipment (UE) | |
| WO2021190552A1 (en) | Mobile terminal and middle frame assembly | |
| CN108776531A (en) | A kind of electronic device and a kind of radiating subassembly | |
| CN211090359U (en) | Electronic equipment and heat conducting element | |
| CN110267491B (en) | Middle frame assembly and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |