JP3707357B2 - Defect detection method for electronic component modules - Google Patents

Defect detection method for electronic component modules Download PDF

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Publication number
JP3707357B2
JP3707357B2 JP2000176820A JP2000176820A JP3707357B2 JP 3707357 B2 JP3707357 B2 JP 3707357B2 JP 2000176820 A JP2000176820 A JP 2000176820A JP 2000176820 A JP2000176820 A JP 2000176820A JP 3707357 B2 JP3707357 B2 JP 3707357B2
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Prior art keywords
electronic component
component module
defect detection
board
defective
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JP2001358432A (en
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真久 阿部
高志 佐々木
孝行 小沼
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いわき電子株式会社
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Description

【０００１】
【発明の属する技術分野】
本発明は、携帯電話やＧＰＳ受信機などに用いられる電子部品モジュールの不良検出方法に関するものである。
【０００２】
【従来の技術】
この種の電子部品モジュールを製造する際には、所定の回路パターンが形成された複数個、例えば１２１個の基板片（個片）からなる多面取りプリント基板を用意し、この多面取りプリント基板の各基板片に所要の電子部品（受動素子、能動素子など）を実装して複数個の電子部品モジュールを構成する方法が広く採用されている。
【０００３】
ここで、多面取りプリント基板上の基板片をすべて良品として形成することは困難であり、外観検査で各基板片の良否を判別すると、およそ０．２〜０．３％の割合で不良が発生することから、特にこの多面取りプリント基板を工業的に量産する場合、基板片の不良の有無にかかわらず、多面取りプリント基板上のすべての基板片に電子部品の実装を行い、実装後の電子部品モジュールの段階で不良品を電気検査で取り除く方法が一般的に採られている。
【０００４】
この基板片の外観検査では、多面取りプリント基板内で良品と判別された基板片（本発明において、これを良品基板片と称する。）と不良品と判別された基板片（本発明において、これを不良基板片と称する。）とを区別するために、油性インキ、サーメットペン、各種ペイントなどによる色付け、あるいは耐熱テープの貼付などにより、不良基板片にマーキングを施し、このマーキングが付いた不良基板片を後工程、例えば多面取りプリント基板から基板片を分離する工程で取り除いている。
【０００５】
他方、電子部品モジュールの電気検査では、この電子部品モジュールに設けられた電源供給用の電極端子に電圧を印加したときの動作特性を調べ、この結果に基づいて当該電子部品モジュールの良否判別を行う。
【０００６】
【発明が解決しようとする課題】
しかし、これでは次のような不都合があった。
【０００７】
第１に、基板片の外観検査におけるマーキングは、油性インク等の場合はかすれや擦れなどによる色落ちがあり、また、耐熱テープの貼付の場合は耐熱テープが脱落する危険性があるため、不良品の判別が不確実となる。
【０００８】
第２に、電子部品モジュールの電気検査において、不良基板片の不良部分が電子部品の実装によって一時的に導通して検査をパスしてしまう場合があり、そのため不良判別を正確に行うことが困難である。特に、この不良部分が寸法不良やソルダーレジストの規格外欠損などの場合、最終的な電気検査での不良判定は実質的に不可能であり、良品として流出してしまうが恐れある。
【０００９】
本発明は、このような事情に鑑み、電子部品モジュールの不良を最終的な検査工程（電気検査）において確実に検出することが可能な電子部品モジュールの不良検出方法を提供することを目的とする。
【００１０】
【課題を解決するための手段】
すなわち本発明は、所定の回路パターン（４）が形成された複数個の基板片（３）からなる多面取りプリント基板（１）に対し、外観検査で各基板片の良否を判別して不良基板片を選び出し、次に、前記各基板片に所要の電子部品を実装して電子部品モジュールをそれぞれ構成し、その後、電気検査で前記各電子部品モジュールの良否を判別する電子部品モジュールの不良検出方法において、前記電子部品の実装前に、所定の断線手段を用いて前記不良基板片上の回路パターンを電気的に断線させるようにして構成される。ここで、回路パターンとは、基板片上に形成された導体パターン（グランドパターン、信号パターンなど）や、基板片上に設けられた電源供給用の導体パターンや電極端子などを含む導体部分を意味する。また、不良基板片とは、外観検査で不良品と判別された基板片を意味する。なお、断線手段としてはドリル、レーザー光、グラインダー、カッターなどを用いることができる。
【００１１】
こうした構成を採用することにより、外観検査で不良品と判別された基板片、つまり不良基板片は、たとえそれが良品基板片に近いものであっても、その不良性が回路パターンの断線によって明確となるため、この不良基板片に電子部品が実装された電子部品モジュールを電気検査で精度よく検出して間違いなく除去することができるようになる。
【００１２】
また本発明は、上記不良基板片上の回路パターン（４）の断線部位を電子部品モジュールへの電源供給用の導体パターンとして構成される。
【００１３】
また本発明は、上記不良基板片上の回路パターン（４）の断線部位を電子部品モジュールへの電源供給用の電極端子として構成される。
【００１４】
また本発明は、上記電子部品として能動素子を採用し、不良基板片上の回路パターン（４）の断線部位をこの能動素子の接続用の導体パターンとして構成される。
【００１５】
また本発明は、上記電子部品モジュールの良否を判別するときに、すべての電子部品モジュールが互いに連結された状態で電気検査を行うようにして構成される。
【００１６】
さらに本発明は、上記電子部品モジュールの良否を判別するときに、各電子部品モジュールが個片化された状態で電気検査を行うようにして構成される。
【００１７】
なお、括弧内の符号は図面において対応する要素を表す便宜的なものであり、したがって、本発明は図面上の記載に限定拘束されるものではない。このことは「特許請求の範囲」の欄についても同様である。
【００１８】
【発明の実施の形態】
以下、本発明の実施形態を図面に基づいて説明する。
【００１９】
図１は本発明に係る電子部品モジュールの不良検出方法の一実施形態が適用される多面取りプリント基板の第１例を示す平面図、
図２は図１に示す多面取りプリント基板の基板片の拡大詳細図であって、（ａ）はその平面図、（ｂ）は（ａ）のＡ−Ａ線による断面図、
図３は本発明に係る電子部品モジュールの不良検出方法の一実施形態が適用される多面取りプリント基板の第２例の基板片の拡大詳細図であって、（ａ）はその平面図、（ｂ）は（ａ）のＢ−Ｂ線による断面図、
図４は本発明に係る電子部品モジュールの不良検出方法の一実施形態を示すフローチャートである。
【００２０】
この電子部品モジュールの不良検出方法は、図４に示すように、次の手順で実施される。
【００２１】
まず、図１に示すように、所定の回路パターン４が形成された複数個（図１では６個）の基板片３からなる多面取りプリント基板１を用意し、この多面取りプリント基板１に対して、外観検査で各基板片３の良否を判別する（ステップＳ１）。この外観検査は、作業者の目視によって行われるほか、多面取りプリント基板上の基板片およびその回路パターンの画像を読み取る電子カメラと、この電子カメラから得られた画像を分析する画像判別装置（例えば、コンピュータ）を使用して行われる。後者の場合、画像判別装置は、それに予め記憶された良品の基板片あるいはその回路パターンの画像と、電子カメラから得られた画像とを比較し、両者が一致しない場合にその基板片を不良品と判別する。
【００２２】
この外観検査の結果、不良品と判別された基板片３、すなわち不良基板片について、その回路パターン４（例えば、所望の電子部品モジュールを構成するために必要な信号パターン、グランドパターン、電源供給用の導体パターン、電源供給用の電極端子など）を電気的に断線させる（ステップＳ２）。それには、所定の直径（例えば１ｍｍ）のドリル（図示せず）を用いて、図２に示すように、不良基板片にドリル加工穴５を明けて回路パターン４の一部を切断する。すると、この回路パターン４の断線により、不良基板片の不良性が明確となる。なお、ドリル加工穴５は不良基板片の裏面まで貫通させてもよい。
【００２３】
さらに、不良基板片の個数を確認し（ステップＳ３）、これに基づいて不良発生率を算出する。次に、部品実装に必要な部位に半田印刷で半田を付着させた後、良品基板片であると不良基板片であるとを問わず、すべての基板片３上に所要の電子部品（例えば、抵抗、インダクタ、キャパシタなどの受動素子、あるいはトランジスタ、ＩＣなどの能動素子）を実装する（ステッＳ４）。次いで、リフローにより上記で付着させた半田を溶解させることで、実装された部品を回路パターンに半田付けする。すると、複数個（図１では６個）の電子部品モジュールが互いに連結された状態で形成される。
【００２４】
次に、これら電子部品モジュールをそれぞれ切り離して個片化する（ステップＳ５）。その後、所定の電気検査で各電子部品モジュールの良否を判別して不良を検出し（ステップＳ６）、不良となった電子部品モジュールを取り除く。この際、先程の外観検査で不良品と判別された基板片、つまり不良基板片は、たとえそれが良品基板片に近いものであっても、その不良性が回路パターン４の断線によって明確となっているので、不良基板片に電子部品が実装された電子部品モジュールは、この電気検査で精度よく検出されて間違いなく除去されることになる。ここで、電子部品モジュールの不良検出が終了する。
【００２５】
なお、上述の実施形態においては、ドリル加工により、回路パターン４の一部を切断して電気的に断線させる場合について説明したが、例えば５ワット程度のＹＡＧレーザー光を用いて、図３に示すように、不良基板片にレーザー加工溝６を形成して回路パターン４の一部を切断するようにしても構わない。或いはまた、グラインダー（図示せず）で回路パターン４の一部を削り取ったり、カッター（図示せず）で回路パターン４の一部を切り取ったりすることにより、回路パターン４を電気的に断線させることも可能である。
【００２６】
また、上述の実施形態では、電子部品モジュールを個片化してから電気検査を行う場合について説明したが、電子部品モジュールを個片化する前の状態、すなわち電子部品モジュールが互いに連結された状態で電気検査を実施してもよい。
【００２７】
【発明の効果】
以上説明したように本発明によれば、外観検査で不良品と判別された基板片、つまり不良基板片は、たとえそれが良品基板片に近いものであっても、その不良性が回路パターンの断線によって明確となるため、この不良基板片に電子部品が実装された電子部品モジュールを電気検査で精度よく検出して間違いなく除去することができることから、電子部品モジュールの不良を最終的な検査工程（電気検査）において確実に検出することが可能な電子部品モジュールの不良検出方法を提供することができる。
【図面の簡単な説明】
【図１】本発明に係る電子部品モジュールの不良検出方法の一実施形態が適用される多面取りプリント基板の第１例を示す平面図である。
【図２】図１に示す多面取りプリント基板の基板片の拡大詳細図であって、（ａ）はその平面図、（ｂ）は（ａ）のＡ−Ａ線による断面図である。
【図３】本発明に係る電子部品モジュールの不良検出方法の一実施形態が適用される多面取りプリント基板の第２例の基板片の拡大詳細図であって、（ａ）はその平面図、（ｂ）は（ａ）のＢ−Ｂ線による断面図である。
【図４】本発明に係る電子部品モジュールの不良検出方法の一実施形態を示すフローチャートである。
【符号の説明】
１……多面取りプリント基板
３……基板片
４……回路パターン
５……ドリル加工穴
６……レーザー加工溝[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a defect detection method for an electronic component module used in a mobile phone, a GPS receiver, or the like.
[0002]
[Prior art]
When manufacturing this type of electronic component module, a multi-sided printed board consisting of a plurality of, for example, 121 board pieces (individual pieces) on which a predetermined circuit pattern is formed is prepared. A method of forming a plurality of electronic component modules by mounting required electronic components (passive elements, active elements, etc.) on each substrate piece is widely adopted.
[0003]
Here, it is difficult to form all the board pieces on the multi-sided printed circuit board as non-defective products, and when the quality of each board piece is determined by visual inspection, defects occur at a rate of about 0.2 to 0.3%. Therefore, especially in the case of industrial mass production of this multi-sided printed board, electronic components are mounted on all the board pieces on the multi-sided printed board regardless of whether the board pieces are defective or not. A method of removing defective products by electrical inspection at the component module stage is generally employed.
[0004]
In the appearance inspection of the board pieces, the board pieces that are determined as non-defective products in the multi-sided printed board (in the present invention, this is referred to as non-defective board pieces) and the board pieces that are determined as defective products (in the present invention, In order to distinguish this from a defective substrate piece), the defective substrate piece is marked by marking it with oil-based ink, cermet pen, various paints, or applying heat resistant tape. The piece is removed in a subsequent step, for example, a step of separating the substrate piece from the multi-sided printed board.
[0005]
On the other hand, in the electrical inspection of the electronic component module, the operation characteristics when a voltage is applied to the electrode terminal for power supply provided in the electronic component module is examined, and the quality of the electronic component module is determined based on the result. .
[0006]
[Problems to be solved by the invention]
However, this has the following disadvantages.
[0007]
First, the markings in the visual inspection of the substrate pieces may be discolored due to fading or rubbing in the case of oil-based inks, etc., and there is a risk that the heat-resistant tape may fall off when heat-resistant tape is applied. It is uncertain whether the product is good.
[0008]
Secondly, in the electrical inspection of the electronic component module, the defective portion of the defective board piece may be temporarily conducted due to the mounting of the electronic component and pass the inspection, so that it is difficult to accurately determine the defect. It is. In particular, when the defective portion is a dimensional defect or a non-standard defect of the solder resist, it is practically impossible to determine a defect in the final electrical inspection, and there is a risk that the defective portion will be discharged as a non-defective product.
[0009]
In view of such circumstances, an object of the present invention is to provide an electronic component module defect detection method capable of reliably detecting defects in an electronic component module in a final inspection process (electrical inspection). .
[0010]
[Means for Solving the Problems]
That is, according to the present invention, for a multi-sided printed board (1) composed of a plurality of board pieces (3) on which a predetermined circuit pattern (4) is formed, the quality of each board piece is determined by visual inspection and a defective board is determined. Electronic component module defect detection method for selecting a piece and then configuring each electronic component module by mounting required electronic components on each of the substrate pieces, and then determining whether each electronic component module is good or bad by electrical inspection The circuit pattern on the defective board piece is electrically disconnected using a predetermined disconnection means before mounting the electronic component. Here, the circuit pattern means a conductor portion including a conductor pattern (ground pattern, signal pattern, etc.) formed on a substrate piece, a power supply conductor pattern, an electrode terminal, etc. provided on the substrate piece. Further, the defective substrate piece means a substrate piece that is determined to be a defective product in the appearance inspection. In addition, a drill, a laser beam, a grinder, a cutter etc. can be used as a disconnection means.
[0011]
By adopting such a configuration, a board piece that is determined to be defective by visual inspection, that is, a defective board piece, even if it is close to a non-defective board piece, its failure is clearly indicated by the disconnection of the circuit pattern. Therefore, the electronic component module in which the electronic component is mounted on the defective board piece can be accurately detected by electrical inspection and removed without fail.
[0012]
In the present invention, the disconnection portion of the circuit pattern (4) on the defective substrate piece is configured as a conductor pattern for supplying power to the electronic component module.
[0013]
In the present invention, the disconnection portion of the circuit pattern (4) on the defective substrate piece is configured as an electrode terminal for supplying power to the electronic component module.
[0014]
In the present invention, an active element is used as the electronic component, and the broken portion of the circuit pattern (4) on the defective substrate piece is configured as a conductor pattern for connecting the active element.
[0015]
In addition, the present invention is configured to perform an electrical inspection in a state where all the electronic component modules are connected to each other when determining the quality of the electronic component module.
[0016]
Furthermore, the present invention is configured to perform an electrical inspection in a state where each electronic component module is separated into pieces when determining the quality of the electronic component module.
[0017]
In addition, the code | symbol in a parenthesis is the thing which represents the corresponding element in drawing, and, therefore, this invention is not restrict | limited to the description on drawing. The same applies to the column “Claims”.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0019]
FIG. 1 is a plan view showing a first example of a multi-sided printed circuit board to which an embodiment of a defect detection method for an electronic component module according to the present invention is applied;
2 is an enlarged detailed view of the board piece of the multi-sided printed board shown in FIG. 1, wherein (a) is a plan view thereof, (b) is a cross-sectional view taken along line AA of (a),
FIG. 3 is an enlarged detailed view of a board piece of a second example of a multi-sided printed circuit board to which an embodiment of a defect detection method for an electronic component module according to the present invention is applied, wherein (a) is a plan view thereof; b) is a cross-sectional view taken along line BB in FIG.
FIG. 4 is a flowchart showing an embodiment of the electronic component module defect detection method according to the present invention.
[0020]
As shown in FIG. 4, this electronic component module defect detection method is carried out in the following procedure.
[0021]
First, as shown in FIG. 1, a multi-sided printed board 1 composed of a plurality (six in FIG. 1) of board pieces 3 on which a predetermined circuit pattern 4 is formed is prepared. Then, the quality of each substrate piece 3 is determined by appearance inspection (step S1). This visual inspection is performed by visual observation by an operator, an electronic camera that reads an image of a board piece on a multi-sided printed circuit board and its circuit pattern, and an image determination device that analyzes an image obtained from the electronic camera (for example, Computer). In the latter case, the image discriminating apparatus compares a non-defective board piece or its circuit pattern image stored in advance with the image obtained from the electronic camera, and if both do not match, the board piece is defective. Is determined.
[0022]
As a result of the appearance inspection, the circuit board pattern 3 (for example, a signal pattern, a ground pattern, and a power supply necessary for configuring a desired electronic component module) is determined for the board piece 3 that is determined as a defective product, that is, a defective board piece. The conductor pattern, the electrode terminal for power supply, etc.) are electrically disconnected (step S2). For this purpose, using a drill (not shown) having a predetermined diameter (for example, 1 mm), as shown in FIG. 2, a drilled hole 5 is made in the defective substrate piece and a part of the circuit pattern 4 is cut. Then, the defect of the defective substrate piece becomes clear due to the disconnection of the circuit pattern 4. In addition, you may penetrate the drilling hole 5 to the back surface of a defective board piece.
[0023]
Further, the number of defective substrate pieces is confirmed (step S3), and the defect occurrence rate is calculated based on this. Next, after soldering is applied to parts necessary for component mounting by solder printing, regardless of whether the substrate is a non-defective substrate piece or a defective substrate piece, required electronic components (for example, A passive element such as a resistor, an inductor, or a capacitor, or an active element such as a transistor or an IC is mounted (step S4). Next, the mounted component is soldered to the circuit pattern by dissolving the solder adhered as described above by reflow. As a result, a plurality (six in FIG. 1) of electronic component modules are formed connected to each other.
[0024]
Next, these electronic component modules are separated and separated into individual pieces (step S5). Thereafter, the quality of each electronic component module is determined by a predetermined electrical inspection to detect a failure (step S6), and the defective electronic component module is removed. At this time, even if the substrate piece determined to be defective in the previous appearance inspection, that is, the defective substrate piece is close to the non-defective substrate piece, the defect is clarified by the disconnection of the circuit pattern 4. Therefore, the electronic component module in which the electronic component is mounted on the defective board piece is accurately detected by this electrical inspection and is definitely removed. Here, the defect detection of the electronic component module is completed.
[0025]
In the above-described embodiment, a case has been described in which a part of the circuit pattern 4 is cut and electrically disconnected by drilling. For example, a YAG laser beam of about 5 watts is used as shown in FIG. As described above, the laser processing groove 6 may be formed in the defective substrate piece to cut a part of the circuit pattern 4. Alternatively, the circuit pattern 4 may be electrically disconnected by cutting off a part of the circuit pattern 4 with a grinder (not shown) or cutting a part of the circuit pattern 4 with a cutter (not shown). Is also possible.
[0026]
Further, in the above-described embodiment, the case where the electrical inspection is performed after the electronic component module is separated is described. However, the state before the electronic component module is separated, that is, the electronic component modules are connected to each other. An electrical inspection may be performed.
[0027]
【The invention's effect】
As described above, according to the present invention, a substrate piece that has been determined to be defective by an appearance inspection, that is, a defective substrate piece, even if it is close to a non-defective substrate piece, has a defect of a circuit pattern. Since the electronic component module in which the electronic component is mounted on this defective board piece can be accurately detected by electrical inspection and removed without fail, since it becomes clear by disconnection, the electronic component module failure is finally checked It is possible to provide a defect detection method for an electronic component module that can be reliably detected in (electrical inspection).
[Brief description of the drawings]
FIG. 1 is a plan view showing a first example of a multi-sided printed circuit board to which an embodiment of a defect detection method for an electronic component module according to the present invention is applied.
2 is an enlarged detail view of a board piece of the multi-sided printed board shown in FIG. 1, wherein (a) is a plan view thereof, and (b) is a sectional view taken along line AA of (a).
FIG. 3 is an enlarged detailed view of a board piece of a second example of a multi-sided printed circuit board to which an embodiment of a defect detection method for an electronic component module according to the present invention is applied, wherein (a) is a plan view thereof; (B) is sectional drawing by the BB line of (a).
FIG. 4 is a flowchart showing one embodiment of a defect detection method for an electronic component module according to the present invention.
[Explanation of symbols]
1 ... Multi-sided printed circuit board 3 ... PC board piece 4 ... Circuit pattern 5 ... Drilling hole 6 ... Laser processing groove

Claims (6)

所定の回路パターン（４）が形成された複数個の基板片（３）からなる多面取りプリント基板（１）に対し、外観検査で各基板片の良否を判別して不良基板片を選び出し、
次に、前記各基板片に所要の電子部品を実装して電子部品モジュールをそれぞれ構成し、
その後、電気検査で前記各電子部品モジュールの良否を判別する電子部品モジュールの不良検出方法において、
前記電子部品の実装前に、所定の断線手段を用いて前記不良基板片上の回路パターンを電気的に断線させるようにしたことを特徴とする電子部品モジュールの不良検出方法。With respect to the multi-sided printed circuit board (1) composed of a plurality of circuit board pieces (3) on which a predetermined circuit pattern (4) is formed, the quality of each board piece is determined by visual inspection and a defective board piece is selected.
Next, a required electronic component is mounted on each of the board pieces to constitute an electronic component module,
Thereafter, in the electronic component module defect detection method for determining the quality of each electronic component module by electrical inspection,
An electronic component module defect detection method, wherein a circuit pattern on the defective substrate piece is electrically disconnected using a predetermined disconnection means before mounting the electronic component. 不良基板片上の回路パターン（４）の断線部位を電子部品モジュールへの電源供給用の導体パターンとしたことを特徴とする請求項１に記載の電子部品モジュールの不良検出方法。2. The defect detection method for an electronic component module according to claim 1, wherein the broken part of the circuit pattern (4) on the defective substrate piece is a conductor pattern for supplying power to the electronic component module. 不良基板片上の回路パターン（４）の断線部位を電子部品モジュールへの電源供給用の電極端子としたことを特徴とする請求項１に記載の電子部品モジュールの不良検出方法。2. The defect detection method for an electronic component module according to claim 1, wherein the broken part of the circuit pattern (4) on the defective substrate piece is used as an electrode terminal for supplying power to the electronic component module. 電子部品として能動素子を採用し、不良基板片上の回路パターン（４）の断線部位をこの能動素子の接続用の導体パターンとしたことを特徴とする請求項１に記載の電子部品モジュールの不良検出方法。2. The defect detection of an electronic component module according to claim 1, wherein an active element is employed as the electronic component, and the disconnection portion of the circuit pattern (4) on the defective substrate piece is used as a conductive pattern for connection of the active element. Method. 電子部品モジュールの良否を判別するときに、すべての電子部品モジュールが互いに連結された状態で電気検査を行うようにしたことを特徴とする請求項１から請求項４までのいずれかに記載の電子部品モジュールの不良検出方法。5. The electronic device according to claim 1, wherein when determining whether the electronic component module is good or bad, an electrical inspection is performed in a state where all the electronic component modules are connected to each other. Defect detection method for component modules. 電子部品モジュールの良否を判別するときに、各電子部品モジュールが個片化された状態で電気検査を行うようにしたことを特徴とする請求項１から請求項４までのいずれかに記載の電子部品モジュールの不良検出方法。5. The electronic device according to claim 1, wherein when determining whether the electronic component module is good or bad, an electrical inspection is performed in a state where each electronic component module is separated into pieces. Defect detection method for component modules.
JP2000176820A 2000-06-13 2000-06-13 Defect detection method for electronic component modules Expired - Fee Related JP3707357B2 (en)

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