CN107234366A - One kind welds silver paste and its preparation technology and applies welding procedure - Google Patents
One kind welds silver paste and its preparation technology and applies welding procedure Download PDFInfo
- Publication number
- CN107234366A CN107234366A CN201710461614.3A CN201710461614A CN107234366A CN 107234366 A CN107234366 A CN 107234366A CN 201710461614 A CN201710461614 A CN 201710461614A CN 107234366 A CN107234366 A CN 107234366A
- Authority
- CN
- China
- Prior art keywords
- weight
- parts
- silver paste
- welding
- conductive silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Abstract
The invention discloses one kind welding silver paste and its preparation technology and application, the cosolvent that the organic carrier and parts by weight that glass dust that the conductive silver powder for being 60 90 by parts by weight, parts by weight are 5 10, parts by weight are 5 39 are 1 is constituted.Cosolvent that the organic carrier and parts by weight that glass dust that conductive silver powder that it is 60 90 by parts by weight that the preparation technology of the welding silver paste, which is, parts by weight are 5 10, parts by weight are 5 39 are 1 is blended successively, formed after stirring and grinding.Using conductive silver paste welding procedure when, with dispensing mode by conductive silver paste point in the place for needing welding lead, then burn 600 900 DEG C, keep combustion peak 10 15 minutes can sinter molding.When the welding silver paste provided using the present invention is welded, after sinter molding, high temperature resistant, adhesive force is strong, easy-to-connect.
Description
Technical field
The present invention relates to electronics new material, electric slurry or Electric radiant Heating Film field, what more particularly to a kind of circuit lead was drawn
Weld silver paste and its preparation technology and apply welding procedure.
Background technology
In the prior art, compared to electronic circuit, several traditional modes of connection of Electric radiant Heating Film,
1. hole knockout.Technique is cumbersome, risky.Hole is taken with turntable, hole can not be too shallow, and too shallow embedding line is not firm, punched
Too deep, base material is easy to be drilled out, or substrate crack, causes full wafer circuit to be scrapped.
Connect electrically 2. pressing.Electric terminal is crimped in electrode surface with spring, and spring is changed over time, it may appear that metal is tired
Labor, adds working space and often has high/low temperature circulation, causes to press terminal and electrode contact occurs not enough, or even virtual connection
Touch, can occur to beat electric spark, the problems such as potential safety hazard such as solder joint failure and service life shorten during energization.
3. tin welding is electric.Scolding tin is the mode of connection being in daily use, but tin fusing point is relatively low, and electric heating film for heating temperature is frequent
Up to five or six hundred degree, soldering terminal is not suitable for the field, even if operating temperature is below tin fusing point, because silver ion is easily migrated
Weakness, bottom silver layer can gradually be moved in tin, elapse over time, and welding spot adhesion force intensity can be gradually reduced, until stripping
From.
The content of the invention
For above-mentioned shortcoming and defect of the prior art, it is an object of the invention to provide one kind.
The purpose of the present invention is achieved through the following technical solutions：
One kind welding silver paste, glass dust that the conductive silver powder for being 60-90 by parts by weight, parts by weight are 5-10, parts by weight are
5-39 organic carrier and parts by weight constitutes for 1 cosolvent.
Preferably, the conductive silver powder is by 3-4 μm of ball shape silver powder, 1-2 μm of near-spherical silver powder and 3-4 μm of sheet silver
Powder is constituted according to parts by weight 4: 4: 2.
Preferably, the glass powder fineness is 5-10 μm, and softening point is 450-520 DEG C.
Preferably, organic carrier is ethyl cellulose of the weight than 10: 90 and butyl carbitol acetate Hybrid Heating
Into.
A kind of preparation technology for welding silver paste, the glass that the conductive silver powder for being 60-90 by parts by weight, parts by weight are 5-10
Cosolvent that the organic carrier and parts by weight that powder, parts by weight are 5-39 are 1 is blended successively, formed after stirring and grinding.
A kind of welding procedure of application conductive silver paste, with dispensing mode by conductive silver paste point on the ground for needing welding lead
Side, then burns 600-900 DEG C, keeps combustion peak 10 minutes can sinter molding.
Compared with prior art, the embodiment of the present invention at least has advantages below：
It need not be punched when being welded using present invention welding silver paste, the dispensing directly on base material, sintering is plastic connects
Line, it is to avoid the risk that the technique and full wafer circuit breakage drilled on base material is scrapped.
Welding silver paste combines together after dispensing, sintering with bottom electrode, thoroughly solves in background technology and presses
Connect the constructional deficiency electrically existed.
Bonding wire silver paste with fused into one with bottom silver layer, formed metal silver bullion, metal silver point up to 960 DEG C, so
This mode of connection heatproof adheres to force intensity and electric conductivity and does not have any decline up to five or six hundred degree.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
Technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is the present invention one
Divide embodiment, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not making
The every other embodiment obtained under the premise of creative work, belongs to the scope of protection of the invention.
With reference to embodiment, the invention will be further described.
One kind welding silver paste, glass dust that the conductive silver powder for being 60-90 by parts by weight, parts by weight are 5-10, parts by weight are
5-39 organic carrier and parts by weight constitutes for 1 cosolvent.
The conductive silver powder by 3-4 μm of ball shape silver powder, 1-2 μm of near-spherical silver powder and 3-4 μm of flake silver powder according to
Parts by weight 4: 4: 2 are constituted.The stability of structure after the completion for being advantageously selected for sintering of different size silver powder and sintering.
The glass powder fineness is 5-10 μm, and softening point is 450-520 DEG C.
Organic carrier is that ethyl cellulose of the weight than 10: 90 and butyl carbitol acetate Hybrid Heating are formed.
It is related to the preparation of welding silver paste, specifically provides following three kinds of proportioning modes.
Specific implementation one：
A kind of preparation technology for welding silver paste, glass dust that the conductive silver powder for being 60 by parts by weight, parts by weight are 10, weight
Cosolvent that the organic carrier for part being 39 and parts by weight are 1 is blended successively, formed after stirring and grinding.
Specific implementation two：
A kind of preparation technology for welding silver paste, glass dust that the conductive silver powder for being 80 by parts by weight, parts by weight are 8, weight
Cosolvent that the organic carrier for part being 11 and parts by weight are 1 is blended successively, formed after stirring and grinding.
Specific implementation three：
A kind of preparation technology for welding silver paste, glass dust that the conductive silver powder for being 85 by parts by weight, parts by weight are 5, weight
Cosolvent that the organic carrier for part being 9 and parts by weight are 1 is blended successively, formed after stirring and grinding.
The proportioning components of different proportion, under identical sintering condition, it is possible to achieve the control to form after sintering, simultaneously
The high proportioning of silver content, it is possible to achieve the conductive of higher level needs and bond strength, the low proportioning of silver content, can be formed into
This high performance-price ratio, is conducive to cost-effective.
Technical scheme according to described in three of the above specific embodiment, by selecting the silver powder of different structure and size,
Silver paste mixture needs to roughly grind after stirring compared to traditional silver paste, the complicated technology such as fine grinding, to conductive silver paste fineness in the present invention
Requirement it is not strict, as long as it is uniform to be sufficiently mixed compacting, shorten processing technology and energy loss.Of different sizes, shape
Different powder can preferably realize the link between each molecule on the contrary in follow-up sintering process, so as to realize more compact
Compact density and realize smaller resistance.
A kind of welding procedure of application conductive silver paste, with dispensing mode by conductive silver paste point on the ground for needing welding lead
Side, then burns 600-900 DEG C (according to different sintering requirements, actual temp is adjusted on demand), keeps combustion peak 10 minutes
Can sinter molding.
After silver paste of the present invention is machined, form of construction work is that first dispensing is right, rear technique burnt in a heap, and the terminals after shaping are in
Existing similar hemisphere is block, and the resistance of the molding structure solder joint is small, the shape wiring point in the case where applying the working condition of voltage heating,
Connection part is not generated heat, it is to avoid terminals overheat and the aging caused by overheat because caused by contact resistance is big, simultaneously
Be conducive to control of the successor circuit to temperature.
It need not be punched when being welded using present invention welding silver paste, the dispensing directly on base material, sintering is plastic connects
Line, it is to avoid the risk that the technique and full wafer circuit breakage drilled on base material is scrapped.
Bonding wire silver paste with fused into one with bottom silver layer, formed metal silver bullion, metal silver point up to 960 DEG C, so
This mode of connection heatproof adheres to force intensity and electric conductivity and does not have any decline up to five or six hundred degree.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, the change or replacement that can be readily occurred in,
It should all be included within the scope of the present invention.Therefore, protection scope of the present invention should be with the protection model of claims
Enclose and be defined.
Claims (6)
1. one kind welding silver paste, it is characterised in that glass dust that the conductive silver powder for being 60-90 by parts by weight, parts by weight are 5-10,
The cosolvent composition that the organic carrier and parts by weight that parts by weight are 5-39 are 1.
2. welding silver paste according to claim 1, it is characterised in that ball shape silver powder, 1- of the conductive silver powder by 3-4 μm
2 μm of near-spherical silver powder and 3-4 μm of flake silver powder are constituted according to parts by weight 4: 4: 2.
3. welding silver paste according to claim 1, it is characterised in that the glass powder fineness is 5-10 μm, softening point is
450-520℃。
4. welding silver paste according to claim 1, it is characterised in that organic carrier is ethyl cellulose of the weight than 10: 90
Element and butyl carbitol acetate Hybrid Heating are formed.
5. a kind of preparation technology for welding silver paste, it is characterised in that the conductive silver powder for being 60-90 by parts by weight, parts by weight are 5-
Cosolvent that the organic carrier and parts by weight that 10 glass dust, parts by weight are 5-39 are 1 is blended successively, after stirring and grinding
Formed.
6. a kind of welding procedure of application conductive silver paste, it is characterised in that conductive silver paste point is being needed into welding with dispensing mode
The place of lead, then burns 600-900 DEG C, keeps combustion peak 10 minutes can sinter molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710461614.3A CN107234366A (en) | 2017-06-16 | 2017-06-16 | One kind welds silver paste and its preparation technology and applies welding procedure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710461614.3A CN107234366A (en) | 2017-06-16 | 2017-06-16 | One kind welds silver paste and its preparation technology and applies welding procedure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107234366A true CN107234366A (en) | 2017-10-10 |
Family
ID=59986347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710461614.3A Pending CN107234366A (en) | 2017-06-16 | 2017-06-16 | One kind welds silver paste and its preparation technology and applies welding procedure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107234366A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101373646A (en) * | 2008-10-09 | 2009-02-25 | 彩虹集团公司 | Middle and low temperature curing conductive silver slurry |
| CN101887764A (en) * | 2010-06-28 | 2010-11-17 | 彩虹集团公司 | Method for preparing silicon-based solar front silver paste |
| CN102288320A (en) * | 2011-07-22 | 2011-12-21 | 肇庆爱晟电子科技有限公司 | Metal-sheet-based negative temperature coefficient (NTC) thermistor temperature sensor and manufacturing method thereof |
| CN102568704A (en) * | 2012-03-16 | 2012-07-11 | 肇庆市羚光电子化学品材料科技有限公司 | Environment-friendly lead-free semiconductor ceramic capacitive electrode silver paste and preparation method thereof |
| CN102652339A (en) * | 2009-12-17 | 2012-08-29 | 东友Fine-Chem股份有限公司 | Electrode paste composition for rear surface of solar cell |
| CN103903677A (en) * | 2014-03-18 | 2014-07-02 | 上海志感电子科技有限公司 | Medium temperature sintering type electro-conduction slurry with lead-free glass powder and preparation method of medium temperature sintering type electro-conduction slurry |
| CN106448808A (en) * | 2016-12-12 | 2017-02-22 | 北京市合众创能光电技术有限公司 | Knotless screen printing front side silver paste for crystalline silicon solar cells |
-
2017
- 2017-06-16 CN CN201710461614.3A patent/CN107234366A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101373646A (en) * | 2008-10-09 | 2009-02-25 | 彩虹集团公司 | Middle and low temperature curing conductive silver slurry |
| CN102652339A (en) * | 2009-12-17 | 2012-08-29 | 东友Fine-Chem股份有限公司 | Electrode paste composition for rear surface of solar cell |
| CN101887764A (en) * | 2010-06-28 | 2010-11-17 | 彩虹集团公司 | Method for preparing silicon-based solar front silver paste |
| CN102288320A (en) * | 2011-07-22 | 2011-12-21 | 肇庆爱晟电子科技有限公司 | Metal-sheet-based negative temperature coefficient (NTC) thermistor temperature sensor and manufacturing method thereof |
| CN102568704A (en) * | 2012-03-16 | 2012-07-11 | 肇庆市羚光电子化学品材料科技有限公司 | Environment-friendly lead-free semiconductor ceramic capacitive electrode silver paste and preparation method thereof |
| CN103903677A (en) * | 2014-03-18 | 2014-07-02 | 上海志感电子科技有限公司 | Medium temperature sintering type electro-conduction slurry with lead-free glass powder and preparation method of medium temperature sintering type electro-conduction slurry |
| CN106448808A (en) * | 2016-12-12 | 2017-02-22 | 北京市合众创能光电技术有限公司 | Knotless screen printing front side silver paste for crystalline silicon solar cells |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171010 |
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| RJ01 | Rejection of invention patent application after publication |