CN107104083B - Fastening assembly with low wind pressure loss, heat radiation assembly and combined structure of heat radiation assembly and chip set - Google Patents
Fastening assembly with low wind pressure loss, heat radiation assembly and combined structure of heat radiation assembly and chip set Download PDFInfo
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- CN107104083B CN107104083B CN201610095255.XA CN201610095255A CN107104083B CN 107104083 B CN107104083 B CN 107104083B CN 201610095255 A CN201610095255 A CN 201610095255A CN 107104083 B CN107104083 B CN 107104083B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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Abstract
The invention discloses a buckling component with low wind pressure loss, a radiating component and a combined structure of the radiating component and a chip set. The heat dissipation assembly comprises a heat radiator and a buckling assembly. The radiator comprises a bottom plate and a plurality of radiating bodies. The buckling assembly comprises a rectangular frame body, a plurality of first side plates and a plurality of guide plates. The rectangular frame body comprises two first beam bodies, two second beam bodies, a first surface and a second surface, the first beam bodies and the second beam bodies are connected to define a hollow area, and the plurality of radiators penetrate through the hollow area. The first side plates are respectively extended out from the two first beam bodies of the rectangular frame body. The guide plates are respectively extended out from the second beam body of the rectangular frame body.
Description
Technical Field
The present invention relates to a heat sink assembly and chipset assembly, a heat sink assembly and a fastening assembly thereof, and more particularly to a fastening assembly capable of concentrating and uniforming a wind field passing through a heat sink, a heat sink assembly suitable for the fastening assembly, and a heat sink assembly and chipset assembly.
Background
As the performance of electronic devices is improved, the waste heat generated by the chipset inside the electronic device in a unit time is increased accordingly, and the working efficiency of the chipset is greatly affected by the working temperature of the chipset, so how to efficiently remove the waste heat generated by the chipset and maintain the working temperature of the chipset within an ideal range is an important issue.
In the prior art, a heat sink with high thermal conductivity is attached to the surface of a chipset, and the heat sink is directly fixed on a motherboard to prevent the heat sink from loosening and tightly contact the chipset, so as to form a heat transfer path with low thermal resistance, and the surface area of the heat sink in contact with air is increased by a plurality of fins of the heat sink, thereby achieving better heat dissipation efficiency. However, in the prior art, in order to directly mount the heat sink on the motherboard, the area of the base of the heat sink must exceed the chip set, so as to mount the fixing component on the base of the heat sink, and the heat sink is directly fixed on the motherboard. The method not only increases the raw material cost of the radiator, but also causes that the arrangement space of the radiator must be additionally reserved when the mainboard is designed, so that the mainboard adopting the radiator in the prior art is difficult to be designed to be light, thin or miniaturized.
In addition, some prior art designs first dispose the heat sink on a heat conducting plate with a larger area than the heat sink base, fix the fan on the heat conducting plate, and then dispose the heat conducting plate on the motherboard to make the chipset contact with the heat conducting plate, so as to further increase the heat dissipation efficiency. However, this method must reserve more space on the motherboard for the heat-conducting board, the heat sink and the fan.
On the other hand, when the heat sink in the prior art utilizes an active heat dissipation device, such as a fan, to drive airflow to dissipate heat from the heat sink and the chipset, since the airflow flows in a non-directional manner, when the airflow flows through the heat dissipation fins of the heat sink, a portion of the airflow often overflows to the outside of the heat sink, so that the airflow is dispersed and the wind resistance is unbalanced, and the heat dissipation efficiency cannot be further improved.
In view of this, how to develop a fastening assembly, a heat dissipation assembly, and a combination structure of the heat dissipation assembly and a chipset to solve the shortcomings of the prior art is a problem that those skilled in the related art are urgently required to solve at present.
Disclosure of Invention
The invention aims to provide a buckling component, a radiating component and a combined structure of the radiating component and a chip set.
Another objective of the present invention is to provide a fastening assembly, a heat dissipating assembly, and a combined structure of a heat sink and a chipset, wherein the design of integrally forming the flow guiding plate and the fastening assembly not only saves the cost of raw materials, but also does not require a space for fixing the assembly or a fan on the motherboard, thereby achieving the advantages of reducing the manufacturing cost and reducing the thickness or miniaturization of the motherboard and the heat sink.
Another objective of the present invention is to provide a fastening assembly, a heat dissipating assembly, and a combined structure of a heat dissipating assembly and a chipset, wherein the size of a bottom plate of a heat sink is increased, the number of heat sinks is increased, and a flow guide plate disposed on the fastening assembly is used to solve the problems of air flow dispersion and uneven wind field that flow through the heat sinks when the bottom plate of the heat sink is enlarged, and further improve the overall heat dissipating efficiency of the heat dissipating assembly.
According to the disclosure, a broad aspect of the disclosure provides a fastening assembly including a rectangular frame, a plurality of first side plates, and a plurality of deflectors. The rectangular frame body comprises two first beam bodies, two second beam bodies, a first surface and a second surface. Two first roof beam bodies set up relatively, and two second roof beam bodies set up relatively, and first surface sets up with the second surface relatively, and two first roof beam bodies and two second roof beam body connected definition form hollow region. The first side plates extend perpendicularly from the first surfaces of the two first beams of the rectangular frame body respectively, and each first side plate comprises at least one clasp extending from the corresponding first side plate to the hollow area. The guide plates extend out of the second surface of the second beam body of the rectangular frame body vertically.
According to the concept of the present invention, another broad embodiment provides a heat dissipation assembly comprising a heat sink and a fastening assembly. The radiator comprises a bottom plate and a plurality of radiators, and the radiators are arranged on the bottom plate at intervals. The buckling assembly comprises a rectangular frame body, a plurality of first side plates and a plurality of guide plates. The rectangular frame body comprises two first beam bodies, two second beam bodies, a first surface and a second surface. The two first beam bodies are arranged oppositely, the two second beam bodies are arranged oppositely, the first surface and the second surface are arranged oppositely, and the two first beam bodies and the second beam bodies are connected to define a hollow area, so that the plurality of radiators of the radiator penetrate through the hollow area. The plurality of first side plates extend perpendicularly from the first surfaces of the two first beams of the rectangular frame body respectively, and each first side plate comprises at least one clasp, and the clasps extend from the first side plates to the hollow area. The guide plates extend out from the second surface of the second beam body of the rectangular frame body respectively.
According to the idea of the present invention, another broad embodiment of the present invention is to provide a combination structure of a heat sink assembly and a chipset, comprising a chipset and a heat sink assembly. The chip group comprises a chip substrate and a chip. The heat dissipation assembly comprises a heat radiator and a buckling assembly. The radiator comprises a bottom plate and a plurality of radiators, and the radiators are arranged on the bottom plate at intervals. The buckling assembly comprises a rectangular frame body, a plurality of first side plates and a plurality of guide plates. The rectangular frame body comprises two first beam bodies, two second beam bodies, a first surface and a second surface. The two first beam bodies are arranged oppositely, the two second beam bodies are arranged oppositely, the first surface and the second surface are arranged oppositely, and the two first beam bodies and the two second beam bodies are connected to define a hollow area, so that the plurality of radiators of the radiator penetrate through the hollow area. The plurality of first side plates extend perpendicularly from the first surfaces of the two first beams of the rectangular frame body respectively, and each first side plate comprises at least one clasp, and the clasps extend from the first side plates to the hollow area. The guide plates extend out of the second surface of the second beam body of the rectangular frame body vertically. At least one clasp of the first side plates of the buckling component is buckled on at least one edge of the bottom surface of the chip substrate of the chip set.
The invention has the beneficial effects that: the buckling component, the radiating component and the combined structure of the radiating component and the chip set have the advantages that the guide plates are arranged on the two opposite sides of the buckling component, so that airflow passing through the radiating component is concentrated towards the radiating body of the radiating component, the airflow is prevented from dissipating towards the outer side of the radiating component, and the overall radiating efficiency of the radiating component is improved. In addition, by means of the design of integrally forming the guide plate and the buckling component, the raw material cost is saved, the arrangement space of a fixing component or a fan does not need to be reserved on the main board, and the advantages of reducing the manufacturing cost and thinning or miniaturization of the main board and the radiator are achieved. Moreover, the arrangement quantity of the heat radiators is increased by means of the size of the bottom plate of the heat radiator, and the guide plates are arranged on the buckling assembly, so that the problems of air flow dispersion and uneven wind field flowing through the heat radiators when the bottom plate of the heat radiator is expanded are solved, and the overall heat radiation efficiency of the heat radiation assembly is further improved.
Drawings
Fig. 1 is a schematic view of a combined structure of a heat dissipation assembly and a chipset according to a first embodiment of the invention.
Fig. 2 is an exploded view of the heat sink assembly according to the first embodiment of the present invention.
FIG. 3A is a schematic view of the fastening assembly shown in FIG. 2.
Fig. 3B is a schematic view of the heat sink shown in fig. 2.
Fig. 4 is an exploded view of a heat sink assembly according to a second embodiment of the present invention.
FIG. 5 is a schematic view of a variation of the fastening assembly shown in FIG. 2.
FIG. 6 is a schematic view of another variation of the fastening assembly shown in FIG. 2.
FIG. 7 is a schematic view of another variation of the fastening assembly shown in FIG. 2.
Fig. 8 is a schematic structural diagram of a heat dissipation assembly according to a third embodiment of the present invention.
Fig. 9 is a schematic structural diagram of a heat dissipation assembly according to a fourth embodiment of the present invention.
Fig. 10 is a schematic structural diagram of a heat dissipation assembly according to a fifth embodiment of the present invention.
Wherein the reference numerals are as follows:
1 Combined structure of heat radiation assembly and chip set
2 Heat radiation assembly
21 radiator
211 base plate
2110 upper surface
2111 setting up a channel
2112 lower surface
212 Heat sink
2121 a top surface
2231 the top surface
22 snap-fit assembly
221 rectangular frame body
2211 first beam
2212 second Beam
2213 first surface
2214 second surface
222 first side plate
2221 clasp
2222 internal surface
223 baffle
224 second side plate
225 resilient arm
2251 sustaining part
3 chip group
31 chip substrate
310 bottom surface
310a edge
32 chips
A1 first setting area
A2 second setting area
C1 center region
C2 extended region
D1 first direction
D2 second direction
E hollow region
Acute angle of theta
Acute angle of theta 1
Acute angle of theta 2
Detailed Description
Some exemplary embodiments that embody features and advantages of the invention will be described in detail in the description that follows. It is to be understood that the invention is capable of other and different embodiments and its several details are capable of modification without departing from the scope of the invention, and that the description and drawings are to be regarded as illustrative in nature and not as restrictive.
Referring to fig. 1, fig. 1 is a schematic view of a combined structure of a heat dissipation assembly and a chipset according to a first embodiment of the invention. As shown in the figure, the combined structure 1 of the heat sink assembly and the chipset includes a heat sink assembly 2 and a chipset 3. The heat dissipation assembly 2 includes a heat sink 21 and a fastening assembly 22, the chip set 3 includes a chip substrate 31 and a chip 32, the chip 32 is disposed on the chip substrate 31, and the chip 32 is a plate-shaped heat generator. In practical application, the heat sink 2 is disposed on the chipset 3, and the fastening component 22 of the heat sink 2 is used as a limiting component to attach the heat sink 21 to the chipset 2 and prevent the heat sink 21 from loosening from the chipset 3, so as to increase the surface area of the air flow contacting the high temperature object by the heat sink 21, thereby improving the heat dissipation efficiency.
Referring to fig. 2, fig. 3A and fig. 3B, fig. 2 is an exploded view of a heat dissipation assembly according to a first embodiment of the present invention; FIG. 3A is a schematic view of the fastening assembly shown in FIG. 2; and FIG. 3B is a schematic view of the heat sink shown in FIG. 2. The heat sink 21 includes a base plate 211 and a plurality of heat radiating bodies 212. In the present embodiment, the plurality of heat sinks 212 are heat dissipation fins of a plate structure, and the plurality of heat sinks 212 are arranged in parallel on the upper surface 2110 of the bottom plate 211, that is, the plurality of heat sinks 212 are linearly arranged along the first direction D1 and are arranged at intervals along the second direction D2, and the first direction D1 is perpendicular to the second direction D2, but not limited thereto, the shape of the heat sinks 212 may vary according to practical application requirements, such as a cylindrical heat dissipation column, an elliptical heat dissipation column, or another heat dissipation column with an arc surface.
Referring to fig. 2 and 3A, the fastening assembly 22 includes a rectangular frame 221, a plurality of first side plates 222, and a plurality of guide plates 223. The rectangular frame 221 includes two first beams 2211, two second beams 2212, a first surface 2213 and a second surface 2214. The two first beams 2211 are disposed opposite to each other, the two second beams 2212 are disposed opposite to each other, and the first surface 2213 is disposed opposite to the second surface 2214. The two first beam bodies 2211 and the two second beam bodies 2212 of the rectangular frame 221 are connected to each other to define a hollow area E and a first surface 2213 and a second surface 2214 which are oppositely arranged. In the embodiment, the two first beam bodies 2211 and the two second beam bodies 2212 are integrally formed, the two first beam bodies 2211 are parallel to each other, and the two second beam bodies 2212 are parallel to each other, but not limited thereto, the shape of the rectangular frame 221 may be changed according to the actual arrangement of the heat dissipation bodies 212 of the heat sink 21.
The first side plates 222 of the fastening assembly 22 extend perpendicularly from the first surfaces 2213 of the two first beams 2211 of the rectangular frame 221. The plurality of first side plates 222 include at least one hook 2221, in other words, each of the first side plates 222 includes at least one hook 2221, or a part of the first side plates 222 includes at least one hook 2221, and a part of the first side plates 222 does not include any hook. The hooks 2221 extend from the inner surface 2222 of the first side plate 222 toward the hollow area E. In the present embodiment, the number of the first side plates 222 is two, and the two first side plates are respectively disposed on the opposite first beam 2211, and each of the first side plates 222 has two hooks 2221, but not limited thereto. In some embodiments, the number of the first side plates 222 is four, and two first side plates 222 are disposed on each first beam 2211, wherein each first side plate 222 has one clasp 2221.
Referring to fig. 1 and 2 again, when the heat dissipation assembly 2 is disposed on the chipset 3, the first beam 2211 is disposed substantially parallel to the second direction D2, and cooperates with the bottom plate 211 of the heat sink 21 and the chip substrate 31 of the chipset 3 via the first side plate 222 to limit the displacement of the heat sink 21 along the first direction D1 or the opposite direction of the first direction. Similarly, when the heat dissipating module 2 is disposed on the chipset 3, the first surface 2213 of the fastening module 22 at least partially abuts against the upper surface 2110 of the bottom plate 211 of the heat sink 21, and at least one hook 2221 of the first side plates 222 of the fastening module 22 is fastened to at least one edge 310a of a bottom surface 310 of the chip substrate 31 of the chipset 3, so that the bottom plate 211 of the heat sink 21 and the chipset 3 are limited between the rectangular frame 221 and the first side plates 222 by the fastening module 22, thereby preventing the heat sink 21 and the chipset 3 from being separated.
Referring to fig. 2, fig. 3A and fig. 3B, two first blank areas a1(first dummy areas) are defined by the plurality of radiators 212 along the second direction D2, and the two first blank areas a1 divide the plurality of radiators 212 into a central area C1 and two extension areas C2, wherein the central area C1 is located between the two extension areas C2, that is, the plurality of radiators 212 are included between the two first blank areas a1, but not limited thereto. In this embodiment, the shortest distance between the two first empty areas a1 is less than or equal to the length of the first beam 2211 of the fastening assembly 22. Therefore, when the fastening component 22 and the heat sink 21 are combined to form the heat dissipating component 2, or the heat dissipating component 2 is further disposed on the chipset 3, the two second beams 2212 of the fastening component 22 are respectively accommodated in the two first empty areas a 1. In addition, the two air deflectors 223 are also respectively located in the two first empty areas a1, so that when an active heat dissipation device, such as a fan, is used to drive an air flow to dissipate heat from the heat sink 21 and the chipset 3 along the direction opposite to the first direction D1 or the first direction D1, the two air deflectors 223 can balance the flow of the air flow passing through each position of the heat sink 21, so as to prevent the two first empty areas a1 from affecting the uniformity of the air field passing through the heat sink 21, and the two air deflectors 223 can intensively guide the air flow to make the air flow intensively and uniformly pass through the heat dissipation body 212 above the heat source.
As shown in fig. 2, fig. 3A and fig. 3B, in the present embodiment, the fastening assembly 22 further includes a plurality of second side plates 224 besides the first side plate 222, and the second side plates extend from the first surfaces 2213 of the second beam 2212 of the rectangular frame 221 to serve as limiting assemblies for limiting the displacement of the heat sink 21 and the chip set 3 along the second direction D2, but not limited thereto. The number of the second side plates 224 is preferably two, and the bottom plate 211 of the heat sink 21 includes two setting channels 2111, the two setting channels 2111 are located in the first blank area a1 of the heat sink, and the two positions of the setting channels 2111 are respectively set relative to the two second side plates 224 of the rectangular frame 221, so that the two second side plates 224 respectively penetrate through the two setting channels 2111, so as to limit the position of the fastening component 22 on the second direction D2 by the cooperation of the second side plates 224 and the setting channels 2111, which can prevent the fastening component 22 from attaching to the heat sink 212, reduce the surface area of the fastening component 22 shielding the heat sink 212, and also prevent the fastening component 22 from sliding along the second direction D2 by the second side plates 224 abutting against the chip substrate 31 of the chip set 3 (as shown in fig. 1).
Referring to fig. 2 and fig. 3A and 3B, the fastening assembly 22 further includes a plurality of elastic arms 225, the elastic arms 225 extend from the two second beams 2212 to the hollow region E, each elastic arm 225 has a top 2251, and the top 2251 extends from the end of the elastic arm 225, so that when the heat dissipation assembly 2 is disposed on the chipset 3, the top 2251 abuts against the bottom 211 of the heat sink 21, so that the bottom surface 2112 of the bottom 211 of the heat sink 21 is more tightly attached to the chipset 3, and the heat conduction efficiency is improved. In the present embodiment, the plurality of heat radiators 212 are arranged at intervals in m columns along the second direction D2, the plurality of heat radiators 212 are arranged at intervals in n rows along the first direction D1, and the heat radiators 212 in different rows are arranged at intervals and define n-1 second blank areas a2(second dummy areas), where m is a positive integer greater than or equal to 3, and n is a positive integer greater than or equal to 2, but not limited thereto. When the fastening assembly 22 and the heat sink 11 are combined to form the heat dissipating assembly 2, or the heat dissipating assembly 2 is further disposed on the chipset 3, the n-1 second empty areas a2 enable the elastic arms 225 to be respectively accommodated in the corresponding second empty areas a 2.
Referring to fig. 4, fig. 4 is an exploded view of a heat dissipation assembly according to a second embodiment of the present invention. In the present embodiment, the structure of the heat dissipation assembly 2 is similar to that of the heat dissipation assembly 2 shown in fig. 2, and the same component numbers represent the same component structures and functions, which are not described herein again. Unlike the heat dissipation assembly 2 shown in fig. 2, the fastening assembly 22 of the present embodiment only includes a rectangular frame 221, two first side plates 222, and two deflectors 223, and the shapes of the plurality of heat dissipation bodies 212 of the heat sink 21 are different. When the fastening assembly 22 and the heat sink 21 are combined to form the heat dissipating assembly 2, or the heat dissipating assembly 2 is further disposed on the chipset 3, the two second beams 2212 of the fastening assembly 22 are respectively disposed in the two first empty areas a1 of the heat sink 21, so that the two second beams 2212 are respectively disposed between the heat dissipating bodies 212, and the position of the fastening assembly 22 in the second direction D2 is limited by the cooperation of the heat dissipating bodies 212 adjacent to the second beam 2212 and the second beam 2212. In addition, in the present embodiment, the heat sinks 21 are arranged in m rows at intervals along the second direction D2, but each row of the heat sinks 212 has only a single plate-shaped heat dissipation fin, i.e., each row of the heat sinks 212 extends along a direction parallel to the first direction D1, thereby increasing the surface area of the air flow contacting the high-temperature object. In some embodiments, the form of the heat sink 21 is not limited to the embodiment shown in fig. 4, and the heat sink 21 shown in fig. 2 may also be used according to the actual application requirement.
Please refer to fig. 5 with reference to fig. 2, fig. 3A and fig. 3B, wherein fig. 5 is a schematic view of a variation of the fastening assembly shown in fig. 2. In this embodiment, the fastening assembly 22 includes a plurality of deflectors 223, such as but not limited to eight deflectors 223, and the plurality of deflectors 223 extend vertically from the second surface 2214 of the second beam 2212 of the rectangular frame 221. In detail, four deflectors 223 are disposed on the second surface 2214 of one of the second beams 2212, and the remaining four deflectors 223 are disposed on the second surface 2214 of the other second beam 2212, wherein the four deflectors 223 disposed on the same second beam 2212 are spaced apart from each other. When the fastening assembly 22 and the heat sink 11 are assembled to form the heat dissipating assembly 2, or the heat dissipating assembly 2 and the chip set 3 are further assembled to form an assembled structure, the second beam 2212 is received in the first empty area a1, the guiding plate 223 extends from the second surface 2214 of the second beam 2212, and the guiding plate 223 and the heat dissipating body 212 of the heat sink 21 are arranged at intervals along the second direction D2. Since the heat sink 21 of the first embodiment has two first blank areas a1, a central area C1 and two extension areas C2, and the plurality of air deflectors 223 of the fastening assembly 22 are accommodated in the first blank area a1, the arrangement of the plurality of air deflectors 223 can increase the wind resistance of the heat sink 21 in the first blank area a1, prevent a larger air flow component from passing through the first blank area a1 and dispersing the air flow component flowing to the central area C1, so as to make the wind resistance of the heat sink 2 uniform, and effectively improve the heat dissipation efficiency of the heat sink 2. In addition, the extended area C2 of the heat sink 21 can increase the heat dissipation surface area, so that the heat dissipation assembly 2 of the present invention can achieve the effect of greatly increasing the heat dissipation efficiency. It should be emphasized that the number of the baffles 223 is not limited to eight, and the number thereof may be varied according to the actual application.
In some embodiments, each of the deflectors 223 has a thickness variation along the second beam 2212 toward the top surface 2231 thereof, wherein the thickness of the deflector 223 is preferably gradually thinner along the second beam 2212 toward the top surface 2231 thereof, thereby making the deflector 223 light and thin and capable of having good mechanical properties. In some embodiments, the deflectors 223 on the same second beam 2212 are linearly arranged, the deflectors 223 on different second beams 2212 are parallel to each other, and each deflector 223 is parallel to two second beams 2212, so as to form a more uniform wind resistance, but not limited thereto.
Referring to fig. 6 and 7 in conjunction with fig. 2, 3A and 3B, fig. 6 is a schematic view of another variation of the fastening assembly shown in fig. 2; FIG. 7 is a schematic view of another variation of the fastening assembly shown in FIG. 2. As shown in fig. 6, in the present embodiment, the structure of the fastening element 22 is similar to that of the fastening element 22 shown in fig. 5, and the same element numbers represent the same element structures and functions, which are not described herein again. Unlike the fastening assembly 22 shown in fig. 5, the plurality of deflectors 223 of the fastening assembly 22 of the present embodiment are arranged in different manners, wherein four deflectors 223 on the same second beam 2212 are parallel to each other, eight deflectors 223 on different second beams 2212 are parallel to each other, and the second beam 2212 and the deflectors 223 disposed thereon form an acute angle θ, wherein the acute angle θ is greater than 0 degree and less than or equal to 5 degrees, but not limited thereto. In yet another variation (not shown), the eight deflectors 223 located on different second beam bodies 2212 are not parallel to each other and the second beam bodies 2212 and the deflectors 223 disposed thereon form an acute angle θ, wherein the acute angle θ is greater than 0 degree and less than or equal to 5 degrees. As shown in fig. 7, in the present embodiment, the four deflectors 223 located on the same second beam 2212 respectively form acute angles θ 1 and θ 2 with the second beam 2212, where the angles of the acute angles θ 1 and θ 2 are both greater than 0 degree and less than or equal to 5 degrees, but not limited thereto. Therefore, the wind field distribution flowing through the heat dissipation assembly 2 can be adjusted by using the plurality of air deflectors 223 of the fastening assembly 22, and can be adjusted and changed according to the actual application requirements.
In still other embodiments, as shown in fig. 2, the deflectors 223 have a top surface 2231, the heat sinks 212 have a top surface 2121, the shortest distance from the top surface 2231 of each of the deflectors 223 to the first surface 2213 of the rectangular frame 221 is a first shortest distance, and the shortest distance from the top surfaces 2121 of the heat sinks 212 to the upper surface 2210 of the bottom plate 211 is a second shortest distance, preferably, the first shortest distance is greater than or equal to the second shortest distance, so as to make the wind field flowing through the heat dissipation assembly 2 more uniform.
Referring to fig. 8, 9 and 10, fig. 8 is a schematic structural diagram of a heat dissipation assembly according to a third embodiment of the present invention; fig. 9 is a schematic structural diagram of a heat dissipation assembly according to a fourth embodiment of the present invention; fig. 10 is a schematic structural diagram of a heat dissipation assembly according to a fifth embodiment of the present invention. In the third, fourth and fifth embodiments, the structure of the heat dissipation assembly 2 is similar to the structure of the heat dissipation assembly 2 shown in fig. 2 and the fastening assembly 22 shown in fig. 5, and the same assembly numbers represent the same assembly structures and functions, which are not described herein again, but the heat sinks 212 shown in the third, fourth and fifth embodiments all penetrate through the hollow area E of the fastening assembly 22, and the heat sinks 212 are disposed at intervals, i.e., the heat sink 21 does not include two first blank areas a1 or the extension area C2. In the third embodiment, the plurality of heat dissipation bodies 212 are similar to the heat dissipation device 21 shown in fig. 4, that is, each row of heat dissipation bodies 212 along the first direction D1 has only a single plate-shaped heat dissipation fin, but not limited thereto. In the fourth embodiment, the plurality of heat radiators 212 are also plate-shaped heat dissipation fins, and each row of the heat radiators 212 along the first direction D1 includes a plurality of heat radiators 212 arranged linearly, but the disclosure is not limited thereto. In the fifth embodiment, each of the heat dissipation bodies 212 is a cylindrical heat dissipation post 212, which is not limited herein. In addition, the fastening components 22 shown in the third, fourth and fifth embodiments are not limited to the embodiment shown in fig. 5, and may be replaced with the embodiments shown in fig. 6 and 7 or other variations described above, and the heat dissipation components 2 shown in the third, fourth and fifth embodiments can concentrate the airflow passing through the heat dissipation components 2 toward the heat source of the heat dissipation components 2 by means of the plurality of flow guiding plates 223 of the fastening components 22, so as to prevent the airflow from dissipating outside the heat dissipation components 2.
In summary, the fastening assembly, the heat dissipating assembly and the combined structure of the heat dissipating assembly and the chip set of the present invention have the advantages that the flow deflectors are arranged on the two opposite sides of the fastening assembly, so that the airflow passing through the heat dissipating assembly is concentrated toward the heat dissipating body of the heat dissipating assembly, and the airflow is prevented from dissipating toward the outer side of the heat dissipating assembly, thereby improving the overall heat dissipating efficiency of the heat dissipating assembly. In addition, by means of the design of integrally forming the guide plate and the buckling component, the raw material cost is saved, the arrangement space of a fixing component or a fan does not need to be reserved on the main board, and the advantages of reducing the manufacturing cost and thinning or miniaturization of the main board and the radiator are achieved. Moreover, the arrangement quantity of the heat radiators is increased by means of the size of the bottom plate of the heat radiator, and the guide plates are arranged on the buckling assembly, so that the problems of air flow dispersion and uneven wind field flowing through the heat radiators when the bottom plate of the heat radiator is expanded are solved, and the overall heat radiation efficiency of the heat radiation assembly is further improved.
The invention may be modified in various ways by anyone skilled in the art, without however departing from the scope of protection of the appended claims.
Claims (14)
1. A heat dissipation assembly applied to a chip set comprises:
the radiator comprises a bottom plate and a plurality of radiating bodies, and the plurality of radiating bodies are arranged on the bottom plate at intervals; and
a snap assembly, comprising:
the rectangular frame body comprises two first beam bodies, two second beam bodies, a first surface and a second surface, wherein the two first beam bodies are oppositely arranged, the two second beam bodies are oppositely arranged, the first surface and the second surface are oppositely arranged, and the two first beam bodies and the two second beam bodies are connected to define a hollow area so that the plurality of heat dissipation bodies of the heat dissipation device penetrate through the hollow area;
the first side plates respectively extend out from the first surfaces of the two first beam bodies of the rectangular frame body in a vertical manner, and each first side plate comprises at least one hook, and the hook extends from the first side plate to the direction of the hollow area; and
and the guide plates are respectively arranged on the second surface of the second beam body of the rectangular frame body and vertically extend out of the second surface of the second beam body of the rectangular frame body, and the guide plates are parallel to each heat radiator.
2. The heat dissipating assembly as claimed in claim 1, wherein the plurality of deflectors and the heat sink respectively have a top surface, the shortest distance from the top surface of the deflector to the first surface of the rectangular frame is a first shortest distance, the shortest distance from the top surface of the plurality of heat sinks to the bottom plate is a second shortest distance, and the first shortest distance is greater than or equal to the second shortest distance.
3. The heat dissipating assembly as claimed in claim 1, wherein each of the heat dissipating bodies is a heat dissipating fin of a plate structure, and each of the heat dissipating fins is arranged in parallel with each other on the bottom plate.
4. The heat dissipating assembly as claimed in claim 1, wherein the fastening assembly further comprises a plurality of elastic arms respectively extending from the two second beams toward the hollow region, and each of the elastic arms has a top portion extending from an end of the elastic arm and configured to abut against the bottom plate of the heat sink.
5. The heat sink assembly as claimed in claim 4, wherein the plurality of heat sinks are defined along a first direction to form two first blank regions, the plurality of heat sinks are arranged in n rows along a second direction, and the heat sinks in different rows are spaced from each other and defined to form n-1 second blank regions, so that the plurality of elastic arms are respectively accommodated in the corresponding second blank regions, wherein n is a positive integer greater than or equal to 2, and the first direction is perpendicular to the second direction.
6. The heat dissipating assembly of claim 1, wherein the fastening assembly further comprises a plurality of second side plates extending perpendicularly from the first surfaces of the two second beams, respectively.
7. The heat sink assembly of claim 6, wherein the number of the second side plates is two, and the bottom plate of the heat sink further comprises two installation channels, the two installation channels are located opposite to the two second side plates, such that the two second side plates are respectively disposed through the two installation channels.
8. The heat dissipating assembly of claim 1, wherein each of the baffles has a thickness that tapers in a direction from the second beam toward a top surface of the baffle.
9. The heat removal assembly of claim 1, wherein the plurality of baffles are parallel to each other.
10. The heat dissipating assembly of claim 9, wherein the two second beams are parallel to each other and the plurality of baffles are parallel to the two second beams, respectively.
11. The heat dissipating assembly of claim 1 or 9, wherein each of the second beams forms an acute angle with the flow guiding plate disposed thereon.
12. The heat dissipating assembly of claim 1, wherein each of the heat sinks is a circular heat sink post or an elliptical heat sink post.
13. The heat sink assembly of claim 1, wherein the heat sink further comprises two first blank areas, the two first blank areas divide the plurality of heat sinks into a central area and two extension areas, the central area is located between the two extension areas, the two second beam bodies are respectively accommodated in the two first blank areas, so that the plurality of baffles are respectively accommodated in the two first blank areas.
14. A combined structure of a heat dissipation assembly and a chip set comprises:
a chip set including a chip substrate and a chip; and
a heat dissipation assembly, comprising:
the radiator comprises a bottom plate and a plurality of radiating bodies, and the plurality of radiating bodies are arranged on the bottom plate at intervals; and
a snap assembly, comprising:
the rectangular frame body comprises two first beam bodies, two second beam bodies, a first surface and a second surface, wherein the two first beam bodies are oppositely arranged, the two second beam bodies are oppositely arranged, the first surface and the second surface are oppositely arranged, and the two first beam bodies and the two second beam bodies are connected to define a hollow area so that the plurality of heat dissipation bodies of the heat dissipation device penetrate through the hollow area;
the first side plates respectively extend out from the first surfaces of the two first beam bodies of the rectangular frame body in a vertical manner, and each first side plate comprises at least one hook, and the hook extends from the first side plate to the direction of the hollow area; and
a plurality of flow deflectors respectively arranged on the second surface of the second beam body of the rectangular frame body and vertically extended from the second surface of the second beam body of the rectangular frame body,
wherein the plurality of flow deflectors are parallel to each heat sink;
the at least one clasp of the plurality of first side plates of the buckling component is buckled on at least one edge of a bottom surface of the chip substrate of the chip set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610095255.XA CN107104083B (en) | 2016-02-19 | 2016-02-19 | Fastening assembly with low wind pressure loss, heat radiation assembly and combined structure of heat radiation assembly and chip set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610095255.XA CN107104083B (en) | 2016-02-19 | 2016-02-19 | Fastening assembly with low wind pressure loss, heat radiation assembly and combined structure of heat radiation assembly and chip set |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107104083A CN107104083A (en) | 2017-08-29 |
| CN107104083B true CN107104083B (en) | 2020-01-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610095255.XA Expired - Fee Related CN107104083B (en) | 2016-02-19 | 2016-02-19 | Fastening assembly with low wind pressure loss, heat radiation assembly and combined structure of heat radiation assembly and chip set |
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| Country | Link |
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| CN (1) | CN107104083B (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201115145Y (en) * | 2007-09-03 | 2008-09-10 | 太业科技股份有限公司 | Heat radiation buckle |
| CN101646331B (en) * | 2008-08-08 | 2012-09-19 | 富准精密工业(深圳)有限公司 | Radiating device |
| CN201918381U (en) * | 2011-01-06 | 2011-08-03 | 中山市凯得电器有限公司 | Heat radiating fan seat for semiconductor refrigeration system |
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2016
- 2016-02-19 CN CN201610095255.XA patent/CN107104083B/en not_active Expired - Fee Related
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| CN107104083A (en) | 2017-08-29 |
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