CN107160862B - Thermal printing head heating base plate and its manufacturing method - Google Patents
Thermal printing head heating base plate and its manufacturing method Download PDFInfo
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- CN107160862B CN107160862B CN201710471420.1A CN201710471420A CN107160862B CN 107160862 B CN107160862 B CN 107160862B CN 201710471420 A CN201710471420 A CN 201710471420A CN 107160862 B CN107160862 B CN 107160862B
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- layer
- conductor layer
- metal conductor
- base plate
- silver
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33535—Substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/3359—Manufacturing processes
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Abstract
The present invention proposes a kind of thermal printing head heating base plate, its individual electrode one end is connected with heating resistor, the other end draws first and draws figure, and the first extraction figure is distributed on ground glaze layer and insulating substrate, and first, which draws figure, draws the interconnecting piece with notch section；Insulating substrate is equipped with the first metal conductor layer formed by way of evaporating or sputtering chromium or nickel chromium triangle target, and initiating terminal covers notch section；First metal conductor layer is equipped with the second metal conductor layer, two conductor layers are respectively formed expected figure, second metal conductor layer is equipped with pad solder graph layer, it is connected with semiconductor chip on pad solder graph layer, therebetween it is filled with filled layer, pad solder graph layer terminal part is equipped with silver conductor layer, and plug connector is connected on silver conductor layer；Draw patterned surface protective mulch in common electrode to part first；It is formed with packaging protection layer in partial protection layer to the region of part plug connector.Above-mentioned heating base plate can reduce cost under the premise of not influencing product quality.
Description
Technical field
The present invention relates to thermal printing field more particularly to a kind of thermal printing head heating base plate and its manufacturing methods.
Background technology
The common electrode and the organic gold of individual electrode generally use of thermal printing head heating base plate in the prior art
Slurry printing-sintering forms, and since the price of gold is very expensive, to reduce product cost, the usage amount for reducing gold is that temperature-sensitive is beaten
Print one of the development trend of head heating base plate.
In order to solve problem above, thermal printing head in the prior art substitutes gold with heating base plate using silver, to reduce
The usage amount of gold, but when gold and silver dissimilar metal connects, due to technological problems, often gold and silver interconnecting piece can be caused to hold
The problem of splitting, breaking.
Invention content
In order to solve the problems in the existing technology, the present invention propose a kind of thermal printing head heating base plate and its
Manufacturing method, to reduce the cost of product under the premise of not influencing product quality.
To achieve the goals above, the present invention proposes a kind of thermal printing head heating base plate, including insulating substrate,
It is equipped with to the surface portion of the insulating substrate ground glaze layer that amorphous glass material is constituted, is equipped on the surface of the ground glaze layer
Common electrode and individual electrode, heating resistor is configured along main Print direction between common electrode and individual electrode, described total
One end of energization pole is connected along secondary Print direction with the heating resistor, and the other end with power supply for being connected；It is described
One end of individual electrode is connected along secondary Print direction with the heating resistor, and the is drawn from the other end of the individual electrode
One draws figure, and a part for the first extraction figure is on ground glaze layer, and another part is on insulating substrate, from described
First draw figure the other end draw interconnecting piece, the interconnecting piece be equipped with notch section, the common electrode, individual electrode,
First extraction figure and interconnecting piece are formed using organic gold material printing-sintering；It is additionally provided on the insulating substrate and passes through steaming
The first metal conductor layer that hair or the mode of sputtering chromium or nickel chromium triangle target are formed, the initiating terminal of first metal conductor layer cover
Cover the notch section on the interconnecting piece；It is additionally provided with the second metal conductor layer on first metal conductor layer, is made by taking a picture
Platemaking technology makes second metal conductor layer form expected figure together with the first metal conductor layer, is led in second metal
It is additionally provided with pad solder graph layer on body layer, semiconductor chip is connected on the pad solder graph layer, is welded in the pad
Expect to be filled with filled layer between graph layer and semiconductor chip, in the pad solder figure of the terminal part of second metal conductor layer
Silver conductor layer is additionally provided on shape layer, be connected on the silver conductor layer for realizing power supply supply and external signal handing-over
Plug connector；The surface covering protection of figure is drawn in the heating resistor, common electrode, individual electrode and part first
Layer；In partial protection layer to the region of part plug connector, it is packaged to form packaging protection layer using packaging plastic.
Preferably, the notch section is the hollow portion formed in the centre of the interconnecting piece.
Preferably, the notch section is the first notch formed in the both sides of the interconnecting piece, first notch
The rounded rectangle in portion.
Preferably, the notch section is the second notch formed in the both sides of the interconnecting piece, second notch
Portion is in chock shape.
Preferably, second metal conductor layer is the shape by way of being electrolysed plating or electroless plating nickel or silver
At.
The invention also provides a kind of manufacturing methods of above-mentioned thermal printing head heating base plate, and the method includes following
Step：
Step 1 prints band-like glass material in the side of insulating substrate along main Print direction, with 1200~1300 DEG C of temperature
Degree sintering 0.1~1 hour, forms the ground glaze layer of 20~70 μm of film thickness；
Step 2 prints organic Gold conductor on the ground glaze layer and SI semi-insulation substrate, with 830 DEG C~890 DEG C of temperature
Degree sintering, forms metallized substrate；
Step 3 is coated with exposure light photoresist comprehensively on the metallized substrate, and expection is formed using photomechanical production technology
Figure, wherein the figure includes common electrode, individual electrode, first draws figure and interconnecting piece, on the interconnecting piece
It is formed with notch section；
Between step 4, common electrode and individual electrode on the ground glaze layer, ribbon resistance is printed along main Print direction
Somaplasm material, sintering form heating resistor；
Step 5, the whole region printing-sintering glass paste in the ground glaze layer, form protective layer, and the protective layer covers
It covers the heating resistor, common electrode, individual electrode and part first and draws figure；
Step 6, on the insulating substrate other than the ground glaze layer, by way of evaporating or sputtering chromium or nickel chromium triangle target,
Form film thicknessThe first metal conductor layer；
Step 7, using first metal conductor layer as substrate, pass through be electrolysed plating or electroless plating nickel or silver side
Formula forms the second metal conductor layer of 3~15 μm of film thickness；
Step 8, using the notch section in the interconnecting piece as target, align reticle；
Step 9, using photomechanical production technology, so that second metal conductor layer is formed expection together with the first metal conductor layer
Figure；
Step 10, by be electrolysed plating or non-electrolytic plating method, on second metal conductor layer formed pad weldering
Expect graph layer；
Step 11, on the pad solder graph layer of the terminal part of second metal conductor layer, pass through electroless plating
Or the mode of displacement plating forms silver conductor layer, the film thickness of the silver conductor layer is at 1~3 μm；
Step 12, by loading device, the configuring semiconductor chip in the pad locations of the pad solder graph layer, will
The semiconductor chip and pad make the two heat fusing electrical connection by 200~300 DEG C of continous way electric furnace；
Step 13, between the semiconductor chip and the pad solder graph layer, utilize glue spreader inject heat curing type
Epoxy resin filling adhesive, to form filled layer；
Step 14 carries out visual examination and electrical test, confirms electrical connection state；
Step 15 welds plug connector on the silver conductor layer；
Step 16, in partial protection layer to the region of part plug connector, using glue spreader injection packaging plastic be packaged
Form packaging protection layer.
The advantageous effect of the program of the present invention is that above-mentioned thermal printing head heating base plate is at low cost, due in xenogenesis
Metal overlapping portion can obtain flawless, bubble-free thermal printing head heating base plate without carrying out high temperature sintering.
Description of the drawings
Fig. 1 shows the structural schematic diagram of thermal printing head heating base plate according to the present invention.
Fig. 2 shows the wiring schematic diagrames at heating resistor according to the present invention.
Fig. 3 shows the structural schematic diagram of dissimilar metal conductor overlapping portion in the first embodiment.
Fig. 4 shows the structural schematic diagram of dissimilar metal conductor overlapping portion in second of embodiment.
Fig. 5 shows the structural schematic diagram of dissimilar metal conductor overlapping portion in the third embodiment.
Reference numeral：1- insulating substrates, 2- ground glaze layers, 3a- common electrodes, 3b- individual electrodes, 3c- first draw figure,
3d- interconnecting pieces, 3e- hollow portions, the first notch of 31e-, the second notch of 32e-, 4- heating resistors, 5- protective layers, 6-
One metal conductor layer, the second metal conductor layers of 7-, 8- pad solder graph layers, 9- semiconductor chips, 10- plug connectors, 11- silver are led
Body layer, 12- filled layers, 13- packaging protection layers.
Specific implementation mode
The specific implementation mode of the present invention is further described below in conjunction with the accompanying drawings.
As shown in Figure 1, thermal printing head heating base plate according to the present invention includes insulating substrate 1, in the insulation
The surface portion of substrate 1 it is equipped with the ground glaze layer 2 that amorphous glass material is constituted.It is equipped on the surface of the ground glaze layer 2 common
Electrode 3a and individual electrode 3b, heating resistor 4 are configured along main Print direction between common electrode 3a and individual electrode 3b, are made
To generate the heater of Joule heat, one end of the common electrode 3a is connected along secondary Print direction with the heating resistor 4,
Its other end with power supply for being connected；One end of the individual electrode 3b is along secondary Print direction and 4 phase of the heating resistor
Connection draws first from the other end of the individual electrode 3b and draws figure 3c, and described first draws at a part of figure 3c
In on ground glaze layer 2, another part is on insulating substrate 1, and the other end that figure 3c is drawn from described first draws interconnecting piece 3d,
As shown in Fig. 2, the interconnecting piece 3d is equipped with notch section, the notch section can be the centre shape in the interconnecting piece 3d
At hollow portion 3e, as shown in Figure 3；The notch section can also be the first notch formed in the both sides of the interconnecting piece 3d
The rounded rectangle of 31e, the first notch 31e, as shown in Figure 4；The notch section can also be in the interconnecting piece 3d
The second notch 32e, the second notch 32e that both sides are formed is in chock shape, as shown in Figure 5.It is the common electrode 3a, a
Other electrode 3b, the first extraction figure 3c and interconnecting piece 3d are formed using organic gold material printing-sintering, and organic gold material uses
830 DEG C~890 DEG C of high temperature sintering.
The first metal conductor layer 6 is additionally provided on the insulating substrate 1, first metal conductor layer 6 is to pass through evaporation
Or the film thickness that the mode of sputtering chromium or nickel chromium triangle target is formed is aboutConductor layer, first metal conductor layer 6
Initiating terminal covers the notch section on the interconnecting piece 3d.Also by being electrolysed plating or nothing on first metal conductor layer 6
It is electrolysed the mode of electronickelling or silver, form the second metal conductor layer 7 of about 3~15 μm of film thickness makes institute by photomechanical production technology
It states the second metal conductor layer 7 and forms expected figure together with the first metal conductor layer 6.On second metal conductor layer 7 also
Equipped with pad solder graph layer 8, it is connected with semiconductor chip 9 on the pad solder graph layer 8, in the pad solder figure
Filled layer 12 is filled between layer 8 and semiconductor chip 9, the filled layer 12 fills glue using thermosetting epoxy resin.
It is additionally provided with silver conductor layer 11 on the pad solder graph layer 8 of 7 terminal part of the second metal conductor layer, in the silver conductor layer
Plug connector 10 is connected on 11, the plug connector 10 is supplied for realizing power supply and the handing-over of external signal.
To protect heating base plate, draw in the heating resistor 4, common electrode 3a, individual electrode 3b and part first
Go out the surface protective mulch 5 of figure 3c, the protective layer 5 is made of glass glaze.In partial protection layer 5 to part plug connector
It in 10 region, is packaged to form packaging protection layer 13 using packaging plastic, heat cured epoxy tree may be used in the packaging plastic
Fat packaging plastic.
The manufacturing method of thermal printing head heating base plate according to the present invention includes the following steps：
Step 1 prints band-like glass material in the side of the insulating substrate 1 along main Print direction, with about 1200~
1300 DEG C of temperature is sintered 0.1~1 hour, forms the ground glaze layer 2 of 20~70 μm of film thickness.
Step 2 prints organic Gold conductor on the ground glaze layer 2 and SI semi-insulation substrate 1, with 830 DEG C~890 DEG C
Temperature is sintered, and forms metallized substrate.
Step 3 is coated with exposure light photoresist comprehensively on the metallized substrate, and expection is formed using photomechanical production technology
Figure.The wherein described figure includes common electrode 3a, individual electrode 3b, first draws figure 3c and interconnecting piece 3d, described
It is formed with notch section on interconnecting piece 3d.
Step 4, the common electrode 3a on the ground glaze layer 2 and between individual electrode 3b, along main Print direction printer belt
Shape resistive element slurry, sintering form heating resistor 4.
Step 5, the whole region printing-sintering glass paste in the ground glaze layer 2 form protective layer 5, described to make
Protective layer 5 covers the heating resistor 4, common electrode 3a, individual electrode 3b and part first and draws figure 3c.
Step 6, on the insulating substrate 1 other than the ground glaze layer 2, by the side for evaporating or sputtering chromium or nickel chromium triangle target
Formula forms film thickness aboutThe first metal conductor layer 6.Wherein
Step 7 with first metal conductor layer 6 is substrate, by being electrolysed plating or electroless plating nickel or silver
Mode forms the second metal conductor layer 7 of about 3~15 μm of film thickness.
Step 8, using the notch section in the interconnecting piece 3d as target, align reticle.
Step 9, using photomechanical production technology, so that second metal conductor layer 7 is formed together with the first metal conductor layer 6 pre-
The figure of phase.The wherein described photomechanical production technology includes exposure, imaging and etching etc..
Step 10, by be electrolysed plating or non-electrolytic plating method, on second metal conductor layer 7 formed pad weldering
Expect graph layer 8.
Step 11, on the pad solder graph layer 8 of 7 terminal part of the second metal conductor layer, pass through electroless plating
Or the mode of displacement plating forms silver conductor layer 11, the film thickness of the silver conductor layer 11 is at 1~3 μm or so.The silver conductor layer
11 can mitigate the discoloration of the base conductor because of caused by ongoing change, the deterioration for the figure quality that corrosion is brought.
Step 12, by loading device, the configuring semiconductor chip 9 in the pad locations of the pad solder graph layer 8,
By the semiconductor chip 9 and pad by 200~300 DEG C of continous way electric furnace, make the two heat fusing electrical connection.
Step 13, between the semiconductor chip 9 and the pad solder graph layer 8, utilize glue spreader inject thermosetting
Type epoxy resin filling adhesive, to form filled layer 12.
Step 14 carries out visual examination and electrical test, confirms electrical connection state.
Step 15 welds plug connector 10 on the silver conductor layer 11.
Step 16, in partial protection layer 5 to the region of part plug connector 10, using glue spreader injection packaging plastic sealed
Dress forms packaging protection layer 13, and thermosetting epoxy resin packaging plastic may be used in the packaging plastic.
Thermal printing head heating base plate according to the present invention is at low cost, due to being not necessarily to carry out in dissimilar metal overlapping portion
High temperature sintering, therefore flawless, bubble-free thermal printing head heating base plate can be obtained.
Claims (6)
1. a kind of thermal printing head heating base plate, including insulating substrate, the insulating substrate surface portion be equipped with it is non-
The ground glaze layer that crystal glass material is constituted is equipped with common electrode and individual electrode, heating resistor on the surface of the ground glaze layer
Along the configuration of main Print direction between common electrode and individual electrode, one end of the common electrode along secondary Print direction with it is described
Heating resistor is connected, and the other end with power supply for being connected；One end of the individual electrode is along secondary Print direction and institute
Heating resistor is stated to be connected, it is characterised in that：From the other end of the individual electrode draw first draw figure, described first
The part for drawing figure is on ground glaze layer, and another part is on insulating substrate, and the another of figure is drawn from described first
Interconnecting piece is drawn at end, and the interconnecting piece is equipped with notch section, and the common electrode, individual electrode, first draw figure and company
Socket part is formed using organic gold material printing-sintering；It is additionally provided on the insulating substrate by evaporating or sputtering chromium or nickel chromium triangle
The initiating terminal of the first metal conductor layer that the mode of target is formed, first metal conductor layer covers lacking on the interconnecting piece
Oral area；It is additionally provided with the second metal conductor layer on first metal conductor layer, by photomechanical production technology, makes second gold medal
Belong to conductor layer and form expected figure together with the first metal conductor layer, pad solder is additionally provided on second metal conductor layer
Graph layer is connected with semiconductor chip on the pad solder graph layer, in the pad solder graph layer and semiconductor chip
Between be filled with filled layer, be additionally provided with silver conductor on the pad solder graph layer of the terminal part of second metal conductor layer
Layer is connected with the plug connector for realizing power supply supply and external signal handing-over on the silver conductor layer；In the fever
The surface protective mulch of figure is drawn in resistive element, common electrode, individual electrode and part first；In partial protection layer to portion
Divide in the region of plug connector, is packaged to form packaging protection layer using packaging plastic.
2. thermal printing head heating base plate according to claim 1, it is characterised in that：The notch section is in the company
The hollow portion that the centre of socket part is formed.
3. thermal printing head heating base plate according to claim 1, it is characterised in that：The notch section is in the company
The first notch that the both sides of socket part are formed, the rounded rectangle of the first notch.
4. thermal printing head heating base plate according to claim 1, it is characterised in that：The notch section is in the company
The second notch that the both sides of socket part are formed, second notch are in chock shape.
5. thermal printing head heating base plate as claimed in any of claims 1 to 4, it is characterised in that：Described
Two metal conductor layers are formed by way of being electrolysed plating or electroless plating nickel or silver.
6. a kind of manufacturing method of thermal printing head heating base plate described in claim 1, it is characterised in that：The method packet
Include following steps：
Step 1 prints band-like glass material in the side of insulating substrate along main Print direction, is burnt with 1200~1300 DEG C of temperature
Knot 0.1~1 hour forms the ground glaze layer of 20~70 μm of film thickness；
Step 2 prints organic Gold conductor on the ground glaze layer and SI semi-insulation substrate, is burnt with 830 DEG C~890 DEG C of temperature
Knot forms metallized substrate；
Step 3 is coated with exposure light photoresist comprehensively on the metallized substrate, and expected figure is formed using photomechanical production technology
Shape is formed wherein the figure includes common electrode, individual electrode, the first extraction figure and interconnecting piece on the interconnecting piece
Jagged portion；
Between step 4, common electrode and individual electrode on the ground glaze layer, band-like resistive element slurry is printed along main Print direction
Material, sintering form heating resistor；
Step 5, the whole region printing-sintering glass paste in the ground glaze layer, form protective layer, and the protective layer covers institute
It states heating resistor, common electrode, individual electrode and part first and draws figure；
Step 6, on the insulating substrate other than the ground glaze layer, by way of evaporating or sputtering chromium or nickel chromium triangle target, formed
Film thicknessThe first metal conductor layer；
Step 7, using first metal conductor layer as substrate, be electrolysed plating or electroless plating nickel or silver by way of,
Form the second metal conductor layer of 3~15 μm of film thickness；
Step 8, using the notch section in the interconnecting piece as target, align reticle；
Step 9, using photomechanical production technology, so that second metal conductor layer is formed expected figure together with the first metal conductor layer
Shape；
Step 10, by be electrolysed plating or non-electrolytic plating method, on second metal conductor layer formed pad solder figure
Shape layer；
Step 11, on the pad solder graph layer of the terminal part of second metal conductor layer, by electroless plating or
The mode of displacement plating forms silver conductor layer, and the film thickness of the silver conductor layer is at 1~3 μm；
Step 12, by loading device, the configuring semiconductor chip in the pad locations of the pad solder graph layer will be described
Semiconductor chip and pad make the two heat fusing electrical connection by 200~300 DEG C of continous way electric furnace；
Step 13, between the semiconductor chip and the pad solder graph layer, utilize glue spreader inject heat cured epoxy
Resin fills glue, to form filled layer；
Step 14 carries out visual examination and electrical test, confirms electrical connection state；
Step 15 welds plug connector on the silver conductor layer；
Step 16, in partial protection layer to the region of part plug connector, be packaged and to be formed using glue spreader injection packaging plastic
Packaging protection layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710471420.1A CN107160862B (en) | 2017-06-20 | 2017-06-20 | Thermal printing head heating base plate and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710471420.1A CN107160862B (en) | 2017-06-20 | 2017-06-20 | Thermal printing head heating base plate and its manufacturing method |
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| CN107160862A CN107160862A (en) | 2017-09-15 |
| CN107160862B true CN107160862B (en) | 2018-10-19 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107901613A (en) * | 2017-11-27 | 2018-04-13 | 山东华菱电子股份有限公司 | A kind of novel thermosensitive printhead heating base plate and its manufacture method |
| JP7001449B2 (en) * | 2017-12-06 | 2022-01-19 | ローム株式会社 | Thermal print head |
| JP7037941B2 (en) * | 2018-01-09 | 2022-03-17 | ローム株式会社 | Thermal print head |
| CN110884260A (en) * | 2019-12-28 | 2020-03-17 | 厦门芯瓷科技有限公司 | Thermal printing head and manufacturing method thereof |
| CN111409376A (en) * | 2020-03-31 | 2020-07-14 | 湖南凯通电子有限公司 | Printing and manufacturing method for base glaze of heating substrate of thermal printing head |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009000936A (en) * | 2007-06-22 | 2009-01-08 | Tdk Corp | Method for manufacturing thermal head, thermal head, and image printer |
| US8810618B2 (en) * | 2010-12-25 | 2014-08-19 | Kyocera Corporation | Thermal head and thermal printer including the same |
| CN102729642B (en) * | 2011-04-13 | 2014-12-31 | 罗姆股份有限公司 | Thermal head and manufacture method thereof |
| CN202319296U (en) * | 2011-12-01 | 2012-07-11 | 山东华菱电子有限公司 | Thermo-sensitive printing head |
| CN203713263U (en) * | 2014-01-27 | 2014-07-16 | 山东华菱电子有限公司 | Thermal-sensitive print head |
| CN104859312A (en) * | 2015-06-08 | 2015-08-26 | 武汉今域通半导体有限公司 | Thermosensitive printing head and manufacturing method therefor |
| JP6364383B2 (en) * | 2015-06-30 | 2018-07-25 | アオイ電子株式会社 | Wiring board and thermal head |
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