CN107365985A - Chemical gilding is bathed - Google Patents
Chemical gilding is bathed Download PDFInfo
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- CN107365985A CN107365985A CN201710124004.4A CN201710124004A CN107365985A CN 107365985 A CN107365985 A CN 107365985A CN 201710124004 A CN201710124004 A CN 201710124004A CN 107365985 A CN107365985 A CN 107365985A
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- Prior art keywords
- plating
- bath
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Abstract
The present invention provides a kind of new chemical gilding bath, and the chemical gilding bathes outward appearance and plating rate after can improving plating stability, plating comprehensively.The chemical gilding bath of the present invention contains water-soluble gold compound, reducing agent, complexing agent and stabilizer, wherein, the stabilizer is the cyanohydrin compound shown in following formula.In formula, R1And R2It is identical or different, represent hydrogen atom, silicyl or the alkyl or aryl that can be substituted with a substituent.
Description
Technical field
The present invention relates to chemical gilding bath.
Background technology
Gold utensil, which has, is only second to silver, the high conductivity of copper, and the physical property by the persistent grade of thermo-compression bonding is good and resistance to
The chemical property of oxidisability, drug-resistant etc. is also good.Therefore, using the gold-plated of gold, electricity is printed in as electronics industry
It is widely used in the final surface treating method that the circuit of road plate, the mounting portion of IC package and portion of terminal are graded.In recent years, companion
With the miniaturization of electronic unit, densification, the good chemical plating method such as lead lead and feature is preferably used without.
Chemical plating method, following methods can typically be enumerated according to coating method.
(1) on substrate chemical nickel plating film, chemical nickel plating/immersion gold plating method (Electroless of immersion gold plating film is formed
Nickel Immersion Gold：ENIG)
(2) the gold-plated method of direct replacement (the Direct Immersion Gold of immersion gold plating film are directly formed on copper：
DIG)
(3) between substrate chemical nickel plating film and immersion gold plating film set chemical palladium-plating film chemical nickel plating/chemical palladium-plating/
Immersion gold plating method (Electroless Nickel Electroless Palladium Immersion Gold：ENEPIG)
These methods can prevent the diffusion of copper, improve circuit and terminal corrosion resistance.Especially with chemical palladium-plating
ENEPIG methods, it is useful in the extreme as the further method for improving the connection reliability between wire, lead-free solder.
Chemical gilding is bathed, and cyanogen is broadly divided into according to the species of the gold salt (water-soluble gold compound) used as golden supply source
Plating bath and non-cyanide plating bath (non-cyanogen plating bath).Wherein, cyanogen plating bath contains cyano-containing (CN) water-soluble gold compound (such as gold cyanide
Cyaniding gold salt of potassium etc. etc.).On the other hand, non-cyanogen plating bath contains water-soluble gold compound (such as the gold sodium chloride of not cyano-containing
Deng chlorination gold salt, the sulfurous acid gold salt of gold sodium sulfide etc. etc.).
Chemical gilding is bathed, in addition to above-mentioned gold salt, the also additive containing reducing agent, complexing agent and stabilizer etc..Its
In, reducing agent be used for reduce gold salt make gold separate out and add.Complexing agent is mainly used in making the golden dissolubility of gold plating liquid to stabilize
And add.In addition, form speed (plating rate) for the outward appearance after further raising plating stability, plating, adjustment plated film
Deng purpose, add stabilizer.
, it is necessary to add stabilizer, such as the situation of cyanogen plating bath according to the species of reducing agent particularly in chemical gilding bath,
Stabilizer is used as using noxious material KCN.However, due to strong toxicity, in keeping, the harmful effect caused to environment is discarded
Greatly, it is expected to provide in cyanogen plating bath, instead of KCN stabilizer.
On the other hand, the situation of non-cyanogen plating bath, as stabilizer, thiodiglycolic acid, mercaptobenzothiazoler, poly- second are used
(such as patent document 1-6) such as enol, hydroxyacetic acid, dimercaptosuccinic acids.
Prior art literature
Patent document
【Patent document 1】Japanese Unexamined Patent Publication 2011-168837 publications
【Patent document 2】Japanese Unexamined Patent Publication 6-145996 publications
【Patent document 3】Japanese Unexamined Patent Publication 6-145997 publications
【Patent document 4】Japanese Unexamined Patent Publication 6-280039 publications
【Patent document 5】Japanese Unexamined Patent Publication 2004-10964 publications
【Patent document 6】Japanese Unexamined Patent Publication 2005-194569 publications
The content of the invention
However, according to the result of study of the present inventor, the compound described in above-mentioned patent document has been distinguished, made
For the not sufficiently effective of stabilizer, effect is poor in any one in the outward appearance, plating rate after stability, plating.
The present invention forms in view of the foregoing, its object is to, there is provided a kind of new chemical gilding bath, chemical gilding bath
It is unrelated with the species of cyanogen plating bath, non-cyanogen plating bath, can improve comprehensively the outward appearance after plating stability, plating and plating rate (with
Under, also they are referred to plating ability).
The purport of the present invention, as described in following 1-4.
1. a kind of bath of chemical gilding, chemical gilding bath contains water-soluble gold compound, reducing agent, complexing agent and stably
Agent, wherein, the stabilizer is the cyanohydrin compound shown in following formula.
[chemical formula 1]
In formula, R1And R2It is identical or different, represent hydrogen atom, silicyl or the alkyl or virtue that can be substituted with a substituent
Base.
2. according to above-mentioned 1 chemical gilding bath, wherein, the cyanohydrin compound be selected from acetone cyanohydrin, formaldehyde cyanalcohol,
At least one of benzal cyanhydrine and 1,1,1- trifluoroacetone cyanalcohols.
3. bathed according to above-mentioned 1 or 2 chemical gildings recorded, wherein, the reducing agent is selected from boron hydride, amino borane
Compound, thiocarbamide, hydroquinones, ascorbic acid, hydrazine, formaldehyde and formaldehyde bisulfite (ホ Le system ア Le デ ヒ De weight Ami sulfuric acid
At least one of salt).
4. the chemical gilding bath according to above-mentioned 1 or 2, wherein, the composition acted on as the reducing agent contains
Selected from least one of formaldehyde and formaldehyde bisulfite, and following formula (1) or the amines shown in formula (2).
·R1-NH-C2H4-NH-R2 (1)
·R3-(CH2-NH-C2H4-NH-CH2)n-R4 (2)
In above-mentioned formula (1) and formula (2), R1、R2、R3And R4Can be with identical or different, expression-OH ,-CH3、-CH2OH、-
C2H4OH、-CH2N(CH3)2、-CH2NH(CH2OH)、-CH2NH(C2H4OH)、-C2H4NH(CH2OH)、-C2H4NH(C2H4OH)、-
CH2N(CH2OH)2、-CH2N(C2H4OH)2、-C2H4N(CH2OH)2Or-C2H4N(C2H4OH)2；N is 1-4 integer.
According to the present invention, due to having used the fabulous cyanohydrin compound of plating ability as stabilizer, there is provided no matter change
The species for learning gold plating bath is that cyanogen plating bath is also non-cyanogen plating bath, can improve the outward appearance after plating stability, plating and plating comprehensively
Cover the new chemical gilding bath of speed (collectively referred to as plating ability).
Embodiment
The present inventor is furtherd investigate to solve above-mentioned problem, and its result is found, as can carry comprehensively
The stabilizer of outward appearance and plating rate after high plating stability, plating, can be reached using the cyanohydrin compound shown in following formula
To desired purpose, so as to complete the present invention.
[chemical formula 2]
In formula, R1And R2It is identical or different, represent hydrogen atom, silicyl or the alkyl or virtue that can be substituted with a substituent
Base.
So, it is a feature of the present invention that the outward appearance and plating that are found that after can improving plating stability, plating comprehensively
The stabilizer of speed, that is, the cyanohydrin compound stabilizer good as plating ability is useful this point.Although by making
The reasons why playing good plating ability with cyanohydrin compound be not also fully aware of, but it is believed that intramolecular not only has cyano group
(CN) also there is hydroxyl (OH) effectively to be acted on.According to the present invention, played although speculating because CN bases are free in plating
Good plating ability, but the compound (such as succinonitrile, acetonitrile) of OH bases only is not contained containing CN bases merely, plating energy
The stability difference in three characteristics required by power is distinguished (referring to aftermentioned ratio by the experimental result of the present inventor
Compared with example 4,5)
In the present invention, alkyl refers to the low alkyl group that carbon number is 1-6, or the intermediate alkane that carbon number is 7-10
Base.Abovementioned alkyl can be any one in straight chain, side chain and ring-type.Abovementioned alkyl includes unsubstituted alkyl and substituent
Both substituted alkyl.Above-mentioned substituent, for example, the halogen of chlorine, fluorine etc. can be enumerated etc..
In the present invention, aryl refers to the group with aromatic rings.In above-mentioned aromatic rings, such as non-benzene series fragrance can be enumerated
Ring；Phenyl ring；Naphthalene nucleus, anthracene nucleus；Condensation aromatic rings of pyrene ring etc. etc..Above-mentioned aryl, substitute comprising unsubstituted aryl and substituent
Aryl both.As the aryl of substituent substitution, for example, above-mentioned non-benzene series aromatic rings, aromatic rings or condensation can be enumerated
Miscellaneous aromatic rings (the pyrroles that the carbon atom of more than 1 of aromatic rings is substituted by the hetero atom of oxygen atom, nitrogen-atoms, sulfuric acid atom etc.
Ring, pyridine ring, thiphene ring, furan nucleus etc.).
As above-mentioned silicyl, silicyl (such as the trimethyl silyl with above-mentioned alkyl can be enumerated
Deng), there is silicyl of alkoxy etc..Above-mentioned alkoxy, refer to the lower alkoxy that carbon number is 1-6, or carbon atom
Number is 7-10 intermediate alkoxy.Above-mentioned alkoxy can be any one in straight chain, side chain and ring-type.As with alcoxyl
The silicyl of base, such as diethoxy silicyl etc. can be enumerated.
As the cyanohydrin compound used in the present invention, such as preferably acetone cyanohydrin, formaldehyde cyanalcohol, benzal cyanhydrine and 1,
1,1- trifluoroacetone cyanalcohols.These compounds, may be used alone, used in two or more.The structure of above-claimed cpd
It is as follows.
[chemical formula 3]
Hereinafter, the chemical gilding bath to the present invention illustrates.The chemical gilding bath of the present invention, its feature exist as described above
In containing water-soluble gold compound, reducing agent, complexing agent and stabilizer, above-mentioned cyanohydrin compound is used as stabilizer.
In order to effectively play the plating ability raising of cyanohydrin compound effect, cyanohydrin compound is shared in chemical gilding bath
Content (individually containing sometimes for individually amount, containing it is two or more when be total amount.), preferably 0.0001-1mol/L is more excellent
Elect 0.001-0.1mol/L as.During less than 0.0001mol/L, it is impossible to obtain intended effect.On the other hand, more than 1mol/L
When, plating speed of separating out reduces.
In the chemical gilding bath of the present invention, there is no particular limitation for the important document beyond aforementioned stable agent, can be to change
The usually used important document in plating field is learned, as long as there is no particular limitation in the range of the effect not influenceing the present invention.With
Under, the preferable mode of each important document is illustrated.
(water-soluble gold compound)
The water-soluble gold compound used in the present invention, it can be the water-soluble gold compound without cyano group (CN), also may be used
Think the water-soluble gold compound of cyano-containing.There is no particular limitation for the species of these compounds, can use the technical field
In usually used compound.As the former example, for example, can enumerate gold sulphite, thiosulfate, rhodanate,
Sulfate, nitrate, mesylate, four amine complexes, chloride, bromide, iodide, hydroxide, oxide etc..As
The example of the latter, for example, the cyaniding gold salt of gold cyanide, potassium auricyanide, gold sodium cyanide, gold cyanide ammonium etc. can be enumerated etc..
Above-mentioned water-soluble gold compound content shared in plating bath, it is preferably 0.0001-1mol/L on the basis of gold, more
Preferably 0.002-0.03mol/L.During less than above range, plating speed of separating out may reduce, on the other hand, more than above-mentioned
During scope, there is economically disadvantageous situation.
(reducing agent)
For the species of the reducing agent used in the present invention, there is no particular limitation, can play desired plating ability
Species, usually used reducing agent in the technical field can be used.For example, boron hydride, amino borane can be enumerated
Compound, thiocarbamide, hydroquinones, ascorbic acid, hydrazine, formaldehyde, formaldehyde bisulfite etc..These reducing agents can individually add
Add, two or more can also be used in combination.
In the present invention, it is preferably and with being selected from least one of formaldehyde and formaldehyde bisulfite (hereinafter also referred to first
Aldehyde and/or formaldehyde bisulfite)；And following formula (1) or the amines shown in formula (2).
·R1-NH-C2H4-NH-R2 (1)
·R3-(CH2-NH-C2H4-NH-CH2)n-R4 (2)
In above-mentioned formula (1) and formula (2), R1, R2、R3And R4Can be with identical or different, expression-OH ,-CH3、-CH2OH、-
C2H4OH、-CH2N(CH3)2、-CH2NH(CH2OH)、-CH2NH(C2H4OH)、-C2H4NH(CH2OH)、-C2H4NH(C2H4OH)、-
CH2N(CH2OH)2、-CH2N(C2H4OH)2、-C2H4N(CH2OH)2Or-C2H4N(C2H4OH)2.N is 1-4 integer.
By and with (coexisting) these compounds, the first aldehyde-amine complex being shown below is generated, as reducing agent composition
Acted on.
Using the situation of formaldehyde,
Formaldehyde+amines
→ reducing agent composition (first aldehyde-amine complex)
Using the situation of formaldehyde bisulfite,
Formaldehyde bisulfite+amines
→ reducing agent composition (first aldehyde-amine complex)+sulfurous acid
As above-mentioned formaldehyde bisulfite, for example, formaldehyde sodium bisulfite, formaldehyde potassium acid sulfite, formaldehyde can be enumerated
Ammonium bisulfite 56to 70 etc..
Details above-mentioned and with mode, due in JP 2008-169425 publications, JP 2008-266668
Recorded in detail in number publication, specifically refer to above-mentioned publication.
Above-mentioned formaldehyde and/or formaldehyde bisulfite concentration shared in plating bath (it is sometimes single concentration individually to contain,
Containing being total concentration when both.) it is preferably 0.0001-0.5mol/L, more preferably 0.001-0.3mol/L.Less than above-mentioned model
When enclosing, substrate nickel may corrode, and on the other hand, during more than above range, plating bath may become unstable.
Above-mentioned amines concentration shared in plating bath is preferably 0.001-3mol/L, more preferably 0.01-1mol/L.
During less than above range, speed of separating out may reduce, and on the other hand, during more than above range, plating bath may become unstable
It is fixed.
Above-mentioned formaldehyde and/or formaldehyde bisulfite content (individually containing sometimes for individually amount, containing when both for close
Metering.), and the preferred molar ratio of the content of above-mentioned amines, formaldehyde and/or formaldehyde bisulfite：Amines=1：
30~3：1, more preferably 1：10~1：1.When formaldehyde and/or formaldehyde bisulfite are more than above range, plating bath may become
Must be unstable, on the other hand, when above-mentioned amines is more than above range, there is economically disadvantageous situation.
(complexing agent)
Also there is no particular limitation for the species of the complexing agent used in the present invention, can use the public affairs used in electroless plating bath
The complexing agent known.For example, phosphoric acid, boric acid, citric acid, gluconic acid can be enumerated, tartaric acid, lactic acid, malic acid, ethylenediamine, three second
Hydramine, ethylenediamine tetra-acetic acid, NTA, diethylenetriamine pentaacetic acid, hydroxyethylethylene diamine tri-acetic acid, the second of three second tetramine six
Acid, 1,3- trimethylen-edinitrilo-tetraacetic acids, 1,3- diaminourea -2- hydroxy propanes tetraacethyl, hydroxyethylamino-diacetic acid, the sweet ammonia of dihydroxy
Acid, glycoletherdiaminotetraacetic acid, dicarboxy-methyl glutamic acid, hydroxy ethylene diphosphonic acid, ethylenediamine tetramethylene phosphonic acid (エ
チ レ Application ジ ア ミ Application テ ト ラ (メ チ レ Application リ Application acid)), or their alkali metal (for example, sodium, potassium) salt, alkaline-earth metal
Salt, ammonium salt etc..These compounds may be used alone, used in two or more.
Above-mentioned complexing agent concentration shared in plating bath is (individually containing being sometimes individually amount, containing being total when both
Amount.) it is preferably 0.001-1mol/L, more preferably 0.01-0.5mol/L.During less than above range, it is possible to due to dissolution
Metal causes speed of separating out to reduce, and on the other hand, during more than above range, there is economically disadvantageous situation.
The pH, preferably 5-10 of the chemical gilding bath of the present invention.During less than above range, it is possible to cause speed of separating out to drop
Low, on the other hand, during more than above range, plating bath may become unstable.There is no particular limitation for the species of pH adjusting agent,
Used in known plating bath, for example, sodium hydroxide, potassium hydroxide, ammonia, sulfuric acid, phosphoric acid, boric acid etc. can be enumerated.
The temperature in use of the chemical gilding bath of the present invention, preferably 40-90 DEG C.During less than above range, speed of separating out can
It is able to can reduce, on the other hand, during more than above range, plating bath may become unstable.
The chemical gilding bath of the present invention, goes for above-mentioned chemical nickel plating/immersion gold plating method (ENIG), direct replacement
Any one in gold-plated method (DIG), chemical nickel plating/chemical palladium-plating/immersion gold plating method (ENEPIG).Such as use the present invention's
Chemical gilding is bathed, and is contacted by making palladium plated film be bathed with chemical gilding, can carry out chemical gilding processing in palladium coated surface.This
In the case of, such as the time of contact with 5-60 minutes, the gold-plated film of 0.01-2 μm of thickness can be formed, for example, can use
0.002-0.03 μm/minute of speed of separating out forms gold-plated film.
The chemical gilding bath of the present invention, for example, it is preferable to for being sealed to printed circuit board (PCB), ceramic substrate, semiconductor substrate, IC
The wired circuit mounting portion and terminal part of the electronic unit of dress etc. carry out chemical gilding processing.
The application advocates the priority based on Japanese patent application filed in 12 days Mays in 2016 the 2016-96511st
Interests.The full content of the specification of Japanese patent application filed in 12 days Mays in 2016 the 2016-96511st, is incorporated into
As reference in the present invention.
Embodiment
Hereinafter, more specific description is carried out to the present invention by enumerating embodiment, the present invention is not by following embodiments
Limitation, can suitably be changed implementation in the range of the purport of context is met, and they are all contained in the skill of the present invention
In the range of art.
Embodiment 1
In the present embodiment, effectively acted on as the stabilizer that chemical gilding is bathed to investigate cyanohydrin compound, to
Under method investigation stability, outward appearance and plated film form speed (plating rate).
(stability)
Prepare the gold plating bath described in table 1 to be put into container, after being warming up to each temperature described in table 1, in said temperature
It is lower to be kept for 24 hours.Temperature (keeping temperature) in table 1 is different, is due to that the species of reducing agent causes Au reduction reaction temperature
It is different.
During said temperature is kept, the state of plating solution is observed by visual observation, and investigation, which whether there is, to be occurred to analyse to the gold of container
Go out the sign of this plating bath decomposition.Be evaluated as 〇 (having good stability) without what gold separated out, it was observed that gold separate out be evaluated as × it is (steady
Qualitative difference).
(outward appearance)
Substrate is impregnated in each plating bath of table 1 and implements gold-plated, plating appearance is observed by visual observation.Specifically, in preparation
Village's industry (strain) BGA substrates processed, after implementing each operation described in table 2 successively, visually observe the outward appearance of golden film.In each of table 2
Between process, except between preimpregnation and activator, carrying out fully washing (washing time substantially 30 seconds~2 minutes).Its
As a result, obtain uniform outer appearance is evaluated as 〇 (outward appearance is good), and outward appearance is uneven, or being evaluated as uneven (system ラ) be present
× (poor appearance).
(plating rate)
Gold-plated film, the thickness fluorescent X-ray thickness Meter of above-mentioned plated film are identically formed with the observational technique of above-mentioned outward appearance
(SFT-9550 of Hitachi High-Technologies Science (former SII NanoTechnology) systems) measure.Will
The thickness of obtained gold-plated film, divided by the formation time of the gold-plated film, calculate plating rate (μm/hr).In the present embodiment, plating
Speed is evaluated as 〇 (plating rate is fast) for 0.15 μm/more than hr's, and plating rate is evaluated as × (plating less than 0.15 μm/hr's
It is slow to cover speed).
These results are recorded in table 3.In the present embodiment, stability, outward appearance and the plating speed evaluated as described above
Spend that all 〇 judgement is good for plating ability, any one for × be determined as that plating ability is poor.
【Table 1A】
【Table 1B】
【Table 2】
【Table 3】
Following consideration can be had according to table 3.
Embodiment 1,4 (using cyanogen plating bath), embodiment 2,3 (using non-cyanogen plating bath) are all cyanohydrin compounds as stabilizer
The example used, stability, outward appearance and plating rate are all good, and plating ability is fabulous.I.e., it is known that cyanohydrin compound is in chemical plating
Exceedingly useful as stabilizer in gold bath, the effect above is unrelated with the species of cyanogen plating bath, non-cyanogen plating bath effectively to be played.
In contrast, comparative example 1 (using cyanogen plating bath), comparative example 3 (using non-cyanogen plating bath), are all not add stabilizer
Example, stability reduce.
Comparative example 2,6 is the example using conventional stabilizer (using non-cyanogen plating bath), it is seen that outward appearance in comparative example 2
The bad and reduction of plating rate.Stability reduces in comparative example 6.
Comparative example 4,5 (using cyanogen plating bath), be using with CN bases without the succinonitrile of OH bases, acetonitrile as stable
The example that agent uses, it can not obtain desired stability.
Claims (4)
1. a kind of chemical gilding bath, chemical gilding bath contain water-soluble gold compound, reducing agent, complexing agent and stabilizer, its
It is characterised by, the stabilizer is the cyanohydrin compound shown in following formula,
[chemical formula 1]
In formula, R1And R2It is identical or different, represent hydrogen atom, silicyl or the alkyl or aryl that can be substituted with a substituent.
2. chemical gilding according to claim 1 bath, wherein, the cyanohydrin compound be selected from acetone cyanohydrin, formaldehyde cyanalcohol,
At least one of benzal cyanhydrine and 1,1,1- trifluoroacetone cyanalcohols.
3. chemical gilding bath according to claim 1 or 2, wherein, the reducing agent is selected from boron hydride, amino borane
At least one of compound, thiocarbamide, hydroquinones, ascorbic acid, hydrazine, formaldehyde and formaldehyde bisulfite.
4. chemical gilding bath according to claim 1 or 2, wherein, the composition acted on as the reducing agent contains
Selected from least one of formaldehyde and formaldehyde bisulfite, and following formula (1) or the amines shown in formula (2),
·R1-NH-C2H4-NH-R2 (1)
·R3-(CH2-NH-C2H4-NH-CH2)n-R4 (2)
In above-mentioned formula (1) and formula (2), R1、R2、R3And R4It is identical or different, expression-OH ,-CH3、-CH2OH、-C2H4OH、-CH2N
(CH3)2、-CH2NH(CH2OH)、-CH2NH(C2H4OH)、-C2H4NH(CH2OH)、-C2H4NH(C2H4OH)、-CH2N(CH2OH)2、-
CH2N(C2H4OH)2、-C2H4N(CH2OH)2Or-C2H4N(C2H4OH)2；N is 1-4 integer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-096511 | 2016-05-12 | ||
| JP2016096511 | 2016-05-12 |
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| Publication Number | Publication Date |
|---|---|
| CN107365985A true CN107365985A (en) | 2017-11-21 |
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ID=60304721
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710124004.4A Pending CN107365985A (en) | 2016-05-12 | 2017-03-03 | Chemical gilding is bathed |
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|---|---|
| JP (1) | JP6901847B2 (en) |
| CN (1) | CN107365985A (en) |
| TW (1) | TWI713669B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111630205A (en) * | 2018-01-26 | 2020-09-04 | 德国艾托特克公司 | Electroless plating gold plating bath |
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| JP5526458B2 (en) * | 2006-12-06 | 2014-06-18 | 上村工業株式会社 | Electroless gold plating bath and electroless gold plating method |
| JP5013077B2 (en) * | 2007-04-16 | 2012-08-29 | 上村工業株式会社 | Electroless gold plating method and electronic component |
| JP4873196B2 (en) * | 2009-04-21 | 2012-02-08 | 上村工業株式会社 | Electroless gold plating bath |
| JP6722037B2 (en) * | 2016-05-12 | 2020-07-15 | 上村工業株式会社 | Method for maintaining and controlling plating ability of electroless gold plating bath |
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- 2016-12-12 JP JP2016240473A patent/JP6901847B2/en active Active
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| US3589916A (en) * | 1964-06-24 | 1971-06-29 | Photocircuits Corp | Autocatalytic gold plating solutions |
| JP2007246955A (en) * | 2006-03-14 | 2007-09-27 | Okuno Chem Ind Co Ltd | Electroless gold-plating bath |
| CN101275224A (en) * | 2007-01-11 | 2008-10-01 | 上村工业株式会社 | Method for maintaining plating capacity in electroless gold plating bath |
| US20090242381A1 (en) * | 2008-03-25 | 2009-10-01 | Riken | Photoreduction processing method of three-dimensional metal nanostructure |
| TW201137185A (en) * | 2010-03-12 | 2011-11-01 | Univ Leuven Kath | Liquid metal salts |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111630205A (en) * | 2018-01-26 | 2020-09-04 | 德国艾托特克公司 | Electroless plating gold plating bath |
| US11512394B2 (en) | 2018-01-26 | 2022-11-29 | Atotech Deutschland Gmbh | Electroless gold plating bath |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017206766A (en) | 2017-11-24 |
| TW201807253A (en) | 2018-03-01 |
| JP6901847B2 (en) | 2021-07-14 |
| TWI713669B (en) | 2020-12-21 |
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