CN107350628A - A kind of brittle transparent material laser processing device and processing method - Google Patents
A kind of brittle transparent material laser processing device and processing method Download PDFInfo
- Publication number
- CN107350628A CN107350628A CN201710668605.1A CN201710668605A CN107350628A CN 107350628 A CN107350628 A CN 107350628A CN 201710668605 A CN201710668605 A CN 201710668605A CN 107350628 A CN107350628 A CN 107350628A
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- China
- Prior art keywords
- laser
- workpiece
- transparent material
- positioning
- processing device
- Prior art date
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- 239000012780 transparent material Substances 0.000 title claims abstract description 27
- 238000003672 processing method Methods 0.000 title abstract description 5
- 238000007493 shaping process Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 9
- 238000009826 distribution Methods 0.000 abstract description 6
- 230000004313 glare Effects 0.000 abstract description 6
- 208000027418 Wounds and injury Diseases 0.000 abstract description 2
- 230000006378 damage Effects 0.000 abstract description 2
- 208000014674 injury Diseases 0.000 abstract description 2
- 238000003754 machining Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention proposes a kind of brittle transparent material laser processing device and processing method, and lasing beam diameter is adjusted by expand unit；The veiling glare of laser beam is filtered out by spatial filter；Coordinated by the combination of beam shaping and focusing unit, make the Energy distribution of laser beam uniform.The mutual cooperation of various operations, laser beam is set to eliminate various influences when processing fragile material；And laser is disposably punched when processing, a series of micron order apertures are formed, the processing of overall figure is completed by continuous aperture, the injury to fragile material reduces.
Description
Technical field
The present invention relates to field of laser processing, more particularly to a kind of brittle transparent material laser processing device and processing side
Method.
Background technology
With the high speed development of laser precision machining, increasing material can use laser to carry out Precision Machining, example
Such as, using laser to metal material, the corresponding Precision Machining of brittle transparent material material (such as glass material) carry out, using sharp
Light Precision Machining can improve the precision of processing, and improve the efficiency of processing, be widely used in various manufacture fields, make precision
The cost of processing is cheaper, is appropriate for producing in batches.
However, because brittle transparent material has frangible property, the focusing that traditional laser processing device is formed in itself
Laser beam can have the problems such as Energy distribution is uneven, and the influence of light beam veiling glare is big, and brittle transparent material is being added using laser
In man-hour, brittle transparent material can be caused broken or be damaged.
The content of the invention
It is an object of the invention to propose a kind of brittle transparent material laser processing device and processing method, to solve background
The focusing laser beam energy distribution that existing laser processing device is formed in technology is uneven and is difficult to brittle transparent material etc.
Problem.
To achieve the above object, the present invention proposes a kind of brittle transparent material laser processing device, including workbench, automatic
Focusing system, focusing unit, reflector element, positioning CCD, beam shaping, spatial filter, expand unit, laser and control
System processed；Wherein, the control system controls the laser transmitting laser beam；The laser beam expands list described in passing sequentially through
Member, spatial filter, beam shaping, reflector element and focusing unit are irradiated on the workpiece of the table surface；It is described
Focusing unit is placed on the autofocus system；The position of figure to be processed on workpiece is identified the positioning CCD
Positioning, the control system identify that positioning signal controls the workbench to move in the horizontal plane according to the positioning CCD.
Preferably, in described brittle transparent material laser processing device, the focusing unit is aspherical focus lamp.
Preferably, in described brittle transparent material laser processing device, the expand unit expands for variable power
Mirror.
Preferably, in described brittle transparent material laser processing device, the workbench is arranged on a guide rail.
In addition, a kind of laser processing of brittle transparent material is also proposed in the present invention, using as described above
Brittle transparent material laser processing device, the technique includes：
Step 1：Control system control autofocus system carries out the identification of thickness of workpiece, and controls focusing unit to be moved to
Focal position；
Step 2：Control system control laser transmitting laser beam, make the laser beam pass sequentially through expand unit,
Spatial filter, beam shaping, reflector element and focusing unit are irradiated on the workpiece of the table surface, to the work
Part is processed；
Step 3：Positioning is identified to the position of graphics processing on workpiece in positioning CCD；The control system is according to
Positioning CCD identification positioning signals control the workbench to carry out real-time tracking adjustment in the horizontal plane, to complete to add workpiece
Work.
Compared with prior art, the beneficial effects are mainly as follows：The present invention adjusts laser by expand unit
Beam diameter；The veiling glare of laser beam is filtered out by spatial filter；Coordinated by the combination of beam shaping and focusing unit, made
The Energy distribution of laser beam is uniform.The mutual cooperation of various operations, laser beam is set to eliminate various shadows when processing fragile material
Ring；And laser is disposably punched when processing, a series of micron order apertures are formed, overall figure is completed by continuous aperture
Processing, injury to fragile material reduces.
Brief description of the drawings
Fig. 1 is the front view of brittle transparent material laser processing device in one embodiment of the invention；
Fig. 2 is the process chart of brittle transparent material laser processing in one embodiment of the invention；
Fig. 3 is the workpieces processing front view of brittle transparent material laser processing device in one embodiment of the invention；
Fig. 4 is Laser Focusing line chart in one embodiment of the invention.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, technical scheme will be made below into
Illustrate to one step.
Fig. 1 is refer to, the present invention proposes a kind of brittle transparent material laser processing device, including workbench 1, auto-focusing
System 3, focusing unit 4, reflector element 5, positioning CCD (Charge Coupled Device charge coupled cells are also named image control
Device processed) 6, beam shaping 7, spatial filter 8, expand unit 9, laser 11 and control system 12.
Wherein, the laser 11 is controlled by the instruction of the control system 12, for launching laser beam 10；The laser
Beam 10 is adjusted by the expand unit 9 first after launching via the laser 11, is adjusted straight to required light beam
Behind footpath, then the filtering by the spatial filter 8 progress veiling glare, to eliminate caused veiling glare in the transmitting procedure of laser beam 10,
Avoid having a negative impact to machining area；Then, shaping is carried out by the beam shaping 7, makes the energy of laser beam 10
It is evenly distributed, the workpiece 2 positioned at the surface of workbench 1 is exposed to through the focusing unit 4 finally by the reflector element 5
On, to carry out corresponding Precision Machining to workpiece 2.
Wherein, the focusing unit 4 is placed on the autofocus system 3, and autofocus system 3 is in control
Mobile focusing unit 4, can make Laser Focusing beam be moved to predetermined focal position under the control of system 12；The positioning CCD
Positioning is identified in the position of figure to be processed on 6 pairs of workpiece 2, so as to which when carrying out technique, control system 12 controls workbench
1, real-time tracking adjustment is carried out, to complete processing of the laser beam 10 to workpiece 2.
In the present embodiment, the focusing unit 4 is aspherical focus lamp, as shown in figure 4, using aspherical focus lamp energy
Enough ensure that the femtosecond light beam 14 after shaping forms the uniform Laser Focusing beam 15 of an Energy distribution.
In the present embodiment, the horizontal multi-direction shifting of the workbench 1 can be realized in the upper mounting rail of workbench 1
It is dynamic.The expand unit 9 is variable power beam expanding lens, and those skilled in the art can change the straight of light beam by actual conditions
Footpath.
Fig. 2 is refer to, in the present embodiment, it is also proposed that a kind of processing method of brittle transparent material laser, using such as
Brittle transparent material laser processing device described above, comprises the following steps:
Step 1：Control system 12 controls autofocus system 3 to carry out the identification to the thickness of workpiece 2, and controls focusing unit
4 are moved to focal position；
Step 2：Control system 12 controls laser 11 to launch laser beam 10, and the laser beam 10, which first passes through, described expands list
Member 9；Pass through the spatial filter 8 again；Then the beam shaping 7 is passed through；Institute is passed through finally by the reflector element 5
State focusing unit 4 to expose on the workpiece 2 on the surface of workbench 1, to carry out corresponding Precision Machining to workpiece 2；
Step 3：Positioning is identified to the position of figure to be processed on workpiece 2 in positioning CCD 6；The control system 12 is controlled
Workbench 1 processed, real-time tracking adjustment is carried out, to complete processing of the laser beam to workpiece.
In the present embodiment, specifically, in step 1, the control system 12 carries out coordination control first, it is automatic right to make
Burnt system 3 identifies the thickness of workpiece 2, and then control system 12 determines focal position according to the thickness of workpiece 2, and controls focusing
Unit 4 is moved to focal position, so that laser beam can focus to the surface of workpiece 2.
In step 2, the laser beam 10 is adjusted to required beam diameter by first passing through expand unit 9；It is described
Laser beam 10 eliminates caused veiling glare in the transmitting procedure of laser beam 10 by spatial filter 8 again, to avoid producing machining area
Raw adverse effect；Then, the laser beam 10 carries out shaping by beam shaping 7, to ensure at the focal line of laser beam 10
Energy distribution is uniform；Finally, the laser beam 10 penetrates the focusing unit 4 by reflector element 5 and is irradiated on workpiece 2, with
Proceed by working process.
In step 3, the current position of laser beam that the control system 12 is collected according to positioning CCD 6 again by with
The fixation and recognition of figure to be processed, control workbench 1 moves, so that workpiece 2 moves relative to laser beam so that swashs
Light beam 10 can move processing according to figure to be processed to workpiece 2.
In addition, in the present embodiment, as shown in figure 4, in 12 mobile work platform 1 of control system, it is ensured that focusing unit 4 produces
Raw Laser Focusing line 15 is remained inside workpiece 2, and is moved according to the track of figure to be processed, until pattern
Scribe completion.
In the present embodiment, as shown in figure 3, the laser beam 10 first gets micron order aperture 13 on workpiece 2, then pass through
Workbench 2 is moved horizontally, and these apertures 13 are continuously produced in workpiece 2, so as to complete to process.
The preferred embodiments of the present invention are above are only, any restrictions effect is not played to the present invention.Belonging to any
Those skilled in the art, in the range of technical scheme is not departed from, to the invention discloses technical scheme and
Technology contents make the variation such as any type of equivalent substitution or modification, belong to the content without departing from technical scheme, still
Belong within protection scope of the present invention.
Claims (5)
1. a kind of brittle transparent material laser processing device, it is characterised in that including workbench, autofocus system, focus on list
Member, reflector element, positioning CCD, beam shaping, spatial filter, expand unit, laser and control system；Wherein, it is described
Control system controls the laser transmitting laser beam；The laser beam passes sequentially through the expand unit, spatial filter, light
Beam reshaper, reflector element and focusing unit are irradiated on the workpiece of the table surface；The focusing unit is placed in institute
State on autofocus system；The positioning CCD position of figure to be processed on workpiece is identified positioning, the control system
Identify that positioning signal controls the workbench to move in the horizontal plane according to the positioning CCD.
2. brittle transparent material laser processing device according to claim 1, it is characterised in that the focusing unit is non-
Spherical surface focusing mirror.
3. brittle transparent material laser processing device according to claim 1, it is characterised in that the expand unit is can
Become multiplying power beam expanding lens.
4. brittle transparent material laser processing device according to claim 1, it is characterised in that the workbench is arranged on
On one guide rail.
A kind of 5. laser processing of brittle transparent material, using brittle transparent such as according to any one of claims 1 to 4
Material laser processing device, it is characterised in that the technique includes：
Step 1：Control system control autofocus system carries out the identification of thickness of workpiece, and controls focusing unit to be moved to focus
Position；
Step 2：The control system control laser transmitting laser beam, makes the laser beam pass sequentially through expand unit, space
Wave filter, beam shaping, reflector element and focusing unit are irradiated on the workpiece of the table surface, and the workpiece is entered
Row processing；
Step 3：Positioning is identified to the position of graphics processing on workpiece in positioning CCD；The control system is according to the positioning
CCD identification positioning signals control the workbench to carry out real-time tracking adjustment in the horizontal plane, to complete the processing to workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710668605.1A CN107350628A (en) | 2017-08-08 | 2017-08-08 | A kind of brittle transparent material laser processing device and processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710668605.1A CN107350628A (en) | 2017-08-08 | 2017-08-08 | A kind of brittle transparent material laser processing device and processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107350628A true CN107350628A (en) | 2017-11-17 |
Family
ID=60286420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710668605.1A Pending CN107350628A (en) | 2017-08-08 | 2017-08-08 | A kind of brittle transparent material laser processing device and processing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN107350628A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109848564A (en) * | 2018-12-28 | 2019-06-07 | 武汉华工激光工程有限责任公司 | A kind of laser processing of glass material surface frosting |
| CN110919169A (en) * | 2018-09-03 | 2020-03-27 | 大族激光科技产业集团股份有限公司 | Laser processing real-time detection device and method |
| CN113319434A (en) * | 2021-06-28 | 2021-08-31 | 苏州赛腾精密电子股份有限公司 | Laser line width adjusting method and laser marking device |
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| CN101075850A (en) * | 2007-06-20 | 2007-11-21 | 电子科技大学 | Optical carrier correlating device of time integral redundancy |
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2017
- 2017-08-08 CN CN201710668605.1A patent/CN107350628A/en active Pending
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| JP2014054668A (en) * | 2012-09-13 | 2014-03-27 | Leo:Kk | Laser processing method and laser processing apparatus |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110919169A (en) * | 2018-09-03 | 2020-03-27 | 大族激光科技产业集团股份有限公司 | Laser processing real-time detection device and method |
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| CN109848564A (en) * | 2018-12-28 | 2019-06-07 | 武汉华工激光工程有限责任公司 | A kind of laser processing of glass material surface frosting |
| CN113319434A (en) * | 2021-06-28 | 2021-08-31 | 苏州赛腾精密电子股份有限公司 | Laser line width adjusting method and laser marking device |
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Application publication date: 20171117 |