CN105263259B - It is a kind of using net as the printed circuit board of substrate - Google Patents
It is a kind of using net as the printed circuit board of substrate Download PDFInfo
- Publication number
- CN105263259B CN105263259B CN201510844814.8A CN201510844814A CN105263259B CN 105263259 B CN105263259 B CN 105263259B CN 201510844814 A CN201510844814 A CN 201510844814A CN 105263259 B CN105263259 B CN 105263259B
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- China
- Prior art keywords
- net
- circuit board
- substrate
- printed circuit
- substrate web
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to a kind of using net as the printed circuit board of substrate, is named as net substrate.The net substrate includes: substrate web, is the wire mesh or metal plate punching net of high density braided；Upper conductive layer, it is to produce required circuitous pattern with metal film or thin printed circuit board or flexible circuit board (FPC), for the connecting element that is welded, it is not routed and does not put excision at component, the pin for the component installed thereon or heat sink needs and the direct contact position aperture of the substrate web thereon；Intermediate glue layer, it is prepreg or high-temperature plastic, the substrate web and Upper conductive lamination are combined into entirety by using Vacuum Heat laminating technology, pin that the needs of the component and the substrate web directly contact or heat sink can directly be welded or heat-conducting glue is adhesive in the substrate web.The present invention can be used for needing the field of air circulation and heat dissipation, have good heat dissipation effect, light-weight, flexible, at low cost advantage.
Description
Technical field
The present invention relates to a kind of printed circuit boards, more particularly to a kind of using net as the printed circuit board of substrate.
Background technique
Printed circuit board is a kind of basic material of electronics industry, is formed by copper film and various base material pressings, substrate material
Material has paper, glass, copper, aluminium, ceramics and other special materials, and different substrates assigns printed circuit board different special natures.
Existing printed circuit board is typically all hardboard, and existing flexible printed circuit board (FPC) has flexibility, although having flexibility,
But plate, the advantage without ventilation and heat.
ZL201310050182.9 is it is proposed that a kind of flexibility Led lamp net, it is directly SMT encapsulation in the prior art
The heat-conducting seat of Led lamp bead is directly welded on radiator-grid, and heat dissipation effect adds aluminium radiator scheme more excellent than aluminum substrate, cost
It greatly reduces, but the connection type between the not clear lamp bead of the technology, and the technology is only used for LED lamp, not conduct
A kind of novel printed circuit board proposition, application range is restricted, while its standardized degree does not rise to a kind of standard yet
The degree of printed circuit board, industry size are restricted.
It can be seen that existing printed circuit board, it is clear that there are still the inconvenience and defect in structure and in cost, and urgently
It is further improved.The designer is based on being engaged in such product design manufacture practical experience and professional knowledge abundant for many years,
Actively it is subject to research and innovation, it is to found a kind of new structural printed circuit board, i.e., a kind of using net as the printed circuit of substrate
Plate can improve general the problem of being unable to ventilation and heat of existing various printed circuit boards, keep its heat dissipation effect more preferable, and be convenient for
It is large-scale to promote.By constantly studying, designing, and studied repeatedly sample and improve after, create finally really have it is practical
The present invention of value.
Summary of the invention
It is a primary object of the present invention to the shortcomings that overcoming existing various printed circuit boards to be unable to ventilation and heat, overcome
Connection type is lack of standardization in ZL201310050182.9, the defect of not scale, and provides a kind of new structural printed circuit
Plate is named as net substrate that is, using net as the printed circuit board of substrate.The technical problem to be solved is that application high density braideds
Metal mesh or metal plate punching net are as heat sink material, using thin printed circuit board and flexible circuit board (FPC) using maturation
Making sheet and welding and assembling technics, can be using mature laser cutting parameter, by cutting off on the Upper conductive layer using metal film
It is not routed and does not put the region of component to not influence the ventilation and heat performance of the substrate web.Pass through the member in the installation
The pin of device or heat sink needs and the direct contact position aperture of the substrate web, then by welding and heat-conducting glue gluing the member
Part is fastened directly in the substrate web, to reduce thermal resistance, enhances heat dissipation performance.
The object of the invention to solve the technical problems adopts the following technical solutions to realize.It proposes according to the present invention
It is a kind of using net as the printed circuit board of substrate, be named as net substrate comprising: substrate web, be high density braided wire
Net or metal plate punching net；Upper conductive layer is to produce institute with metal film or thin printed circuit board or flexible circuit board (FPC)
The circuitous pattern needed is not routed thereon and does not put excision, the component installed thereon at component for the connecting element that is welded
Pin or it is heat sink needs and the direct contact position aperture of the substrate web；Intermediate glue layer is prepreg or high-temperature plastic, leads to
It crosses and the substrate web and Upper conductive lamination is combined by entirety using Vacuum Heat laminating technology, needs of the component and described
Pin that substrate web directly contacts heat sink can be welded directly or heat-conducting glue is adhesive in the substrate web；And using net as substrate
Printed circuit board production processing step:
A, substrate web is evened up with net puller, and keeps flare mode；
B, when Upper conductive layer uses thin printed circuit board or flexible circuit board (FPC), using existing manufacture craft system
Make circuitous pattern, is not then routed on the cutting techniques such as milling or punching or laser cutting excision Upper conductive layer and is not put member
In place of device, the pin for the component installed on Upper conductive layer or heat sink needs and the direct contact position of the substrate web are used
State cutting technique aperture；
When Upper conductive layer makes circuitous pattern, and the above-mentioned cutting technique of use using above-mentioned cutting technique using metal film
Component place is not routed and not put on excision Upper conductive layer；
C, when intermediate glue layer uses prepreg, prepreg need to be cut into figure identical with Upper conductive layer
Shape；When intermediate glue layer uses high-temperature plastic, high-temperature plastic need to be coated in the back side of Upper conductive layer；
D, it is pressed according to the order Vacuum Heat laminating technology that stacks of Upper conductive layer, intermediate glue layer, substrate web.
Further, the mesh of the substrate web be rectangular or diamond shape, its weaving manner be plain weave tiltedly knit or satin weave,
Its net type is plain weave net or seat type net or hook flower net or stretching nets, its stratum reticulare mode are monolayer net or multiple-level stack net.
Further, the thickness of the Upper conductive layer is welded needs and component that substrate web directly contacts is to facilitate
Standard is 0.1-0.3 millimeters general.
Further, the thin printed circuit board or flexible circuit board (FPC) are lamina or multi-layer board.
From the above technical scheme, the present invention-is a kind of at least has the advantage that by the printed circuit board of substrate of net
The radiator-grid that substrate web of the invention is woven with filament has the advantages that effective thermal expansion coefficient is big in face.Substrate web net
Hole very little, the thin large contact area with air of twine string diameter, etc. length and width dimensions substrate web and air contact area than it is board-like dissipate
Hot device is in big more of air contact area.Since its string diameter all very littles (0.2--0.03 millimeters) NATURAL CONVECTION COEFFICIENT OF HEAT is than flat
The several times greater hundreds of times of the NATURAL CONVECTION COEFFICIENT OF HEAT of plate shape material, radiator-grid have taken into account net heat conduction and net and air heat
The dual function of convection current.Due to its porous characteristic, substrate web flows almost without resistance air, this be panel radiator more
No property.If not using commercial standard copper mesh, but from selected string diameter, mesh size, mesh form, stratum reticulare number its
Heat dissipation performance also greatly improves.It can use using the metal film, thin printed circuit board, flexible circuit board (FPC) existing
Cutting, making sheet and welding and assembling technics, accelerate industrialization process, by not being routed in excision thin printed circuit board and not putting component
Region to not influence the heat dissipation performance and performance of ventilating of the substrate web.By the pin of the component in the installation or
Heat sink needs and the direct contact position aperture of the substrate web, then the element is fastened directly to by welding or heat-conducting glue gluing
In the substrate web, to reduce thermal resistance, enhance heat dissipation performance.
The above description is only an overview of the technical scheme of the present invention, in order to better understand the technical means of the present invention,
And can be implemented in accordance with the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention and the accompanying drawings.
Detailed description of the invention
Fig. 1 is that one embodiment of the invention is a kind of using net as the printed circuit board top view illustration of substrate.
Fig. 2 is that one embodiment of the invention is a kind of using net as the printed circuit board front view schematic diagram of substrate.
Fig. 3 is that second embodiment of the invention is a kind of using net as the printed circuit board top view illustration of substrate.
Fig. 4 is that second embodiment of the invention is a kind of to be illustrated by the Upper conductive layer top view of the printed circuit board of substrate of net
Figure.
Fig. 5 is that second embodiment of the invention is a kind of to be illustrated by the intermediate glue layer top view of the printed circuit board of substrate of net
Figure.
1, substrate web 2, Upper conductive layer (having 3 in Fig. 1) 3, single lamp control chips W S2811 (having 12 in Fig. 1) 4,
Red LED lamp bead (having 12 in Fig. 1) 5, green LED lamp bead (having 12 in Fig. 1) 6, blue led lamp bead (having 12 in Fig. 1)
7,8, zero Europe resistance of wire jointing base (having 3 in Fig. 1) (for powering to chip 3, having 12 in Fig. 1) 9, single lamp control chip
The DIN control line 10 of WS2811, the DO control line 11 of single lamp control chips W S2811, ground wire 12,5V power supply connection in substrate web
Point 13, intermediate glue layer 14,0.5 watts of 6V white light LEDs lamp beads (having 40 in Fig. 3) 15,6V positive pole terminals 16,6V power supply
Negative terminals
Specific embodiment
It is of the invention to reach the technical means and efficacy that predetermined goal of the invention is taken further to illustrate, below in conjunction with
Attached drawing and preferred embodiment, to the specific embodiment of the Led lamp net proposed according to the present invention with standard socket, structure,
Feature and its effect, detailed description is as follows.
If Fig. 1 is that a kind of of presently preferred embodiments of the present invention proposition illustrates by the printed circuit board top view of substrate of net
Figure, red copper net (string diameter 66 micron, aperture 106 micron) of the substrate web (1) using 150 mesh, 9 centimetres of length are 7 centimetres wide.Have 3
Upper conductive layer (2), using FR4 thin printed circuit board, 0.2 millimeter of thickness.3 thin printed circuit boards (2) centre
Adhesive layer (13) is bonded at equal intervals on substrate web (1), and intermediate glue layer (13) is using high-temperature plastic.
Circuitous pattern is made on 3 Upper conductive layers (2) using existing PCB processing technology, according to as shown in Figure 2
Hierarchical chart, use Vacuum Heat laminating technology by Upper conductive layer (2), intermediate glue layer (13), substrate web (1) pressure for one
A entirety.
Using existing SMT welding and assembling technics, in the pressing of Upper conductive layer (2), intermediate glue layer (13), substrate web (1)
The single lamp control that is welded on body chips W S2811 (3), it red LED lamp bead (4), green LED lamp bead (5), blue led lamp bead (6), leads
Line attachment base (7), zero Europe resistance (8), the model 2835 of LED, power are 0.3 watt, and the anode of all LED is welded on substrate web
(1) on, cathode is welded on thin printed circuit board (2).One electrode welding of zero Europe resistance (8) is another on substrate web (1)
A electrode welding is on thin printed circuit board (2).
Using when 5V positive pole welding substrate web on 5V power connection points (12), cathode connects the ground of wire jointing base (7)
Line (11), the control signal of controller (not marking in figure) also meet the DIN of the single lamp control chips W S2811 of wire jointing base (7)
The DO control line (10) of control line (9) and single lamp control chips W S2811, is programmed, 12 in Fig. 1 are red by controller software
Color LED lamp bead (4), green LED lamp bead (5), blue led lamp bead (6) brightness can 256 grades of Independent adjustables.Long-time work
Make the heat sink temperature rise of LED lower than 20 degree, meets life requirements in 100,000 hours.
As Fig. 3 be presently preferred embodiments of the present invention propose another using net as substrate printed circuit board top view illustrate
Figure, red copper net (string diameter 66 micron, aperture 106 micron) of the substrate web (1) using 150 mesh, 12.5 centimetres of length are 10 lis wide
Rice.Upper conductive layer (2) is cut into using 70 microns of thick copper molds such as Fig. 4 figure, every 2.5 millimeters of width of centre.
Intermediate glue layer (13) is 100 microns of prepreg thickness, is cut into such as Fig. 5 figure, every 3.5 millimeters of width of centre.It will be upper
Layer conductive layer (2) and intermediate glue layer (13) overlapping, it is ensured that the copper film figure of Upper conductive layer (2) is placed on intermediate glue layer
(13) centre of prepreg figure will make copper film figure and substrate web (1) have 0.5 millimeter of insulation gap.According to such as
Fig. 2 show Upper conductive layer (2), intermediate glue layer (13), substrate web (1) hierarchical chart, using Vacuum Heat be laminated work
Three's pressure is an entirety by skill.
Using existing SMT welding and assembling technics, in the pressing of Upper conductive layer (2), intermediate glue layer (13), substrate web (1)
Be welded 40 0.5 watt of 6V white light LEDs lamp beads (14) on body, and the anode of all LED lamp beads (14) is welded on substrate web (1), bears
Pole is welded on copper film (2).
Using when 6V power supply anode (do not marked) in figure be welded to 6V positive pole terminals (15) in substrate web, cathode connects
6V power cathode terminals (16).The heat sink temperature rise of the LED lamp bead that works long hours (14) is lower than 30 degree, meets 100,000 hours longevity
Life requires.
The above is only one embodiment of the present of invention, is not intended to limit the present invention in any form, and is appointed
What those skilled in the art, without departing from the scope of the present invention, when in the technology using the disclosure above
Hold the equivalent embodiment for being modified or being modified to equivalent variations, but anything that does not depart from the technical scheme of the invention content,
Any simple modification, equivalent change and modification to the above embodiments according to the technical essence of the invention still fall within this
In the range of inventive technique scheme.
Claims (4)
1. a kind of using net as the printed circuit board of substrate, it is characterised in that comprising:
Substrate web is the wire mesh or metal plate punching net of high density braided；
Upper conductive layer is to produce required circuitous pattern with metal film or thin printed circuit board or flexible circuit board (FPC),
For the connecting element that is welded, excision, the pin for the component installed thereon or heat sink at component are not routed and not put thereon
It needs and the direct contact position aperture of the substrate web；
Intermediate glue layer, is prepreg or high-temperature plastic, by using Vacuum Heat laminating technology by the substrate web and upper layer
Conductive lamination is combined into entirety, pin that the needs of the component and the substrate web directly contact or it is heat sink can directly weld or
Heat-conducting glue is adhesive in the substrate web；And the processing step produced using net as the printed circuit board of substrate:
A, substrate web is evened up with net puller, and keeps flare mode；
B, when Upper conductive layer uses thin printed circuit board or flexible circuit board (FPC), electricity is made using existing manufacture craft
Then road figure is not routed and does not put component place in milling or punching or laser cutting parameter excision Upper conductive layer,
The pin for the component installed on Upper conductive layer or heat sink needs and the above-mentioned cutter in the direct contact position of the substrate web
Skill aperture；
When Upper conductive layer using metal film using above-mentioned cutting technique make circuitous pattern, and using above-mentioned cutting technique cut off
Component place is not routed and not put on Upper conductive layer；
C, when intermediate glue layer uses prepreg, prepreg need to be cut into figure identical with Upper conductive layer；When
When intermediate glue layer uses high-temperature plastic, high-temperature plastic need to be coated in the back side of Upper conductive layer；
D, it is pressed according to the order Vacuum Heat laminating technology that stacks of Upper conductive layer, intermediate glue layer, substrate web.
2. according to claim 1 using net as the printed circuit board of substrate, it is characterised in that the mesh of the substrate web is
Rectangular or diamond shape, its weaving manner be plain weave or tiltedly knit satin weave, its net type be plain weave net or seat type net or hook Hua Wanghuo
Stretching nets, its stratum reticulare mode are monolayer net or multiple-level stack net.
3. according to claim 1 using net as the printed circuit board of substrate, it is characterised in that the thickness of the Upper conductive layer
Degree, which is subject to facilitate, is welded needs and component that substrate web directly contacts, 0.1-0.3 millimeters general.
4. according to claim 1 using net as the printed circuit board of substrate, it is characterised in that the thin printed circuit board or
Flexible circuit board (FPC) is lamina or multi-layer board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510844814.8A CN105263259B (en) | 2015-11-30 | 2015-11-30 | It is a kind of using net as the printed circuit board of substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510844814.8A CN105263259B (en) | 2015-11-30 | 2015-11-30 | It is a kind of using net as the printed circuit board of substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105263259A CN105263259A (en) | 2016-01-20 |
| CN105263259B true CN105263259B (en) | 2019-03-01 |
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| CN201510844814.8A Active CN105263259B (en) | 2015-11-30 | 2015-11-30 | It is a kind of using net as the printed circuit board of substrate |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205305215U (en) * | 2015-11-30 | 2016-06-08 | 靳丰泽 | Use printed circuit board of net as basement |
| CN107466169B (en) * | 2016-06-03 | 2024-03-08 | 深圳万知达科技有限公司 | LED chip mounter material feeding unit |
| CN107072037A (en) * | 2017-03-15 | 2017-08-18 | 西华大学 | A kind of circuit board and a kind of net substrate |
| CN108541133A (en) * | 2018-06-25 | 2018-09-14 | 芜湖纯元光电设备技术有限公司 | A kind of circuit board that permeability is strong |
| CN114158205B (en) * | 2021-11-15 | 2023-09-05 | 广德宝达精密电路有限公司 | Manufacturing method of high-density interconnection printed circuit board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004009284A1 (en) * | 2004-02-26 | 2005-09-15 | Osram Opto Semiconductors Gmbh | Light-emitting diode arrangement for a high-performance light-emitting diode and method for producing a light-emitting diode arrangement |
| CN200965601Y (en) * | 2006-05-26 | 2007-10-24 | 稳态科技股份有限公司 | LCD panel backlight heat dissipation device |
| CN104197225B (en) * | 2014-09-19 | 2018-01-16 | 西华大学 | A kind of LED net with standard lamp head |
| CN205305215U (en) * | 2015-11-30 | 2016-06-08 | 靳丰泽 | Use printed circuit board of net as basement |
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