CN107184084A - It is a kind of to have the solid of optimization conductive structure is stealthy to heat stone pot - Google Patents
It is a kind of to have the solid of optimization conductive structure is stealthy to heat stone pot Download PDFInfo
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- CN107184084A CN107184084A CN201710651470.8A CN201710651470A CN107184084A CN 107184084 A CN107184084 A CN 107184084A CN 201710651470 A CN201710651470 A CN 201710651470A CN 107184084 A CN107184084 A CN 107184084A
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- pot
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- solid
- heating board
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J27/00—Cooking-vessels
- A47J27/002—Construction of cooking-vessels; Methods or processes of manufacturing specially adapted for cooking-vessels
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Food Science & Technology (AREA)
- Cookers (AREA)
Abstract
It is particularly a kind of to have the solid of optimization conductive structure is stealthy to heat stone pot, the stone pot being made especially with medical stone the invention belongs to cooking utensil technical field.The pan of traditional non-permeable material is unable to magnetic conduction, it is impossible to heated on electromagnetic oven, is heated by placing sheet metal in pot come magnetic conduction, there are problems that the equal inconvenient, heating of use, cleaning.The present invention is provided with heating board in the bottom of a pan, and pot wall, which is provided with interlayer, interlayer, is provided with heating board and/or heat-conducting plate, and heat transfer structure is provided between heating board and heat-conducting plate.By designing heating board, heat-conducting plate in stone pot, and heat transfer structure is set therebetween, the pan of non-permeable material is used on electromagnetic oven, and pass through heat-conducting plate and heat transfer structure, the heat of pot bottom heating board is rapidly transferred to pot wall, makes the water fast boiling in pot.
Description
Technical field
It is particularly a kind of to have the solid of optimization conductive structure is stealthy to heat the invention belongs to cooking utensil technical field
Stone pot, the stone pot being made especially with medical stone.
Background technology
Conventional culinary process is that pan vessel are placed on kitchen range, and the kitchen range are generally using the flammable combustion such as bavin, coal, gas
Expect combustion heating, or heated by resistance heating form, but there is generation pernicious gas, hot spoke in these mode of heatings
Penetrate, the problems such as naked light is inflammable, and its thermal efficiency is not high.Electromagnetic oven is a kind of energy-efficient kitchen tools, is the production of modern kitchen revolution
Thing, it allows heat directly to be produced in the bottom of a pan without naked light or conduction-type heating, therefore the thermal efficiency is greatly improved.Electromagnetism
Stove is different from that tradition is all to have fire or without fiery conduction heating kitchen tools, and its principle is electromagnetic induction phenomenon, that is, utilizes alternating current
The changing alternating magnetic field in direction, the conductor in alternating magnetic field are produced by coil（There is the metal pan of magnetic conductivity
Bottom）Inside vortex current will occurs, the joule heating effect of vortex current makes conductor heat up, so as to realize heating.But tradition
The culinary art of flavoured food is typically all using non iron class vessel such as crock, marmite, soup pot, stone pots, and these non-permeable materials are not
The magnetic line of force can be effectively converged, vortex can hardly be formed, it can not be heated on electromagnetic oven.
Some existing schemes attempt to solve the above problems, and the gold with magnetic conductivity is placed such as in above-mentioned non iron pan
Belong to piece, by the sheet metal to the food heating in pot.As above the sheet metal being separately provided, although can magnetic conduction heating, but
It is Split type structure with pot, and inconvenient using, cleaning, the integrity degree of pot product is poor；In addition, the heating of sheet metal and leading
Hot property is undesirable, above-mentioned pan is heated when in use slowly, poor user experience.
The content of the invention
The purpose of the present invention is：A kind of stone pot for having and optimizing conductive structure, especially medical stone pot are developed, it, which has, leads
Heat structure, the heat that can produce pot bottom is quickly conducted to pot wall, pot is integrally heated.
It is to solve the technical scheme that is used of above-mentioned technical problem：It is a kind of to have the solid of optimization conductive structure is stealthy to add
Hot stone pot, it is characterised in that：Including pot, pot includes the bottom of a pan, pot wall；Outer surface of pot bottom is provided with heating board, and pot wall is provided with folder
Heating board and/or heat-conducting plate are provided with layer, interlayer.
The heating board is made up of magnetic conductive material, and is pasted onto the bottom of a pan by heat-conducting silicone grease and/or heat-conducting glue.
The heat-conducting plate is made from a material that be thermally conductive, and packing material is provided between heat-conducting plate and interlayer.
The packing material includes heat-conducting silicone grease and/or heat-conducting glue and/or aluminium（Aluminium liquid）.
The surrounding of the outer surface of pot bottom and/or center are provided with footing.
The top of the interlayer or bottom opening, i.e. interlayer take the shape of the letter U.
The top of the open-topped U-clamp layer is provided with ring cowling, for by the closure of openings of U-clamp layer.
Heat transfer structure is provided between the heating board and heat-conducting plate.
The heat transfer structure includes heat pipe, and heat pipe one end is connected with heating board, and the other end is connected with heat-conducting plate；Heat pipe is vertical
Place；Heat pipe is surrounded by multiple along pot wall.
The heat pipe extends up to the top of heating board.
The pot includes interior pot, outer pot, and interior pot is nested in inside outer pot, in being formed between inner pot outer wall and outer pot inwall
Interbed；Intermediate layer is provided with middle pot, and the bottom of a pan of middle pot is made up of magnetic conductive material, pot wall by Heat Conduction Material and/or permeability magnetic material and/
Or heat transfer structure is made.
Space between the middle pot and interior pot and outer pot is filled with heat-conducting silicone grease and/or heat-conducting glue and/or aluminium（Aluminium liquid）.
The bottom of a pan is spherical, pot wall and the bottom of a pan edge-smoothing transition.
The beneficial effects of the invention are as follows：By designing heating board, heat-conducting plate in stone pot, and heat transfer knot is set therebetween
Structure, enables the pan of non-permeable material to be used on electromagnetic oven, and by heat-conducting plate and heat transfer structure, pot bottom is generated heat
The heat of plate is rapidly transferred to pot wall, makes the water fast boiling in pot.
Brief description of the drawings
Fig. 1 is the structural representation of the embodiment of the present invention one；
Fig. 2 is the structural representation of the embodiment of the present invention two；
Fig. 3 is the mplifying structure schematic diagram in the A portions of the embodiment of the present invention two；
Fig. 4 is the structural representation of the heat pipe of the embodiment of the present invention two；
Fig. 5 is the structural representation of the embodiment of the present invention three；
Fig. 6 is the mplifying structure schematic diagram in the B portions of the embodiment of the present invention three；
Fig. 7 is the structural representation of the embodiment of the present invention four.
Wherein：
The ring seal of 1 pot, 11 the bottom of a pan, 12 pot wall, 13 interlayer, 14 footing 15
2 heating boards
3 heat-conducting plates
The heat pipe of 4 heat transfer structure 41
The outer pot of pot 53 in pot 52 in 51
6 electromagnetic ovens.
Embodiment
【Embodiment one】
As shown in figure 1, a kind of described in the present embodiment have the solid of optimization conductive structure is stealthy to heat stone pot, its pot includes pot
Bottom, pot wall；Outer surface of pot bottom is provided with heating board, and pot wall, which is provided with interlayer, interlayer, is provided with heating board and/or heat-conducting plate；Heating board
It is made up of magnetic conductive material, and the bottom of a pan is pasted onto by heat-conducting silicone grease and/or heat-conducting glue；Heat-conducting plate is made from a material that be thermally conductive, and is led
Packing material is provided between hot plate and interlayer, packing material includes heat-conducting silicone grease and/or heat-conducting glue and/or aluminium（Aluminium liquid）.
Further, the surrounding of the outer surface of pot bottom and/or center are provided with footing.
Further, the top of the interlayer or bottom opening, i.e. interlayer take the shape of the letter U.
Further, the top of the open-topped U-clamp layer is provided with ring seal, and ring seal is along in pot wall along annularly setting
Put, for by U-clamp layer closure of openings.
In said structure, pot wall domestic demand digs interlayer, and heat-conducting plate and/or heating board are placed in the interlayer；Consider
The factors such as structural stability, the overall aesthetics of pot, interlayer preferably by pot wall bottom up dig, i.e., grinding tool from the bottom of a pan,
Along certain distance stopping is left in knife under the position corresponding with pot wall, and feed upwards, feed to pot wall, make on interlayer along guarantor
Hold closing.According to processing equipment and the level of technique, pot wall can be straight or arc, straight pot wall shape
It is shape, simple in construction, it is easy to process；And the pot wall of arc is relatively attractive in appearance, and pot wall can outwards extend, to increase pot appearance
Product.Further, above-mentioned interlayer is used to place heat-conducting layer and/or heating layer, and heat-conducting layer and heating layer are used to in pot
Liquid is heated, therefore, when digging interlayer, interlayer inner side pot wall is may be configured as compared with outside pot wall thickness, so that heat is more to folder
Layer inner side, i.e. pot nside are radiated, and reduce thermal loss.
The surrounding of the outer surface of pot bottom and/or center are provided with footing.Heating board is by heat-conducting silicone grease and/or heat-conducting glue
Paste（Constitute tack coat）In the bottom of a pan, heating board produces electromagnetic induction, vortex current to generate heat, and heat is transferred out
Go, therefore heating board is in higher temperature state all the time.To avoid under this higher temperature, the thermal conductive silicon for bonding heating board
There is softening, deformation in fat and/or heat-conducting glue, cause heating board to bond loosely, can pass through foot support pot, it is to avoid heating board is long
Time is squeezed, deformed.Footing height is advisable at 1 ~ 10 millimeter, with reference to the principle of heating of electromagnetic oven, and the heating board in the bottom of a pan should be with
Electromagnetic oven panel is close to, so that heating board magnetic flux is maximum, therefore, the optimum height of footing is：Footing lower edge and heating board bottom
Face is concordant, i.e., footing is highly equal to heating plate thickness and adhesive layer thickness sum.
Further, the bottom of a pan center be provided with footing, the footing can effectively supporting pan body weight, and according to electromagnetic oven
Characteristics of magnetic field distribution, the electromagnetic induction phenomenon of electromagnetic oven center is weaker, based on this, can be by the center drilling of heating board, and incites somebody to action
Heating board is fixed on by the hole on the footing of the bottom of a pan center, so as to greatly enhance the journey that is connected firmly in heating board and the bottom of a pan
Degree.
Further, each corner of pot can do fillet processing, and pot stress distribution can be made uniform, easy to clean, and pot
Body is attractive in appearance.
【Embodiment two】
As shown in Figure 2,3, 4, on the basis of above-described embodiment, provided with heat transfer knot between heating board and heat-conducting plate described in the present embodiment
Structure, the heat that heat transfer structure is used to produce heating board is rapidly transferred to heat-conducting plate, and the bottom of a pan and pot wall for making pot generate heat simultaneously,
It is heated, is seethed with excitement with accelerating liquid in pot.
Above-mentioned heat transfer structure, its effect is that the heat for producing heating board is rapidly transferred to heat-conducting plate, therefore heat transfer structure
Can be any of form, specifically, heat transfer structure can by it is any by heating board and heat conduction plate weld, splice, pour
The prior art for the structure that is cast as one makes, realized, i.e., heat transfer structure is using the welded plate of above-mentioned technology, splice plate, poured
Ingot bar.The heat transfer structure includes heat pipe, and heat pipe one end is connected with heating board, and the other end is connected with heat-conducting plate；Heat pipe is put vertically
Put；Heat pipe is surrounded by multiple along pot wall.Heat pipe extends up to the top of heating board.
Heat pipe is the phase transition process condensed after being evaporated using medium in hot junction in cold end（I.e. using liquid evaporation latent heat and
The latent heat of condensation）, heat is quickly conducted.General heat pipe is made up of shell, liquid-sucking core and end cap.Inside heat pipe is to be pumped into negative pressure
State, is filled with appropriate liquid, and this boiling point of liquid is low, readily volatilized.Tube wall has liquid-sucking core, and it is by capillary-porous material structure
Into.Heat pipe one end is evaporation ends, and other end is condensation end, when heat pipe one end is heated, the liquid rapid vaporization in capillary,
Steam flows to other end under the power of thermal diffusion, and discharges heat in cold end condensation, and liquid leans on hair along porous material again
Spy is with evaporation ends are flowed back to, and so circulation is more than, and until heat pipe two ends, temperature is equal（Now steam thermal diffusion stops）.It is this to follow
Ring is quickly carried out, and heat, which can be conducted continuously, to be come.
The heat that heating board is produced is rapidly transferred to by heat-conducting plate using heat pipe, electromagnetic power, maximum journey can be effectively utilized
The loss of heat is reduced on degree, so as to accelerate liquid boiling in pot.Because heat-conducting plate is placed in the interlayer of pot wall, so hot
Pipe is also required to be arranged in interlayer.Specific method for posting has diversified forms, and corresponding groove is such as dug in interlayer, heat pipe is put
Put in groove；Heat pipe and heat-conducting plate can also be processed into a single integrated structure, simplify the processing technology of interlayer.
【Embodiment three】
As shown in Figure 5,6, on the basis of above-described embodiment, pot described in the present embodiment includes interior pot, outer pot, and interior pot is nested outside
Pot is internal, and intermediate layer is formed between inner pot outer wall and outer pot inwall；Middle pot is provided with intermediate layer, the bottom of a pan of middle pot is by magnetic conductivity material
Material is made, and pot wall is made up of Heat Conduction Material and/or permeability magnetic material and/or heat transfer structure.Sky between middle pot and interior pot and outer pot
Gap is filled with heat-conducting silicone grease and/or heat-conducting glue and/or aluminium（Aluminium liquid）.
In the present embodiment, heating board is integrated with heat-conducting plate, pot in formation, and heating board is placed in the middle part of the bottom of a pan.Thus,
Pot can be divided into interior pot, outer pot two parts, inner pot outer wall coincide with outer pot inner wall shape, profile, and interior pot can be embedding with outer pot
It is nested together；By middle pot（Heating board and heat-conducting plate）It is placed between interior pot and outer pot, and is entered by heat-conducting silicone grease and/or heat-conducting glue
Row is adhesively fixed, or is closed, fixed by metal liquid casting form.Said structure has many merits, on the one hand, three
Layer pot is mutually nested, and its globality is strong, Stability Analysis of Structures, and processing technology is simple, and manufacturing cost is cheap；On the other hand, by heating board,
Heat-conducting plate and heat transfer structure design integrated middle pot, make heat conduction efficiency higher, and middle pot process for machining and manufacturing more
Simplify, the manufacture of the pot is more quick.
Aluminium used is filled in above-described embodiment（Aluminium liquid）, refer to liquid aluminum or aluminum alloy passing through the sides such as pouring, injection
Formula is filled into above-mentioned interlayer, space, so that each component is closely connected, is reduced space, is strengthened heat-conducting effect.
【Example IV】
As shown in fig. 7, on the basis of above-described embodiment, it is a kind of described in the present embodiment to have the solid of optimization conductive structure is stealthy to add
Hot stone pot, the bottom of a pan of its pot is spherical, pot wall and the bottom of a pan edge-smoothing transition.The bottom of a pan of above-mentioned spheric can be substantially increased
The bottom of a pan and the contact area of electromagnetic oven, produce stronger electromagnetic induction and vortex current, so as to strengthen the heating effect in the bottom of a pan；Together
When, the pot seamlessly transitted is more beneficial for conducting heat, additionally it is possible to accelerates the convection current of fluid in pot, can shorten the heat time.
Based on the design of above-mentioned spheric pot, the present embodiment also needs to matched, special electromagnetic oven, the electromagnetic oven
Panel with concave ball surfaces（That is coil）, it is possible to achieve the abundant heating to above-mentioned spheric pot.
It should be noted last that, technical scheme rather than limit of the above embodiment only to illustrate the invention
System, although the invention is described in detail with reference to example, it will be understood by those within the art that, can be right
The technical scheme of the invention is modified or equivalent substitution, without departing from the spirit and model of the invention technical scheme
Enclose, it all should cover among the right of the invention.
Claims (10)
1. a kind of have the solid of optimization conductive structure is stealthy to heat stone pot, it is characterised in that：Including pot, pot includes pot
Bottom, pot wall；Outer surface of pot bottom is provided with heating board, and pot wall, which is provided with interlayer, interlayer, is provided with heating board and/or heat-conducting plate.
2. stone pot is heated in a kind of solid stealth with optimization conductive structure according to claim 1, it is characterised in that：Institute
State heating board to be made up of magnetic conductive material, and the bottom of a pan is pasted onto by heat-conducting silicone grease and/or heat-conducting glue.
3. stone pot is heated in a kind of solid stealth with optimization conductive structure according to claim 1, it is characterised in that：Institute
State heat-conducting plate to be made from a material that be thermally conductive, packing material is provided between heat-conducting plate and interlayer, packing material includes heat-conducting silicone grease and/or led
Hot glue and/or aluminium（Aluminium liquid）.
4. stone pot is heated in a kind of solid stealth with optimization conductive structure according to claim 1, it is characterised in that：Institute
The surrounding and/or center for stating outer surface of pot bottom are provided with footing.
5. stone pot is heated in a kind of solid stealth with optimization conductive structure according to claim 1, it is characterised in that：Institute
Top or the bottom opening of interlayer are stated, i.e. interlayer takes the shape of the letter U；The top of open-topped U-clamp layer is provided with ring cowling, for by U-shaped
The closure of openings of interlayer.
6. stone is heated in a kind of solid stealth with optimization conductive structure according to claim 1 to 5 any claim
Pot, it is characterised in that：Heat transfer structure is provided between the heating board and heat-conducting plate.
7. stone pot is heated in a kind of solid stealth with optimization conductive structure according to claim 6, it is characterised in that：Institute
Stating heat transfer structure includes heat pipe, and heat pipe one end is connected with heating board, and the other end is connected with heat-conducting plate；Heat pipe is placed vertically；Heat pipe
It is surrounded by along pot wall multiple.
8. stone pot is heated in a kind of solid stealth with optimization conductive structure according to claim 1, it is characterised in that：Institute
Stating pot includes interior pot, outer pot, and interior pot is nested in inside outer pot, and intermediate layer is formed between inner pot outer wall and outer pot inwall；It is middle
Layer is provided with middle pot, and the bottom of a pan of middle pot is made up of magnetic conductive material, and pot wall is tied by Heat Conduction Material and/or permeability magnetic material and/or heat transfer
It is configured to.
9. stone pot is heated in a kind of solid stealth with optimization conductive structure according to claim 8, it is characterised in that：Institute
The space stated between pot and interior pot and outer pot is filled with heat-conducting silicone grease and/or heat-conducting glue and/or aluminium（Aluminium liquid）.
10. stone pot, its feature are heated in a kind of solid stealth with optimization conductive structure according to claim 1,8 or 9
It is：The bottom of a pan is spherical, pot wall and the bottom of a pan edge-smoothing transition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710651470.8A CN107184084A (en) | 2017-08-02 | 2017-08-02 | It is a kind of to have the solid of optimization conductive structure is stealthy to heat stone pot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710651470.8A CN107184084A (en) | 2017-08-02 | 2017-08-02 | It is a kind of to have the solid of optimization conductive structure is stealthy to heat stone pot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107184084A true CN107184084A (en) | 2017-09-22 |
Family
ID=59884645
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710651470.8A Withdrawn CN107184084A (en) | 2017-08-02 | 2017-08-02 | It is a kind of to have the solid of optimization conductive structure is stealthy to heat stone pot |
Country Status (1)
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108720556A (en) * | 2018-07-06 | 2018-11-02 | 荆门它山之石电子科技有限公司 | A kind of round bottom combination Motuo stone pot |
| CN113276283A (en) * | 2021-06-04 | 2021-08-20 | 徐阿勇 | Aluminum-clad stone processing technology |
| CN114010810A (en) * | 2021-10-28 | 2022-02-08 | 常州百佳纺织科技有限公司 | Oxford high-heat-conductivity steam disinfection furnace shell assembly and steam disinfection furnace |
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| CN113276283A (en) * | 2021-06-04 | 2021-08-20 | 徐阿勇 | Aluminum-clad stone processing technology |
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| CN114010810A (en) * | 2021-10-28 | 2022-02-08 | 常州百佳纺织科技有限公司 | Oxford high-heat-conductivity steam disinfection furnace shell assembly and steam disinfection furnace |
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Application publication date: 20170922 |
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