CN107072073B - A kind of method of LTCC ceramic chips the via hole - Google Patents
A kind of method of LTCC ceramic chips the via hole Download PDFInfo
- Publication number
- CN107072073B CN107072073B CN201611249291.3A CN201611249291A CN107072073B CN 107072073 B CN107072073 B CN 107072073B CN 201611249291 A CN201611249291 A CN 201611249291A CN 107072073 B CN107072073 B CN 107072073B
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- CN
- China
- Prior art keywords
- hole
- printing
- primary tile
- annulus
- tile
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
A kind of method that the present invention proposes LTCC ceramic chips the via hole, Step 1: being provided with annulus hole corresponding with the through-hole on pretreated primary tile on printing screen plate, the outer diameter of annulus hole is greater than aperture and internal diameter is less than aperture；Step 2: carrying out printing calibration after printing screen plate is arranged in the halftone card slot of printing equipment, then the packing paper under primary tile and its is placed on printing platform and carries out printing contraposition, so that the center of circle of any one annulus hole and through hole center are coaxial；Step 3: slurry is printed on positive through-hole by annulus hole, packing paper is changed after printing immediately；Step 4: the primary tile after printing is placed the scheduled time in the environment of constant temperature and humidity, then dry；Step 5: the primary tile after drying is overturn, the primary tile after overturning repeats step 2 to step 4.The method of the via hole of the invention makes slurry uniformly be paved with primary tile hole wall, and slurry is avoided to block hole wall, improves the uniformity of hole wall hanging.
Description
Technical field
The present invention relates to ltcc substrate technology field, in particular to the side of through hole wall metallization on a kind of LTCC ceramic chips
Method.
Background technique
LTCC LTCC Technology is the current very rapid passive integration technology of development.Ltcc substrate passes through in life
On tile prepared by the processes such as punching, via metal, conductor printing, lamination, sintering, which is formed in three-dimensional space mutually not
The high-density circuit board of interference.Group loads onto mount components and two kinds of interconnecting devices to ltcc substrate according to demand, and group loads onto attachment member
Part meets the needs of circuit integration, miniaturization and densification, and group loads onto interconnecting devices also and can meet mechanical strength and resistance to big
The demand of electric current.
The via hole technology in ltcc substrate preparation section, for realizing the vertical interconnection between laminated ceramic chips.Mesh
Before, it is easy to be filled up by metal paste when the via hole, in hole or hanging is uneven, member can not be patched in ltcc substrate over-assemble
Part reduces the application range of ltcc substrate.
Summary of the invention
To solve the problems, such as to be easy in the via hole process mesoporous to be filled up by metal paste and hanging is non-uniform, this hair
The bright method for proposing LTCC ceramic chips the via hole.
The technical scheme of the present invention is realized as follows:
A kind of method of LTCC ceramic chips the via hole, comprising the following steps:
Step 1: ceramic chips are processed into the primary tile with scheduled through-hole, will be provided on printing screen plate and institute
The one-to-one annulus hole of through-hole is stated, wherein the outer diameter of annulus hole is greater than the diameter of through-hole, and internal diameter is less than the diameter of through-hole；
Step 2: printing calibration is carried out after printing screen plate is arranged in the halftone card slot of printing equipment, it then will be primary
Tile is placed on packing paper, then is placed on the printing platform of printing equipment and is carried out printing contraposition, so that any one annulus hole
The center of circle is coaxial with through hole center；
Step 3: slurry is printed on the positive through-hole of corresponding primary tile by annulus hole on printing screen plate,
Packing paper is changed after printing slurry immediately；
Step 4: the primary tile after printing in step 3 is placed the scheduled time in the environment of constant temperature and humidity, then
Drying；
Step 5: the primary tile after drying in step 4 is overturn, the primary tile after overturning repeats step 2 to step
Rapid four, so that the through hole wall metallization of primary tile.
Preferably, in the step 1, the outer diameter of the annulus hole is 0.2mm bigger than the diameter of the through-hole, internal diameter ratio
The small 0.2mm of the diameter of the through-hole.
Preferably, in the step 3, when changing packing paper after printing slurry, which does not occur phase with primary tile
To movement.
Preferably, in the step 4, the scheduled time is set as at least 5 minutes.
The invention has the benefit that the method for LTCC ceramic chips the via hole of the invention, by printing screen plate
Annulus hole on the through-hole of primary tile printing slurry, avoid slurry block through-hole；By on primary tile through-hole front and
Reverse side distinguishes printing slurry, improves the uniformity of hole wall hanging, while slurry being made to be paved with hole wall；Through-hole is being just on primary tile
Behind face or back face printing slurry, packing paper is changed immediately, slows down the lower half portion that slurry is deposited in through-hole.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical scheme in the embodiment of the invention is clearly and completely described,
Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based in the present invention
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the scope of protection of the invention.
Embodiment: ferroA6M green is cut into 6inch and torn by a kind of method of LTCC ceramic chips the via hole
Fall notacoria processing for primary tile, processes the through-hole of several 0.6mm on green using mechanical punching or laser boring, printing
Be provided on brush halftone outer diameter be 0.8mm and internal diameter be 0.4mm with the one-to-one annulus hole of through-hole；Printing screen plate is arranged
Printing calibration is carried out in the web plate card slot of printing equipment, then primary tile is placed on packing paper, then is placed on printing and sets
Printing contraposition is carried out on standby printing platform, so that the center of circle of any one annulus hole and the center of circle of a through-hole are coaxially distributed；It will
Ferro CN36-020 slurry is printed on the positive through-hole of corresponding primary tile by the annulus hole on printing screen plate, through-hole
Packing paper is changed in 10s after printing slurry；The primary tile of printing is placed one hour in the environment of constant temperature and humidity, is placed into
It is dried in hot-air drying stove.By the primary tile overturning after drying, printing equipment re-starts printing calibration, and primary tile is anti-
It is placed upwardly on packing paper, then is placed on printing platform and re-starts printing contraposition, so that any one annulus hole when printing
The center of circle and the center of circle of a through-hole be coaxially distributed；Ferro CN36-020 slurry is printed on by annulus hole on printing screen plate
On the through-hole of corresponding primary tile reverse side, through-hole changes packing paper after printing slurry in 10s；Again by the primary tile after printing
It is placed one hour in the environment of constant temperature and humidity, is finally putting into hot-air drying stove and dries, obtain the good life of the via hole
Porcelain.
When changing packing paper after printing slurry, which does not relatively move with primary tile, avoids primary tile
The end face set-off contacted with packing paper.
The outer diameter of annulus hole in embodiment is 0.2mm bigger than the diameter of through-hole, and internal diameter is 0.2mm smaller than the diameter of through-hole.It is permanent
It is at least placed 5 minutes when being placed in constant temperature and humidity environment.
Printing scaling method in embodiment are as follows: calibration hole is provided on printing screen plate and ceramic chips, by printing screen plate
On calibration hole printing on a pet film, printing equipment capture PET film on calibration hole simultaneously remember the calibration hole.Printing contraposition side
Method are as follows: ceramic chips are placed on the printing platform of printing equipment, printing equipment captures the calibration hole on ceramic chips, printing equipment tune
The position of whole ceramic chips realizes that the center of circle of any one annulus hole and through hole center are coaxial.The printing of different printing equipments is demarcated
It is different with printing contraposition method.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (3)
1. a kind of method of LTCC ceramic chips the via hole, which comprises the following steps:
Step 1: ceramic chips are processed into the primary tile with scheduled through-hole, it will be provided on printing screen plate and lead to described
The one-to-one annulus hole in hole, wherein the outer diameter of annulus hole is greater than the diameter of through-hole, and internal diameter is less than the diameter of through-hole, the circle
The outer diameter of annular distance is 0.2mm bigger than the diameter of the through-hole, and internal diameter is 0.2mm smaller than the diameter of the through-hole；
Step 2: primary tile is placed on packing paper, it is then placed on the printing platform of printing equipment, printing screen plate is arranged
In the halftone card slot of printing equipment, printing calibration is then carried out, so that the center of circle of any one annulus hole and through-hole circle when printing
The heart is coaxial；
Step 3: slurry is printed on the positive through-hole of corresponding primary tile by annulus hole on printing screen plate, printing
Packing paper is changed after slurry immediately；
Step 4: the primary tile after printing in step 3 is placed the scheduled time in the environment of constant temperature and humidity, then dry；
Step 5: the primary tile after drying in step 4 is overturn, the primary tile after overturning repeats step 2 to step 4,
So that the through hole wall metallization of primary tile.
2. the method for LTCC ceramic chips the via hole according to claim 1, which is characterized in that in the step 3,
When changing packing paper after printing slurry, which does not relatively move with primary tile.
3. the method for LTCC ceramic chips the via hole according to claim 1, which is characterized in that in the step 4,
The scheduled time is set as at least 5 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611249291.3A CN107072073B (en) | 2016-12-29 | 2016-12-29 | A kind of method of LTCC ceramic chips the via hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611249291.3A CN107072073B (en) | 2016-12-29 | 2016-12-29 | A kind of method of LTCC ceramic chips the via hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107072073A CN107072073A (en) | 2017-08-18 |
| CN107072073B true CN107072073B (en) | 2019-06-04 |
Family
ID=59623565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611249291.3A Active CN107072073B (en) | 2016-12-29 | 2016-12-29 | A kind of method of LTCC ceramic chips the via hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107072073B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60167396A (en) * | 1984-02-09 | 1985-08-30 | 日立化成工業株式会社 | Method of coating paste material on inner wall of through hole |
| JPH11346055A (en) * | 1998-04-29 | 1999-12-14 | Lucent Technol Inc | Method of coating side wall of via hole with thick film |
| JP3687108B2 (en) * | 1994-06-16 | 2005-08-24 | 株式会社デンソー | Manufacturing method of through-hole double-sided board |
| CN103085451A (en) * | 2011-11-03 | 2013-05-08 | 北大方正集团有限公司 | Silk screen printing board and preparation method thereof and printed circuit board and preparation method thereof |
-
2016
- 2016-12-29 CN CN201611249291.3A patent/CN107072073B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60167396A (en) * | 1984-02-09 | 1985-08-30 | 日立化成工業株式会社 | Method of coating paste material on inner wall of through hole |
| JP3687108B2 (en) * | 1994-06-16 | 2005-08-24 | 株式会社デンソー | Manufacturing method of through-hole double-sided board |
| JPH11346055A (en) * | 1998-04-29 | 1999-12-14 | Lucent Technol Inc | Method of coating side wall of via hole with thick film |
| CN1245392A (en) * | 1998-04-29 | 2000-02-23 | 朗迅科技公司 | Method for coating through-hole side wall with thick film |
| CN103085451A (en) * | 2011-11-03 | 2013-05-08 | 北大方正集团有限公司 | Silk screen printing board and preparation method thereof and printed circuit board and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107072073A (en) | 2017-08-18 |
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Address after: No. 115, Heping South Road, Wanbailin District, Taiyuan City, Shanxi Province Patentee after: Northwest electronic equipment Technology Research Institute (the second Research Institute of China Electronic Technology Corp.) Address before: No. 115, Heping South Road, Taiyuan City, Taiyuan City, Shanxi Province 030024 Patentee before: THE SECOND RESEARCH INSTITUTE OF CHINA ELECTRONIC TECHNOLOGY Group Corp. |
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