TWM523893U - Assembly structure comprising low wind pressure loss buckling device, heat dissipation assembly and chip set - Google Patents
Assembly structure comprising low wind pressure loss buckling device, heat dissipation assembly and chip set Download PDFInfo
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- 230000017525 heat dissipation Effects 0.000 title claims description 39
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Description
本案係關於一種散熱組件與晶片組之組合結構、散熱組件及其扣合元件，尤指一種可讓通過散熱器之風場更為集中且均勻之扣合元件及其適用之散熱組件及散熱組件與晶片組之組合結構。The present invention relates to a combination structure of a heat dissipating component and a chip set, a heat dissipating component and a fastening component thereof, and more particularly to a fastening component which can make a more concentrated and uniform wind field through a heat sink and a suitable heat dissipating component and a heat dissipating component thereof Combined structure with the chip set.
隨著電子裝置的效能不斷提升，電子裝置內部的晶片組在單位時間內產生的廢熱亦相應地增加，由於晶片組的工作溫度對其工作效率影響甚鉅，因此如何有效率地將晶片組所產生的廢熱帶走，使晶片組的工作溫度維持在理想範圍內是重要的課題。As the performance of electronic devices continues to increase, the waste heat generated by the chipset inside the electronic device increases correspondingly per unit time. Since the operating temperature of the chipset has a great influence on its working efficiency, how to efficiently process the chipset The resulting waste tropics are an important issue in maintaining the operating temperature of the wafer set within a desired range.
習用技藝之散熱方式係將導熱係數高之散熱器貼附於晶片組的表面，並將散熱器直接固定設置於主機板上，以避免散熱器鬆脫並使散熱器緊密地與晶片組接觸，形成具較低熱阻的熱傳路徑，再藉由散熱器之複數個鰭片增加散熱器與空氣接觸之表面積，達到較佳的散熱效率。然而，習用技藝為實現直接將散熱器設置於主機板，散熱器之底座面積必須超出晶片組甚多，以在散熱器之底座上設置固定元件，讓散熱器直接固定設置於主機板。此種作法不僅增加了散熱器的原料成本，更造成設計主機板時必須額外預留散熱器的設置空間，使得採用習用技藝之散熱器之主機板難以朝向輕薄或微型化的設計。The heat dissipation method of the conventional technique is to attach a heat sink with a high thermal conductivity to the surface of the wafer set, and fix the heat sink directly on the motherboard to prevent the heat sink from loosening and the heat sink to closely contact the wafer set. A heat transfer path with a lower thermal resistance is formed, and a plurality of fins of the heat sink are used to increase the surface area of the heat sink in contact with the air to achieve better heat dissipation efficiency. However, in order to realize the direct placement of the heat sink on the motherboard, the base area of the heat sink must exceed the number of the chip set to provide a fixing component on the base of the heat sink, and the heat sink is directly fixed to the motherboard. This method not only increases the raw material cost of the heat sink, but also requires additional space for the heat sink to be reserved when designing the motherboard, making it difficult to adopt a conventional heat sink motherboard to face a thin or miniaturized design.
此外，一些習用技藝係先將散熱器設置於一面積較散熱器底座更大之導熱板上，並將風扇固定於在導熱板上，再將導熱板設置於主機板上，以讓晶片組與導熱板接觸，以求更進一步增加散熱效率。然而，此種作法必須在主機板上預留更多的設置空間，以供導熱板、散熱器及風扇安置。In addition, some conventional techniques are to first place the heat sink on a heat conducting board having a larger area than the heat sink base, and fix the fan on the heat conducting board, and then set the heat conducting board on the motherboard to allow the chip set to The thermal plate is in contact to further increase the heat dissipation efficiency. However, this method must reserve more space on the motherboard for the heat shield, heat sink and fan.
另一方面，當習用技藝之散熱器利用主動散熱裝置，例如風扇，驅動氣流以對散熱器以及晶片組進行散熱時，由於氣流係不定向流動，於氣流流經散熱器之散熱鰭片時，往往會有部分之氣流往散熱器之外側散溢，如此將使氣流分散且風阻不平衡，造成散熱效能無法進一步提升。On the other hand, when the conventional art radiator uses an active heat sink, such as a fan, to drive the airflow to dissipate heat from the heat sink and the wafer set, since the airflow is not directed, when the airflow flows through the heat sink fins of the heat sink, There is often a part of the airflow that overflows to the outside of the heat sink, which will cause the airflow to be dispersed and the wind resistance to be unbalanced, so that the heat dissipation performance cannot be further improved.
有鑑於此，如何發展一種扣合元件、散熱組件及散熱組件與晶片組之組合結構，以解決習用技術的缺失，實為相關技術領域者目前迫切需要解決的課題。In view of this, how to develop a combination structure of a fastening component, a heat dissipating component, and a heat dissipating component and a chip set to solve the lack of conventional technology is an urgent problem to be solved by those skilled in the related art.
本案之目的在於提供一種扣合元件、散熱組件及散熱組件與晶片組之組合結構，藉由在扣合元件之兩相對側設置導流板，使通過散熱組件之氣流往散熱組件之散熱體集中，避免氣流往散熱組件外側散逸，以提升散熱組件整體的散熱效率。The purpose of the present invention is to provide a combination structure of a fastening component, a heat dissipating component, and a heat dissipating component and a chip set. By providing a baffle on opposite sides of the fastening component, the airflow passing through the heat dissipating component is concentrated toward the heat dissipating component of the heat dissipating component. The airflow is prevented from dissipating to the outside of the heat dissipation component to improve the heat dissipation efficiency of the heat dissipation component as a whole.
本案之另一目的在於提供一種扣合元件、散熱組件及散熱器與晶片組之組合結構，藉由將導流板與扣合元件一體成形的設計，不僅節省原料成本，更無須在主機板預留固定元件或風扇的設置空間，達到降低製造成本與主機板及散熱器之薄型化或微型化之優點。Another object of the present invention is to provide a fastening component, a heat dissipating component, and a combination structure of a heat sink and a chip set. By designing the baffle and the fastening component integrally, the material cost can be saved, and the main board is not required to be pre-prepared. The installation space of the fixing component or the fan is left to reduce the manufacturing cost and the thinning or miniaturization of the motherboard and the heat sink.
本案之又一目的在於提供一種扣合元件、散熱組件及散熱組件與晶片組之組合結構，藉由擴增散熱器之底板大小，增加散熱體的設置數量，並透過設置在扣合元件上之導流板，以解決擴增散熱器之底板時發生流經散熱體之氣流分散且風場不均勻之問題，並進一步地提升散熱組件整體的散熱效率。Another object of the present invention is to provide a combination structure of a fastening component, a heat dissipating component, and a heat dissipating component and a chip set. By amplifying the size of the bottom plate of the heat sink, the number of the heat dissipating body is increased, and the device is disposed on the fastening component. The deflector solves the problem that the airflow flowing through the heat sink is dispersed and the wind field is uneven when the bottom plate of the heat sink is amplified, and the heat dissipation efficiency of the heat dissipation component as a whole is further improved.
根據本案之構想，本案之一較廣實施態樣為提供一種扣合元件，包括矩形框體、複數個第一側板及複數個導流板。矩形框體包括二個第一樑體、二個第二樑體、第一表面及第二表面。二個第一樑體相對設置，二個第二樑體相對設置，第一表面與第二表面相對設置，且二個第一樑體與二個第二樑體連接定義形成中空區域。複數個第一側板分別由矩形框體之二個第一樑體之第一表面垂直延伸而出，複數個第一側板包括至少一扣鉤，扣鉤由第一側板往中空區域之方向延伸。複數個導流板分別由矩形框體之第二樑體之第二表面垂直延伸而出。According to the concept of the present invention, a wider embodiment of the present invention provides a fastening component, which comprises a rectangular frame body, a plurality of first side plates and a plurality of baffles. The rectangular frame body comprises two first beam bodies, two second beam bodies, a first surface and a second surface. The two first beam bodies are oppositely disposed, the two second beam bodies are oppositely disposed, the first surface is opposite to the second surface, and the connection between the two first beam bodies and the two second beam bodies defines a hollow region. The plurality of first side plates respectively extend perpendicularly from the first surface of the two first beam bodies of the rectangular frame body, and the plurality of first side plates comprise at least one hook extending from the first side plate toward the hollow region. A plurality of baffles are respectively extended perpendicularly from a second surface of the second beam of the rectangular frame.
根據本案之構想，另一較廣實施態樣為提供一種散熱組件，包括散熱器以及扣合元件。散熱器包括底板及複數個散熱體，複數個散熱體係相互間隔設置於底板。扣合元件包括矩形框體、複數個第一側板及複數個導流板。矩形框體包括二個第一樑體、二個第二樑體、第一表面及第二表面。二個第一樑體相對設置，二個第二樑體相對設置，第一表面與第二表面相對設置，且二個第一樑體與第二樑體連接定義形成中空區域，使散熱器之複數個散熱體穿設於中空區域。複數個第一側板分別由矩形框體之二個第一樑體之第一表面垂直延伸而出，且複數個第一側板包括至少一扣鉤，扣鉤由第一側板往中空區域之方向延伸。複數個導流板分別由矩形框體之第二樑體之第二表面延伸而出。According to the concept of the present invention, another broad aspect of the invention provides a heat dissipating component including a heat sink and a snap element. The heat sink includes a bottom plate and a plurality of heat sinks, and the plurality of heat dissipation systems are spaced apart from each other on the bottom plate. The fastening component comprises a rectangular frame, a plurality of first side plates and a plurality of baffles. The rectangular frame body comprises two first beam bodies, two second beam bodies, a first surface and a second surface. The two first beam bodies are oppositely disposed, the two second beam bodies are oppositely disposed, the first surface is opposite to the second surface, and the two first beam bodies are connected with the second beam body to define a hollow region, so that the heat sink is A plurality of heat sinks are disposed in the hollow region. The plurality of first side plates respectively extend perpendicularly from the first surface of the two first beam bodies of the rectangular frame body, and the plurality of first side plates comprise at least one hook, and the hooks extend from the first side plate toward the hollow region . A plurality of baffles are respectively extended from the second surface of the second beam of the rectangular frame.
根據本案之構想，本案之又一較廣實施態樣為提供一種散熱組件與晶片組之組合結構，包括晶片組及散熱組件。晶片組包括晶片基板及晶片。散熱組件包括散熱器及扣合元件。散熱器包括底板及複數個散熱體，複數個散熱體係相互間隔設置於底板。扣合元件包括矩形框體、複數個第一側板及複數個導流板。矩形框體包括二個第一樑體、二個第二樑體、第一表面及第二表面。二個第一樑體相對設置，二個第二樑體相對設置，第一表面與第二表面相對設置，且二個第一樑體與二個第二樑體連接定義形成中空區域，使散熱器之複數個散熱體穿設於中空區域。複數個第一側板分別由矩形框體之二個第一樑體之第一表面垂直延伸而出，且複數個第一側板包括至少一扣鉤，扣鉤由第一側板往中空區域之方向延伸。複數個導流板分別由矩形框體之第二樑體之第二表面垂直延伸而出。其中，扣合元件之複數個第一側板之至少一扣鉤係扣合於晶片組之晶片基板之底面之至少一邊緣。According to the concept of the present invention, another broad aspect of the present invention provides a combination structure of a heat dissipating component and a chip set, including a chip set and a heat dissipating component. The wafer set includes a wafer substrate and a wafer. The heat dissipating component includes a heat sink and a fastening component. The heat sink includes a bottom plate and a plurality of heat sinks, and the plurality of heat dissipation systems are spaced apart from each other on the bottom plate. The fastening component comprises a rectangular frame, a plurality of first side plates and a plurality of baffles. The rectangular frame body comprises two first beam bodies, two second beam bodies, a first surface and a second surface. The two first beam bodies are oppositely disposed, the two second beam bodies are oppositely disposed, the first surface is opposite to the second surface, and the two first beam bodies are connected with the two second beam bodies to define a hollow region for heat dissipation. A plurality of heat sinks are disposed in the hollow region. The plurality of first side plates respectively extend perpendicularly from the first surface of the two first beam bodies of the rectangular frame body, and the plurality of first side plates comprise at least one hook, and the hooks extend from the first side plate toward the hollow region . A plurality of baffles are respectively extended perpendicularly from a second surface of the second beam of the rectangular frame. The at least one hook of the plurality of first side plates of the fastening component is fastened to at least one edge of the bottom surface of the wafer substrate of the chip set.
體現本案特徵與優點的一些典型實施例將在後段的說明中詳細敘述。應理解的是本案能夠在不同的態樣上具有各種的變化，其皆不脫離本案的範圍，且其中的說明及圖式在本質上係當作說明之用，而非架構於限制本案。Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in various aspects, and is not intended to limit the scope of the invention.
請參閱第1圖，第1圖係為本案第一實施例之散熱組件與晶片組之組合結構示意圖。如圖所示，散熱組件與晶片組之組合結構1包括散熱組件2與晶片組3。散熱組件2包括散熱器21以及扣合元件22，晶片組3包括晶片基板31及晶片32，晶片32係設置於晶片基板31上，其中晶片32係為板狀發熱體。實際應用時係將散熱組件2設置於晶片組3上，藉由散熱組件2之扣合元件22作為限位元件，使散熱器21與晶片組2相貼合並避免散熱器21與晶片組3之間鬆脫，以藉由散熱器21增加氣流與高溫物體接觸之表面積，俾達到提升散熱效率的效果。Please refer to FIG. 1 , which is a schematic diagram of a combined structure of a heat dissipating component and a chip set according to a first embodiment of the present invention. As shown, the combined structure 1 of the heat dissipating component and the wafer set includes the heat dissipating component 2 and the wafer set 3. The heat dissipating component 2 includes a heat sink 21 and a fastening component 22, the wafer set 3 includes a wafer substrate 31 and a wafer 32, and the wafer 32 is disposed on the wafer substrate 31, wherein the wafer 32 is a plate-shaped heating element. In the actual application, the heat dissipating component 2 is disposed on the chip set 3, and the fastening component 22 of the heat dissipating component 2 is used as a limiting component, so that the heat sink 21 and the chip set 2 are attached to each other to avoid the heat sink 21 and the chip set 3. The air is loosened to increase the surface area of the airflow in contact with the high temperature object by the heat sink 21, thereby achieving the effect of improving the heat dissipation efficiency.
請參閱第2圖、第3A圖及第3B圖，其中第2圖係為本案第一實施例之散熱組件之結構分解圖；第3A圖係為第2圖所示之扣合元件之示意圖；以及第3B圖係為第2圖所示之散熱器之示意圖。散熱器21包括底板211及複數個散熱體212。於本實施例中，複數個散熱體212係為板體結構之散熱鰭片，且複數個散熱體212平行排列於底板211之上表面2110，亦即複數個散熱體212係沿第一方向D1線性排列，並沿第二方向D2間隔排列，且第一方向D1垂直於第二方向D2，然不以此為限，散熱體212之形狀係可依實際應用需求而變化，例如圓柱體之散熱柱、橢圓柱體之散熱柱或其他具弧面之柱體之散熱柱。Please refer to FIG. 2, FIG. 3A and FIG. 3B , wherein FIG. 2 is a structural exploded view of the heat dissipating component of the first embodiment of the present invention; FIG. 3A is a schematic view of the fastening component shown in FIG. 2 ; And Fig. 3B is a schematic view of the heat sink shown in Fig. 2. The heat sink 21 includes a bottom plate 211 and a plurality of heat sinks 212. In this embodiment, the plurality of heat sinks 212 are heat dissipation fins of the board structure, and the plurality of heat sinks 212 are arranged in parallel on the upper surface 2110 of the bottom plate 211, that is, the plurality of heat sinks 212 are along the first direction D1. The linear arrangement is arranged in the second direction D2, and the first direction D1 is perpendicular to the second direction D2. However, the shape of the heat sink 212 can be changed according to actual application requirements, for example, the heat dissipation of the cylinder. Column, elliptical cylinder heat sink or other heat sink with curved face.
請再參閱第2圖及第3A圖，扣合元件22包括矩形框體221、複數個第一側板222及複數個導流板223。矩形框體221包括二個第一樑體2211、二個第二樑體2212、第一表面2213及第二表面2214。二個第一樑體2211係相對設置，二個第二樑體2212係相對設置，第一表面2213與第二表面2214相對設置。矩形框體221之二個第一樑體2211與二個第二樑體2212係彼此連接定義形成中空區域E以及相對設置之第一表面2213與第二表面2214。於本實施例中，二個第一樑體2211與二個第二樑體2212係一體成形，二個第一樑體2211係彼此平行，且二個第二樑體2212係彼此平行，然並不以此為限，矩形框體221之形狀係可配合散熱器21之散熱體212之實際排列型態進行變化。Referring to FIG. 2 and FIG. 3A again, the fastening component 22 includes a rectangular frame body 221 , a plurality of first side plates 222 , and a plurality of baffles 223 . The rectangular frame body 221 includes two first beam bodies 2211, two second beam bodies 2212, a first surface 2213, and a second surface 2214. The two first beam bodies 2211 are oppositely disposed, and the two second beam bodies 2212 are oppositely disposed. The first surface 2213 is disposed opposite to the second surface 2214. The two first beam bodies 2211 and the two second beam bodies 2212 of the rectangular frame body 221 are connected to each other to define a hollow area E and oppositely disposed first surface 2213 and second surface 2214. In this embodiment, the two first beam bodies 2211 and the two second beam bodies 2212 are integrally formed, the two first beam bodies 2211 are parallel to each other, and the two second beam bodies 2212 are parallel to each other, and Without limitation, the shape of the rectangular frame 221 can be changed in accordance with the actual arrangement of the heat sink 212 of the heat sink 21.
扣合元件22之複數個第一側板222分別由矩形框體221之二個第一樑體2211之第一表面2213垂直延伸而出。複數個第一側板222包括至少一扣鉤2221，換言之，每一個第一側板222包括至少一個扣鉤2221，或者部分之第一側板222包括至少一個扣鉤2221，部分之第一側板222並未包括任何扣鉤。扣鉤2221由第一側板222之內表面2222往中空區域E之方向延伸。於本實施例中，第一側板222之數量係為二個，分別設置於相對之第一樑體2211，且每一個第一側板222具有二個扣鉤2221，但不以此為限。於一些實施例中，第一側板222之數量係為四個，且每一個第一樑體2211設置兩個第一側板222，其中每一個第一側板222具有一個扣鉤2221。The plurality of first side plates 222 of the fastening elements 22 are vertically extended by the first surfaces 2213 of the two first beam bodies 2211 of the rectangular frame body 221, respectively. The plurality of first side plates 222 include at least one hook 2221. In other words, each of the first side plates 222 includes at least one hook 2221, or a portion of the first side plate 222 includes at least one hook 2221, and the portion of the first side plate 222 does not. Includes any clasps. The clasp 2221 extends from the inner surface 2222 of the first side plate 222 toward the hollow region E. In this embodiment, the number of the first side plates 222 is two, which are respectively disposed on the opposite first beam bodies 2211, and each of the first side plates 222 has two hooks 2221, but is not limited thereto. In some embodiments, the number of the first side panels 222 is four, and each of the first beam bodies 2211 is provided with two first side panels 222, wherein each of the first side panels 222 has a hook 2221.
請再參閱第1圖及第2圖，當散熱組件2設置於晶片組3上時，第一樑體2211係大致平行設置於第二方向D2，並藉由第一側板222與散熱器21之底板211及晶片組3之晶片基板31相配合，以限制散熱器21沿第一方向D1或第一方向之相反方向之位移。相似地，當散熱組件2設置於晶片組3上時，扣合元件22之第一表面2213係至少部分地抵頂於散熱器21之底板211之上表面2110，扣合元件22之複數個第一側板222之至少一扣鉤2221係扣合於晶片組3之晶片基板31之一底面310之至少一邊緣310a，以藉由扣合元件22將散熱器21之底板211及晶片組3限制於矩形框體221與複數個第一側板222之間，避免散熱器21與晶片組3分離。Referring to FIG. 1 and FIG. 2 again, when the heat dissipating component 2 is disposed on the chip set 3, the first beam body 2211 is disposed substantially in parallel in the second direction D2, and is supported by the first side plate 222 and the heat sink 21. The bottom plate 211 and the wafer substrate 31 of the wafer set 3 are fitted to limit the displacement of the heat sink 21 in the first direction D1 or in the opposite direction of the first direction. Similarly, when the heat dissipating component 2 is disposed on the wafer set 3, the first surface 2213 of the fastening component 22 at least partially abuts against the upper surface 2110 of the bottom plate 211 of the heat sink 21, and the plurality of the fastening components 22 At least one hook 2221 of the one side plate 222 is fastened to at least one edge 310a of one of the bottom surfaces 310 of the wafer substrate 31 of the chip set 3 to limit the bottom plate 211 and the chip set 3 of the heat sink 21 to the wafer set 3 by the fastening component 22 Between the rectangular frame 221 and the plurality of first side plates 222, the heat sink 21 is prevented from being separated from the wafer set 3.
請再參閱第2圖、第3A圖及第3B圖，複數個散熱體212沿第二方向D2定義形成二個第一空白區域A1(first dummy area)，且二個第一空白區域A1將複數個散熱體212劃分為一個中央區域C1及兩個延伸區域C2，其中該中央區域C1係位於兩個延伸區域C2之間，即二個第一空白區域A1之間係包括複數個散熱體212，但不以此為限。於本實施例中，二個第一空白區域A1之間的最短距離係小於或等於扣合元件22之第一樑體2211之長度。藉此，當扣合元件22與散熱器21組合為散熱組件2，或更進一步將散熱組件2設置於晶片組3上時，使扣合元件22之二個第二樑體2212分別容設於二個第一空白區域A1。此外，兩個導流板223亦分別位於二個第一空白區域A1，藉此當利用主動散熱裝置，例如風扇，驅動氣流沿第一方向D1或第一方向D1之相反方向對散熱器21以及晶片組3進行散熱時，可利用二個導流板223平衡通過散熱器21各個位置之氣流的流量，以避免二個第一空白區域A1影響通過散熱器21之風場的均勻度，且利用二個導流板223集中導送氣流，使氣流集中並均勻地通過熱源上方之散熱體212。Referring to FIG. 2, FIG. 3A and FIG. 3B, the plurality of heat sinks 212 define two first blank areas A1 along the second direction D2, and the two first blank areas A1 will be plural. The heat dissipating body 212 is divided into a central area C1 and two extended areas C2, wherein the central area C1 is located between the two extended areas C2, that is, the plurality of first heat-dissipating bodies 212 are included between the two first blank areas A1. But not limited to this. In this embodiment, the shortest distance between the two first blank areas A1 is less than or equal to the length of the first beam body 2211 of the fastening component 22. Thereby, when the fastening component 22 and the heat sink 21 are combined into the heat dissipation component 2, or the heat dissipation component 2 is further disposed on the wafer set 3, the two second beam bodies 2212 of the fastening component 22 are respectively accommodated in Two first blank areas A1. In addition, the two baffles 223 are also respectively located in the two first blank areas A1, thereby driving the airflow to the heat sink 21 in the opposite direction of the first direction D1 or the first direction D1 by using an active heat sink, such as a fan. When the chip set 3 performs heat dissipation, the flow of the airflow passing through the respective positions of the heat sink 21 can be balanced by the two baffles 223 to prevent the two first blank areas A1 from affecting the uniformity of the wind field passing through the heat sink 21, and utilizing The two baffles 223 collectively direct the airflow to concentrate and uniformly pass the heat sink 212 above the heat source.
再如第2圖、第3A圖及第3B圖所示，於本實施例中，扣合元件22除第一側板222以外更包括複數個第二側板224，分別由矩形框體221之第二樑體2212之第一表面2213垂直延伸而出，以作為限位元件，俾限制散熱器21與晶片組3沿第二方向D2上位移，但不以此為限。第二側板224之數量較佳為二個，且散熱器21之底板211包括二個設置通道2111，二個設置通道2111係位於散熱器之第一空白區域A1內，且二個設置通道2111之位置係分別相對於矩形框體221之二個第二側板224設置，使二個第二側板224分別穿設於二個設置通道2111，以藉由第二側板224與設置通道2111的配合限制扣合元件22於第二方向D2上之位置，除可避免扣合元件22貼合於散熱體212，減少扣合元件22遮蔽散熱體212之表面積，更可藉由第二側板224抵頂於晶片組3(如第1圖所示)之晶片基板31，避免扣合元件22沿第二方向D2滑動。As shown in FIG. 2, FIG. 3A, and FIG. 3B, in the embodiment, the fastening component 22 includes a plurality of second side plates 224 in addition to the first side plate 222, and is respectively formed by the second frame 221. The first surface 2213 of the beam body 2212 extends vertically to serve as a limiting member for limiting the displacement of the heat sink 21 and the wafer group 3 in the second direction D2, but is not limited thereto. The number of the second side plates 224 is preferably two, and the bottom plate 211 of the heat sink 21 includes two setting channels 2111. The two setting channels 2111 are located in the first blank area A1 of the heat sink, and the two setting channels 2111 The two second side plates 224 are respectively disposed on the two second side plates 224, so that the two second side plates 224 are respectively disposed in the two setting channels 2111, so as to be restrained by the cooperation of the second side plate 224 and the setting channel 2111. The position of the component 22 in the second direction D2 can prevent the fastening component 22 from being attached to the heat sink 212, reduce the surface area of the fastening component 22 to shield the heat sink 212, and can be placed on the wafer by the second side plate 224. The wafer substrate 31 of the group 3 (as shown in Fig. 1) prevents the fastening member 22 from sliding in the second direction D2.
請再參閱第2圖並配合第3A圖及第3B圖，扣合元件22更包括複數個彈性臂225，複數個彈性臂225分別由二個第二樑體2212往中空區域E之方向延伸而出，且每一彈性臂225具有一抵頂部2251，抵頂部2251由彈性臂225之末端延伸而出，以當散熱組件2設置於晶片組3上時，藉由抵頂部2251抵頂散熱器21之底板211，使散熱器21之底板211之下表面2112更緊密地貼合於晶片組3，俾提升熱傳導效率。於本實施例中，複數個散熱體212係沿第二方向D2間隔排列為m列，複數個散熱體212係沿第一方向D1間隔排列為n行，且不同行之散熱體212係相互間隔設置並定義形成n-1個第二空白區域A2(second dummy area)，其中，m係為大於或等於3之正整數，n係為大於或等於2之正整數，但不以此為限。當扣合元件22與散熱器11組合為散熱組件2，或更進一步將散熱組件2設置於晶片組3上時，n-1個第二空白區域A2可使複數個彈性臂225分別容置於對應之第二空白區域A2。Referring to FIG. 2 again, in conjunction with FIGS. 3A and 3B, the fastening component 22 further includes a plurality of elastic arms 225 extending from the two second beam bodies 2212 toward the hollow region E. And each resilient arm 225 has an abutting top portion 2251 extending from the end of the resilient arm 225 to abut the top surface of the heat sink 21 when the heat dissipating component 2 is disposed on the wafer stack 3 The bottom plate 211 is such that the lower surface 2112 of the bottom plate 211 of the heat sink 21 is more closely attached to the wafer group 3, thereby improving heat transfer efficiency. In this embodiment, the plurality of heat sinks 212 are arranged in the second direction D2 at intervals of m columns, and the plurality of heat sinks 212 are arranged in the first direction D1 at intervals of n rows, and the heat sinks 212 of different rows are spaced apart from each other. The n-1 second dummy area is set and defined, wherein m is a positive integer greater than or equal to 3, and n is a positive integer greater than or equal to 2, but is not limited thereto. When the fastening component 22 and the heat sink 11 are combined into the heat dissipation component 2, or the heat dissipation component 2 is further disposed on the wafer set 3, the n-1 second blank areas A2 can accommodate the plurality of elastic arms 225 respectively. Corresponding to the second blank area A2.
請參閱第4圖，第4圖係為本案第二實施例之散熱組件之結構分解圖。於本實施例中，散熱組件2之結構與第2圖所示散熱組件2之結構相似，且相同元件標號代表相同之元件結構與功能，於此不再贅述。不同於第2圖所示之散熱組件2，本實施例之扣合元件22僅包括矩形框體221、二個第一側板222及二個導流板223，且散熱器21之複數個散熱體212的形態不同。當扣合元件22與散熱器21組合為散熱組件2，或更進一步將散熱組件2設置於晶片組3上時，扣合元件22之二個第二樑體2212係分別設置於散熱器21之二個第一空白區域A1，使二個第二樑體2212分別位於複數個散熱體212之間，以藉由與第二樑體2212相鄰之複數個散熱體212與第二樑體2212相配合，限制扣合元件22於第二方向D2之位置。此外，於本實施例中，散熱器21係沿第二方向D2間隔排列為m列，但每一列散熱體212僅具單一之板狀散熱鰭片212，即每一列散熱體212係沿平行於第一方向D1之方向延伸，藉此以增加氣流與高溫物體接觸之表面積。於一些實施例中，散熱器21之形態不以第4圖所示之實施例為限，其亦可依實際應用需求使用如第2圖所示之散熱器21。Please refer to FIG. 4, which is a structural exploded view of the heat dissipating component of the second embodiment of the present invention. In the present embodiment, the structure of the heat dissipating component 2 is similar to that of the heat dissipating component 2 shown in FIG. 2, and the same component numbers represent the same component structure and function, and details are not described herein. Different from the heat dissipating component 2 shown in FIG. 2, the fastening component 22 of the embodiment includes only the rectangular frame body 221, the two first side plates 222 and the two baffles 223, and the plurality of heat sinks of the heat sink 21 The shape of 212 is different. When the fastening component 22 and the heat sink 21 are combined into the heat dissipation component 2, or the heat dissipation component 2 is further disposed on the wafer set 3, the two second beam bodies 2212 of the fastening component 22 are respectively disposed on the heat sink 21. The two first blank regions A1 are disposed between the plurality of heat radiating bodies 212 respectively to form a plurality of heat radiating bodies 212 adjacent to the second beam body 2212 and the second beam body 2212. In cooperation, the position of the fastening element 22 in the second direction D2 is limited. In addition, in this embodiment, the heat sinks 21 are arranged in the second direction D2 at intervals of m columns, but each row of heat sinks 212 has only a single plate-shaped heat sink fin 212, that is, each column of heat sinks 212 is parallel to The direction of the first direction D1 extends, thereby increasing the surface area of the gas stream in contact with the hot object. In some embodiments, the shape of the heat sink 21 is not limited to the embodiment shown in FIG. 4, and the heat sink 21 as shown in FIG. 2 can also be used according to actual application requirements.
請參閱第5圖並參酌第2、3A及3B圖，其中第5圖係為第2圖所示之扣合元件之一變化例之示意圖。於本實施例中，扣合元件22包括複數個導流板223，例如但不限於八個導流板223，該複數個導流板223係分別由矩形框體221之第二樑體2212之第二表面2214垂直延伸而出。詳言之，四個導流板223係設置於其中一個第二樑體2212之第二表面2214上，其餘四個導流板223係設置於另一個第二樑體2212之第二表面2214上，其中設置於同一個第二樑體2212之四個導流板223係彼此間隔設置。當扣合元件22與散熱器11組合為散熱組件2，或更進一步將散熱組件2與晶片組3組裝為組合結構時，第二樑體2212係容置於第一空白區域A1，且導流板223係由第二樑體2212之第二表面2214延伸而出，並且導流板223與散熱器21之散熱體212係沿第二方向D2間隔排列。由於第一實施例所示之散熱器21具有二個第一空白區域A1、中央區域C1及二個延伸區域C2，且扣合元件22之複數個導流板223係容置於第一空白區域A1中，因此藉由複數個導流板223之設置可增加散熱器21於第一空白區域A1之風阻，避免較大之氣流分量往第一空白區域A1通過而分散流向中央區域C1之氣流分量，俾使散熱組件2整體之風阻較為平均，而可有效地提升散熱組件2之散熱效率。此外，藉由散熱器21之延伸區域C2更可增加散熱表面積，使本案之散熱組件2可達到大幅提升散熱效率之功效。應強調的是，導流板223之數量並不以八個為限，其數量可依實際應用需求任施變化。Please refer to Fig. 5 and refer to Figures 2, 3A and 3B, wherein Fig. 5 is a schematic view showing a variation of one of the fastening elements shown in Fig. 2. In this embodiment, the fastening component 22 includes a plurality of baffles 223, such as but not limited to eight baffles 223, which are respectively formed by the second beam 2212 of the rectangular frame 221 The second surface 2214 extends vertically. In detail, four baffles 223 are disposed on the second surface 2214 of one of the second beam bodies 2212, and the remaining four baffles 223 are disposed on the second surface 2214 of the other second beam body 2212. The four baffles 223 disposed in the same second beam body 2212 are spaced apart from each other. When the fastening component 22 and the heat sink 11 are combined into the heat dissipation component 2, or the heat dissipation component 2 and the wafer assembly 3 are further assembled into a combined structure, the second beam body 2212 is accommodated in the first blank area A1, and the flow is guided. The plate 223 extends from the second surface 2214 of the second beam 2212, and the deflector 223 and the heat sink 212 of the heat sink 21 are spaced apart in the second direction D2. The heat sink 21 shown in the first embodiment has two first blank areas A1, a central area C1 and two extended areas C2, and the plurality of baffles 223 of the fastening elements 22 are placed in the first blank area. In A1, the wind resistance of the heat sink 21 in the first blank area A1 can be increased by the arrangement of the plurality of baffles 223, and the airflow component of the large airflow component passing through the first blank area A1 is dispersed to the central area C1. Therefore, the overall wind resistance of the heat dissipating component 2 is relatively average, and the heat dissipation efficiency of the heat dissipating component 2 can be effectively improved. In addition, the heat dissipating surface area can be increased by the extended area C2 of the heat sink 21, so that the heat dissipating component 2 of the present invention can achieve the effect of greatly improving the heat dissipating efficiency. It should be emphasized that the number of the baffles 223 is not limited to eight, and the number thereof may be changed according to actual application requirements.
於一些實施例中，每一個導流板223沿第二樑體2212往其頂面2231之方向具有厚度變化，其中導流板223之厚度以沿第二樑體2212往其頂面2231之方向漸薄為較佳，藉此，使導流板223滿足輕薄化設計並可兼具良好的機械性質。於一些實施例中，位於同一個第二樑體2212上之複數個導流板223係線性排列，位於不同第二樑體2212上之複數個導流板223係互相平行，且每一個導流板223係平行於二個第二樑體2212，以形成較均勻之風阻，但不以此為限。In some embodiments, each of the baffles 223 has a thickness variation along the second beam 2212 toward the top surface 2231 thereof, wherein the thickness of the baffle 223 is along the second beam 2212 toward the top surface 2231 thereof. The thinning is preferable, whereby the deflector 223 is designed to be light and thin and can have both good mechanical properties. In some embodiments, the plurality of baffles 223 on the same second beam 2212 are linearly arranged, and the plurality of baffles 223 located on the different second beams 2212 are parallel to each other, and each of the diversions The plate 223 is parallel to the two second beam bodies 2212 to form a relatively uniform wind resistance, but is not limited thereto.
請參閱第6及7圖並參酌第2、3A及3B圖，其中第6圖係為第2圖所示之扣合元件之另一變化例之示意圖；以及第7圖係為第2圖所示之扣合元件之又一變化例之示意圖。如第6圖所示，於本實施例中，扣合元件22之結構與第5圖所示之扣合元件22之結構相似，且相同之元件標號代表相同之元件結構與功能，於此不再贅述。不同於第5圖所示之扣合元件22，本實施例之扣合元件22之複數個導流板223係以不同方式排列，其中位於同一第二樑體2212之四個導流板223係相互平行，位於不同第二樑體2212之八個導流板223係相互平行，且第二樑體2212係與設置於其上之導流板223呈一銳角θ，其中該銳角θ之角度係大於0度且小於或等於5度，但不以此為限。於再一變化實施例中(未圖示)，位於不同第二樑體2212之八個導流板223係相互不平行且第二樑體2212係與設置於其上之導流板223呈一銳角θ，其中該銳角θ之角度係分別大於0度且小於或等於5度。如第7圖所示，於本實施例中，位於同一第二樑體2212之四個導流板223係分別與該第二樑體2212呈不同角度之銳角θ1、θ2，其中銳角θ1及θ2之角度皆大於0度且小於或等於5度，但不以此為限。藉此，可利用扣合元件22之複數個導流板223以調整流經散熱組件2之風場分布，且可依據實際應用需求而調整與變化。Please refer to Figures 6 and 7 and refer to Figures 2, 3A and 3B, wherein Figure 6 is a schematic view of another variation of the fastening element shown in Figure 2; and Figure 7 is the second Figure. A schematic diagram of yet another variation of the snap element shown. As shown in FIG. 6, in the present embodiment, the structure of the fastening component 22 is similar to that of the fastening component 22 shown in FIG. 5, and the same component numbers represent the same component structure and function. Let me repeat. Different from the fastening component 22 shown in FIG. 5, the plurality of baffles 223 of the fastening component 22 of the present embodiment are arranged in different manners, wherein the four deflectors 223 of the same second beam body 2212 are Parallel to each other, the eight baffles 223 located in different second beam bodies 2212 are parallel to each other, and the second beam body 2212 is at an acute angle θ with the deflector 223 disposed thereon, wherein the angle of the acute angle θ is More than 0 degrees and less than or equal to 5 degrees, but not limited to this. In still another variation (not shown), the eight baffles 223 located in different second beam bodies 2212 are not parallel to each other and the second beam 2212 is attached to the deflector 223 disposed thereon. An acute angle θ, wherein the angle of the acute angle θ is greater than 0 degrees and less than or equal to 5 degrees, respectively. As shown in FIG. 7, in the present embodiment, the four deflectors 223 located in the same second beam body 2212 are respectively at an acute angle θ1, θ2 different from the second beam 2212, wherein the acute angles θ1 and θ2 The angles are all greater than 0 degrees and less than or equal to 5 degrees, but are not limited thereto. Thereby, a plurality of baffles 223 of the fastening component 22 can be utilized to adjust the wind field distribution flowing through the heat dissipation component 2, and can be adjusted and changed according to actual application requirements.
於又一些實施例中，如第2圖所示，導流板223具有一頂面2231，散熱體212具有一頂面2121，每一個導流板223之頂面2231至矩形框體221之第一表面2213之最短距離為第一最短距離，複數個散熱體212之頂面2121至底板211之上表面2210之最短距離為第二最短距離，較佳為第一最短距離大於或等於第二最短距離，以讓流經散熱組件2之風場較均勻。In still another embodiment, as shown in FIG. 2, the deflector 223 has a top surface 2231, and the heat sink 212 has a top surface 2121, and a top surface 2231 of each of the deflectors 223 to a rectangular frame 221 The shortest distance of a surface 2213 is the first shortest distance, and the shortest distance between the top surface 2121. of the plurality of heat sinks 212 and the upper surface 2210 of the bottom plate 211 is the second shortest distance, preferably the first shortest distance is greater than or equal to the second shortest distance. The distance is such that the wind field flowing through the heat dissipating component 2 is relatively uniform.
請參閱第8圖、第9圖及第10圖，第8圖係為本案第三實施例之散熱組件之結構示意圖；第9圖係為本案第四實施例之散熱組件之結構示意圖；以及第10圖係為本案第五實施例之散熱組件之結構示意圖。於第三實施例、第四實施例及第五實施例中，散熱組件2之結構與第2圖所示散熱組件2之結構以及第5圖所示之扣合元件22相似，且相同元件標號代表相同之元件結構與功能，於此不再贅述，惟第三實施例、第四實施例及第五實施例所示之複數個散熱體212皆穿設於扣合元件22之中空區域E，且複數個散熱體212係彼此間隔設置，即散熱器21並未包括二個第一空白區域A1或延伸區域C2。於第三實施例中，複數個散熱體212係與第4圖所示之散熱器21相似，即沿第一方向D1上之每一列散熱體212僅具單一之板狀散熱鰭片212，但不以此為限。於第四實施例中，複數個散熱體212亦為板狀之散熱鰭片212，且沿第一方向D1上之每一列散熱體212包括複數個線性排列的散熱體212，然不以此為限。於第五實施例中，每一個散熱體212皆為圓柱體之散熱柱212，亦不以此為限。此外，第三實施例、第四實施例及第五實施例所示之扣合元件22並不局限於第5圖所示之實施態樣，亦可依第6圖、第7圖或前述其他變化實施態樣進行替換，且第三實施例、第四實施例及第五實施例所示之散熱組件2可藉由扣合元件22之複數個導流板223使通過散熱組件2之氣流往散熱組件2之熱源集中，避免氣流往散熱組件2外側散逸。Please refer to FIG. 8 , FIG. 9 and FIG. 10 , FIG. 8 is a schematic structural view of a heat dissipating component according to a third embodiment of the present invention; FIG. 9 is a schematic structural view of a heat dissipating component according to a fourth embodiment of the present invention; 10 is a schematic structural view of a heat dissipating component of a fifth embodiment of the present invention. In the third embodiment, the fourth embodiment, and the fifth embodiment, the structure of the heat dissipating component 2 is similar to the structure of the heat dissipating component 2 shown in FIG. 2 and the fastening component 22 shown in FIG. 5, and the same component numbering The same components and functions are not described here, but the plurality of heat sinks 212 shown in the third embodiment, the fourth embodiment, and the fifth embodiment are disposed in the hollow region E of the fastening component 22, The plurality of heat sinks 212 are spaced apart from each other, that is, the heat sink 21 does not include two first blank areas A1 or extension areas C2. In the third embodiment, the plurality of heat sinks 212 are similar to the heat sink 21 shown in FIG. 4, that is, each row of heat sinks 212 in the first direction D1 has only a single plate-shaped heat sink fin 212, but Not limited to this. In the fourth embodiment, the plurality of heat sinks 212 are also plate-shaped heat sink fins 212, and each of the heat sinks 212 in the first direction D1 includes a plurality of linear heat sinks 212. limit. In the fifth embodiment, each of the heat dissipating bodies 212 is a cylindrical heat dissipating post 212, and is not limited thereto. In addition, the fastening elements 22 shown in the third embodiment, the fourth embodiment, and the fifth embodiment are not limited to the embodiment shown in FIG. 5, and may be according to FIG. 6, FIG. 7, or the other The heat dissipation component 2 shown in the third embodiment, the fourth embodiment, and the fifth embodiment can pass the airflow through the heat dissipation component 2 through the plurality of baffles 223 of the fastening component 22 The heat source of the heat dissipating component 2 is concentrated to prevent airflow from dissipating to the outside of the heat dissipating component 2.
綜上所述，本案之扣合元件、散熱組件及散熱組件與晶片組之組合結構藉由在扣合元件之兩相對側設置導流板，使通過散熱組件之氣流往散熱組件之散熱體集中，避免氣流往散熱組件外側散逸，以提升散熱組件整體的散熱效率。。此外，藉由將導流板與扣合元件一體成形的設計，不僅節省原料成本，更無須在主機板預留固定元件或風扇的設置空間，達到降低製造成本與主機板及散熱器之薄型化或微型化之優點。再者，再藉由擴增散熱器之底板之大小，增加散熱體的設置數量，並在扣合元件上設置導流板，以解決擴增散熱器之底板時發生流經散熱體之氣流分散且風場不均勻之問題，並進一步地提升散熱組件整體的散熱效率。In summary, the combination structure of the fastening component, the heat dissipating component, and the heat dissipating component and the chip set of the present invention is such that a baffle is disposed on opposite sides of the fastening component to concentrate the airflow passing through the heat dissipating component to the heat dissipating component of the heat dissipating component. The airflow is prevented from dissipating to the outside of the heat dissipation component to improve the heat dissipation efficiency of the heat dissipation component as a whole. . In addition, by designing the baffle and the fastening component integrally, not only the raw material cost is saved, but also the installation space of the fixing component or the fan is reserved in the main board, thereby reducing the manufacturing cost and the thinning of the main board and the radiator. Or the advantages of miniaturization. Furthermore, by amplifying the size of the bottom plate of the heat sink, the number of heat sinks is increased, and a baffle is disposed on the fastening component to solve the problem of airflow flowing through the heat sink when the bottom plate of the heat sink is amplified. Moreover, the problem of uneven wind field, and further improve the overall heat dissipation efficiency of the heat dissipation component.
本案得由熟習此技術之人士任施匠思而為諸般修飾，然皆不脫如附申請專利範圍所欲保護者。This case has been modified by people who are familiar with the technology, but it is not intended to be protected by the scope of the patent application.
1‧‧‧散熱組件與晶片組之組合結構
2‧‧‧散熱組件
21‧‧‧散熱器
211‧‧‧底板
2110‧‧‧上表面
2111‧‧‧設置通道
2112‧‧‧下表面
212‧‧‧散熱體、散熱鰭片
2121、2231‧‧‧頂面
22‧‧‧扣合元件
221‧‧‧矩形框體
2211‧‧‧第一樑體
2212‧‧‧第二樑體
2213‧‧‧第一表面
2214‧‧‧第二表面
222‧‧‧第一側板
2221‧‧‧扣鉤
2222‧‧‧內表面
223‧‧‧導流板
224‧‧‧第二側板
225‧‧‧彈性臂
2251‧‧‧抵頂部
3‧‧‧晶片組
31‧‧‧晶片基板
310‧‧‧底面
310a‧‧‧邊緣
32‧‧‧晶片
A1‧‧‧第一設置區域
A2‧‧‧第二設置區域
C1‧‧‧中央區域
C2‧‧‧延伸區域
D1‧‧‧第一方向
D2‧‧‧第二方向
E‧‧‧中空區域
θ、θ1、θ2‧‧‧銳角1‧‧‧Combination structure of heat sink and chipset
2‧‧‧Heat components
21‧‧‧ radiator
211‧‧‧floor
2110‧‧‧ upper surface
2111‧‧‧Setting channel
2112‧‧‧ lower surface
212‧‧‧heat sink, heat sink fin
2121, 2231‧‧‧ top
22‧‧‧Snap components
221‧‧‧Rectangular frame
2211‧‧‧First beam
2212‧‧‧Second beam
2213‧‧‧ first surface
2214‧‧‧ second surface
222‧‧‧ first side panel
2221‧‧‧ hook
2222‧‧‧ inner surface
223‧‧‧ deflector
224‧‧‧ second side panel
225‧‧‧Flexible arm
2251‧‧‧ arrive at the top
3‧‧‧ chipsets
31‧‧‧ wafer substrate
310‧‧‧ bottom
Edge of 310a‧‧
32‧‧‧ wafer
A1‧‧‧First setting area
A2‧‧‧Second setting area
C1‧‧‧Central Area
C2‧‧‧Extended area
D1‧‧‧ first direction
D2‧‧‧ second direction
E‧‧‧ hollow area θ, θ1, θ2‧‧‧ acute angle
第1圖係為本案第一實施例之散熱組件與晶片組之組合結構示意圖。 第2圖係為本案第一實施例之散熱組件之結構分解圖。 第3A圖係為第2圖所示之扣合元件之示意圖。 第3B圖係為第2圖所示之散熱器之示意圖。 第4圖係為本案第二實施例之散熱組件之結構分解圖。 第5圖係為第2圖所示之扣合元件之一變化例之示意圖。 第6圖係為第2圖所示之扣合元件之另一變化例之示意圖。 第7圖係為第2圖所示之扣合元件之又一變化例之示意圖。 第8圖係為本案第三實施例之散熱組件之結構示意圖。 第9圖係為本案第四實施例之散熱組件之結構示意圖。 第10圖係為本案第五實施例之散熱組件之結構示意圖。1 is a schematic view showing the combined structure of a heat dissipating component and a wafer set of the first embodiment of the present invention. Fig. 2 is a structural exploded view of the heat dissipating component of the first embodiment of the present invention. Fig. 3A is a schematic view of the fastening element shown in Fig. 2. Fig. 3B is a schematic view of the heat sink shown in Fig. 2. Figure 4 is a structural exploded view of the heat dissipating component of the second embodiment of the present invention. Fig. 5 is a schematic view showing a modification of one of the fastening elements shown in Fig. 2. Fig. 6 is a schematic view showing another modification of the fastening member shown in Fig. 2. Fig. 7 is a schematic view showing still another modification of the fastening member shown in Fig. 2. Figure 8 is a schematic view showing the structure of the heat dissipating component of the third embodiment of the present invention. Figure 9 is a schematic view showing the structure of the heat dissipating component of the fourth embodiment of the present invention. Figure 10 is a schematic view showing the structure of the heat dissipating component of the fifth embodiment of the present invention.
1‧‧‧散熱組件與晶片組之組合結構 1‧‧‧Combination structure of heat sink and chipset
2‧‧‧散熱組件 2‧‧‧Heat components
21‧‧‧散熱器 21‧‧‧ radiator
22‧‧‧扣合元件 22‧‧‧Snap components
3‧‧‧晶片組 3‧‧‧ chipsets
31‧‧‧晶片基板 31‧‧‧ wafer substrate
310‧‧‧底面 310‧‧‧ bottom
310a‧‧‧邊緣 Edge of 310a‧‧
32‧‧‧晶片 32‧‧‧ wafer
Claims (20)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105202435U TWM523893U (en) | 2016-02-19 | 2016-02-19 | Assembly structure comprising low wind pressure loss buckling device, heat dissipation assembly and chip set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105202435U TWM523893U (en) | 2016-02-19 | 2016-02-19 | Assembly structure comprising low wind pressure loss buckling device, heat dissipation assembly and chip set |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM523893U true TWM523893U (en) | 2016-06-11 |
Family
ID=56757298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105202435U TWM523893U (en) | 2016-02-19 | 2016-02-19 | Assembly structure comprising low wind pressure loss buckling device, heat dissipation assembly and chip set |
Country Status (1)
| Country | Link |
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| TW (1) | TWM523893U (en) |
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2016
- 2016-02-19 TW TW105202435U patent/TWM523893U/en not_active IP Right Cessation
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |