CN107378231B - The method for preparing metal structure in transparent material surface using metal nano prepared Chinese ink - Google Patents
The method for preparing metal structure in transparent material surface using metal nano prepared Chinese ink Download PDFInfo
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- CN107378231B CN107378231B CN201710718692.7A CN201710718692A CN107378231B CN 107378231 B CN107378231 B CN 107378231B CN 201710718692 A CN201710718692 A CN 201710718692A CN 107378231 B CN107378231 B CN 107378231B
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- chinese ink
- prepared chinese
- transparent substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
Abstract
The invention discloses a kind of methods for preparing metal structure in transparent material surface using metal nano prepared Chinese ink, transparent substrate is placed in metal nano prepared Chinese ink, utilize laser irradiation substrate, by the parameter, the material of prepared Chinese ink and the concentration that control laser, to make the metal material in metal nano prepared Chinese ink selectively be precipitated at the laser spot of substrate surface, metal micro-nanostructure finally is made on transparent substrate surface.This preparation method is directly prepared in the liquid phase, laser can go directly transparent substrate surface, and the metallic particles in metal nano prepared Chinese ink is sintered to the metal layer for stablizing conduction, simplify preparation process, metal oxygenation efficiency is low in preparation process, and the controllable metal layer of size is only formed selectively at laser focusing, the problem of preventing substrate surface integrally to deposit adsorbing metal particle, save raw material, reduce energy consumption, production cost is thereby reduced, there is great market prospects and economic value.
Description
Technical field
The invention belongs to field of laser processing, are related to a kind of laser printing processes, specifically, being related to a kind of using metal
The method that nanometer prepared Chinese ink carries out laser printing to transparent material surface.
Background technique
Currently, being the device of substrate in optics, consumer electronics, biomedical and micro-optical electromechanical system using transparent material
Etc. obtain more and more extensive application in technical fields.It is that one kind is relatively conventional in transparent material surface preparation metal structure to change
Property means, the method for use mainly has: (1) Common deposition method and (2) laser deposition the preparation method.In the surface micro-nano of transparent material
In structure preparation, laser, which is directly write, unique advantage, such as does not need vacuum, can reduce cost and simplification is processed
Journey.
The method that directly or indirectly prepared by laser solid phase at present is mainly include the following types: laser transfer method (laser
Induced forward transfer): laser beam 1 passes through transparent substrate, is radiated at the metal foil of source substrate 2 (transparent material)
On film 3, laser interacts with thin-film material, and metallic film is transferred to since the effect of laser is removed from source substrate 2
In the target base plate 4 close with source substrate, the source film shifted deposits in target base plate, forms surface metal figure
Shape 5, as shown in Figure 1；Laser direct sintering (laser induced annealing): laser direct sintering transparent substrate 6 is used
The metallic solution film 7 of the drying of upper setting, using laser energy local irradiation, the metallic solution film 7 of transparent substrate 6 or drying
In metalloform-selective absorb energy, laser can activate substrate surface or metal ion is quickly restored
It is deposited on source substrate surface, forms surface metal figure 5, as shown in Figure 2.Both the above method requires preparation " precursor ",
In the method for laser liquid phase preparation, pregnant solution is exactly the precursor of metal layer.But in existing two methods, laser turns
Shifting method there are preparation process complex, the low problem of production efficiency, that there are oxygenation efficiency is high for common laser direct sintering rule,
The step of increasing drying is needed, so as to cause raw material loss is big, energy consumption is high, at high cost.
Summary of the invention
For this purpose, the present invention exactly will solve above-mentioned technical problem, thus propose a kind of high production efficiency, material loss it is low,
Low energy consumption, the economic method for easily carrying out laser printing to transparent material surface using metal nano prepared Chinese ink.
In order to solve the above technical problems, the technical solution of the present invention is as follows:
The present invention provides a kind of method using metal nano prepared Chinese ink in transparent material surface preparation metal structure, the side
Method includes the following steps:
A, metal nano prepared Chinese ink is taken；
B, transparent substrate is taken, is placed in metal nano prepared Chinese ink；
C, laser processing parameter and focal position are set, laser beam is made to be irradiated to institute's transparent substrate surface；
D, metal prepared Chinese ink is precipitated at laser spot under laser action and selective sintering is in substrate surface；
E, control laser parameter obtains required metal micro-nanostructure in substrate surface.
Preferably, the solute of the metal nano prepared Chinese ink is the nano particle of metal or alloy, said metal nano-ink
The solvent of juice is water or alcohol organic solvent, and the mass concentration of the metal nano prepared Chinese ink is 10-90%.
Preferably, in the step c, the parameter of laser processing are as follows: optical maser wavelength 355nm, 532nm, 1064nm；Function
Rate is 0.1-100W；Frequency is 1Hz-1MHz.
Preferably, the transparent substrate is immersed in the metal nano prepared Chinese ink or floats on metal in the step b
Nanometer prepared Chinese ink surface.
Preferably, control laser parameter makes laser when the transparent substrate is immersed in the metal nano prepared Chinese ink
Beam passes through the metal nano prepared Chinese ink at the top of transparent substrate and irradiates in transparent substrate top surface, and metal nano prepared Chinese ink is in transparent substrate top surface
Laser spot at Selective separation-out, be made metal micro-nanostructure；Or control laser parameter makes laser beam pass through transparent substrate
The metal nano prepared Chinese ink and transparent substrate at top are irradiated in transparent substrate bottom surface, and metal nano prepared Chinese ink is in transparent substrate bottom surface
Metal micro-nanostructure is made in Selective separation-out at laser spot.
Preferably, control laser parameter makes laser when the transparent substrate floats on the metal nano prepared Chinese ink surface
Beam passes through the transparent substrate, irradiates in transparent substrate bottom surface, metal nano prepared Chinese ink is at the laser spot of transparent substrate bottom surface
Metal micro-nanostructure is made in Selective separation-out.
Preferably, the metal micro-nanostructure is three-dimensional structure, having a size of micron, Nano grade.
Preferably, the transparent substrate is low melting point polymer transparent substrate, glass substrate, sapphire substrate or compound
Substrate.
Preferably, the metal is aluminium, copper, gold or silver.
The above technical solution of the present invention has the following advantages over the prior art:
(1) method of the present invention for preparing metal structure in transparent material surface using metal nano prepared Chinese ink, will be saturating
Bright substrate is placed in metal nano prepared Chinese ink, using laser irradiation substrate, by controlling the parameter of laser, the material of prepared Chinese ink and dense
Degree, to make the metal material in metal nano prepared Chinese ink selectively be precipitated at the laser spot of substrate surface, thus saturating
Metal micro-nanostructure is made in bright substrate surface.This preparation method is directly prepared in the liquid phase, and laser can go directly transparent substrate table
Face, and the metallic particles in metal nano prepared Chinese ink is sintered to the metal layer for stablizing conduction, simple process is simplified and was prepared
Journey, since process is carried out in metal nano prepared Chinese ink, so metal oxygenation efficiency is low in preparation process, and only in laser
The controllable metal layer of size is formed selectively at focusing, it is therefore prevented that substrate surface integrally deposits asking for adsorbing metal particle
Topic, saves raw material, reduces energy consumption, thereby reduce production cost, has great market prospects and economic value.
(2) method of the present invention for preparing metal structure in transparent material surface using metal nano prepared Chinese ink, can root
According to the power to laser absorption of metal nano prepared Chinese ink, transparent substrate is immersed in inside metal nano prepared Chinese ink or is made transparent base
Plate floats on metal nano prepared Chinese ink surface, by adjusting laser parameter, laser beam is made to penetrate the irradiation of metal nano prepared Chinese ink solution in saturating
Bright substrate top surface makes that laser beam penetrates prepared Chinese ink at the top of transparent substrate and transparent substrate is irradiated in substrate bottom surface, or makes laser
Beam passes through transparent substrate and irradiates in transparent substrate bottom surface, by this set and adjusting so that this method can be used for processing it is a variety of
Metalloid prepared Chinese ink keeps the application range of this method wider, for preparing different metal nano micro-nano structures, by using this two
Kind different processing methods, no replacement is required process equipment further reduced production cost.
Detailed description of the invention
In order to make the content of the present invention more clearly understood, it below according to specific embodiments of the present invention and combines
Attached drawing, the present invention is described in further detail, wherein
Fig. 1 is the preparation process schematic diagram of laser transfer method in the prior art；
Fig. 2 is the preparation process schematic diagram of laser direct sintering in the prior art；
Fig. 3 is the schematic diagram of method described in the embodiment of the present invention 1；
Fig. 4 is the schematic diagram of method described in the embodiment of the present invention 2；
Fig. 5 is the schematic diagram of method described in the embodiment of the present invention 3.
Appended drawing reference indicates in figure are as follows: 1- laser beam；The source 2- substrate；3- metallic film；4- target base plate, 5- surface metal
Figure；6- transparent substrate；7- metallic solution film；8- metal nano prepared Chinese ink；9- metal micro-nanostructure.
Specific embodiment
Embodiment 1
A kind of method for preparing metal structure in transparent material surface using metal nano prepared Chinese ink is present embodiments provided, such as
Shown in Fig. 3, described method includes following steps:
A, metal nano prepared Chinese ink 8 is taken, the solute of the metal nano prepared Chinese ink 8 is metal silver nano-grain, and solvent is alcohols
Organic solvent, is ethyl alcohol in the present embodiment, and the mass concentration of the metal nano prepared Chinese ink is 70%.
B, transparent substrate 6 is taken, the transparent substrate 6 is low melting point transparent polymer substrate, is placed on metal nano
In prepared Chinese ink 8, and metal nano prepared Chinese ink 8 is made to submerge the transparent substrate 6；
C, laser processing parameter and focal position are set, laser beam 1 is made to penetrate the metal nano prepared Chinese ink at 6 top of transparent substrate
8 are irradiated to the top surface of institute's transparent substrate 6, and laser described in the present embodiment is the short-pulse laser that wavelength is 355nm, and power is
0.1W, frequency 1Hz；
D, metal nano prepared Chinese ink analyses metal nanoparticle out under laser action at laser spot and selective sintering exists
The upper surface of transparent substrate 6；
E, metal micro-nanostructure 9 (metal film) layer of size required for control laser parameter obtains on 6 surface of transparent substrate,
The metal micro-nanostructure 9 is having a size of micro-nano rank, such as diameter 800nm, high 1 μm of cylindrical structure.
Embodiment 2
A kind of method for preparing metal structure in transparent material surface using metal nano prepared Chinese ink is present embodiments provided, such as
Shown in Fig. 4, described method includes following steps:
A, metal nano prepared Chinese ink 8 is taken, the solute of the metal nano prepared Chinese ink 8 is magnesium alloy nano particle, and solvent is water, institute
The mass concentration for stating metal nano prepared Chinese ink 8 is 50%；
B, transparent substrate 6 is taken, the transparent substrate 6 is glass substrate, is placed in metal nano prepared Chinese ink 8, and make
Transparent substrate 6 floats on 8 surface of metal nano prepared Chinese ink；
C, laser processing parameter and focal position are set, so that laser beam 1 is penetrated transparent substrate 6, is irradiated to institute's transparent substrate 6
Bottom surface, the power of the laser is 1W, frequency 1MHz, and it is the ultrashort of 532nm that laser described in the present embodiment, which is wavelength,
Pulse laser；
D, metal nano prepared Chinese ink 8 is analysed at laser spot under laser action and selective sintering is under transparent substrate 6
Surface；
E, the metal micro-nanostructure 9 of size required for control laser parameter obtains on 6 surface of transparent substrate, the metal are micro-
Micro-nano structure 9 is the cube structure having a size of 200*500*1000nm.
Embodiment 3
A kind of method for preparing metal structure in transparent material surface using metal nano prepared Chinese ink is present embodiments provided, such as
Shown in Fig. 4, described method includes following steps:
A, metal nano prepared Chinese ink 8 is taken, the solute of the metal nano prepared Chinese ink 8 is metal aluminum nanoparticles, and solvent is alcohols
Organic solution, is ethylene glycol in the present embodiment, and the concentration of the metal nano prepared Chinese ink 8 is 15%；
B, transparent substrate 6 is taken, the transparent substrate 6 is sapphire substrate, it is placed in metal nano prepared Chinese ink 8, and
Metal nano prepared Chinese ink 8 is set to submerge the transparent substrate 6；
C, laser processing parameter and focal position are set, laser beam 1 is made to penetrate the metal prepared Chinese ink irradiation of 6 top of transparent substrate
To the upper surface of institute's transparent substrate 6, laser described in the present embodiment is the continuous laser that wavelength is 1064nm, power 5W,
Frequency is 500Hz；
D, metal nano prepared Chinese ink 8 is precipitated at laser spot under laser action and selective sintering is in transparent substrate 6
Upper surface；
E, the metal micro-nanostructure 9 of size required for control laser parameter is obtained in the lower surface of transparent substrate 6, the gold
Belonging to micro-nano structure 9 is the metal film with a thickness of 2 μm.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (6)
1. a kind of method for preparing metal structure in transparent material surface using metal nano prepared Chinese ink, which is characterized in that the side
Method includes the following steps:
A, metal nano prepared Chinese ink is taken；
B, transparent substrate is taken, is placed in metal nano prepared Chinese ink；
C, laser processing parameter and focal position are set, laser beam is made to be irradiated to the transparent substrate surface；
D, metal prepared Chinese ink is precipitated at laser spot under laser action and selective sintering is in substrate surface；
E, control laser parameter obtains required metal micro-nanostructure in substrate surface；
The solute of the metal nano prepared Chinese ink is the nano particle of metal or alloy, and the solvent of the metal nano prepared Chinese ink is water
Or alcohol organic solvent, the mass concentration of the metal nano prepared Chinese ink are 10-90%；
In the step c, the parameter of laser processing are as follows: optical maser wavelength 355nm, 532nm, 1064nm；Power is 0.1-100W；
Frequency is 1Hz-1MHz；
The metal micro-nanostructure is three-dimensional structure, having a size of micron, Nano grade.
2. the method according to claim 1 for preparing metal structure in transparent material surface using metal nano prepared Chinese ink,
It is characterized in that, in the step b, the transparent substrate is immersed in the metal nano prepared Chinese ink or floats on metal nano prepared Chinese ink
Surface.
3. the method according to claim 2 for preparing metal structure in transparent material surface using metal nano prepared Chinese ink,
It is characterized in that, when the transparent substrate is immersed in the metal nano prepared Chinese ink, it is saturating that control laser parameter passes through laser beam
In transparent substrate top surface, laser of the metal nano prepared Chinese ink in transparent substrate top surface is burnt for the metal nano prepared Chinese ink irradiation of bright substrate top
Metal micro-nanostructure is made in Selective separation-out at point；Or control laser parameter makes laser beam pass through the gold at the top of transparent substrate
Belong to nanometer prepared Chinese ink and transparent substrate, irradiates in transparent substrate bottom surface, laser spot of the metal nano prepared Chinese ink in transparent substrate bottom surface
Locate Selective separation-out, metal micro-nanostructure is made.
4. the method according to claim 3 for preparing metal structure in transparent material surface using metal nano prepared Chinese ink,
It is characterized in that, when the transparent substrate floats on the metal nano prepared Chinese ink surface, control laser parameter makes laser beam pass through institute
Transparent substrate is stated, is irradiated in transparent substrate bottom surface, the selectivity analysis at the laser spot of transparent substrate bottom surface of metal nano prepared Chinese ink
Out, metal micro-nanostructure is made.
5. the method according to claim 4 for preparing metal structure in transparent material surface using metal nano prepared Chinese ink,
It is characterized in that, the transparent substrate is low melting point polymer transparent substrate, glass substrate, sapphire substrate or composite substrate.
6. the method according to claim 5 for preparing metal structure in transparent material surface using metal nano prepared Chinese ink,
It is characterized in that, the metal is aluminium, copper, gold or silver.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710718692.7A CN107378231B (en) | 2017-08-21 | 2017-08-21 | The method for preparing metal structure in transparent material surface using metal nano prepared Chinese ink |
| PCT/CN2017/106249 WO2019037213A1 (en) | 2017-08-21 | 2017-10-16 | Method for preparing metal structure on surface of transparent material by using metal nanoparticle ink |
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| CN201710718692.7A CN107378231B (en) | 2017-08-21 | 2017-08-21 | The method for preparing metal structure in transparent material surface using metal nano prepared Chinese ink |
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| CN107378231B true CN107378231B (en) | 2019-06-07 |
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| EP3839628A1 (en) * | 2019-12-20 | 2021-06-23 | The Chinese University Of Hong Kong | Method for a photon induced material deposition and a device therefor |
| CN112024877B (en) * | 2020-09-08 | 2022-05-03 | 常州英诺激光科技有限公司 | Method for improving surface quality of 3D printing micro-channel part |
| CN114160975B (en) * | 2021-12-30 | 2022-11-08 | 中南大学 | Large-area high-strength laser welding method and device for dissimilar materials |
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| CN103455179A (en) * | 2012-05-28 | 2013-12-18 | 东元奈米应材股份有限公司 | High-resolution laser etching method for transparent conducting layer of touch panel |
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| WO2019037213A1 (en) | 2019-02-28 |
| CN107378231A (en) | 2017-11-24 |
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