CN107262428A - A kind of semiconductor equipment EncoreTa device feature cleaning protection tools and its method of cleaning - Google Patents
A kind of semiconductor equipment EncoreTa device feature cleaning protection tools and its method of cleaning Download PDFInfo
- Publication number
- CN107262428A CN107262428A CN201710481978.8A CN201710481978A CN107262428A CN 107262428 A CN107262428 A CN 107262428A CN 201710481978 A CN201710481978 A CN 201710481978A CN 107262428 A CN107262428 A CN 107262428A
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- CN
- China
- Prior art keywords
- cleaning
- pressure
- super
- washed
- handled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
- B08B7/026—Using sound waves
- B08B7/028—Using ultrasounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C9/00—Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning In General (AREA)
Abstract
The present invention provides a kind of cleaning method for the semiconductor equipment Encore Ta device features for being equipped with described cleaning protection tool, using the film layer overlay area of Ta/TaN in removing component by the way of super-pressure is washed；Part after being washed by super-pressure is handled using blasting craft, a small amount of residual film of removing component surface attachment；The part after blasting craft is handled is cleaned using pure water ultrasonic wave.The design method can ensure that the assembly area of part is not gone membrane process to be influenceed in cleaning process by physics, effectively reduce the loss that part is produced during cleaning and regeneration, so as to improve the cleaning quality and access times of part, suitable for precision equipment area of maintenance large-scale promotion application.
Description
Technical field
The present invention relates to clean renovation process, precision equipment area of maintenance, and in particular to a kind of semiconductor equipment Encore
Ta device feature cleaning protection tools and its method of cleaning.
Background technology
As semiconductor integrated circuit chip processing line width enters nanometer era, LOW K technologies obtain playing stage so that
The Cu lead technology scope of applications are more and more extensive.But, because Cu molecules easily spread, deep levels defect is easily caused, therefore need
Deposit one layer of Ta/TaN barrier layer to prevent Cu diffusion pollution, Encore Ta devices are semiconductor integrated circuit Cu
The key equipment in processing procedure field.
In conventional cleaning, using the hydrofluoric acid or nitre fluoric acid (mixed solution of nitric acid and hydrofluoric acid) of high concentration
To remove the Ta/TaN films on Encore Ta device inner shield body inner shield, although the process cleaning performance
Substantially, but concentrated acid can not be avoided to the etching problem of hardware body aluminium material.Section components are in conventional regeneration in Encore Ta chambers
During produce compared with lossy, with the increase of regeneration times, section components can be bad because of deformation, thinning, perforation etc., finally leads
Complete equipment part is caused not use normally.
The content of the invention
The problem of existing for prior art, the present invention provides a kind of semiconductor equipment Encore Ta device features cleaning
Tool and its method of cleaning are protected, is a kind of protection tool of Ta/TaN films on physical removal inner shield body inner shield
Application method, coordinate corresponding physics to clean technique, with cleaning performance substantially, part reuse often, it is pollution-free,
The advantages of no chemical residues risk, it is adapted to send out energetically in terms of semiconductor, liquid crystal flat-panel such as show at the maintaining of precision equipment
Exhibition.
The technical scheme is that：A kind of semiconductor equipment Encore Ta device feature cleaning protection tools, are to be used for
The covering of the inner shield body cup assembly areas in Encore Ta devices is covered, the covering offers centre bore and relative
In symmetrical two positioning holes of centre bore, the centre bore is used for the perforation for being directed at the cup assembly areas, two positioning
Hole be used to being respectively aligned to the cup assembly areas relative to symmetrical two spacing holes of the perforation.
The present invention also provides a kind of semiconductor equipment Encore Ta device features for being equipped with described cleaning protection tool
Cleaning method, comprise the following steps that：
Step 1: using the film layer overlay area of Ta/TaN in removing component by the way of super-pressure is washed；
Step 2: the part after being washed in step one by super-pressure is handled using blasting craft, removal portion
A small amount of residual film of part surface attachment；
Step 3: being cleaned using pure water ultrasonic wave to the part in step 2 after blasting craft is handled.
Further, in step one, super-pressure hydraulic giant muzzle sprayed fiber concrete is about 45-55mm.
Further, in step one, super-pressure washing pressure is 1800~2000Kg/CM2。
Further, in step 2, the part after being washed in step one by super-pressure is sprayed using WA60# white fused aluminas
Sand technique is handled.
The beneficial effects of the invention are as follows：
1st, the present invention relates to the design and preparation method that a kind of Encore Ta device features cleaning and regeneration protects tool, use
Assembled in a kind of cup (functional plastics structure member) for the inner shield body (Inner shield) for covering Encore Ta devices
Region, the design method can ensure that the assembly area of part is not gone membrane process to be influenceed in cleaning process by physics, effectively
The loss that part is produced during cleaning and regeneration is reduced, so that the cleaning quality and access times of part are improved, suitable for precision
Plant maintenance field large-scale promotion application.
2nd, using the film layer overlay area of Ta/TaN in removing component by the way of super-pressure is washed.Gone using physical method
When adhering to Ta except inner surface, the protective effect due to protection tool to cup assembly areas can effectively reduce removal inner surface additional
The generation of the bad phenomenon such as deformation, perforation during Ta/TaN.
3rd, sandblasting can be with a small amount of residual film of removing component surface attachment, and the part after being washed for super-pressure is used
The blasting crafts such as WA60# white fused aluminas are handled, and can ensure overall appearance and cleaning quality after part striping.
4th, high-pressure washing can be matched with the weaker particle of removing component surface adhesion with pure water ultrasonic cleaning process
Close, can effectively reduce the probability of happening of the bad problems of parts surface particle.
Brief description of the drawings
Fig. 1 is Encore Ta device feature structural representations；
Fig. 2 is cup locality protection jig structure schematic diagrames；
Fig. 3 is Fig. 1 and Fig. 2 assembling design sketch.
In figure：1 is hole centered on cup assembly sections, 2, and 3 be positioning hole, and 4 be Encore Ta device features, and 5 be cup regions
Tool is protected, 6 be the heavy diaphragm areas of cavity inner wall Ta/TaN.
Embodiment
The present invention is described further below in conjunction with the accompanying drawings.
Encore Ta device features cleaning and regeneration protection tool is the interior screen for covering the Encore Ta devices
Cover the covering of the cup assembly areas of body (Inner shield).
As shown in Fig. 2 covering offers centre bore 2 and relative to symmetrical two positioning holes 3 of centre bore, the center
Hole 2 is used for the perforation for being directed at the cup assembly areas 1, and two positioning holes 3 are used to be respectively aligned to the cup assembly areas 1
Relative to symmetrical two spacing holes of the perforation.Cleaning and regeneration protection tool 5 in the present invention is to be used to cover Encore
The covering of inner shield body cup assembly areas in Ta devices 4 (Fig. 1).
Cup assembly areas very thin thickness in inner shield body (Fig. 1), regenerative process causes certain loss to this region,
With the increase of wash number, this region can be deformed perforation etc. it is bad, cause part to scrap in advance.Shown in Fig. 3, with above-mentioned
Encore Ta device features cleaning and regenerations protection tool (Fig. 2) cover the inner shield bodies of the Encore Ta devices
Cup assembly areas, will protect the perforation of cup assembly areas described in tool central aperture, and two positioning holes are respectively aligned to described
Cup assembly areas relative to symmetrical two spacing holes of perforating, Encore Ta device features cleaning and regeneration is protected into tool 2
Assembled with the cup assembly areas.
Physics striping (cavity inner wall Ta/TaN sink diaphragm area 6) technique for Encore Ta device features is specific as follows：
Step 1: super-pressure washing process peels off Ta/TaN films
Using the film layer overlay area of Ta/TaN in removing component by the way of super-pressure is washed.Super-pressure washes technological parameter
For 1800~2000Kg/CM of pressure2, super-pressure hydraulic giant muzzle sprayed fiber concrete is about 50mm.In being removed using physical method
During surface attachment Ta, the protective effect due to protection tool to cup assembly areas can effectively reduce and remove inner surface attachment
The generation of the bad phenomenon such as deformation, perforation during Ta/TaN.
Step 2: sandblasting
Sandblasting can be with a small amount of residual film of removing component surface attachment, and the part after being washed for super-pressure uses WA60#
The blasting crafts such as white fused alumina are handled, and can ensure overall appearance and cleaning quality after part striping.
Step 3: pure water ultrasonic wave
High-pressure washing can be engaged with the weaker particle of removing component surface adhesion with pure water ultrasonic cleaning process,
The probability of happening of parts surface particle (particulate, particle diameter≤0.3 μm) bad problem can effectively be reduced.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (5)
1. a kind of semiconductor equipment Encore Ta device feature cleaning protection tools, it is characterised in that：It is to be used to cover
The covering of inner shield body cup assembly areas (1) in EncoreTa devices, the covering offers centre bore (2) and phase
Two positioning holes (3) symmetrical for centre bore, the centre bore (2) is used for the perforation for being directed at the cup assembly areas (1),
Two positioning holes (3) are used to be respectively aligned to the spacing relative to symmetrical two of the perforation of the cup assembly areas (1)
Hole.
2. a kind of semiconductor equipment Encore Ta device features of cleaning protection tool being equipped with described in claim 1 is clear
Washing method, it is characterised in that：Comprise the following steps that：
Step 1: using the film layer overlay area of Ta/TaN in removing component by the way of super-pressure is washed；
Step 2: the part after being washed in step one by super-pressure is handled using blasting craft, removing component table
A small amount of residual film of face attachment；
Step 3: being cleaned using pure water ultrasonic wave to the part in step 2 after blasting craft is handled.
3. method according to claim 2, it is characterised in that：In step one, super-pressure hydraulic giant muzzle sprayed fiber concrete is about
For 45-55mm.
4. method according to claim 2, it is characterised in that：In step one, super-pressure washing pressure be 1800~
2000Kg/CM2。
5. method according to claim 2, it is characterised in that：In step 2, it will be washed by super-pressure in step one
Part afterwards is handled using WA60# white fused alumina blasting crafts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710481978.8A CN107262428A (en) | 2017-06-22 | 2017-06-22 | A kind of semiconductor equipment EncoreTa device feature cleaning protection tools and its method of cleaning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710481978.8A CN107262428A (en) | 2017-06-22 | 2017-06-22 | A kind of semiconductor equipment EncoreTa device feature cleaning protection tools and its method of cleaning |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107262428A true CN107262428A (en) | 2017-10-20 |
Family
ID=60068263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710481978.8A Pending CN107262428A (en) | 2017-06-22 | 2017-06-22 | A kind of semiconductor equipment EncoreTa device feature cleaning protection tools and its method of cleaning |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107262428A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109590267A (en) * | 2018-12-28 | 2019-04-09 | 深圳仕上电子科技有限公司 | Cleaning method |
| CN111715590A (en) * | 2020-07-23 | 2020-09-29 | 安徽富乐德科技发展股份有限公司 | Cleaning method of evaporation equipment in electronic industry |
| CN111871950A (en) * | 2020-07-27 | 2020-11-03 | 安徽富乐德科技发展股份有限公司 | Surface treatment device and process for graphite component of semiconductor ion implantation device |
| CN111993287A (en) * | 2020-07-31 | 2020-11-27 | 上海富乐德智能科技发展有限公司 | Regeneration method of anodic oxidation part in dry etching equipment for semiconductor |
| CN112226742A (en) * | 2020-07-29 | 2021-01-15 | 安徽富乐德科技发展股份有限公司 | Method for cleaning holes of gas distribution aluminum component in CVD (chemical vapor deposition) equipment |
| CN114749407A (en) * | 2022-04-08 | 2022-07-15 | 安徽富乐德科技发展股份有限公司 | Ultrahigh-pressure physical film removing method for semiconductor component |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102021512A (en) * | 2010-11-04 | 2011-04-20 | 上海申和热磁电子有限公司 | Encore Ta device part cleaning regeneration protective jig and related cleaning regeneration method |
| CN104674263A (en) * | 2014-12-26 | 2015-06-03 | 昆山硕磁金属材料制品有限公司 | Metal surface cleaning method |
-
2017
- 2017-06-22 CN CN201710481978.8A patent/CN107262428A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102021512A (en) * | 2010-11-04 | 2011-04-20 | 上海申和热磁电子有限公司 | Encore Ta device part cleaning regeneration protective jig and related cleaning regeneration method |
| CN104674263A (en) * | 2014-12-26 | 2015-06-03 | 昆山硕磁金属材料制品有限公司 | Metal surface cleaning method |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109590267A (en) * | 2018-12-28 | 2019-04-09 | 深圳仕上电子科技有限公司 | Cleaning method |
| CN111715590A (en) * | 2020-07-23 | 2020-09-29 | 安徽富乐德科技发展股份有限公司 | Cleaning method of evaporation equipment in electronic industry |
| CN111715590B (en) * | 2020-07-23 | 2021-06-08 | 安徽富乐德科技发展股份有限公司 | Cleaning method of evaporation equipment in electronic industry |
| CN111871950A (en) * | 2020-07-27 | 2020-11-03 | 安徽富乐德科技发展股份有限公司 | Surface treatment device and process for graphite component of semiconductor ion implantation device |
| CN112226742A (en) * | 2020-07-29 | 2021-01-15 | 安徽富乐德科技发展股份有限公司 | Method for cleaning holes of gas distribution aluminum component in CVD (chemical vapor deposition) equipment |
| CN111993287A (en) * | 2020-07-31 | 2020-11-27 | 上海富乐德智能科技发展有限公司 | Regeneration method of anodic oxidation part in dry etching equipment for semiconductor |
| CN114749407A (en) * | 2022-04-08 | 2022-07-15 | 安徽富乐德科技发展股份有限公司 | Ultrahigh-pressure physical film removing method for semiconductor component |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20181210 Address after: 244000 Jinqiao Economic Development Zone, Tongling, Anhui Applicant after: Anhui Fule De Science and Technology Development Co., Ltd. Address before: No. 181 Shanlian Road, Baoshan City Industrial Park, Baoshan District, Shanghai, 2004 Applicant before: Shanghai Shenhe Thermo-magenetic Electronic Co., Ltd. |
|
| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171020 |
|
| RJ01 | Rejection of invention patent application after publication |