CN103695976B - A kind of processing method before copper products electronickelling - Google Patents
A kind of processing method before copper products electronickelling Download PDFInfo
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- CN103695976B CN103695976B CN201310695709.3A CN201310695709A CN103695976B CN 103695976 B CN103695976 B CN 103695976B CN 201310695709 A CN201310695709 A CN 201310695709A CN 103695976 B CN103695976 B CN 103695976B
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Abstract
The present invention relates to the processing method before a kind of copper products electronickelling, comprise the following steps: first carry out the copper products preparing electronickelling polishing for the first time, wash subsequently;Carry out second time again to polish, carry out three road washings subsequently;Then carry out pickling, the pickle that described pickling uses be volume fraction be the sulphuric acid of 30%;Last carry out again activating i.e. complete to process, the activating solution that described activation uses be volume fraction be the sulphuric acid of 3~5%.Copper products oxide on surface and greasy dirt are only processed by the present invention, do not corrode layers of copper, protect the integrity of product greatly, and after carrying out electronickelling, the outward appearance electroplated out is unanimously preferable, and surface color is consistent, and uniformity is good, and brightness is improved simultaneously.
Description
Technical field
The present invention relates to the processing method before a kind of copper products electronickelling, belong to copper products electro-nickel process neck
Territory.
Background technology
Fast-developing with electronic circuit, the importance of nickel plating technology significantly improves, pre-treatment in the market
It mostly is and directly copper material is carried out chemical attack (sulphuric acid and sodium thiosulfate), easily injure copper products surface.
Containing a large amount of sulphuric acid in the composition of former chemical attack, it is strong oxidizer (oxidisability: dense nitre with nitric acid
Acid > concentrated sulphuric acid), vigorous oxidation all can be occurred to react with copper, when polishing, copper mainly (is joined with sulfuric acid reaction
Than time sulfuric acid content much larger than nitric acid), and reaction is acutely, and polishing time is short, easily causes copper products local
Region polishing is not thorough, causes jaundice or blackout during plating.
Summary of the invention
The technical problem to be solved is to provide the processing method before a kind of copper products electronickelling, solves
Certainly deficiency of the prior art, meets the simplicity of copper products electronickelling pre-treatment, it is ensured that the product of copper products
Matter.
The technical scheme is that the process before a kind of copper products electronickelling
Method, comprises the following steps:
(1) first carry out the copper products preparing electronickelling polishing for the first time, wash subsequently;Wherein,
The polishing fluid I that the polishing of described first time uses is grouped into by the one-tenth of volumes below ratio: nitric acid: sulphuric acid: hydrochloric acid:
Water: degreasing agent=1:12:0.05:28:2.5;
(2) copper products after polishing for the first time and washing is carried out second time to polish, carry out subsequently
Three road washings;The polishing fluid II that the polishing of wherein said second time uses is grouped into by the one-tenth of volumes below ratio:
Nitric acid: polishing fluid I: water: degreasing agent=1:1:7:1;
(3) copper products after second time polishing and washing being carried out pickling, described pickling uses
Pickle be volume fraction be the sulphuric acid of 30%;
(4) being activated by the copper products after overpickling again, i.e. complete to process, described activation uses
Activating solution be volume fraction be the sulphuric acid of 3~5%.
Complete after above-mentioned process copper products can directly carry out the step of electronickelling operation.
On the basis of technique scheme, the present invention can also do following improvement.
Further, in described step (1), the temperature of polishing for the first time is room temperature, and the time is 5~10 seconds.
Further, in described step (2), three road washing concrete operations are entered for sequentially entering three rinsing bowls
Row washing, the water wherein used in three road washings is deionized water.
Further, in described step (2), the temperature of second time polishing is room temperature, and the time is 2~3 minutes.
Further, in described step (3), the temperature of pickling is room temperature, and the time is 4~6 seconds.
Further, in described step (4), the temperature of activation is room temperature, and the time is 1~3 minute.
Above-mentioned room temperature refers to 15~25 DEG C.
Further, in described step (1) and step (2), degreasing agent is the dimethylbenzene adding scouring agent,
The amount that wherein scouring agent adds is 0.1L/kg.
Further, the main component of described scouring agent be poly-(oxo-1,2-second dimethylene)--
Nonyl phenyl-ω-hydroxyl.
In polishing fluid, sulfuric acid content is die-offed (a small amount of sulphuric acid is that old polishing fluid is brought into), copper and nitric acid and sulphuric acid
All becoming diluted acid, oxidisability reduces immediately, main aobvious acidity, be responsible for removing terminal surfaces copper oxide and
Oil mark, reaction gentleness during polishing, polishing time lengthens, and can eliminate the not thorough phenomenon of pre-treatment.
Owing to the reaction of existing polishing fluid is gentle (the most not contacting internal layer copper), so plating out product surface is mist
Shape, can add former polishing flow process (about 5 seconds time) together, it is ensured that plate out according to demand before existing polishing
Copper products brightness increase.
The invention has the beneficial effects as follows: copper products oxide on surface and greasy dirt are only processed by the present invention,
Do not corrode layers of copper, protect the integrity of product greatly, after carrying out electronickelling, outside electroplating out simultaneously
Seeing consistent preferable, surface color is consistent, and uniformity is good, and brightness is improved.
Detailed description of the invention
Principle and feature to the present invention are described below, and example is served only for explaining the present invention, and
Non-for limiting the scope of the present invention.
Embodiment 1
(1) first at room temperature carry out polishing 5 seconds, with laggard for the first time by the copper products preparing electronickelling
Row washing;Wherein, the polishing fluid I that the polishing of described first time uses is grouped into by the one-tenth of volumes below ratio:
Nitric acid: sulphuric acid: hydrochloric acid: water: degreasing agent=1:12:0.05:28:2.5.
(2) copper products after polishing for the first time and washing is at room temperature carried out second time and polish 2
Minute, respectively enter subsequently in three rinsing bowls and utilize deionized water to wash;Wherein said second time
The polishing fluid II that polishing uses is grouped into by the one-tenth of volumes below ratio: nitric acid: polishing fluid I: water: degreasing agent
=1:1:7:1。
In described step (1) and step (2), degreasing agent is the dimethylbenzene adding scouring agent, the most concise
The amount that agent adds is 0.1L/kg, uses addition 1.5L scouring agent in 15 kilograms of dimethylbenzene to make.
(3) copper products after second time polishing and washing is at room temperature carried out pickling, described acid
Wash the pickle of employing be volume fraction be the sulphuric acid of 30%, pickling 4 seconds.
(4) being activated by the copper products after overpickling again, i.e. complete to process, described activation uses
Activating solution be volume fraction be the sulphuric acid of 3%, activate 1 minute.
Copper products surface color after activation is homogeneous, and uniformity is good, presents the original yellow of copper.
Complete after above-mentioned process copper products can directly carry out the step of electronickelling operation.
After electronickelling, copper products surface color is consistent, and uniformity is good, and brightness is improved, and presents glittering
Silver color.
Embodiment 2
(1) first at room temperature carry out polishing 8 seconds, with laggard for the first time by the copper products preparing electronickelling
Row washing;Wherein, the polishing fluid I that the polishing of described first time uses is grouped into by the one-tenth of volumes below ratio:
Nitric acid: sulphuric acid: hydrochloric acid: water: degreasing agent=1:12:0.05:28:2.5.
(2) copper products after polishing for the first time and washing is at room temperature carried out second time and polish 2.5
Minute, respectively enter subsequently in three rinsing bowls and utilize deionized water to wash;Wherein said second time
The polishing fluid II that polishing uses is grouped into by the one-tenth of volumes below ratio: nitric acid: polishing fluid I: water: degreasing agent
=1:1:7:1。
In described step (1) and step (2), degreasing agent is the dimethylbenzene adding scouring agent, the most concise
The amount that agent adds is 0.1L/kg, uses addition 1.5L scouring agent in 15 kilograms of dimethylbenzene to make.
(3) copper products after second time polishing and washing is at room temperature carried out pickling, described acid
Wash the pickle of employing be volume fraction be the sulphuric acid of 30%, pickling 5 seconds.
(4) being activated by the copper products after overpickling again, i.e. complete to process, described activation uses
Activating solution be volume fraction be the sulphuric acid of 5%, activate 2 minutes.
Copper products surface color after activation is homogeneous, and uniformity is good, presents the original yellow of copper.
Complete after above-mentioned process copper products can directly carry out the step of electronickelling operation.
After electronickelling, copper products surface color is consistent, and uniformity is good, and brightness is improved, and presents glittering
Silver color.
Embodiment 3
(1) first at room temperature carry out polishing 10 seconds, with laggard for the first time by the copper products preparing electronickelling
Row washing;Wherein, the polishing fluid I that the polishing of described first time uses is grouped into by the one-tenth of volumes below ratio:
Nitric acid: sulphuric acid: hydrochloric acid: water: degreasing agent=1:12:0.05:28:2.5.
(2) copper products after polishing for the first time and washing is at room temperature carried out second time and polish 3
Minute, respectively enter subsequently in three rinsing bowls and utilize deionized water to wash;Wherein said second time
The polishing fluid II that polishing uses is grouped into by the one-tenth of volumes below ratio: nitric acid: polishing fluid I: water: degreasing agent
=1:1:7:1。
In described step (1) and step (2), degreasing agent is the dimethylbenzene adding scouring agent, the most concise
The amount that agent adds is 0.1L/kg, uses addition 1.5L scouring agent in 15 kilograms of dimethylbenzene to make.
(3) copper products after second time polishing and washing is at room temperature carried out pickling, described acid
Wash the pickle of employing be volume fraction be the sulphuric acid of 30%, pickling 6 seconds.
(4) being activated by the copper products after overpickling again, i.e. complete to process, described activation uses
Activating solution be volume fraction be the sulphuric acid of 5%, activate 3 minutes.
Copper products surface color after activation is homogeneous, and uniformity is good, presents the original yellow of copper.
Complete after above-mentioned process copper products can directly carry out the step of electronickelling operation.
After electronickelling, copper products surface color is consistent, and uniformity is good, and brightness is improved, and presents glittering
Silver color.
Comparative example
Use the mode of the chemical attack of a large amount of sulphuric acid in background technology and nitric acid, copper products is carried out electricity
Nickel plating pre-treatment, there is aberration, lack of homogeneity in the copper products surface obtained, surface brightness is not so good as above-mentioned reality
Execute example.
After electronickelling there is aberration, lack of homogeneity in copper products surface, has the generation of white haze, and color and luster does not dodges
Bright.
It can thus be seen that embodiments of the invention only to copper products oxide on surface and greasy dirt at
Reason, does not corrode layers of copper, protects the integrity of product greatly, after carrying out electronickelling, electroplate out simultaneously
Outward appearance unanimously preferable, relative to comparative example, surface color is consistent, and uniformity is good, and brightness is improved.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all in the present invention
Spirit and principle within, any modification, equivalent substitution and improvement etc. made, should be included in this
Within bright protection domain.
Claims (7)
1. the processing method before a copper products electronickelling, it is characterised in that comprise the following steps:
(1) first carry out the copper products preparing electronickelling polishing for the first time, wash subsequently;Wherein,
The polishing fluid I that the polishing of described first time uses is made up of the composition of volumes below ratio: nitric acid: sulphuric acid: hydrochloric acid:
Water: degreasing agent=1:12:0.05:28:2.5;
(2) copper products after polishing for the first time and washing is carried out second time to polish, carry out subsequently
Three road washings;The polishing fluid II that the polishing of wherein said second time uses is made up of the composition of volumes below ratio:
Nitric acid: polishing fluid I: water: degreasing agent=1:1:7:1;
(3) copper products after second time polishing and washing being carried out pickling, described pickling uses
Pickle be volume fraction be the sulphuric acid of 30%;
(4) being activated by the copper products after overpickling again, i.e. complete to process, described activation uses
Activating solution be volume fraction be the sulphuric acid of 3~5%.
Processing method before copper products electronickelling the most according to claim 1, it is characterised in that institute
The temperature stating polishing for the first time in step (1) is room temperature, and the time is 5~10 seconds.
Processing method before copper products electronickelling the most according to claim 1, it is characterised in that institute
State three road washing concrete operations in step (2) to wash for sequentially entering three rinsing bowls, Qi Zhongsan
The water used in road washing is deionized water.
Processing method before copper products electronickelling the most according to claim 1, it is characterised in that institute
Stating the temperature of second time polishing in step (2) is room temperature, and the time is 2~3 minutes.
Processing method before copper products electronickelling the most according to claim 1, it is characterised in that institute
Stating the temperature of pickling in step (3) is room temperature, and the time is 4~6 seconds.
Processing method before copper products electronickelling the most according to claim 1, it is characterised in that institute
Stating the temperature of activation in step (4) is room temperature, and the time is 1~3 minute.
7., according to the processing method before copper products electronickelling described in any one of claim 1 to 6, it is special
Levying and be, in described step (1) and step (2), degreasing agent is the dimethylbenzene adding scouring agent, wherein
The amount that scouring agent adds is 0.1L/kg.
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CN106702448A (en) * | 2017-03-16 | 2017-05-24 | 江苏金坤科技有限公司 | Pretreatment method of nickel material electrogilding |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN85102657A (en) * | 1985-04-01 | 1986-08-06 | 南京大学 | The electropolishing method on copper zinc alloy surface |
SU1330209A1 (en) * | 1986-04-03 | 1987-08-15 | Институт Химии И Химической Технологии Ан Литсср | Composition for chemical polishing of copper and its alloys |
KR20060018324A (en) * | 2004-08-24 | 2006-03-02 | 장기범 | Chemical polishing of aluminum |
CN101285205A (en) * | 2007-04-11 | 2008-10-15 | 姜堰市德美化工有限公司 | Degreasing agent for metal surface treatment and method for preparing same |
CN102965697A (en) * | 2012-12-18 | 2013-03-13 | 南通广联实业有限公司 | Electroplating process for flexible nickel |
-
2013
- 2013-12-17 CN CN201310695709.3A patent/CN103695976B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN85102657A (en) * | 1985-04-01 | 1986-08-06 | 南京大学 | The electropolishing method on copper zinc alloy surface |
SU1330209A1 (en) * | 1986-04-03 | 1987-08-15 | Институт Химии И Химической Технологии Ан Литсср | Composition for chemical polishing of copper and its alloys |
KR20060018324A (en) * | 2004-08-24 | 2006-03-02 | 장기범 | Chemical polishing of aluminum |
CN101285205A (en) * | 2007-04-11 | 2008-10-15 | 姜堰市德美化工有限公司 | Degreasing agent for metal surface treatment and method for preparing same |
CN102965697A (en) * | 2012-12-18 | 2013-03-13 | 南通广联实业有限公司 | Electroplating process for flexible nickel |
Non-Patent Citations (1)
Title |
---|
铜合金直接镀银工艺;程永红 ;《电镀与环保》;20060730;第26卷(第4期);第41-43页 * |
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