CN107210103A - Patch resistor - Google Patents
Patch resistor Download PDFInfo
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- CN107210103A CN107210103A CN201580074630.6A CN201580074630A CN107210103A CN 107210103 A CN107210103 A CN 107210103A CN 201580074630 A CN201580074630 A CN 201580074630A CN 107210103 A CN107210103 A CN 107210103A
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- electrode
- wire bonding
- insulated substrate
- patch resistor
- resistive elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
In order to provide the patch resistor for the wire bonding connecting-type that can stablize welding, patch resistor 1 includes：The insulated substrate 2 of rectangular shape；The table electrode 3,4 formed along the relative both sides on the surface of insulated substrate 2；The wire bonding electrode 5 formed in the region that table electrode 3,4 is clipped；Two resistive elements 6,7 formed in the way of wire bonding is individually connected with electrode 5 with table electrode 3,4；Cover the protective layer 8,9 of each resistive element 6,7；The back electrode 10 formed at the back side of insulated substrate 2；And insulated substrate 2 relative end face formation a pair of welding end electrode 11,12, table electrode 3,4 turns on back electrode 10 via these terminal electrodes 11,12.
Description
Technical field
The present invention relates to the patch resistor of wire bonding connecting-type, more particularly to wire bonding and weldering can be used in combination
The patch resistor connect.
Background technology
In the past, it is proposed that the patch resistor as described in patent document 1, the patch resistor will be connected to electricity
One of two table electrodes of resistance body is used as wire bonding electrode, and the end electrode for being conducted to another table electrode is used
It is used as the terminal electrode of welding.
Figure 12 is the top view of the patch resistor described in above-mentioned patent document 1, and Figure 13 is cuing open along Figure 12 line A-A
View.As shown in Figure 12 and Figure 13, the patch resistor 100 is main by being constituted with lower component：The insulated substrate of rectangular shape
101；A pair of the table electrodes 102,103 formed at the length direction both ends on the surface of insulated substrate 101；So that these tables are electric
The resistive element 104 that the mode that pole 102,103 is bridged is formed；Cover the protective layer 105 of resistive element 104；In the whole of insulated substrate 101
The back electrode 106 that the individual back side is formed；And the end electrode 107 for turning on the back electrode 106 and a table electrode 102, in electricity
It is formed with resistance body 104 and trims (trimming) groove 108 for adjust resistance value.Here, a pair of the formation of table electrode 102,103
It is partial to the position of a side, the table electricity of the wider side of surface region in the length direction central portion relative to insulated substrate 101
Pole 103 turns into the electrode of wire bonding.
The patch resistor 100 so constituted is mounted on printed circuit board (not shown) to use.Now, turn on
End electrode 107 and back electrode 106 to a table electrode 102 are connected to the defined cloth of printed circuit board via scolding tin
Line pattern, and another table electrode 103 is connected to the other of printed circuit board via by the lead that gold and aluminium etc. are constituted
Wiring pattern, therefore, by the way that welding and wire bonding is used in combination, so that being securely connected to printed circuit board and multiple
The electrical connection of miscellaneous circuit structure becomes possibility.
Prior art literature
Patent document
Patent document 1：Japanese Patent Laid-Open 9-162002 publications
The content of the invention
The technical problems to be solved by the invention
However, in existing patch resistor 100 described in patent document 1, an end face only in insulated substrate 101
Form the end electrode 107 of welding, another end face in opposite to that side do not form end electrode 107, accordingly, there exist with
Lower problem：That is, when the patch resistor 100 for being attached to printed circuit board is heated in reflow oven, the scolding tin institute after melting
The surface tension of generation is applied only to the end electrode 107 of side, and the paster referred to as Manhattan phenomenon and tomb stone effect is holded up
Phenomenon becomes to be easier to occur.In addition, after patch resistor 100 is attached into printed circuit board, there is problems：
That is, due to the cataclysm (thermal shock) of temperature environment, it is easier to never be formed the end face and the back of the body of the insulated substrate 101 of end electrode 107
The intersection of electrode 106 ftractures, so that the more difficult bonding strength maintained securely with printed circuit board.
The present invention be in view of the actual conditions of such prior art and make, its object is to there is provided can stablize weld
The patch resistor of the wire bonding connecting-type connect.
Solve the technical scheme that technical problem is used
In order to reach above-mentioned purpose, patch resistor of the invention uses following structure, i.e. including：Rectangular shape
Insulated substrate；The table electrode formed along at least relative both sides on the surface of the insulated substrate；Clipped in the table electrode
The wire bonding electrode formed in region；The shape in the way of the wire bonding to be individually connected with electrode with the table electrode
Into multiple resistive elements；Cover the protective layer of these resistive elements；The back electrode formed at the back side of the insulated substrate；And
The terminal electrode of a pair of welding of the relative end face formation of the insulated substrate, the table electrode and the back electrode via
These terminal electrodes are turned on.
In the patch resistor so constituted, across wire bonding electrode and along at least relative two of insulated substrate
The table electrode that side is formed, via the terminal electrode of a pair of welding of the relative end face formation in insulated substrate and back electrode
Conducting, therefore the wiring pattern of printed circuit board can be equably soldered to using this pair of end sub-electrode, patch can be suppressed
Piece holds up the generation of phenomenon and cracking.In addition, as table electrode and wire bonding with being connected in parallel to multiple resistance between electrode
The form of body, makes to be dispersed to multiple resistive elements in the voltage that table electrode and wire bonding electricity consumption interpolar apply, therefore, each resistive element
Temperature rise diminish, can be applied to high-power.
Preferably, the respective resistance value of multiple resistive elements is set at essentially in such a configuration identical, thus, passed through
Each resistive element of formed objects is printed simultaneously to be formed, so as to easily manufacture the patch resistor of regulation resistance value.
In addition, in such a configuration, wire bonding is made up of with electrode double-layer structural, double-layer structural includes：In insulation
The surface of substrate is formed and the edge part lower electrode overlapping with resistive element；And formed and covering protection on the lower electrode
Layer edge part upper electrode, so as to using the wider upper electrode of area come easily connecting lead wire.
In addition, in such a configuration, wire bonding is formed in the face center portion of insulated substrate with electrode, from without depositing
Directionality in top view, therefore, the manufacturing process of patch resistor and the processing being installed to when on circuit board become
Easily.In addition, at least ensuring that the position for making wire bonding electrode equal with the distance between table electrode at two, therefore, pass through
Resistive element is formed respectively at these positions, so as to easily manufacture the patch resistor of foregoing wire bonding connecting-type.
In the case, following structure can be used：A pair of table electrodes are formed exhausted across wire bonding electrode
The both ends of edge substrate, and these table electrodes turn on back electrode via terminal electrode, and two resistive elements are connect with connecting lead wire
The mode for sharing electrode and a pair of table electrodes is configured on straight line.
In addition, in such a configuration, the number of resistive element is not limited to two, for example, it can use following structure：Table electricity
Pole along insulated substrate three while or when four and formed, three or four electricity that the table electrode and wire bonding are connected with electrode
Resistance body is configured in the orthogonal coordinates by the wire bonding electrode.
Invention effect
According to the present invention, the terminal electrode of welding is formed with the relative end face of insulated substrate, and be conducted to
The table electrode and wire bonding of these terminal electrodes with being connected in parallel to multiple resistive elements between electrode, therefore, it is possible to uniform and
It is stably installed to printed circuit board, using the teaching of the invention it is possible to provide be used as the high-power Chip-R with the wire bonding connecting-type being also suitable
Device.
Brief description of the drawings
Fig. 1 is the top view of the patch resistor of the first embodiment of the present invention.
Fig. 2 is the sectional view along Fig. 1 II-II lines.
Fig. 3 is the top view for showing the patch resistor being attached to the state after printed circuit board.
Fig. 4 is the top view for the manufacturing process for showing the patch resistor.
Fig. 5 is the sectional view for the manufacturing process for showing the patch resistor.
Fig. 6 is the top view of the patch resistor of second embodiment of the present invention.
Fig. 7 is the sectional view along Fig. 6 VII-VII lines.
Fig. 8 is the top view for the manufacturing process for showing the patch resistor.
Fig. 9 is the sectional view for the manufacturing process for showing the patch resistor.
Figure 10 is the top view of the patch resistor of third embodiment of the present invention.
Figure 11 is the top view of the patch resistor of the 4th embodiment of the present invention.
Figure 12 is the top view of the patch resistor of conventional example.
Figure 13 is the sectional view along Figure 12 line A-A.
Embodiment
Embodiments of the present invention are illustrated referring to the drawings, as depicted in figs. 1 and 2, the first embodiment party of the invention
The patch resistor 1 of formula with lower component by being constituted：The insulated substrate 2 of rectangular shape；Along the length on the surface of the insulated substrate 2
A pair of table electrodes 3,4 that degree direction both ends are formed；In the surface for the insulated substrate 2 that the two table electrodes 3,4 are clipped
The wire bonding that centre portion is formed electrode 5；Formed by being connected to the wire bonding in the way of electrode 5 and a table electrode 3
Resistive element 6；To be connected to the resistive element 7 that the wire bonding is formed in the way of electrode 5 and another table electrode 4；With independent
A pair of protective layers 8,9 that the mode that ground covers the two resistive elements 6,7 is formed；Almost whole face institute at the back side of insulated substrate 2
The back electrode 10 of formation；In the way of the back electrode 10 and a table electrode 3 to be turned on insulated substrate 2 end face formation
Electrode 11；The end face formed in the way of the back electrode 10 and another table electrode 4 are turned in the other end of insulated substrate 2
Electrode 12；The outer electrode 13 formed in the way of covering table electrode 3,4 and back electrode 10 and end electrode 11,12；And
To cover the connection electrode 14 that wire bonding is formed in the way of electrode 5.
Insulated substrate 2 is made up of ceramic (aluminum oxide 96 and aluminum oxide 99) etc., by by large-sized set base described later
Plate is split along the slot segmentation and secondary splitting groove extended in length and breadth and obtains multiple above-mentioned insulated substrates 2.
Table electrode 3,4 and wire bonding electrode 5 are that silk-screen printing Ag (or Ag/Pd) is starched and is dried and firing is formed
, these table electrodes 3,4 and wire bonding are formed in the lump with electrode 5 in same process.Wire bonding is with electrode 5 by shape
As rectangle, table electrode 3,4 and wire bonding are set to identical with the separating distance between electrode 5.
Resistive element 6,7 is that the resistance such as silk-screen printing ruthenium-oxide are starched and are dried and fire and form, resistive element 6
Both ends are overlapping with electrode 5 with table electrode 3 and wire bonding, the both ends of another resistive element 7 and another table electrode 4 and draw
Wire bonding is overlapping with electrode 5.The shape and resistance value of two resistive elements 6,7 are set to identical, and these resistive elements 6,7 are to use
What same resistance material was formed in the lump in same process.
Protective layer 8,9 is good epoxy resin grout of silk-screen printing moisture resistance etc. and progress is heating and curing, two
Protected seam 8,9 covers to prevent the influence from external environment condition resistive element 6,7 respectively.But, protective layer 8,9 only connects with lead
The both ends for sharing electrode 5 are overlapping, and major part of the wire bonding electrode 5 in addition to both ends is exposed from protective layer 8,9.
Furthermore, the groove (not shown) that trims can also be formed in resistive element 6,7 and carrys out semifixed resistor value, it is in this case, excellent
Selection of land makes protective layer 8,9 be respectively to include the double-layer structural of undercoating and external coating.Here, undercoating is starched by silk-screened glasses
And the layer for being dried and firing is constituted, the undercoating formed trim groove before in the way of to cover resistive element 6,7
Formed.In addition, external coating is by screen print epoxy paste resin etc. and carries out the layer that is heating and curing and constitutes, the external coating exists
Trim after groove is formed and formed with covering internally coated mode.
Back electrode 10 is silk-screen printing Ag slurries and Cu slurries etc. and is dried and fires and form, and the back electrode 10 is formed
The whole back side of insulated substrate 2.
End electrode 11,12 is a pair by being sprayed to the end face of insulated substrate 2 formed by nickel (Ni)/chromium (Cr) etc.
Table electrode 3,4 is conducted to back electrode 10 via end electrode 11,12 respectively.
Outer electrode 13 and connection electrode 14 are made up of Ni coating and Au coating etc., these outer electrodes 13 and connection electrode
14 form in the lump in same process.Here, end electrode 11,12 is formed the terminal electrode of welding, external electrical
Pole 13 is entirety and the side of the table electrode 3,4 exposed from protective layer 8,9 for covering these end electrodes 11,12 and back electrode 10
Formula formation.On the other hand, connection electrode 14 is the shape in the way of covering the wire bonding exposed from protective layer 8,9 with electrode 5
Into, the connection electrode 14 turns into the connecting portion of bonding wire described later.
The patch resistor 1 so constituted is as shown in figure 3, be that wire bonding and welding is used in combination and printing cloth is installed to
On line substrate 20.That is, wiring pattern 21,22 is arranged at printed circuit board 20 with the state of separation, is taken in patch resistor 1
In the state of being loaded onto on a wiring pattern 21, the outer electrode 13 for covering a pair of end electrodes 11,12 is used into scolding tin 23 respectively
To fix.Another wiring diagram is fixed in addition, the one end for the lead 24 being made up of gold and aluminium etc. is fetched with supersonic welding
Case 22, the other end of the lead 24 is fixed to ultrasonic welding the connection electrode 14 of covering wire bonding electrode 5.
Then, by (the wire bonding use of connection electrode 14 for the patch resistor 1 that will be so welded on wiring pattern 21
Electrode 5) wire bonding is to other wiring patterns 22, so that as being connected in parallel two electricity between wiring pattern 21,22
The circuit structure of resistance body 6,7.
Then, for the manufacturing process of the patch resistor 1 constituted as described above, reference picture 4 and Fig. 5 are illustrated.
First, prepare that the assembly substrate 2A of multiple insulated substrates 2 can be obtained.On assembly substrate 2A, in advance in grid
Once slot segmentation and secondary splitting groove (omitting diagram) be set shape, the grid separated out by two slot segmentations each
As a paster region.Furthermore, the assembly substrate 2A equivalent to a paster region is representatively illustrated in Fig. 4 and Fig. 5,
But in practice for each operation that the assembly substrate 2A equivalent to multiple paster regions is illustrated below in the lump.
That is, as shown in Fig. 4 (a) and Fig. 5 (a), by starching and being dried in assembly substrate 2A back side silk-screen printing Ag
And firing, so that back electrode 10 is formed at the assembly substrate 2A back side, also, the front and rear surface printing in assembly substrate 2A herein
Ag/Pd is starched and is dried and fires, so as to form a pair of table electrodes 3,4 and wire bonding electricity consumption on assembly substrate 2A surface
Pole 5.
Then, by being dried and burning after the resistance somaplasms such as the surface screen-printed ruthenium-oxide in assembly substrate 2A
System so that as shown in Fig. 4 (b) and Fig. 5 (b), formed be connected with a table electrode 3 and wire bonding electrode 5 resistive element 6,
And the resistive element 7 being connected with the opposing party's table electrode 4 and wire bonding electrode 5.
Then, by covering the region screen print epoxy paste resin of resistive element 6,7 and being heating and curing, so that such as Fig. 4
(c) and shown in Fig. 5 (c), the entirety of covering resistive element 6,7 and the part and wire bonding electrode 5 of table electrode 3,4 are formed
A part protective layer 8,9.Trim groove to finely tune initial resistivity value as it was previously stated, can also be formed in resistive element 6,7,
In this case, making protective layer 8,9 be respectively to include starching the undercoating constituted and the external coating being made up of resin material by glass material
Double-layer structural be preferred.
Then, by the way that assembly substrate 2A is once divided into strip along a slot segmentation, so as to obtain paster
The bond length of the left and right of forming region as width dimensions strip substrate 2B.Then, in subsequent processing, by the strip
Substrate 2B divisional plane injection Ni/Cr etc., so as to as shown in Fig. 4 (d) and Fig. 5 (d), be formed table electrode 3,4 and back electrode 10
A pair of end electrodes 11,12 of conducting.
Then, by the way that strip substrate 2B is carried out into secondary splitting along secondary splitting groove, so as to obtain and patch resistor 1
The monolithic (paster monomer) of equal size.As it was previously stated, each paster forming region in moment assembly substrate 2A respectively becomes
One insulated substrate 2.Finally, by the end electrode 11,12 to each paster monomer and whole back electrode 10 and from protective layer
8th, the 9 table electrodes 3,4 exposed and wire bonding electrode 5 apply Ni coating and Au coating etc., so that such as Fig. 4 (e) and Fig. 5 (e)
It is shown, form the end electrode 11,12 of welding and cover the outer electrode 13 and connection electrode 14 of wire bonding electrode 5,
So as to complete patch resistor 1.
As described above, in the patch resistor 1 of first embodiment, on the surface of insulated substrate 2 across drawing
Wire bonding electrode 5 is formed with a pair of table electrodes 3,4, is formed with these wire bonding electrodes 5 and table electrode 3,4 individually
The resistive element 6,7 of connection, also, each table electrode 3,4 is via a pair of end electrodes of the relative end face formation in insulated substrate 2
11st, 12 turned on back electrode, therefore, as in table electrode 3,4 and wire bonding with being connected in parallel two resistance between electrode 5
The form of body 6,7.
Then, in the case where the patch resistor 1 is attached on printed circuit board 20, by making scolding tin 23 respectively
The outer electrode 13 on end electrode 11,12 that the relative both ends of the surface being attached in insulated substrate 2 are set, so as in rule
Equably welded on fixed wiring pattern 21, so as to suppress the generation that paster holds up phenomenon and cracking.In addition, by that will draw
The both ends of line 24 are connected to connection electrode 14 and other wiring patterns 22 on wire bonding electrode 5, so as to reality
In conjunction with the three-dimensional circuit structure using welding and wire bonding, and make table electrode 3,4 and wire bonding electrode 5 it
Between the voltage that applies be distributed to two resistive elements 6,7, therefore, it is possible to suppress the temperature of each resistive element 6,7 rise with realize be adapted to it is big
The patch resistor 1 of the wire bonding connecting-type of power.
Fig. 6 is the top view of the patch resistor 30 of second embodiment of the present invention, and Fig. 7 is the patch resistor 30
Sectional view, label identical for part corresponding with Fig. 1 and Fig. 2 mark.
This second embodiment point different from foregoing first embodiment is, using double-decker, the double-decker
Including：Formed on the surface of insulated substrate 2 and edge part and the overlapping wire bonding of resistive element 6,7 are with electrode 5 (lower electrode)；
And in auxiliary electrode 31 (upper electrode) of the wire bonding with the edge part of formation and protective mulch 8,9 on electrode 5, remove
Structure outside this is substantially identical.
That is, on the wire bonding surface of electrode 5 and insulated substrate 2 exposed from protective layer 8,9, it is formed with auxiliary electrode
31, the auxiliary electrode 31 crosses the edge part of protective layer 8,9 until reaching upper face center portion.Auxiliary electrode 31 is silk-screen printing
What Ag was starched and was sintered, connection electrode 14 is formed in the way of covering auxiliary electrode 31.So, compared by being formed
The wider array of auxiliary electrode 31 of exposed portion area of the wire bonding that protective layer 8,9 is clipped electrode 5, so as to cover auxiliary electricity
The area of the connection electrode 14 of pole 31 also becomes wide, therefore, it is possible to which the lead of engagement easily is connected into connection electrode 14.Separately
Outside, by covering auxiliary electrode 31 until the upper surface portion (not shown) for trimming groove, thermal diffusivity improves, so as to realize more
Plus it is adapted to the patch resistor 1 of high-power wire bonding connecting-type.
Then, for the manufacturing process of the patch resistor 30 constituted as described above, reference picture 8 and Fig. 9 are illustrated.Again
Person, in figs. 8 and 9, because the process before forming protective layer 8,9 is identical with foregoing first embodiment, so near should
Each operation untill power is omitted, and process thereafter is illustrated.
That is, after the process shown in Fig. 4,5 (a)~Fig. 4,5 (c), by than the protection from covering resistive element 6,7
The wire bondings exposed of layer 8,9 are starched and sintered with the bigger region printing Ag of the exposed surface of electrode 5, thus such as Fig. 8 (a) and
Shown in Fig. 9 (a), formed from wire bonding with electrode 5 up to the auxiliary electrode 31 in the upper face center portion of protective layer 8,9.
Then, by the way that assembly substrate 2A is once divided into strip along a slot segmentation, so as to obtain paster
The bond length of the left and right of forming region as width dimensions strip substrate 2B.Then, point in strip substrate 2B is passed through
Face injection Ni/Cr etc., so as to as shown in Fig. 8 (b) and Fig. 9 (b), form turn on table electrode 3,4 and back electrode 10 a pair
End electrode 11,12.
Then, by the way that strip substrate 2B is carried out into secondary splitting along secondary splitting groove, so as to obtain and patch resistor 1
The paster monomer of equal size, afterwards, by the end electrode 11,12 to each paster monomer and whole back electrode 10 and from guarantor
The table electrode 3,4 and auxiliary electrode 31 that sheath 8,9 exposes apply Ni coating and Au coating etc., so that such as Fig. 8 (c) and Fig. 9 (c) institutes
Show, form the end electrode 11,12 of welding and cover the outer electrode 13 and connection electrode 14 of auxiliary electrode 31, so that
Patch resistor 30 is completed.
In the patch resistor 30 of the second embodiment so constituted, wire bonding electrode 5 is with auxiliary electrode
31 double-decker, the auxiliary electrode 31 on upper strata from the wire bonding electrode 5 of lower floor cross the edge part of protective layer 8,9 up to
Upper face center portion is reached, therefore, the connection electrode 14 wider to sticking to the area on auxiliary electrode 31 can easily connect
The lead of engagement.
Furthermore, in first and second above-mentioned embodiment, in table electrode 3,4 and wire bonding with parallel between electrode 5
The patch resistor 1,30 for being connected to two resistive elements 6,7 is illustrated, but the number for the resistive element being connected in parallel is not limited to
Two, or more than three.
For example, as shown in Figure 10, in the patch resistor 40 of third embodiment of the present invention, in the table of insulated substrate 2
Face forms the table electrode 3 of rectangle and the table electrode 4 of L-shaped, and encloses formation square in region in the two table electrodes 3,4
Wire bonding electrode 5, in the wire bonding with foring a resistive element 41 between one side of electrode 5 and table electrode 3,
Wire bonding is with foring two resistive elements 42,43 between remaining both sides of electrode 5 and table electrode 4.These three resistive elements 41,
42nd, 43 resistance value be set to it is identical, the patch resistor 40 turn into table electrode 3,4 and wire bonding between electrode 5
It has been connected in parallel the form of three resistive elements 41,42,43.Furthermore, although diagram is eliminated, but each resistive element 41,42,43 is protected
Sheath is covered, and wire bonding electrode 5 exposes from protective layer.
In addition, as shown in figure 11, in the patch resistor 50 of the 4th embodiment of the invention, in the table of insulated substrate 2
Face forms the table electrode 3,4 of L-shaped, and forms the lead of square in the central portion that the two table electrodes 3,4 enclose region
Engagement use electrode 5, the wire bonding with formd between the relative both sides of electrode 5 and table electrode 3 two resistive elements 51,
52, in wire bonding with foring two resistive elements 53,54 between remaining both sides of electrode 5 and table electrode 4.This four resistive elements
51st, 52,53,54 resistance value be set to it is identical, the patch resistor 50 turn into table electrode 3,4 and wire bonding electrode
The form of four resistive elements 51,52,53,54 has been connected in parallel between 5.Although eliminating diagram, each resistive element 51,52,53,
54 protected seams are covered, and wire bonding electrode 5 exposes from protective layer.
Furthermore, in these the 3rd and the 4th embodiments, a pair of table electrodes 3,4 can also be made to be connected and be used as a table
Electrode, for example, table electrode can be formed as into spill along three sides of insulated substrate 2, or can also be along insulated substrate 2
Four sides table electrode is formed as into square shape.
Label declaration
1st, 30,40,50 patch resistor
2 insulated substrates
2A assembly substrates
2B strip substrates
3rd, 4 table electrode
5 wire bonding electrodes
6th, 7,41,42,43,51,52,53,54 resistive element
8th, 9 protective layer
10 back electrodes
11st, 12 end electrodes (terminal electrode)
13 outer electrodes
14 connection electrodes
20 printed circuit boards
21st, 22 wiring pattern
23 scolding tin
24 leads
31 auxiliary electrodes
Claims (6)
1. a kind of patch resistor, it is characterised in that have：
The insulated substrate of rectangular shape；The table electrode formed along at least relative both sides on the surface of the insulated substrate；
The wire bonding electrode formed in the region that the table electrode is clipped；With by the wire bonding electrode and the table electrode list
Multiple resistive elements that the mode solely connected is formed；Cover the protective layer of these resistive elements；In the back side shape of the insulated substrate
Into back electrode；And the insulated substrate relative end face formation a pair of welding terminal electrode, the table electricity
Pole is turned on the back electrode via these terminal electrodes.
2. patch resistor as claimed in claim 1, it is characterised in that
Multiple respective resistance values of the resistive element are set to roughly the same.
3. patch resistor as claimed in claim 1 or 2, it is characterised in that
The wire bonding is made up of with electrode double-layer structural, and the double-layer structural includes：In the surface shape of the insulated substrate
Into and the edge part lower electrode overlapping with the resistive element；And formed on the lower electrode and cover the protective layer
The upper electrode of edge part.
4. patch resistor as claimed in claim 1, it is characterised in that
The wire bonding is with electrode formation in the face center portion of the insulated substrate.
5. patch resistor as claimed in claim 4, it is characterised in that
Table electrode described in a pair forms the both ends in the insulated substrate across the wire bonding electrode, and these
Table electrode and the back electrode are turned on via the terminal electrode, and two resistive elements are to connect the wire bonding electrode
Configured with the mode of table electrode described in a pair on straight line.
6. patch resistor as claimed in claim 1, it is characterised in that
The table electrode along the insulated substrate three while or when four and formed, by the table electrode and the wire bonding electricity consumption
Pole connection three or four resistive elements be configured in the orthogonal coordinates by the wire bonding electrode.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015012578A JP2016139661A (en) | 2015-01-26 | 2015-01-26 | Chip resistor |
| JP2015-012578 | 2015-01-26 | ||
| PCT/JP2015/082403 WO2016121203A1 (en) | 2015-01-26 | 2015-11-18 | Chip resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107210103A true CN107210103A (en) | 2017-09-26 |
Family
ID=56542841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580074630.6A Pending CN107210103A (en) | 2015-01-26 | 2015-11-18 | Patch resistor |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016139661A (en) |
| CN (1) | CN107210103A (en) |
| DE (1) | DE112015006051T5 (en) |
| WO (1) | WO2016121203A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109961913A (en) * | 2017-12-14 | 2019-07-02 | 米库龙电气有限公司 | The capacitor of resistor and strip resistance device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018078152A (en) * | 2016-11-07 | 2018-05-17 | Koa株式会社 | Chip resistor |
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-
2015
- 2015-01-26 JP JP2015012578A patent/JP2016139661A/en not_active Withdrawn
- 2015-11-18 WO PCT/JP2015/082403 patent/WO2016121203A1/en active Application Filing
- 2015-11-18 DE DE112015006051.0T patent/DE112015006051T5/en not_active Withdrawn
- 2015-11-18 CN CN201580074630.6A patent/CN107210103A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04152502A (en) * | 1990-10-17 | 1992-05-26 | Fujitsu Ltd | Hybrid integrated circuit |
| JPH04162401A (en) * | 1990-10-24 | 1992-06-05 | Toshiba Lighting & Technol Corp | Resistor |
| JPH09162002A (en) * | 1995-12-07 | 1997-06-20 | Koa Corp | Chip-shaped electronic component and fabrication thereof |
| CN1343364A (en) * | 1999-03-08 | 2002-04-03 | 松下电器产业株式会社 | PTC chip thermistor |
| JP2005032753A (en) * | 2003-07-07 | 2005-02-03 | Taiyosha Electric Co Ltd | Chip component |
| JP2013258292A (en) * | 2012-06-13 | 2013-12-26 | Panasonic Corp | Chip resistor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109961913A (en) * | 2017-12-14 | 2019-07-02 | 米库龙电气有限公司 | The capacitor of resistor and strip resistance device |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112015006051T5 (en) | 2017-10-12 |
| JP2016139661A (en) | 2016-08-04 |
| WO2016121203A1 (en) | 2016-08-04 |
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Application publication date: 20170926 |