CN201693290U - Laser processing device - Google Patents
Laser processing device Download PDFInfo
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- CN201693290U CN201693290U CN2010201741198U CN201020174119U CN201693290U CN 201693290 U CN201693290 U CN 201693290U CN 2010201741198 U CN2010201741198 U CN 2010201741198U CN 201020174119 U CN201020174119 U CN 201020174119U CN 201693290 U CN201693290 U CN 201693290U
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- machining head
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Abstract
The utility model discloses a laser processing device, which comprises a processing platform, a laser, a laser processing head and a driving mechanism for adjusting the relative positions of the laser, the laser processing head and the processing platform; the laser processing device further comprises a camera and a computer, the camera is mounted on the laser processing head and connected with the computer, and the computer is connected with the driving mechanism; the laser processing head comprises a translucent semi-reflecting mirror, the light beams emitted from the laser are reflected by the translucent semi-reflecting mirror on a workpiece to be processed to form light spots, and the light spots come into the camera through the translucent semi-reflecting mirror. Compared with the prior art, the laser processing device provided by the utility model not only can perform laser processing, but also has the functions of precise focusing and positioning of initial position, thereby facilitating laser processing.
Description
Technical field
The utility model relates to laser processing technology, particularly a kind of laser processing device.
Background technology
At present, laser process equipment is widely used in fields such as semiconductor and microelectronic industry, auto industry, shipping industry, aerospace industries.Since laser be cut by after focusing on, weld, processing such as punching, so the relative position on laser beam foucing and workpiece to be machined surface also seems important unusually.Conventional laser focusing method mainly contains: burned spot method, infrared photography method, aperture scanning method etc.Wherein the burned spot method is the most commonly used, only need get a l Water Paper and be attached to surface of the work and get final product, and is simple.But this method can only provide the profile of focus roughly to people, and because the transverse heat transfer effect of material makes and burns the focus pattern distortion of getting, smudgy sometimes, it is inaccurate to focus.And, when determining initial processing position, adopt the not high ocular estimate of accuracy at present, can not satisfy accurately machined requirement.
Summary of the invention
The purpose of this utility model is, a kind of laser processing device with the accurate focusing of initial position and positioning function is provided.
To achieve these goals, the technical solution adopted in the utility model is: a kind of laser processing device, the driving mechanism that comprises processing platform, laser instrument, laser Machining head and be used to regulate laser instrument, laser Machining head and processing platform relative position, its key is, also comprise camera and computer, this camera is installed on the described laser Machining head and with described computer and links to each other, and described computer links to each other with described driving mechanism; Described laser Machining head comprises semi-permeable and semi-reflecting mirror, and the light beam that described laser instrument sends forms hot spot through the surface at workpiece to be machined after the reflection of this semi-permeable and semi-reflecting mirror, and this light spot image sees through semi-permeable and semi-reflecting mirror and enters described camera.
The utility model makes laser processing device not only can be used for conventional Laser Processing by setting up parts such as camera and computer, also has the function of auxiliary focusing and location, has made things convenient for laser processing operation.
As the preferred embodiment of technique scheme, described camera preferably adopts the CCD camera, to obtain the light spot image of high-res.In addition, also comprise the HDMI capture card, described camera links to each other with described computer through this HDMI capture card, utilizes the HDMI capture card to gather high-definition image.
Compared with prior art, advantage of the present utility model is: not only can Laser Processing, also have the accurately function of focusing and location of initial position, and made things convenient for laser processing operation.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment laser processing device;
Fig. 2 is the fundamental diagram of the utility model embodiment;
Fig. 3 is the location diagram between the center of circle D2 of the center of circle D1 of initial position D and light spot image.
Description of reference numerals:
1-processing platform, 2-workpiece to be machined, 3-nozzle, 4-sleeve, 5-focus lamp group, 6-laser beam, 7-semi-permeable and semi-reflecting mirror, 8-camera, 9-support, 10-laser Machining head, 11-laser instrument, 12-HDMI capture card, 13-computer.
The specific embodiment
Below in conjunction with accompanying drawing embodiment of the present utility model is elaborated:
See Fig. 1, the laser processing device of the utility model embodiment mainly is made up of processing platform 1, laser instrument 11, laser Machining head 10, camera 8, HDMI capture card 12 and computer 13, wherein laser Machining head 10 be vertical at processing platform 1 directly over, side at this laser Machining head 10 is provided with laser instrument 11, and install by support 9 at its top and to be equipped with camera 8, this camera 8 links to each other with computer 13 by HDMI capture card 12, and computer 13 links to each other with driving mechanism again.Camera 8 is the CCD camera.Laser instrument 11 and camera and laser Machining head 10 synchronous interactions can unify to be driven to move synchronously by driving mechanism to focus and locate.The driving mechanism of present embodiment adopts mechanical hand, and its repetitive positioning accuracy reaches 0.05mm.Also the screw mandrel driving mechanism can be set on processing platform 1, drive processing platform 1 by the screw mandrel driving mechanism and move with respect to laser Machining head 10 and focus and locate.
Laser Machining head 10 is laser cutting head or laser welding system, selects according to the processing needs.Present embodiment laser Machining head 10 mainly is made up of semi-permeable and semi-reflecting mirror 7, nozzle 3, sleeve 4 and focus lamp group 5.The light beam 6 that laser instrument 11 sends forms hot spot through the surface at workpiece to be machined after the reflection of semi-permeable and semi-reflecting mirror 7, and this light spot image sees through semi-permeable and semi-reflecting mirror 7 and enters camera 8.Other structure of laser Machining head 10 is same as the prior art.
See Fig. 2, the operation principle of present embodiment is as follows:
(a), at first carry out the correction of light path system.
(b), then, carry out the focusing work of laser processing device.
Workpiece to be machined 2 is placed on the processing platform 1, open the indication light source (ruddiness) of laser instrument 11, the light beam 6 that laser instrument 11 sends is incident upon the surface of workpiece to be machined 2 through the light path system of laser Machining head 10, form red some shaped laser spot, the shape of hot spot can be circle, square or regular polygon, is easy to convert get final product; At this moment, manipulator drives laser Machining head 10 and moves up and down, and light spot image is real-time transmitted in the computer 13 by camera 8, HDMI capture card 12, computer 13 carry out light spot image attribute to recently determining the focal plane.Detailed process is: because it is the highest to be positioned at area minimum, brightness maximum and the definition of the light spot image of focal plane, therefore, by to one in specific area, brightness and the definition or multinomially can find out the light spot image that is positioned at the focal plane.Present embodiment is example with the definition, see Fig. 2, when the focus of laser beam drops on position B or C place, the definition of light spot image is minimum, by moving up and down laser Machining head 10, the focus of laser beam drops on the somewhere between B and the C, computer 13 compares the definition of the light spot image between this, find out the highest clear light spot image, i.e. the light spot image of A position that is to say the position at place, focal plane, then, computer 13 is according to the displacement of the pairing laser Machining head 10 of this light spot image, and control laser Machining head 10 makes progress or moves down, and makes laser beam just in time drop on the A place, be of the reflection of the laser beam that sends of laser instrument 11 by semi-permeable and semi-reflecting mirror 7, and after being focused on by focus lamp group 5, the laser spot after coming out from nozzle 3 just in time drops on the workpiece to be machined 2, and this moment, focusing work was finished.
(c), at last, carry out the location work of initial position.
The direction that will parallel along processing platform 1 surface defocused laser Machining head 10, move near the processing initial point D of workpiece to be machined 2, the image D1 that gathers processing initial point D by camera 8 in advance is stored in the computer 13, after passing through image preliminary treatment, removal noise and interference then, the center of circle that obtains image D1 again by center of circle location algorithm; Open the indication light source of laser instrument 11, gather the light spot image D2 of this position by camera 8, then through after the image preliminary treatment, removing noise and interference, obtain the center of circle of image D2 again by center of circle location algorithm, owing to be pre-determined bit, the center of circle of D2 does not overlap (see figure 3) with the center of circle of D1, obtains the positional information between the center of circle of the center of circle of D2 and D1 by calculating, all around moves according to this positional information control laser Machining head 10.This kind method is simple to operate, and positioning accuracy can reach 0.05mm.
This moment, whole focusing location work was finished, and regulated laser instrument 11 then to light source for processing, can carry out Laser Processing.
Only be specific embodiment of the utility model below, do not limit protection domain of the present utility model with this; Any replacement and the improvement done on the basis of not violating the utility model design all belong to protection domain of the present utility model.
Claims (4)
1. laser processing device, the driving mechanism that comprises processing platform, laser instrument, laser Machining head and be used to regulate laser instrument, laser Machining head and processing platform relative position, it is characterized in that: also comprise camera and computer, this camera is installed on the described laser Machining head and with described computer and links to each other, and described computer links to each other with described driving mechanism; Described laser Machining head comprises semi-permeable and semi-reflecting mirror, and the light beam that described laser instrument sends forms hot spot through the surface at workpiece to be machined after the reflection of this semi-permeable and semi-reflecting mirror, and this light spot image sees through semi-permeable and semi-reflecting mirror and enters described camera.
2. laser processing device according to claim 1 is characterized in that: described camera is the CCD camera.
3. laser processing device according to claim 2 is characterized in that: also comprise the HDMI capture card, described camera links to each other with described computer through this HDMI capture card.
4. the described laser processing device arbitrary according to claim 1 to 3 is characterized in that: described laser Machining head is laser cutting head or laser welding system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201741198U CN201693290U (en) | 2010-04-22 | 2010-04-22 | Laser processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201741198U CN201693290U (en) | 2010-04-22 | 2010-04-22 | Laser processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201693290U true CN201693290U (en) | 2011-01-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010201741198U Expired - Lifetime CN201693290U (en) | 2010-04-22 | 2010-04-22 | Laser processing device |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101856773A (en) * | 2010-04-22 | 2010-10-13 | 广州中国科学院工业技术研究院 | Focusing positioning method based on initial laser processing position and laser processing device |
| CN102189333A (en) * | 2011-05-04 | 2011-09-21 | 苏州天弘激光股份有限公司 | Laser cutting machine with CCD automatic focusing system |
| CN103909346A (en) * | 2013-12-26 | 2014-07-09 | 广东大族粤铭激光科技股份有限公司 | Large format laser marking device |
| CN104427442A (en) * | 2013-08-22 | 2015-03-18 | 昆山迈思科兄弟光电科技有限公司 | Diaphragm laser welding apparatus and processing technology thereof |
| CN104708202A (en) * | 2015-03-19 | 2015-06-17 | 深圳市玖玖创想科技有限公司 | Laser welding machine |
| CN106271045A (en) * | 2016-09-05 | 2017-01-04 | 苏州大学 | A kind of automatic focusing adjustor for laser processing, laser process equipment and focus adjustment method |
| WO2022088727A1 (en) * | 2020-10-26 | 2022-05-05 | 快克智能装备股份有限公司 | Laser automatic calibration mechanism and calibration method therefor |
| CN115138992A (en) * | 2022-08-11 | 2022-10-04 | 广东宏石激光技术股份有限公司 | System and method for determining zero focus of laser cutting head |
-
2010
- 2010-04-22 CN CN2010201741198U patent/CN201693290U/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101856773A (en) * | 2010-04-22 | 2010-10-13 | 广州中国科学院工业技术研究院 | Focusing positioning method based on initial laser processing position and laser processing device |
| CN101856773B (en) * | 2010-04-22 | 2012-08-22 | 广州中国科学院工业技术研究院 | Focusing positioning method based on initial laser processing position and laser processing device |
| CN102189333A (en) * | 2011-05-04 | 2011-09-21 | 苏州天弘激光股份有限公司 | Laser cutting machine with CCD automatic focusing system |
| CN104427442A (en) * | 2013-08-22 | 2015-03-18 | 昆山迈思科兄弟光电科技有限公司 | Diaphragm laser welding apparatus and processing technology thereof |
| CN103909346A (en) * | 2013-12-26 | 2014-07-09 | 广东大族粤铭激光科技股份有限公司 | Large format laser marking device |
| CN103909346B (en) * | 2013-12-26 | 2015-12-16 | 广东大族粤铭激光科技股份有限公司 | Big width laser marking device |
| CN104708202A (en) * | 2015-03-19 | 2015-06-17 | 深圳市玖玖创想科技有限公司 | Laser welding machine |
| CN106271045A (en) * | 2016-09-05 | 2017-01-04 | 苏州大学 | A kind of automatic focusing adjustor for laser processing, laser process equipment and focus adjustment method |
| WO2022088727A1 (en) * | 2020-10-26 | 2022-05-05 | 快克智能装备股份有限公司 | Laser automatic calibration mechanism and calibration method therefor |
| CN115138992A (en) * | 2022-08-11 | 2022-10-04 | 广东宏石激光技术股份有限公司 | System and method for determining zero focus of laser cutting head |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110105 |