CN107249260A - A kind of processing welding technique of electronic component - Google Patents
A kind of processing welding technique of electronic component Download PDFInfo
- Publication number
- CN107249260A CN107249260A CN201710466109.8A CN201710466109A CN107249260A CN 107249260 A CN107249260 A CN 107249260A CN 201710466109 A CN201710466109 A CN 201710466109A CN 107249260 A CN107249260 A CN 107249260A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- electronic component
- pcb
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/165—Stabilizing, e.g. temperature stabilization
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to electronic component welding technology field, a kind of processing welding technique of electronic component is disclosed, is comprised the following steps：1) selection of printed circuit board (PCB)：The printed circuit board (PCB) being adapted with the electronic component specification of required welding is chosen, checks that the printed circuit board (PCB) chosen incomplete and surface occurs with the presence or absence of corner and the quality problems such as slight crack occurs；2) cleaning of printed circuit board (PCB)：By step 1) in the printed circuit board (PCB) chosen be put into clean area, then sprayed mouth by blowing by blower fan and spray clean nitrogen high wind blowing printed circuit board surface absorption dust by high efficiency filter.The processing welding technique of the electronic component, by observing the temperature curve on temperature curve tester, ensure that the processing welding technique of the electronic component can obtain optimal solderability, avoid that element is caused due to overtemperature to damage, and ensure that the welding quality of the processing welding technique of the electronic component.
Description
Technical field
The present invention relates to electronic component welding technology field, specially a kind of processing welding technique of electronic component.
Background technology
Electronic component is electronic component and the small-sized machine of electricity, the part of instrument, and itself is often by some parts
Constitute, can be general in like product；Often refer to electrical equipment, radio, some parts of the industry such as instrument, such as electric capacity, transistor,
The general name of the sub- device such as hairspring, clockwork spring.It common are diode etc..Electronic component includes：Resistance, capacitor, potentiometer, electricity
Sub- pipe, radiator, electromechanical compo, connector, semi-conductor discrete device, electro-acoustic element, laser device, electron display device, light
Electrical part, sensor, power supply, switch, small and special electric machine, electronic transformer, relay, integrated circuit, all kinds of circuits, piezoelectricity, crystalline substance
Body, quartz, ceramic magnet material, electric function technique proprietary material, electronic pastes (band) product, electron chemistry material and component
Deng.
In existing electronics industry, come there is presently no the soldering welding procedure of the reliable electronic component of complete set
Instructing manufacture, therefore, being solved the above problems we have proposed a kind of processing welding technique of electronic component.
The content of the invention
(1) technical problem solved
In view of the shortcomings of the prior art, the invention provides a kind of processing welding technique of electronic component, possesses electronics
The good advantage of component welding quality, solves the problem of existing process cannot be guaranteed to the welding quality of electronic component.
(2) technical scheme
To realize purpose that above-mentioned electronic component welding quality is good, the present invention provides following technical scheme：A kind of electronics
The processing welding technique of component, comprises the following steps：
1) selection of printed circuit board (PCB)：Choose the printed circuit being adapted with the electronic component specification of required welding
Plate, checks that the printed circuit board (PCB) chosen incomplete and surface occurs with the presence or absence of corner and the quality problems such as slight crack occurs；
2) cleaning of printed circuit board (PCB)：By step 1) the middle printed circuit board (PCB) chosen is put into clean area, then led to by blower fan
Over-blowing sprays mouth and sprays the clean nitrogen high wind blowing printed circuit board surface absorption dust for passing through high efficiency filter；
3) plated film of welding tooling：Welding tooling removes the foreign matter of surface attachment before plated film using water sand blasting process
Particle, then plates ceramic membrane using filming equipment to the surface of welding tooling；
4) the drilling processing of printed circuit board (PCB)：According to the specification of electronic component, using the drill bit of different-diameter in printing
The surface of circuit board opens up through hole；
5) making of solder(ing) paste silk screen：According to electronic component position on a printed circuit and specification, braiding system
Obtain the solder(ing) paste silk screen being adapted with electronic component；
6) the connection processing of electronic component and printed circuit board (PCB)：In welding tooling 350 DEG C of high-temperature bakings are carried out using preceding
Destatic processing with ion, using welding tooling by etc. electronic component inserting step 4 to be welded) in printed circuit board surface
The inside of the through hole opened up and marshalling；
7) the connection processing of solder(ing) paste silk screen and printed circuit board (PCB)：By step 6) in printed circuit board (PCB) be put into paste solder printing
In machine, solder(ing) paste silk screen and printed circuit board (PCB) are carried out using the optical alignment of stencil printer corresponding on position；
8) soldering：Electronic component is welded using solder reflow device, in welding process, observation temperature is bent
Temperature curve on line tester, temperature variations of the analysis electronic component element in whole reflow process, until
Complete the welding job carried out to electronic component；
9) cleaning again of printed circuit board (PCB)：The printed circuit board (PCB) being welded is put into ultrasonic cleaning apparatus, Xiang Chao
Add inorganic solvent in sound wave cleaning equipment to clean printed circuit board (PCB), printed circuit board (PCB) cleaning is set after finishing using drying
It is standby to carry out drying and processing and the inorganic solvent for remaining in printed circuit board surface is reclaimed；
10) packaging of printed circuit board (PCB) and storage：The electronic component being welded is carried out to pack into bag, it is packaged
Electronic component is placed in dry, shady and cool normal temperature environment.
It is preferred that, the step 2) in blow spray mouth blow the pouring time for 15 seconds.
It is preferred that, the step 9) in scavenging period be 20-30 minutes.
(3) beneficial effect
Compared with prior art, the invention provides a kind of processing welding technique of electronic component, possess following beneficial
Effect：
1st, the processing welding technique of the electronic component, by observing the temperature curve on temperature curve tester, it is ensured that
The processing welding technique of the electronic component can obtain optimal solderability, it is to avoid element is caused due to overtemperature to damage
It is bad, and ensure that the welding quality of the processing welding technique of the electronic component.
2nd, the processing welding technique of the electronic component, by carrying out secondary cleaning to printed circuit board (PCB), it is ensured that electronics
Component is clean and tidy before and after being welded with printed circuit board (PCB), so as to substantially increase the processing Welder of the electronic component
Crudy of the skill to electronic component, it is ensured that the practicality of the processing welding technique of the electronic component.
Embodiment
Below in conjunction with embodiments of the invention, the technical scheme in the embodiment of the present invention is clearly and completely retouched
State, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Based on the present invention
In embodiment, the every other implementation that those of ordinary skill in the art are obtained under the premise of creative work is not made
Example, belongs to the scope of protection of the invention.
A kind of processing welding technique of electronic component, comprises the following steps：
1) selection of printed circuit board (PCB)：Choose the printed circuit being adapted with the electronic component specification of required welding
Plate, checks that the printed circuit board (PCB) chosen incomplete and surface occurs with the presence or absence of corner and the quality problems such as slight crack occurs；
2) cleaning of printed circuit board (PCB)：By step 1) the middle printed circuit board (PCB) chosen is put into clean area, then led to by blower fan
Over-blowing sprays mouth and sprays the clean nitrogen high wind blowing printed circuit board surface absorption dust for passing through high efficiency filter, blows and sprays mouth
The pouring time is blown for 15 seconds；
3) plated film of welding tooling：Welding tooling removes the foreign matter of surface attachment before plated film using water sand blasting process
Particle, then plates ceramic membrane using filming equipment to the surface of welding tooling；
4) the drilling processing of printed circuit board (PCB)：According to the specification of electronic component, using the drill bit of different-diameter in printing
The surface of circuit board opens up through hole；
5) making of solder(ing) paste silk screen：According to electronic component position on a printed circuit and specification, braiding system
Obtain the solder(ing) paste silk screen being adapted with electronic component；
6) the connection processing of electronic component and printed circuit board (PCB)：In welding tooling 350 DEG C of high-temperature bakings are carried out using preceding
Destatic processing with ion, using welding tooling by etc. electronic component inserting step 4 to be welded) in printed circuit board surface
The inside of the through hole opened up and marshalling；
7) the connection processing of solder(ing) paste silk screen and printed circuit board (PCB)：By step 6) in printed circuit board (PCB) be put into paste solder printing
In machine, solder(ing) paste silk screen and printed circuit board (PCB) are carried out using the optical alignment of stencil printer corresponding on position；
8) soldering：Electronic component is welded using solder reflow device, in welding process, observation temperature is bent
Temperature curve on line tester, temperature variations of the analysis electronic component element in whole reflow process, until
The welding job carried out to electronic component is completed, by observing the temperature curve on temperature curve tester, it is ensured that the electricity
The processing welding technique of sub- component can obtain optimal solderability, it is to avoid element is caused due to overtemperature to damage, and
It ensure that the welding quality of the processing welding technique of the electronic component；
9) cleaning again of printed circuit board (PCB)：The printed circuit board (PCB) being welded is put into ultrasonic cleaning apparatus, Xiang Chao
Add inorganic solvent in sound wave cleaning equipment to clean printed circuit board (PCB), scavenging period is 20-30 minutes, printed circuit board (PCB)
Cleaning carries out drying and processing using drying plant after finishing and the inorganic solvent for remaining in printed circuit board surface is returned
Receive, by carrying out secondary cleaning to printed circuit board (PCB), it is ensured that electronic component with printed circuit board (PCB) before and after being welded
Neatly, so as to substantially increase crudy of the processing welding technique to electronic component of the electronic component, it is ensured that should
The practicality of the processing welding technique of electronic component；
10) packaging of printed circuit board (PCB) and storage：The electronic component being welded is carried out to pack into bag, it is packaged
Electronic component is placed in dry, shady and cool normal temperature environment.
In summary, the processing welding technique of the electronic component, it is bent by observing the temperature on temperature curve tester
Line, it is ensured that the processing welding technique of the electronic component can obtain optimal solderability, it is to avoid due to overtemperature to element
Cause to damage, and ensure that the welding quality of the processing welding technique of the electronic component；By being carried out to printed circuit board (PCB)
Secondary cleaning, it is ensured that electronic component is clean and tidy before and after being welded with printed circuit board (PCB), so as to substantially increase the electricity
Crudy of the processing welding technique of sub- component to electronic component, it is ensured that the processing welding technique of the electronic component
Practicality.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of changes, modification can be carried out to these embodiments, replace without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (3)
1. a kind of processing welding technique of electronic component, it is characterised in that comprise the following steps：
1) selection of printed circuit board (PCB)：Choose the printed circuit board (PCB) being adapted with the electronic component specification of required welding, inspection
There are the quality problems such as slight crack with the presence or absence of corner appearance incompleteness and surface in the printed circuit board (PCB) for looking into selection；
2) cleaning of printed circuit board (PCB)：By step 1) in the printed circuit board (PCB) chosen be put into clean area, then by blower fan by blowing
Spray mouth and spray the clean nitrogen high wind blowing printed circuit board surface absorption dust for passing through high efficiency filter；
3) plated film of welding tooling：Welding tooling removes the foreign matter of surface attachment before plated film using water sand blasting process
Grain, then plates ceramic membrane using filming equipment to the surface of welding tooling；
4) the drilling processing of printed circuit board (PCB)：According to the specification of electronic component, using the drill bit of different-diameter in printed circuit
The surface of plate opens up through hole；
5) making of solder(ing) paste silk screen：According to electronic component position on a printed circuit and specification, braiding be made with
The solder(ing) paste silk screen that electronic component is adapted；
6) the connection processing of electronic component and printed circuit board (PCB)：Welding tooling using it is preceding carry out 350 DEG C of high-temperature bakings and from
Son destatics processing, using welding tooling by etc. electronic component inserting step 4 to be welded) in printed circuit board surface
The inside of the through hole opened up and marshalling；
7) the connection processing of solder(ing) paste silk screen and printed circuit board (PCB)：By step 6) in printed circuit board (PCB) be put into stencil printer
In, solder(ing) paste silk screen and printed circuit board (PCB) are carried out using the optical alignment of stencil printer corresponding on position；
8) soldering：Electronic component is welded using solder reflow device, in welding process, observation temperature curve is surveyed
Try the temperature curve on instrument, temperature variations of the analysis electronic component element in whole reflow process, until completing
The welding job carried out to electronic component；
9) cleaning again of printed circuit board (PCB)：The printed circuit board (PCB) being welded is put into ultrasonic cleaning apparatus, to ultrasonic wave
Add inorganic solvent in cleaning equipment to clean printed circuit board (PCB), printed circuit board (PCB) cleaning is entered after finishing using drying plant
Row drying and processing and the inorganic solvent for remaining in printed circuit board surface is reclaimed；
10) packaging of printed circuit board (PCB) and storage：The electronic component being welded is carried out to pack into bag, packaged electronics
Component is placed in dry, shady and cool normal temperature environment.
2. a kind of processing welding technique of electronic component according to claim 1, it is characterised in that the step 2) in
Blow spray mouth blow the pouring time for 15 seconds.
3. a kind of processing welding technique of electronic component according to claim 1, it is characterised in that the step 9) in
Scavenging period be 20-30 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710466109.8A CN107249260A (en) | 2017-06-19 | 2017-06-19 | A kind of processing welding technique of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710466109.8A CN107249260A (en) | 2017-06-19 | 2017-06-19 | A kind of processing welding technique of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107249260A true CN107249260A (en) | 2017-10-13 |
Family
ID=60019355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710466109.8A Withdrawn CN107249260A (en) | 2017-06-19 | 2017-06-19 | A kind of processing welding technique of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107249260A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110139502A (en) * | 2019-05-31 | 2019-08-16 | 深圳市英创立电子有限公司 | Pcb board surface mount process |
| CN110139503A (en) * | 2019-05-31 | 2019-08-16 | 深圳市英创立电子有限公司 | Printed circuit board surface sticked technique |
-
2017
- 2017-06-19 CN CN201710466109.8A patent/CN107249260A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110139502A (en) * | 2019-05-31 | 2019-08-16 | 深圳市英创立电子有限公司 | Pcb board surface mount process |
| CN110139503A (en) * | 2019-05-31 | 2019-08-16 | 深圳市英创立电子有限公司 | Printed circuit board surface sticked technique |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109362189A (en) | A kind of SMT patch packaging technology | |
| CN107249260A (en) | A kind of processing welding technique of electronic component | |
| US6642624B2 (en) | Ball grid array type semiconductor device | |
| JP4357940B2 (en) | Mounting board manufacturing method | |
| JPH11260957A (en) | Electronic part package, printed wiring board and inspection of printed wiring board | |
| CN114783887A (en) | Preparation method of semiconductor power device and packaging module prepared by same | |
| CN102157318B (en) | Energy-saving lamp production process | |
| US8522426B2 (en) | Vent blocking on vented ball grid arrays to provide a cleaner solution barrier | |
| KR102510457B1 (en) | Apparatus and method for surface mounting | |
| CN108633189A (en) | Shake motor line plate whole plate packaging technology | |
| KR100891076B1 (en) | Process for recovering Printed Circuit Board | |
| KR100417338B1 (en) | Surface cleaning and modificating method by using plasma when chip packaging | |
| US6159838A (en) | Method of performing rework test on integrated circuit packages | |
| CN114200283B (en) | Circuit board manufacturing method for on-off test after coating solder resist on circuit board | |
| CN115458420B (en) | Ball mounting process of IC carrier plate | |
| JP2013172029A (en) | Repairing device and repairing method | |
| CN115942633B (en) | SMT processing technology of high-heat-dissipation circuit board | |
| US7411295B2 (en) | Circuit board, device mounting structure, device mounting method, and electronic apparatus | |
| JP3707357B2 (en) | Defect detection method for electronic component modules | |
| JP2003282630A (en) | Bare chip mounting board, bare chip mounting method, and method for cleaning print mask being used in that method | |
| JPH11185915A (en) | Area array package socket | |
| CN105763781A (en) | Camera production method | |
| TW550766B (en) | Manufacturing method semiconductor device | |
| JPH05107212A (en) | Inspecting method of external appearance of printed circuit board having parts mounted thereon | |
| CN111633290A (en) | Welding process of circuit welding plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20171013 |
|
| WW01 | Invention patent application withdrawn after publication |