CN107001876A - Resin film formation is with piece and resin film formation composite sheet - Google Patents
Resin film formation is with piece and resin film formation composite sheet Download PDFInfo
- Publication number
- CN107001876A CN107001876A CN201680003816.7A CN201680003816A CN107001876A CN 107001876 A CN107001876 A CN 107001876A CN 201680003816 A CN201680003816 A CN 201680003816A CN 107001876 A CN107001876 A CN 107001876A
- Authority
- CN
- China
- Prior art keywords
- resin film
- film formation
- piece
- silicon wafer
- composite sheet
- Prior art date
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- 229920005989 resin Polymers 0.000 title claims abstract description 401
- 239000011347 resin Substances 0.000 title claims abstract description 401
- 230000015572 biosynthetic process Effects 0.000 title claims abstract description 301
- 239000002131 composite material Substances 0.000 title claims abstract description 81
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 110
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 108
- 239000010703 silicon Substances 0.000 claims abstract description 108
- 230000003746 surface roughness Effects 0.000 claims abstract description 45
- 238000003475 lamination Methods 0.000 claims abstract description 17
- 239000000203 mixture Substances 0.000 claims description 72
- 239000000463 material Substances 0.000 claims description 71
- 239000000853 adhesive Substances 0.000 claims description 47
- 230000001070 adhesive effect Effects 0.000 claims description 47
- 229920000058 polyacrylate Polymers 0.000 claims description 35
- 238000012856 packing Methods 0.000 claims description 33
- 229920001187 thermosetting polymer Polymers 0.000 claims description 26
- 229920000642 polymer Polymers 0.000 claims description 25
- 235000012431 wafers Nutrition 0.000 description 93
- 238000000034 method Methods 0.000 description 66
- -1 (methyl) ethyl Chemical group 0.000 description 36
- 230000008569 process Effects 0.000 description 34
- 150000001875 compounds Chemical class 0.000 description 32
- 150000002118 epoxides Chemical class 0.000 description 30
- 239000004593 Epoxy Substances 0.000 description 25
- 239000003795 chemical substances by application Substances 0.000 description 25
- 239000000178 monomer Substances 0.000 description 25
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 22
- 239000002585 base Substances 0.000 description 22
- 238000010276 construction Methods 0.000 description 21
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 20
- 239000012528 membrane Substances 0.000 description 19
- 239000004065 semiconductor Substances 0.000 description 18
- 238000002834 transmittance Methods 0.000 description 14
- 239000003822 epoxy resin Substances 0.000 description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 238000001723 curing Methods 0.000 description 12
- 239000007822 coupling agent Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000001029 thermal curing Methods 0.000 description 11
- 238000004040 coloring Methods 0.000 description 10
- 238000005520 cutting process Methods 0.000 description 10
- 125000000524 functional group Chemical group 0.000 description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 10
- 125000005250 alkyl acrylate group Chemical group 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000009471 action Effects 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 6
- 239000002313 adhesive film Substances 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000000227 grinding Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 5
- 239000000975 dye Substances 0.000 description 5
- 238000011049 filling Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000007689 inspection Methods 0.000 description 5
- 239000011572 manganese Substances 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 229920001568 phenolic resin Polymers 0.000 description 5
- 239000000049 pigment Substances 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 150000003254 radicals Chemical class 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 229920006243 acrylic copolymer Polymers 0.000 description 4
- 230000006978 adaptation Effects 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 150000002460 imidazoles Chemical class 0.000 description 4
- 229920001684 low density polyethylene Polymers 0.000 description 4
- 239000004702 low-density polyethylene Substances 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 4
- 238000009418 renovation Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000004480 active ingredient Substances 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 229940106691 bisphenol a Drugs 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 241000894007 species Species 0.000 description 3
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000001055 blue pigment Substances 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- GWVMLCQWXVFZCN-UHFFFAOYSA-N isoindoline Chemical compound C1=CC=C2CNCC2=C1 GWVMLCQWXVFZCN-UHFFFAOYSA-N 0.000 description 2
- 238000007648 laser printing Methods 0.000 description 2
- 239000002932 luster Substances 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- FYNROBRQIVCIQF-UHFFFAOYSA-N pyrrolo[3,2-b]pyrrole-5,6-dione Chemical compound C1=CN=C2C(=O)C(=O)N=C21 FYNROBRQIVCIQF-UHFFFAOYSA-N 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 239000001054 red pigment Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 229920006305 unsaturated polyester Polymers 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- CVBWTNHDKVVFMI-LBPRGKRZSA-N (2s)-1-[4-[2-[6-amino-8-[(6-bromo-1,3-benzodioxol-5-yl)sulfanyl]purin-9-yl]ethyl]piperidin-1-yl]-2-hydroxypropan-1-one Chemical compound C1CN(C(=O)[C@@H](O)C)CCC1CCN1C2=NC=NC(N)=C2N=C1SC(C(=C1)Br)=CC2=C1OCO2 CVBWTNHDKVVFMI-LBPRGKRZSA-N 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical class OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical group C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- LESMLVDJJCWZAJ-UHFFFAOYSA-N 2-(diphenylphosphorylmethyl)-1,3,5-trimethylbenzene Chemical class CC1=CC(C)=CC(C)=C1CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 LESMLVDJJCWZAJ-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- FPKCTSIVDAWGFA-UHFFFAOYSA-N 2-chloroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3C(=O)C2=C1 FPKCTSIVDAWGFA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 150000004941 2-phenylimidazoles Chemical class 0.000 description 1
- YLAIPKRCICZKAK-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]-1-(oxiran-2-ylmethoxy)propan-1-ol Chemical compound CCO[Si](C)(OCC)CCC(O)OCC1CO1 YLAIPKRCICZKAK-UHFFFAOYSA-N 0.000 description 1
- BUZICZZQJDLXJN-UHFFFAOYSA-N 3-azaniumyl-4-hydroxybutanoate Chemical compound OCC(N)CC(O)=O BUZICZZQJDLXJN-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- NFVPEIKDMMISQO-UHFFFAOYSA-N 4-[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=C(O)C=C1 NFVPEIKDMMISQO-UHFFFAOYSA-N 0.000 description 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical group CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Natural products CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- GNBCKKSGQPLTRW-UHFFFAOYSA-N C(C=C)(=O)OC.C(N)(O)=O Chemical compound C(C=C)(=O)OC.C(N)(O)=O GNBCKKSGQPLTRW-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 244000168525 Croton tiglium Species 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- 239000004150 EU approved colour Substances 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical class CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 1
- DJOWTWWHMWQATC-KYHIUUMWSA-N Karpoxanthin Natural products CC(=C/C=C/C=C(C)/C=C/C=C(C)/C=C/C1(O)C(C)(C)CC(O)CC1(C)O)C=CC=C(/C)C=CC2=C(C)CC(O)CC2(C)C DJOWTWWHMWQATC-KYHIUUMWSA-N 0.000 description 1
- 239000004425 Makrolon Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 1
- SJEYSFABYSGQBG-UHFFFAOYSA-M Patent blue Chemical compound [Na+].C1=CC(N(CC)CC)=CC=C1C(C=1C(=CC(=CC=1)S([O-])(=O)=O)S([O-])(=O)=O)=C1C=CC(=[N+](CC)CC)C=C1 SJEYSFABYSGQBG-UHFFFAOYSA-M 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 208000032825 Ring chromosome 2 syndrome Diseases 0.000 description 1
- CIVKKLRUDDHREQ-UHFFFAOYSA-N SC(CC[Si](OC)(OC)C)O Chemical compound SC(CC[Si](OC)(OC)C)O CIVKKLRUDDHREQ-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229920006266 Vinyl film Polymers 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 239000000980 acid dye Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000012675 alcoholic extract Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- 238000012661 block copolymerization Methods 0.000 description 1
- 150000001638 boron Chemical class 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical group CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical class OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- KVNRLNFWIYMESJ-UHFFFAOYSA-N butyronitrile Chemical compound CCCC#N KVNRLNFWIYMESJ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000004657 carbamic acid derivatives Chemical class 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- MCJUWBUSIQXMPY-UHFFFAOYSA-N cyclopenta-1,3-diene titanium Chemical compound [Ti].C1C=CC=C1 MCJUWBUSIQXMPY-UHFFFAOYSA-N 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- YQGOWXYZDLJBFL-UHFFFAOYSA-N dimethoxysilane Chemical compound CO[SiH2]OC YQGOWXYZDLJBFL-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 1
- 239000000982 direct dye Substances 0.000 description 1
- 239000000986 disperse dye Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- XSMJZKTTXZAXHD-UHFFFAOYSA-N ethene;2-methylprop-2-enoic acid Chemical compound C=C.CC(=C)C(O)=O XSMJZKTTXZAXHD-UHFFFAOYSA-N 0.000 description 1
- UHPJWJRERDJHOJ-UHFFFAOYSA-N ethene;naphthalene-1-carboxylic acid Chemical compound C=C.C1=CC=C2C(C(=O)O)=CC=CC2=C1 UHPJWJRERDJHOJ-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N iso-butene Natural products CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000002454 metastable transfer emission spectrometry Methods 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229940006093 opthalmologic coloring agent diagnostic Drugs 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000007591 painting process Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001596 poly (chlorostyrenes) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000000985 reactive dye Substances 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- KUCOHFSKRZZVRO-UHFFFAOYSA-N terephthalaldehyde Chemical compound O=CC1=CC=C(C=O)C=C1 KUCOHFSKRZZVRO-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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Abstract
The present invention provides the excellent resin film formation of releasable with piece and with the resin film formation with piece and the resin film formation composite sheet of the structure of the direct lamination of supporter, the resin film formation is to be pasted on silicon wafer, the piece for forming resin film on the silicon wafer with piece, wherein, it is more than 40nm to treat the surface roughness (Ra) that the surface (α) of the piece of side is pasted with silicon wafer.
Description
Technical field
The present invention relates to resin film formation with piece and resin film formation composite sheet.
Background technology
In recent years, used and be referred to as the Method for Installation of so-called upside-down mounting (face down) mode to carry out semiconductor device
Manufacture.In upside-down mounting mode, use has the semiconductor chip of the electrodes such as projection (hereinafter also referred to as in circuit face
" chip "), and the electrode engages with substrate.Therefore, the surface for sometimes resulting in the side opposite with circuit face of chip is (following to be also referred to as
For " back side of chip ") exhume.
At the back side of the chip exhumed, the resin film formed by organic material is formed sometimes, so that with tape tree
The form assembling of the chip of adipose membrane is in semiconductor devices.Resin film is as preventing from producing after cutting action, encapsulation
The diaphragm of raw crackle or as being used for gained die bonding in other components such as brilliant pad portion or other semiconductor chip
Adhesive film formed by.
In general, the chip of the tape tree adipose membrane is by the way that the solution for wrapping resiniferous composition is being utilized into spin-coating method etc.
It is coated on the back side of chip and is formed after film, makes the dried coating film and be solidified to form resin film, and to gained resin
The chip of film is cut and manufactured.
As diaphragm, the formation material of adhesive film set on the back side of such chip, the back side of chip, carry
Various resin film formation pieces are gone out.
For example, Patent Document 1 discloses a kind of chip protection film, it is with energy-line solidifying type diaphragm shape
Stratification is included by the chip protection film of the structure of 2 stripping film clampings, the energy-line solidifying type diaphragm forming layer：
Component of polymer comprising acrylic copolymer, energy ray-curable composition, dyestuff or pigment, inorganic filling material and light
Polymerization initiator.
According to the record of patent document 1, the chip protection film can form laser marking knowledge by irradiation energy line
Other property, hardness and the diaphragm being improved with the adaptation of chip, and compared with existing chip protection film,
The simplification of process can be realized.
In addition, Patent Document 2 discloses a kind of one-piece type wafer back surface protective film of dicing tape, it, which has, includes base material
And the dicing tape of adhesive phase, and have on the adhesive phase of the dicing tape and have passed through coloring and with given springform
The wafer back surface protective film of amount.
According to the record of patent document 2, the wafer back surface protective film can be played in the cutting action of semiconductor wafer
The excellent confining force gone out between semiconductor wafer.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2009-138026 publications
Patent document 2：Japanese Unexamined Patent Publication 2010-199543 publications
The content of the invention
Problems to be solved by the invention
However, in the process that the diaphragm disclosed in by patent document 1 and 2 is pasted onto on chip, in the viscous of diaphragm
Patch position produces dislocation or is pasting diaphragm in the way of also including foreign matter in the state of not finding the foreign matter on chip
In the case of, it is difficult to carry out peeling off again for chip after diaphragm is peeled off.
For the diaphragm disclosed in patent document 1 and 2, if closely sealed between chip when being pasted for raising
Property, paste after confining force between chip purpose and be temporarily pasted onto on chip, then due to closely sealed between chip
Property it is high, thus there is in terms of releasable problem.And if the diaphragm for being about to temporarily be pasted onto on chip of being eager to excel is peeled off, then
Be likely to occur causes chip to occur damaged or the remnant diaphragm on chip situation by peeling force.Accordingly, it is difficult to real
The recycling of chip after now being pasted with diaphragm.
That is, in patent document 1 and 2, for described diaphragm, from when pasting it is closely sealed between chip
Property, paste after studied from the viewpoint of confining force between chip, but not no shelling again on diaphragm completely
From the research of property.
The present invention is completed in view of the above problems, and its object is to provide the excellent resin film formation of releasable to use
Piece and with resin film formation composite sheet of the resin film formation with piece and supporter.
The method solved the problems, such as
The present inventor etc. has found that the surface roughness that will be pasted with the surface of silicon wafer side is adjusted to more than set-point
Resin film formation piece can solve above-mentioned problem, and then complete the present invention.
That is, the present invention provides following [1]~[15].
[1] a kind of resin film formation piece, it is pasted on silicon wafer, for forming resin film on the silicon wafer
Piece, wherein,
It is more than 40nm to treat the surface roughness (Ra) that the surface (α) of the piece of side is pasted with silicon wafer.
[2] the resin film formation piece described in above-mentioned [1], it includes component of polymer (A) and curability composition (B).
[3] the resin film formation piece described in above-mentioned [2], wherein, component of polymer (A) includes acrylic polymer
(A1)。
[4] the resin film formation piece any one of above-mentioned [1]~[3], it includes thermosetting component (B1).
[5] the resin film formation piece any one of above-mentioned [1]~[4], it includes packing material (C).
[6] the resin film formation piece described in above-mentioned [5], wherein, relative to the total amount of above-mentioned resin film formation piece, fill out
The content for filling material (C) is 10~80 mass %.
[7] the resin film formation piece described in above-mentioned [5] or [6], wherein, the average grain diameter of packing material (C) for 100~
1000nm。
[8] the resin film formation piece any one of above-mentioned [1]~[7], it is to be used to be formed on silicon to protect
The diaphragm formation piece of cuticula.
[9] the resin film formation piece any one of above-mentioned [1]~[8], wherein, by above-mentioned resin film formation piece
Surface (α) be pasted on after silicon wafer, from forming the resin film formed with piece by the resin film and the silicon wafer opposite side
Surface (β ') determine gloss value be more than 25.
[10] a kind of resin film formation composite sheet, it has：
Resin film formation any one of above-mentioned [1]~[9] with piece and
Supporter.
[11] a kind of resin film formation composite sheet, it has：
Silicon wafer, the resin film formation piece for forming resin film on the silicon wafer are pasted on, and
Supporter (I),
The composite sheet, which has, treats the surface (α) with the above-mentioned resin film formation piece of silicon wafer stickup side and rough surface
Spend the structure of surface (i) the directly lamination of supporter (I) for more than 40nm.
[12] the resin film formation composite sheet described in above-mentioned [11], wherein, remove above-mentioned resin film formation composite sheet
The surface roughness (Ra) on the surface (α) of the above-mentioned resin film formation piece exposed during supporter (I) having is more than 40nm.
[13] the resin film formation composite sheet described in above-mentioned [11] or [12], wherein, piece bag is used in above-mentioned resin film formation
Containing thermosetting component (B1).
[14] the resin film formation composite sheet described in above-mentioned [11] or [12], it has in above-mentioned resin film formation piece
The surface (β) with surface (α) opposite side on further directly lamination has the structure of the 2nd supporter (II),
Above-mentioned resin film formation piece contains thermosetting component (B1).
[15] the resin film formation composite sheet described in above-mentioned [14], wherein, supporter (II) is with adhesive phase
Bonding sheet, the composite sheet has the adhesive phase and structure of the above-mentioned resin film formation with surface (β) the directly lamination of piece.
The effect of invention
The releasable of the resin film formation piece of the present invention is excellent.Therefore, by the present invention resin film formation piece
Temporarily it is pasted on when judging to need to carry out re-posted after silicon wafer, silicon wafer can be not being caused to occur damaged and suppressing residual
While the generation of slag, the resin film formation is peeled off with piece, and for having peeled off the silicon wafer after resin film formation piece,
Recycling can be realized.
It should be noted that in this manual, " releasable of resin film formation piece " refers to, is being pasted on
When being peeled off again after silicon wafer, silicon wafer can not caused to occur damaged and not remaining resin on silicon
Film formation is with the property that stripping is realized in the case of a part for piece.
Brief description of the drawings
[Fig. 1] is the profile of the resin film formation composite sheet of an embodiment of the invention.
Symbol description
1a, 1b, 1c, 1d resin film formation composite sheet
10 resin film formation pieces
11st, 11 ' supporter
12 fixture adhesive linkages
Embodiment
In the record of this specification, the weight average molecular weight (Mw) of each composition and the value of number-average molecular weight (Mn) are using solidifying
The value for the polystyrene standard conversion that glue penetration chromatogram (GPC) method is determined, is based on the method described in embodiment specifically
And the value determined.
In addition, in this manual, such as when using the term of " (methyl) acrylate ", expression is " acrylic acid
Both ester " and " methacrylate ", other similar terms are similarly.
In addition, in this manual, " energy line " refers to such as ultraviolet, electron beam.
[resin film formation piece]
The resin film formation of the present invention is to be pasted on silicon wafer, the piece for forming resin film on the silicon wafer with piece,
Wherein, treat to paste with silicon wafer the surface (α) of the piece of side surface roughness (Ra) (hereinafter also referred to as " surface (α's)
Surface roughness (Ra) ") it is more than 40nm.
The resin film formation piece of the present invention is more than 40nm due to surface (α) surface roughness (Ra), even if therefore
Temporarily it is pasted on by the resin film formation with piece after silicon wafer, can is not also causing silicon wafer to occur damaged and press down
While the generation of residue processed, the resin film formation is peeled off with piece, its releasable is excellent.
On the other hand, it is pasted on silicon with piece in the resin film formation by surface (α) surface roughness (Ra) less than 40nm
When being intended to be peeled off after chip, the residue of the resin film formation piece is produced on silicon sometimes.In addition, being intended to by force to
When it is peeled off, also sometimes result in silicon wafer and occur breakage.
From the above point of view, resin film of the invention is formed is preferably with the surface roughness (Ra) on the surface (α) of piece
More than 45nm, more preferably more than 50nm, more preferably more than 53nm, still more preferably be more than 55nm.
It should be noted that the higher limit of the surface roughness (Ra) as surface (α), from making the sight of releasable well
Point sets out, and is not particularly limited.
But from the viewpoint of the good resin film formation piece of the adaptation obtained between silicon wafer, tree of the invention
Adipose membrane formation is preferably below 150nm with the surface roughness (Ra) on the surface (α) of piece, is more preferably below 100nm, further
Preferably below 80nm.
In this specification, the surface roughness (Ra) of surface (α) refers to determine using the method described in embodiment
Value.
In addition, the surface roughness (Ra) of surface (α) for example can be by that can be included in resin film formation piece
Species, average grain diameter and content of the particle components such as packing material, colouring agent etc. are appropriately configured to adjust.In addition, also may be used
To be adjusted by the coarse supporter of coating surface.
It should be noted that in an embodiment of the invention, on resin film formation piece and surface (α) phase
The surface roughness (Ra) on the surface (β) tossed about, is not particularly limited, but preferably 5~80nm, more preferably 8~60nm, enter
One step is preferably 10~45nm.
When within the range, the surface (β ') of the resin film described below formed with piece will be easily formed by resin film
Gloss value is adjusted so as to higher.In addition, to forming the silicon wafer of the resin film formed with piece by resin film, by silicon wafer
It in the case that obtained chip etc. is carried out using inspections of electromagnetic wave such as infrared rays, can uprise the transmittance of electromagnetic wave.
The resin film formation of an embodiment of the invention is pasted on after silicon wafer with the surface (α) of piece, from by this
The gloss value that the surface (β ') of the side opposite with the silicon wafer for the resin film that resin film formation is formed with piece is determined is preferably 25
More than, more preferably more than 30, more preferably more than 35, still more preferably be more than 40.
When the gloss value on the surface (β ') of resin film is more than 25, the visual identity that can obtain laser printing is excellent
Resin film.
In an embodiment of the invention, form what is formed with piece as resin film formation with piece and by the resin film
Light transmittance of the resin film under wavelength 1250nm, preferably more than 25%, more preferably more than 30%, more preferably 35%
Above, still more preferably it is more than 40%.
When the light transmittance is more than 25%, ultrared transmittance becomes good, can be to possessing resin film formation piece
Or the silicon wafer or chip for by the resin film forming the resin film formed with piece carry out infrared inspection.That is, can be across resin
Crackle that film formation piece or resin film and easily finding out is produced on silicon wafer or chip etc., therefore, it is possible to make product finished product
Rate is improved.
It should be noted that light transmittance of the resin film formation piece under wavelength 1250nm refers to using described in embodiment
Method and the value that determines.
The resin film formation of the present invention is not particularly limited with the form of piece, can be such as bar-shape, single leaf label
Etc. form.
In addition, the resin film formation piece of the present invention can be the individual layers that are formed by a kind of composition or by 2
Plant the polylayer forest of combination of the above thing formation.
It should be noted that in the case that the resin film formation of an embodiment of the invention is polylayer forest with piece, it is right
In as surface (α) side formation material composition (α '), preferably so that the surface roughness (Ra) of surface (α) reach it is above-mentioned
The mode of scope is adjusted to species, the use level of its composition.
In an embodiment of the invention, resin film formation can suitably be set with the thickness of piece according to purposes, but
Preferably 1~300 μm, more preferably 3~250 μm, more preferably 5~200 μm, still more preferably be 7~150 μm.
In addition, being particularly used as resin film in the case where being pasted with the thickness of thin of silicon wafer of resin film formation piece
The thickness of formation piece, preferably 1~20 μm, more preferably 3~15 μm.
It should be noted that in the case where resin film formation piece is by more than the 2 layers polylayer forests constituted, it is also preferred that should
The gross thickness of polylayer forest is in above range.
<The constituent of resin film formation piece>
As long as the surface roughness (Ra) on the resin film formation piece surface (α) of an embodiment of the invention is upper
The piece of scope is stated, then is not particularly limited for its constituent.
But from the viewpoint of the good resin film formation piece of the shape retention for obtaining sheet, a reality of the invention
The resin film formation piece for applying mode is preferably the piece comprising component of polymer (A) and curability composition (B).
In addition, being adjusted from by surface (α) surface roughness (Ra) to the viewpoint of above range and will be by resin film shape
Thermal coefficient of expansion into the resin film formed with piece is adjusted to appropriate scope, an embodiment of the invention
Resin film formation preferably comprises packing material (C) with piece.
Further, in the range of effect of the present invention is not destroyed, the resin film of an embodiment of the invention can be made
Formation further includes more than a kind be selected from colouring agent (D), coupling agent (E) and universal additive (F) with piece.
Hereinafter, for can turn into an embodiment of the invention resin film formation piece constituent it is above-mentioned
Composition (A)~(F) is illustrated.
[component of polymer (A)]
In this manual, described " component of polymer " represent be by HMW body obtained from polymerisation,
It is the compound with least one kind of repeat unit.
The resin film formation piece used in an embodiment of the invention, by containing component of polymer (A), energy
It is enough to be easily endowed flexibility, so that the shape retention of sheet is good.As a result, can be by the storage of resin film formation piece
Energy modulus is adjusted to above range.
As component of polymer (A) weight average molecular weight (Mw), adjusted from by the storage modulus of gained resin film formation piece
It is whole to from the viewpoint of above range, preferably more than 20,000, more preferably 20,000~3,000,000, more preferably 100,000~200
Ten thousandth, still more preferably it is 150,000~1,500,000.
As acrylic polymer (A1) glass transition temperature (Tg), be preferably more than -40 DEG C, be more preferably -
30~50 DEG C, more preferably -20~20 DEG C, still more preferably be -15~0 DEG C.
It should be noted that in this manual, the value of the glass transition temperature (Tg) of acrylic polymer etc. is
Will be using following formula (1) calculating with absolute temperature (unit：K) glass transition temperature (the Tg representedK) it is scaled temperature Celsius
Spend (unit：DEG C) obtained from be worth.
[mathematical expression 1]
[in above-mentioned formula (1), W1、W2、W3、W4... represent to constitute the mass fraction (matter of the monomer component of component of polymer
Measure %), Tg1、Tg2、Tg3、Tg4... represent to constitute the glass transition temperature of the homopolymer of each monomer component of component of polymer
(unit：K).]
In an embodiment of the invention, relative to the total amount (100 mass %) of resin film formation piece, resin film
To be formed with the content of the component of polymer (A) in piece be preferably 5~60 mass %, more preferably 8~50 mass %, further excellent
Elect 10~45 mass % as, be still more preferably 15~40 mass %.
It should be noted that in this manual, " relative to the content of the composition (A) of the total amount of resin film formation piece "
With " composition (A) relative to the total amount of the active ingredient in the composition as the formation material of resin film formation piece contains
Amount " is identical.It is also identical on the content of other compositions of following explanation.
Further, above-mentioned " active ingredient " refers in composition except solvent etc. will not be directly and indirectly to anti-
Composition beyond the material that the physical property for the piece that should, be formed is impacted, specifically, expression is water and organic solvent equal solvent
Composition in addition.
Component of polymer (A) preferably comprises acrylic polymer (A1).
In addition, component of polymer (A) can also include non-acrylic compounds while comprising acrylic polymer (A1)
Polymer (A2).
These component of polymer may be used singly or in combination of two or more.
In an embodiment of the invention, as relative to resin film formation with the component of polymer included in piece
(A) content of the acrylic polymer (A1) of total amount (100 mass %), preferably 50~100 mass %, more preferably 60
~100 mass %, more preferably 70~100 mass %, still more preferably be 80~100 mass %.
(acrylic polymer (A1))
Adjust supreme from for resin film formation piece imparting flexibility and film forming, by the storage modulus of resin film formation piece
State from the viewpoint of scope, the weight average molecular weight (Mw) of acrylic polymer (A1) is preferably 20,000~3,000,000, is more preferably
100000~1,500,000, it is more preferably 150,000~1,200,000, is still more preferably 250,000~1,000,000.
As acrylic polymer (A1), the polymer using (methyl) alkyl acrylate as principal component can be enumerated, is had
For body, the construction unit of (methyl) alkyl acrylate from the alkyl with carbon number 1~18 is preferably included
(a1) acrylic polymer, or further include third of the other structures unit (a2) beyond construction unit (a1)
Olefin(e) acid analog copolymer.
It should be noted that acrylic polymer (A1) may be used singly or in combination of two or more.
In addition, in the case that acrylic polymer (A1) is copolymer, the form of the copolymer can be block copolymerization
Any form in thing, random copolymer, alternate copolymer, graft copolymer.
(construction unit (a1))
As the carbon number of the alkyl of (methyl) alkyl acrylate for constituting construction unit (a1), from for resin film shape
Into from the viewpoint of with piece imparting flexibility and film forming, preferably 1~18, more preferably 1~12, more preferably 1~8.
As (methyl) alkyl acrylate, it can enumerate for example：(methyl) methyl acrylate, (methyl) ethyl acrylate,
(methyl) propyl acrylate, (methyl) butyl acrylate, (methyl) amyl acrylate, (methyl) 2-EHA, (first
Base) Isooctyl acrylate monomer, (methyl) n-octyl, the positive nonyl ester of (methyl) acrylic acid, the different nonyl ester of (methyl) acrylic acid, (first
Base) decyl acrylate, (methyl) lauryl acrylate, (methyl) stearyl acrylate ester etc..
It should be noted that these (methyl) alkyl acrylates may be used singly or in combination of two or more.
Among these, (methyl) alkyl acrylate of the alkyl preferably with carbon number 1~3, more preferably (methyl)
Methyl acrylate.
Relative to the entire infrastructure unit (100 mass %) of acrylic polymer (A1), acrylic polymer (A1)
In the content of construction unit (a11) of (methyl) alkyl acrylate for being derived from the alkyl with carbon number 1~3 be preferably
5~80 mass %, more preferably 15~70 mass %, more preferably 25~60 mass %.
Additionally, it is preferred that (methyl) alkyl acrylate of the alkyl with carbon number 4~12, more preferably (methyl) propylene
Acid butyl ester.
Relative to the entire infrastructure unit (100 mass %) of acrylic polymer (A1), acrylic polymer (A1)
In be derived from carbon number 4~12 alkyl (methyl) alkyl acrylate construction unit (a12) content it is preferred
For 5~80 mass %, more preferably 15~70 mass %, more preferably 20~60 mass %.
It should be noted that as the acrylic polymer (A1) used in an embodiment of the invention, it is excellent
Elect the acrylic copolymer while comprising said structure unit (a11) and construction unit (a12) as.
As the acrylic copolymer construction unit (a11) and construction unit (a12) contain than [(a11)/
(a12)] (mass ratio), preferably 20/80~95/5, more preferably 30/70~90/10, more preferably 40/60~85/
15th, still more preferably it is 52/48~75/25.
Relative to the entire infrastructure unit (100 mass %) of acrylic polymer (A1), acrylic polymer (A1)
In construction unit (a1) content be preferably more than 50 mass %, more preferably 50~99 mass %, more preferably 55
~98 mass %, still more preferably be 60~97 mass %.
(construction unit (a2))
In the range of effect of the present invention is not destroyed, the acrylic used in an embodiment of the invention
Thing (A1) can also have the other structures unit (a2) in addition to said structure unit (a1).
As the monomer for constituting construction unit (a2), it can enumerate for example：Hydroxyl monomer, carboxyl group-containing monomer, containing epoxy radicals
Monomer etc. contains monomer；The vinyl ester monomer such as vinyl acetate, propionate；The alkene such as ethene, propylene, isobutene
Hydrocarbon monomer；The aromatic vinyl monomers such as styrene, methyl styrene, vinyltoluene；The diene such as butadiene, isoprene
Class monomer；Nitrile monomers such as (methyl) acrylonitrile etc..
Among these, preferably containing monomer, more preferably selected from hydroxyl monomer and containing 1 in epoxy based monomers
More than kind.
As hydroxyl monomer, it can enumerate for example：(methyl) acrylic acid 2- hydroxy methacrylates, (methyl) acrylic acid 2- hydroxyls third
Ester, (methyl) acrylic acid 3- hydroxy propyl esters, (methyl) acrylic acid 2- hydroxybutyls, (methyl) acrylic acid 3- hydroxybutyls, (first
Base) (methyl) the hydroxyalkyl acrylates class such as acrylic acid 4- hydroxybutyls；Unsaturation alcohols such as vinyl alcohol, allyl alcohol etc..
Among these, preferred (methyl) acrylic acid 2- hydroxy methacrylates.
As carboxyl group-containing monomer, (methyl) acrylic acid, maleic acid, fumaric acid, itaconic acid etc. can be enumerated.
As containing epoxy based monomers, it can enumerate for example：(methyl) glycidyl acrylate, (methyl) acrylic acid Beta-methyl
Ethylene oxidic ester, (methyl) acrylic acid (3,4- epoxycyclohexyls) methyl esters, (methyl) acrylic acid 3- epoxide ring -2- hydroxy propyl esters etc.
(methyl) acrylate containing epoxy radicals；The non-acrylic compounds such as crotons acid glycidyl ester, allyl glycidyl ether contain ring
Epoxide monomer；Etc..
It should be noted that with the acrylic polymer that the Mw from the construction unit containing epoxy based monomers is more than 20,000
Compound has thermosetting, but is not curability composition (B), but is considered as included in component of polymer (A) concept.
The acrylic polymer (A1) used in an embodiment of the invention is preferably comprised from hydroxyl list
The construction unit (a21) of body.
Relative to the entire infrastructure unit (100 mass %) of acrylic polymer (A1), acrylic polymer (A1)
In the construction unit (a21) from hydroxyl monomer content be preferably 1~40 mass %, more preferably 5~30 mass %,
More preferably 8~25 mass %, still more preferably be 10~20 mass %.
In addition, the acrylic polymer (A1) used in an embodiment of the invention is preferably comprised from containing ring
The construction unit (a22) of epoxide monomer.
Relative to the entire infrastructure unit (100 mass %) of acrylic polymer (A1), acrylic polymer (A1)
In the content from the construction unit (a22) containing epoxy based monomers be preferably 1~40 mass %, more preferably 5~30 matter
Measure %, more preferably 8~25 mass %.
In addition, in the case of using epoxy-based thermosetting composition as the curability composition (B) described below, carboxyl with
Epoxy radicals in epoxy-based thermosetting composition can react, therefore, in acrylic polymer (A1), preferably originate from containing carboxylic
The poor situation of the construction unit of base monomer.
In the case where using epoxy-based thermosetting composition as curability composition (B), relative to acrylic polymer
(A1) entire infrastructure unit (100 mass %), the content of the construction unit from carboxyl group-containing monomer is preferably 0~10 matter
Measure %, more preferably 0~5 mass %, more preferably 0~2 mass %, be still more preferably 0 mass %.
Relative to the entire infrastructure unit (100 mass %) of acrylic polymer (A1), acrylic polymer (A1)
In construction unit (a2) content be preferably 1~50 mass %, more preferably 2~45 mass %, more preferably 3~40
Quality %.
(non-acrylic resin (A2))
The resin film formation piece of an embodiment of the invention can also contain as needed and be used as aforesaid propylene
The non-acrylic polymer (A2) of component of polymer beyond acids polymers (A1).
As non-acrylic polymer (A2), it can enumerate for example：It is polyester, phenoxy resin, makrolon, polyethers, poly-
Urethane, polysiloxanes, rubber polymer etc..
These non-acrylic polymers (A2) may be used singly or in combination of two or more.
As non-acrylic polymer (A2) weight average molecular weight (Mw), preferably more than 20,000, more preferably 20,000~
100000, it is more preferably 20,000~80,000.
[curability composition (B)]
Curability composition (B) be the resin film that plays a part of making resin film formation be solidified to form hard with piece into
Point, it is the compound that weight average molecular weight (Mw) is less than 20,000.
In the resin film formation piece used in the present invention, as curability composition (B), thermosetting component is preferably comprised
(B1) and at least one of energy ray-curable composition (B2), from making the viewpoint and reduce into that curing reaction fully carries out
From the viewpoint of this, more preferably at least comprising thermosetting component (B1).
As thermosetting component (B1), the chemical combination at least with the functional group that can be reacted by heating is preferably comprised
Thing.
In addition, energy ray-curable composition (B2) contains the change with the functional group reacted by irradiation energy line
Compound (B21), so as to occur polymerizing curable when being irradiated by energy line.
The functional group that these curability compositions have reacts with each other and forms tridimensional network, is achieved in solid
Change.
For curability composition (B) weight average molecular weight (Mw), shape is suppressed from by being applied in combination with composition (A)
The formation of resin film is with the viscosity of the composition of piece, improving operability etc., viewpoint is set out, and preferably shorter than 20,000, more preferably
Less than 10,000, it is more preferably 100~10,000.
(thermosetting component (B1))
It is used as thermosetting component (B1), preferably epoxy-based thermosetting composition.
As epoxy-based thermosetting composition, preferably it is applied in combination while using compound (B11) with epoxy radicals
Thermal curing agents (B12).
As the compound (B11) (hereinafter also referred to " epoxide (B11) ") with epoxy radicals, it can enumerate for example：
Multi-functional epoxy resin, bisphenol-A diglycidyl ether and its hydrogenation thing, the phenolic aldehyde such as cresol novolak type epoxy resin are clear
Paint shaped epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy
With epoxide more than 2 functions etc. in resin, phenylene matrix type epoxy resin equimolecular.
These epoxides (B11) may be used singly or in combination of two or more.
Among these, more than a kind in phenolic resin varnish type epoxy resin and biphenyl type epoxy resin is preferably comprised.
In addition, in an embodiment of the invention, epoxide (B11) preferably is contained at 25 DEG C as liquid
Epoxide (hereinafter also referred to " liquid epoxy compound ").
It by making epoxide (B11) include liquid epoxy compound, can stretch the fracture of resin film formation piece
The value of long rate rises, and can obtain the excellent resin film formation piece of releasable.
In an embodiment of the invention, from the above point of view, relative to the epoxy in resin film formation piece
The total amount (100 mass %) of compound (B11), the content of liquid epoxy compound is preferably more than 10 mass %, more preferably
More than 15 mass %, more preferably more than 30 mass %, still more preferably be more than 40 mass %.
On the other hand, the viewpoint of the reliability of the chip of the tape tree adipose membrane manufactured from raising using resin film formation piece
Set out, relative to the total amount (100 mass %) of the epoxide (B11) in resin film formation piece, liquid epoxy compound
Content be preferably below 90 mass %, more preferably below 80 mass %, more preferably below 75 mass %, more enter one
Step is preferably below 70 mass %.
It should be noted that in this manual, " the liquid epoxy compound " refers to that the viscosity at 25 DEG C is
Below 40Pas epoxide.In addition, in this manual, viscosity of the epoxide at 25 DEG C is to be based on JIS Z
8803rd, using E types viscosimeter in 25 DEG C of values determined.
Relative to the mass parts of composition (A) 100, the content of epoxide (B11) is preferably 1~500 mass parts, more preferably
For 3~300 mass parts, more preferably 5~150 mass parts, be still more preferably 10~100 mass parts.
(thermal curing agents (B12))
Thermal curing agents (B12) function as the curing agent relative to epoxide (B11).
There are more than 2 compounds that can be with the functional group of epoxy reaction as thermal curing agents, in preferably 1 molecule.
As the functional group, it can enumerate：Phenolic hydroxyl group, alcoholic extract hydroxyl group, amino, carboxyl and acid anhydrides etc..In these functional groups, preferably
Phenolic hydroxyl group, amino or acid anhydrides, more preferably phenolic hydroxyl group or amino, further preferred amino.
As the phenols thermal curing agents with phenolic hydroxyl group, it can enumerate for example：Multifunctional phenolic resin, xenol, phenolic aldehyde are clear
Paint shaped phenolic resin, dicyclopentadiene type phenolic resin, XYLOK types phenolic resin, aralkyl-type phenol resin etc..
As the amine thermal curing agents with amino, it can enumerate for example：Dicyandiamide (DICY) etc..
These thermal curing agents (B12) may be used singly or in combination of two or more.
Among these, amine thermal curing agents are preferably comprised.
Relative to the mass parts of epoxide (B11) 100, the content of thermal curing agents (B12) is preferably 0.1~500 mass
Part, more preferably 0.5~300 mass parts, more preferably 1~200 mass parts.
(curing accelerator (B13))
For the resin film formation piece of an embodiment of the invention, from the consolidating based on heating for adjusting the piece
Change from the viewpoint of speed, curing accelerator (B13) can also be contained.
Curing accelerator (B13) is preferably applied in combination with the epoxide (B11) as thermosetting component (B1).
As curing accelerator (B13), it can enumerate for example：Triethylenediamine, benzyldimethylamine, 2,4, triethanolamine, two
The tertiary amines such as methyl amino ethanol, three (dimethylaminomethyl) phenol；2-methylimidazole, 2- phenylimidazoles, 2- phenyl -4- first
The imidazoles such as base imidazoles, 2- phenyl -4,5- bishydroxymethyls imidazoles, 2- phenyl -4- methyl -5- hydroxymethylimidazoles；Tributyl
Organic phosphine such as phosphine, diphenylphosphine, triphenylphosphine；TetraphenylFour benzene such as tetraphenyl borate, triphenylphosphine tetraphenylborate
Base boron salt etc..
These curing accelerators (B13) may be used singly or in combination of two or more.
Formed from improving by resin film from the viewpoint of the cementability of the resin film formed with piece, relative to epoxide
(B11) and thermal curing agents (B12) the mass parts of total amount 100, the content of curing accelerator (B13) is preferably 0.01~10 mass
Part, more preferably 0.1~6 mass parts, more preferably 0.3~4 mass parts.
(energy ray-curable composition (B2))
As energy ray-curable composition (B2), it can also be used alone with being reacted by irradiation energy line
The compound (B21) of functional group, but Photoepolymerizationinitiater initiater (B22) preferably is applied in combination while using compound (B21).Need
It is noted that the composition that energy ray-curable composition (B2) solidifies preferably by ultraviolet.
(compound (B21) with the functional group reacted by irradiation energy line)
It is used as compound (B21) (hereinafter also referred to " energy with the functional group reacted by irradiation energy line
Line reactive compounds (B21) "), it can enumerate for example：Trimethylolpropane tris (methyl) acrylate, (first of pentaerythrite three
Base) acrylate, pentaerythrite four (methyl) acrylate, dipentaerythritol monohydroxy five (methyl) acrylate, two seasons penta
It is tetrol six (methyl) acrylate, 1,4- butanediols two (methyl) acrylate, 1,6-HD two (methyl) acrylate, low
Polyester (methyl) acrylate, carbamate (methyl) acrylate quasi-oligomer, epoxy (methyl) acrylate, polyethers
(methyl) acrylate, itaconic acid oligomer etc..
These energy line reactive compounds (B21) may be used singly or in combination of two or more.
It should be noted that the weight average molecular weight (Mw) of energy line reactive compounds (B21) is preferably 100~30,
000th, 200~20,000, more preferably 300~10,000 are more preferably.
Relative to the mass parts of composition (A) 100, the content of energy line reactive compounds (B21) is preferably 1~1500 mass
Part, more preferably 3~1200 mass parts, more preferably 5~1000 mass parts.
(Photoepolymerizationinitiater initiater (B22))
By the way that Photoepolymerizationinitiater initiater (B22) is applied in combination while using above-mentioned energy line reactive compounds (B21),
The polymerizing curable time can be shortened, even if reducing light exposure, resin film formation can also carried out with the solidification of piece.
As Photoepolymerizationinitiater initiater (B22), it can enumerate for example：Benzoin compound, acetophenone compound, acylphosphine oxide
Compound, cyclopentadiene titanium compound, thioxanthone compounds, peroxide compound etc..
As more specifically Photoepolymerizationinitiater initiater, it can enumerate for example：1- hydroxycyclohexylphenylketones, benzoin, benzoin
Methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldiphenyl thioether, tetramethylthiuram monosulfide, azo two are different
Butyronitrile, bibenzyl, diacetyl, β-chloroanthraquinone, 2,4,6- trimethyl benzyl diphenyl phosphine oxides etc..
These Photoepolymerizationinitiater initiaters may be used singly or in combination of two or more.
From the viewpoint of from making resin film formation fully be carried out with the curing reaction of piece, while suppressing the generation of residue,
Relative to the mass parts of energy line reactive compounds (B21) 100, the content of Photoepolymerizationinitiater initiater (B22) is preferably 0.1~10 matter
Measure part, more preferably more preferably 0.5~8 mass parts, 1~5 mass parts.
In an embodiment of the invention, relative to the total amount (100 mass %) of resin film formation piece, resin film
To be formed with the content of the curability composition (B) in piece be preferably 5~50 mass %, more preferably 8~40 mass %, further excellent
Elect 10~30 mass % as, be still more preferably 12~25 mass %.
It should be noted that above-mentioned " content of curability composition (B) " refers to above-mentioned include epoxide
(B11), the thermosetting component (B1) of thermal curing agents (B12) and curing accelerator (B13) and the reactive chemical combination of energy line is included
The total content of the energy ray-curable composition (B2) of thing (B21) and Photoepolymerizationinitiater initiater (B22).
[packing material (C)]
The resin film formation of an embodiment of the invention preferably comprises packing material (C) with piece.
By the way that comprising packing material (C), easily the surface roughness (Ra) on the surface (α) of resin film formation piece is adjusted
To above range.
In addition, for the resin film formation piece comprising packing material (C), can be by the heat of the resin film formed
The coefficient of expansion is adjusted to appropriate scope, makes being optimal of thermal coefficient of expansion of the chip of tape tree adipose membrane, thus, it is possible to improve
It is assembled with the reliability of the semiconductor device of the chip.The resin formed with piece is formed by the resin film in addition it is possible to reduce
The hydroscopicity of film.
As packing material (C), it can enumerate：The organic filler materials such as polymethyl methacrylate filler, rubber-like particle,
And silica, aluminum oxide, talcum, calcium carbonate, titanium oxide, iron oxide, carborundum, boron nitride etc. powder, by these materials
Material carries out the inorganic filling materials such as pearl, mono-crystlling fibre and the glass fibre of spheroidization.
These packing materials (C) may be used singly or in combination of two or more.
Among these, in resin film formation piece in the case of heat cured, from viewpoints such as excellent heat resistances, preferably
Inorganic filling material, more preferably silica or aluminum oxide.
In an embodiment of the invention, from easily by the surface (α) of the resin film formation piece formed
Surface roughness (Ra) is adjusted to above range, and the average grain diameter of packing material (C) is preferably 3~20 μm, more
Preferably 5~15 μm.
If packing material of the average grain diameter in above range, even in the less situation of the content of packing material (C)
Under, also easily the resin film formation formed can be adjusted to above-mentioned model with the surface roughness (Ra) on the surface (α) of piece
Enclose.
However, using compound by more adding the content of packing material (C) or forming the resin film described below formation
The composition of piece, then, also can be by the tree formed in the case of the packing material (C) with smaller average grain diameter is used
Adipose membrane formation is adjusted to above range with the surface roughness (Ra) on the surface (α) of piece.
As the average grain diameter of the packing material (C) in the case of above-mentioned, preferably 100~1000nm, more preferably 200~
900nm, more preferably 200~800nm, still more preferably for 300~750nm, much further preferably from 400~
700nm。
The average grain diameter of packing material (C) be more than 100nm when, easily by adjustment packing material (C) content and incite somebody to action
Resin film formation is adjusted to above range with the surface roughness (Ra) on the surface (α) of piece.
In addition, when the average grain diameter of packing material (C) is below 1000nm, there are following (1)~(4).
(1) it can make resin film formation being pasted on after silicon wafer from by the resin film with the surface (α) of piece and form use
The gloss value that the surface (β ') of the side opposite with the silicon wafer of the resin film of piece formation is determined is improved.
(2) transmittance of the electromagnetic waves such as infrared ray to resin film formation piece and above-mentioned resin bed can easily be improved.Its
As a result, the inspection based on electromagnetic wave is being carried out to there is resin film formation with silicon wafer, chip of piece and resin bed etc.
Under, because the transmittance of electromagnetic wave is high, therefore the efficiency of Inspection improves.
(3) silicon wafer with resin film formation piece and above-mentioned resin film is being irradiated in the technique of laser, easily kept away
Exempt from the problem of laser diffusion is such because caused by there is resin film formation piece and resin film.
(4) when manufacturing such as less than 20 μm of the resin film formation piece of thinner thickness, used as resin film formation
In the painting process of the composition of the formation material of piece, being formed not for the film as caused by particle diameter big packing material is easily avoided
It is good to wait adverse effect.
With piece it is the polylayer forest that is formed by two or more composition in the resin film formation of an embodiment of the invention
In the case of, preferably coordinate above range in the composition as the formation material of surface (α) side of the resin film formation piece
Average grain diameter packing material (C) and the surface roughness (Ra) to surface (α) is adjusted.
On the other hand, from making the surface from the side opposite with the silicon wafer that the resin film formed with piece is formed by resin film
From the viewpoint of the gloss value that (β ') is determined is improved, preferably coordinate in the composition as the formation material of surface (β) side
Packing material (C ') with the small average grain diameter different from above range.
As packing material (C ') average grain diameter, usually 1~400nm, be preferably 1~250nm, more preferably 1~
100nm。
It should be noted that in this manual, packing material (C) and (C ') average grain diameter refer to dissipate using dynamic optical
The value penetrated formula grain-distribution detection instrument (Nanotrack Wave-UT151, Nikkiso Company Limited's system) and determined.
In an embodiment of the invention, from by the surface roughness (Ra) on the surface (α) of resin film formation piece
Adjust the reliability to the viewpoint of above range and the chip for making the tape tree adipose membrane manufactured using the resin film formation piece
From the viewpoint of good, relative to the total amount (100 mass %) of resin film formation piece, the filling material in resin film formation piece
Material (C) content be preferably 10~80 mass %, more preferably 20~70 mass %, more preferably 30~65 mass %,
Still more preferably it is 40~60 mass %.
In an embodiment of the invention, as the component of polymer (A) in resin film formation piece, curability into
The total content of point (B) and packing material (C), with the total amount (100 mass %) of piece is preferably 60 matter relative to resin film formation
Measure more than %, more preferably more than 70 mass %, more preferably more than 80 mass %, be still more preferably 90 mass %
More than.
[colouring agent (D)]
The resin film formation piece of an embodiment of the invention can also further include colouring agent (D).
By making resin film formation piece contain colouring agent (D), by with forming the resin formed with piece by resin film
When the semiconductor chip of film is assembled into equipment, be difficult visuognosis to semiconductor wafer grinding when the grinding trace, the energy that produce
Enough repair the outward appearance of semiconductor chip.
As colouring agent (D), the pigment and dyestuff of organic or inorganic can be used.
As dyestuff, such as acid dyes, reactive dye, direct dyes, disperse dyes, the dye of positive ion in it is any
Dyestuff can be used.
In addition, as pigment, being not particularly limited, it can suitably select to use from known pigment, for example, phthalocyanine system
Blue pigment, isoindoline system yellow uitramarine and pyrrolo-pyrrole-dione system red pigment or carbon black, iron oxide, titanium dioxide
Black pigments such as manganese, nigrosine, activated carbon etc..
These colouring agents (D) may be used singly or in combination of two or more.
It should be noted that by by phthalocyanine system blue pigment, isoindoline system yellow uitramarine and pyrrolo-pyrrole-dione
Be that red pigment is used in mixed way, be readily obtained make red area light transmittance improve while, visible ray transmittance
Low resin film.
As colouring agent (D) average grain diameter, preferably below 400nm, more preferably below 300nm, further preferably
For below 200nm, be still more preferably below 100nm, additionally, it is preferred that being more than 10nm, more preferably more than 20nm.
In an embodiment of the invention, relative to the total amount (100 mass %) of resin film formation piece, resin film
Formation is preferably 0.01~20 mass % with the content of the colouring agent (D) in piece, is more preferably 0.05~15 mass %, further
Preferably 0.1~10 mass %, still more preferably be 0.15~5 mass %.
[coupling agent (E)]
The resin film formation piece of an embodiment of the invention can also further include coupling agent (E).
By comprising coupling agent (E), the heat-resisting of the resin film formed with piece can be formed not destroying gained by resin film
Property in the case of make its water resistance improve.In addition, also helping the raising of the end adaptation after being pasted with silicon wafer.
It is preferably the compound that the functional group having with composition (A), composition (B) reacts as coupling agent (E),
More preferably silane coupler.
As silane coupler, it can enumerate for example：γ-glycidoxypropyltrime,hoxysilane, γ-glycidoxy
Hydroxypropyl methyl diethoxy silane, β-(3,4- epoxycyclohexyls) ethyl trimethoxy silane, γ-(methacryloxy third
Base) trimethoxy silane, gamma-amino propyl trimethoxy silicane, N- β-(amino-ethyl)-gamma-amino propyl trimethoxy silicon
Alkane, N- β-(amino-ethyl)-gamma-amino hydroxypropyl methyl diethoxy silane, N- phenyl-gamma-amino propyl trimethoxy silicane,
γ-urea propyl-triethoxysilicane, γ-mercaptopropyl trimethoxysilane, γ-mercapto hydroxypropyl methyl dimethoxysilane, double (3- tri-
Triethoxysilyl propyl group) tetrasulfide, MTMS, MTES, vinyl trimethoxy
Silane, vinyltriacetoxy silane, imidizole silane etc..
These coupling agents (E) may be used singly or in combination of two or more.
It is used as coupling agent (E), preferably oligomeric coupling agent.
As also include oligomeric coupling agent coupling agent (E) molecular weight, preferably 100~15000, more preferably
150~10000, be more preferably 200~5000, be still more preferably 250~3000, be still more preferably 350~
2000。
In an embodiment of the invention, relative to the total amount (100 mass %) of resin film formation piece, resin film
Formation is preferably 0.01~3.0 mass %, more preferably 0.03~1.5 mass % with the content of the coupling agent (E) in piece, enters one
Step is preferably 0.05~0.8 mass %, is still more preferably 0.1~0.3 mass %.
[universal additive (F)]
In the resin film formation piece used in an embodiment of the invention, the model of effect of the present invention is not being destroyed
In enclosing, in addition to mentioned component, universal additive (F) can also be contained as needed.
As universal additive (F), it can enumerate for example：Crosslinking agent, plasticizer, levelling agent, antistatic additive, antioxidant, from
Sub- capturing agent, getter, chain-transferring agent etc..
These respective content phases of universal additive (F) in the resin film formation piece of an embodiment of the invention
For resin film formation with the total amount (100 mass %) of piece be preferably 0~10 mass %, more preferably 0~5 mass %, enter one
Step is preferably 0~2 mass %.
<The manufacture method of resin film formation piece>
As the present invention resin film formation piece manufacture method, be not particularly limited, can using known to method come
Manufacture.
For example, being used preparing as the formation of the resin film comprising above-mentioned each composition of the formation material of resin film formation piece
After composition, it is suitably added organic solvent and is diluted, obtains the solution of resin film formation composition.Then, this is set
Film is formed on the supporter that the solution of adipose membrane formation composition is described below using known coating method coating, and
Make the dried coating film, thus can manufacture resin film formation piece.
It should be noted that adjusting supreme from by the surface roughness (Ra) on the surface (α) of gained resin film formation piece
State from the viewpoint of scope, as the manufacture method of resin film formation piece, preferably include that resin film formation piece will be used as
The resin film formation for forming material is coated on the supporter with the surface that surface roughness (Ra) is more than 40nm with composition
The surface on and form film and the process that the film is dried.
For above-mentioned resin film formation composition, it suitably can also add solvent to be diluted, so as to form tree
The form of the solution of adipose membrane formation composition.
In addition, the surface roughness (Ra) on the surface having as above-mentioned supporter, preferably more than 40nm, more
Preferably more than 70nm, more preferably more than 100nm, still more preferably for more than 200nm, much further preferably from
More than 300nm, additionally, it is preferred that being below 1000nm, more preferably below 800nm, more preferably below 500nm.
In addition, in the case that the resin film formation of an embodiment of the invention is polylayer forest with piece, being used as the resin
The manufacture method of film formation piece or for example include the manufacture method of following processes：Pass through the supporter more than 2
On be respectively coated the solution of resin film formation composition and form film, and fit the film and film lamination will be applied, Ran Houjin
The dry process of row.
As the organic solvent of the solution for preparing resin film formation composition, it can enumerate for example：Toluene, acetic acid second
Ester, MEK etc..
It with the solid component concentration of the solution of composition is preferably 10 to coordinate the resin film formation in the case of organic solvent
~80 mass %, more preferably 20~70 mass %, more preferably 30~65 mass %.
As coating method, it can enumerate for example：Spin-coating method, spraying process, stick coating method, scraper for coating method, rolling method, roller cutter painting
Cloth method, scraper plate rubbing method, die coating method, gravure coating process etc..
<The purposes of resin film formation piece>
The resin film formation piece of an embodiment of the invention can be pasted on the chip semiconductor of upside-down mounting mode
The back side of the workpiece such as the silicon wafers such as chip, semiconductor chip and resin film is formed on workpiece.There is the resin film protection partly to lead
The function as diaphragm at the back side of the workpiece such as body chip, semiconductor chip.For example, being pasted on the situation of semiconductor wafer
Under, resin film has the function of reinforcement chip, breakage therefore, it is possible to prevent chip etc..
That is, the resin film formation of an embodiment of the invention is preferably used for forming diaphragm on silicon with piece
Diaphragm formation piece.
In addition, conduct can also be assigned by forming the resin film formed with piece by the resin film of an embodiment of the invention
The function of adhesive sheet.That is, had using resin film formed by the resin film formation piece of an embodiment of the invention and made
In the case of function for adhesive film, the chip with the resin film can be bonded in brilliant pad portion or other semiconductor chips etc.
On other components (in chip carrying portion), it can aid in manufacture the productive raising of semiconductor device.
That is, can also using the resin film formation of an embodiment of the invention with piece as to be formed on silicon
The adhesive film formation piece of adhesive film.
[composition of resin film formation composite sheet]
The resin film formation of the present invention has the resin film shape of the present invention with composite sheet (hereinafter also referred to as " composite sheet ")
Into with piece and supporter.
, can be with it should be noted that the form of the composite sheet on an embodiment of the invention, is not particularly limited
It is the form such as bar-shape, single leaf label.
Fig. 1 is the profile of the resin film formation composite sheet of an embodiment of the invention.
As the composite sheet of an embodiment of the invention, it can enumerate such with supporter 11 shown in Fig. 1 (a)
Upper direct lamination has the composite sheet 1a of the structure of resin film formation piece 10.
As the shape of the resin film formation piece 10 of the composite sheet of an embodiment of the invention, as long as with conduct
The essentially identical shape of the silicon wafer of adherend or the shape of silicon wafer can be included.
It should be noted that in Fig. 1 (a) composite sheet 1a, supporter 11 and resin film formation use piece 10 in essentially identical
Shape but it is also possible to be resin film formation is less than the shape of supporter 11 with the shape of piece 10 as shown in Fig. 1 (b)
Composite sheet 1b.
In addition, as the composite sheet of an embodiment of the invention, can enumerate has ring as shown in Fig. 1 (c)
The composite sheet 1c of the fixture adhesive linkage 12 of shape.
The fixture adhesive linkage 12 of ring-type is in order at the bonding improved when Nian Jie with the fixture such as ring-shaped frame for the fixture
The purpose of power and the layer set, it can be formed by the double-sided adhesive sheet with base material (core) or by adhesive.
It should be noted that in the composite sheet 1c shown in Fig. 1 (c), shown is the composite sheet relative to Fig. 1 (a)
1a is further provided with the structure of fixture adhesive linkage 12, but as the composite sheet of an embodiment of the invention, can also arrange
Lift the composite sheet for the structure that fixture adhesive linkage 12 is provided with the face of Fig. 1 (b) composite sheet 1b supporter 11.
As the composite sheet of an embodiment of the invention, can also be has resin film as shown in Fig. 1 (d)
Formation is with piece 10 by the composite sheet 1d of the structure of 2 supporters 11,11 '.
It should be noted that can also in the same manner as composite sheet 1d structure, Fig. 1 (b) composite sheet 1b it is exposed
The resin film formation supporters different from supporter 11 of setting on the face of piece 10.
In addition, similarly, on the face of the resin film formation piece 10 of the composite sheet 1c shown in Fig. 1 (c) and can also press from both sides
Have and the supporters different from supporter 11 are set on the face of adhesive linkage 12.
<Supporter>
The supporter that the composite sheet of an embodiment of the invention has is to play to prevent in resin film formation piece
Surface attachment dust etc. stripping film or for being protected in cutting action etc. to resin film formation with the surface of piece
The sheet material of the effect of cutting sheet etc..
The supporter used in the present invention is preferably the structure with resin film.
As the resin film, it can enumerate for example：Low density polyethylene (LDPE) (LDPE) film, straight-chain low density polyethylene (LLDPE)
The polyethylene films such as film, ethylene-propylene copolymer film, polypropylene screen, polybutene film, polybutadiene film, polymethylpentene film, polychlorostyrene
Vinyl film, vinyl chloride copolymer film, polyethylene terephthalate film, poly (ethylene naphthalate) film, poly- terephthaldehyde
Sour butanediol ester film, polyurethane film, vinyl-vinyl acetate copolymer film, ionomer resin film, ethene-(methyl) acrylic acid
Co-polymer membrane, ethene-(methyl) acrylate copolymer film, polystyrene film, polycarbonate membrane, polyimide film, fluororesin
Film etc..
The base material used in an embodiment of the invention can be the monofilm being made up of a kind of resin film, also may be used
To be by the stack membrane of two or more resin film lamination.
In addition, above-mentioned resin film can also be cross linking membrane.
Furthermore it is also possible to using piece obtained from being coloured to these resin films or implement piece obtained from printing etc..
Further, resin film can be film obtained from thermoplastic resin is made into piece by extrusion molding or
Stretched film, can also use and obtain curable resin using piece is made after given method progress filming and solidification
Film.
In these resin films, there is expansion adaptability from excellent heat resistance and due to the flexibility with appropriateness, also hold
Easily keep from the viewpoint of pickup adaptability, preferably comprise the base material of polypropylene screen.
It should be noted that can be the list being only made up of polypropylene screen as the structure of the base material comprising polypropylene screen
Rotating fields or the sandwich construction being made up of polypropylene screen and other resin films.
In the case of resin film formation piece is heat cured, constituting the resin film of base material has heat resistance, thus can suppress
By the damage of thermally-induced base material, so as to suppress the generation of the undesirable condition in the manufacturing process of semiconductor device.
Using supporter as preventing in the case where the stripping film of the surface attachment dust of resin film formation piece etc. is used,
As the supporter, easily it can be peeled off when being preferably when being pasted with silicon wafer, cutting action from resin film formation with piece
Resin film.
In addition, as the supporter, the resin for implementing lift-off processing to the surface of above-mentioned resin film can also be used
Film.
As the method for the lift-off processing, the stripping film formed by remover is preferably set on the surface of above-mentioned resin film
Method.
As the remover, can enumerate comprising selected from such as acrylic resin, alkyd based resin, organic silicon resin,
Remover of resin in fluorine-type resin, unsaturated polyester (UP) resinoid, polyolefin resin, wax class resin etc. etc..
Using supporter as being subject to what fixed cutting sheet was used with piece to resin film formation in cutting action etc.
In the case of, it is preferably the bonding sheet on above-mentioned resin film with the adhesive phase formed by adhesive as the supporter.
As the resin of binding property included in the adhesive, in the case where being conceived to the structure of resin of binding property, it can arrange
Citing such as acrylic resin, urethane based resin, rubber resin, organic silicon resin, vinyl ethers resinoid,
In the case where being conceived to function, it can enumerate such as energy-line solidifying type resin.
In an embodiment of the invention, from the viewpoint of making pick good, energy line curing is preferably comprised
The adhesive of type resin.
As the thickness of supporter, can suitably be selected according to purposes, but preferably 10~500 μm, more preferably 20~
350 μm, more preferably 30~200 μm.
It should be noted that the thickness of above-mentioned supporter is not only the thickness for the resin film for constituting supporter, with viscous
In the case of mixture layer or stripping film, the also thickness including the adhesive phase or stripping film.
<Fixture adhesive linkage>
Fixture adhesive linkage can be formed or by the adhesive comprising adhesive by the double-sided adhesive sheet with base material (core)
Composition is formed.
As the base material (core), the resin film that can act as above-mentioned base material, preferably polypropylene screen can be enumerated.
In addition, as above-mentioned adhesive, can enumerate for example：Acrylic resin, urethane based resin, rubber-like tree
Fat, organic silicon resin, vinyl ethers resinoid etc..
The thickness of fixture adhesive linkage is preferably 1~80 μm, more preferably 5~60 μm, more preferably 10~40 μm.
[the resin film formation composite sheets of other embodiments of the present invention]
As other embodiments of the present invention, following resin film formation composite sheet can be enumerated (hereinafter also referred to " multiple
Close piece (1) ").
It is with supporter (I) and resin film formation piece as the composite sheet (1) of an embodiment of the invention
Composite sheet, the resin film formation is pasted on silicon wafer with piece, for forming resin film on the silicon wafer, with above-mentioned Fig. 1 institutes
Composite sheet 1a~the 1d shown is identical structure.
Simply, composite sheet (1) have by treat with silicon wafer paste side above-mentioned resin film formation piece surface (α) and
Surface roughness is the structure of surface (i) the directly lamination of more than 40nm supporter (I).
It is believed that by transfer, can cause from composite sheet (1) remove supporter (I) when exposed above-mentioned resin film shape
It is more than 40nm's into the surface roughness (Ra) shown with the surface (α) of piece with being formed on supporter (I) surface (i)
The small surface roughness of surface roughness (Ra) of the bumps for equal extent or than being formed on supporter (I) surface (i)
(Ra)。
It is understood that from composite sheet (1) remove supporter (I) after resin film formation piece surface (α)
Surface roughness (Ra) is more than the set-point of the degree for the improvement that can play releasable, the resin with the invention described above
Film formation similarly has the improvement of releasable with piece.
The resin film formation piece having as the composite sheet (1) of an embodiment of the invention preferably has thermosetting
Property.
If with heat cured resin film formation piece, then by the resin film formation be pasted on piece silicon wafer it
In heating process afterwards, resin film formation easily deformed with the concaveconvex shape on the surface (α) of piece, thus with silicon wafer it
Between interface be not likely to produce the space as caused by forming with the concaveconvex shape on the surface (α) of piece resin film.As a result, in silicon wafer
On the resin film of upper formation, the scattering of the light as caused by the space can be suppressed, the electromagnetism such as naked eyes or infrared ray are easily utilized
Ripple and carry out to the silicon wafer with resin film, inspection of chip etc. observe.
From the viewpoint of thermosetting is assigned, the tree having as the composite sheet (1) of an embodiment of the invention
Adipose membrane formation preferably comprises above-mentioned thermosetting component (B1) with piece.
The surface roughness of resin film formation piece after the supporter (I) having as removing composite sheet (1)
(Ra), preferably more than 40nm, more preferably more than 45nm, more preferably more than 50nm, still more preferably be 53nm
Above, much further preferably from more than 55nm, additionally, it is preferred that being below 200nm, being more preferably below 150nm, further preferably
For below 100nm.
In addition, the surface roughness (Ra) on the surface (i) as supporter (I), preferably more than 40nm, more preferably
More than 70nm, more preferably more than 100nm, still more preferably for more than 200nm, much further preferably from 300nm with
On, additionally, it is preferred that being below 1000nm, more preferably below 800nm, more preferably below 500nm.
The supporter (I) having as composite sheet (1), as long as reach surface roughness (Ra) by surface treatment
Then it is not particularly limited, but is preferably formed by paper or resin film to above range and the supporter that can peel off, is produced from reduction
From the viewpoint of the possibility of dust, more preferably formed by resin film.
As the method for the surface roughness (Ra) on the surface (i) of adjustment supporter (I), it can enumerate for example：Make composition branch
The stripping film that the method containing packing material, setting are formed by the remover comprising packing material in the resin film of support body (I)
Method etc..
In addition, supporter (I) is by the case that the resin film manufactured by melting extrusion is constituted, can be made to melt
Resin be injected on the roller of rough surface shape so that surface roughness (Ra) is adjusted to the resin film of above range.
In addition, as the formation material of supporter (I), can using paper, non-woven fabrics etc., it can become surface in nature
Coarse material adjusts the surface roughness (Ra) on the surface (i) of supporter (I).
Used in addition, composite sheet (1) has can also being the composite sheet 1d as shown in Fig. 1 (d) in resin film formation
Further directly lamination has the composite sheet of the structure of the 2nd supporter (II) on the surface (β) of the side opposite with surface (α) of piece.
The resin film formation piece that the composite sheet has preferably has thermosetting.Therefore, resin film formation is excellent with piece
Choosing contains above-mentioned thermosetting component (B1).
It should be noted that for having resin film formation piece supported body (I) and branch as shown in Fig. 1 (d)
Support body (II) clamping structure composite sheet (1) for, by resin film formation be pasted on the surface (α) of piece silicon wafer it
Afterwards, make to make the resin in the state of the supporter (II) and resin film formation piece lamination not peeling off supporter (II)
Film formation carries out heat cure, and the gloss determined from the surface (β ') of the side opposite with the silicon wafer of the resin film formed with piece
There is the tendency increased in angle value.The gloss value is higher than the table of the resin film using the composite sheet formation without supporter (II)
The gloss value in face (β ') and will supporter (II) peel off after make the exposed state in the surface (β) of resin film formation piece
The gloss value on the surface (β ') of resin film formed by lower carry out heat cure.
That is, even if causing for the reason such as having used the big packing material of average grain diameter as packing material (C)
In the case of the gloss value reduction on the surface (β ') of resin film, by not shelling composite sheet (1) is pasted on after silicon wafer
From supporter (II) but make the resin film formation piece in the state of the supporter (II) and resin film formation are with piece lamination
Heat cure is carried out, the high resin film of the visual identity of laser printing can be formed.
In order that resin film formation piece has thermosetting, resin film formation piece is set to contain above-mentioned thermosetting component
(B1).
As supporter (II), the supporter identical material having with the composite sheet of the invention described above can be enumerated, is had
Body can be enumerated：Above-mentioned resin film, the resin film with stripping film, bonding sheet with adhesive phase etc..
It should be noted that in the case that supporter (II) is the bonding sheet with adhesive phase, composite sheet (1) is preferred to be had
There is the structure that surface (β) the directly lamination with piece is formed by the adhesive phase and above-mentioned resin film.In the structure shown here, pass through
Adhesive phase is formed by the adhesive comprising energy-line solidifying type resin, energy line irradiation is carried out in advance and it is solidified and is obtained
Adhesive phase, and the resin film formation piece is occurred heat in the state of the supporter (II) and resin film formation piece lamination
Solidification, can with when the gloss value on the surface (β ') of resin film that is formed improve.
[renovation process of silicon wafer]
As the laminated body pasted from the surface (α) of silicon wafer and the resin film formation piece of the present invention by the resin
Film formation piece is peeled off to regenerate the method for silicon wafer, can enumerate silicon wafer for example including following processes (1)~(2) again
Generation method.
Process (1)：The adhesive phase of bonding sheet with base material and adhesive phase is pasted onto the tree of above-mentioned laminated body
Process on the surface (β) of surface (α) opposite side with being pasted with silicon wafer of adipose membrane formation piece；
Process (2)：The above-mentioned bonding sheet pasted in process (1) is pulled, will be pasted onto on above-mentioned silicon wafer
The process that above-mentioned resin film formation is peeled off with piece.
The renovation process of above-mentioned silicon wafer is to make use of the resin film formation of the invention with excellent releasable to use
The renovation process of the property of piece, this method can not cause silicon wafer to be sent out when being intended to be peeled off after being pasted on silicon wafer
Give birth to breakage and realized in the case of not producing residue and peeled off.
It should be noted that the renovation process of the silicon wafer can be applied not only to silicon wafer and the tree of the present invention just
The surface (α) of adipose membrane formation piece paste after laminated body, for have passed through 24 hours or so, silicon wafer and tree after stickup
The laminated body for the state that adipose membrane formation is improved with the adaptation between piece can be also applicable.
<Process (1)>
Process (1) is that the adhesive phase of the bonding sheet with base material and adhesive phase is pasted onto to the tree of above-mentioned laminated body
Process on the surface (β) of surface (α) opposite side with being pasted with silicon wafer of adipose membrane formation piece.
Silicon wafer is not limited to carry out the chip or utilization such as DBG (dicing before singualtion
Before grinding) method has been made the chip of monolithic, and the DBG methods are by from silicon wafer and face to be ground
The face of opposite side sets groove and carried out until the grinding of groove is reached, so that silicon wafer monolithic to be melted into the method for chip.
It is the bonding sheet with base material and adhesive phase as the bonding sheet used in this process.It should be noted that
In the case where the composite sheet (1) with the supporter (II) formed by bonding sheet is pasted on into silicon wafer, it will can also support
Body (II) is used as " bonding sheet " described in this process.
As the base material, preferably resin film, the resin film that example goes out in the project of above-mentioned supporter can be set forth in.
, can be by resin film formation piece in process (2) as long as having as the adhesive for forming the adhesive phase
Then it is not particularly limited from the adhesive of the bonding force of silicon wafer extent of exfoliation.
As specific adhesive, it can enumerate for example：Acrylic adhesives, carbamates adhesive, organosilicon
Class adhesive etc..
As the shape of the bonding sheet, it is not particularly limited, but the operational viewpoint from follow-up process (2) goes out
Hair, preferable shape and the bonding sheet that resin film formation piece is that identical or shape is more than resin film formation piece.
As the surface (β) in this process and the method for attaching of the adhesive phase of bonding sheet, machinery can be used to be glued
Patch, can also be carried out by manual working.
It should be noted that being used in the resin film formation with the composite sheet of an embodiment of the invention described above
The surface (α) of piece is pasted on silicon wafer and lamination has feelings as bonding sheets such as the cutting sheets of supporter for its surface (β) side
Under condition, it is possible to use the bonding sheet as this process bonding sheet.
<Process (2)>
Process (2) is that the above-mentioned bonding sheet pasted in process (1) is pulled, and will be pasted onto on above-mentioned silicon wafer
The process that above-mentioned resin film formation is peeled off with piece.
In this process, because the surface on the surface (α) pasted with silicon wafer of the resin film formation piece of the present invention is thick
Rugosity (Ra) has been adjusted to above range, therefore by being led to the bonding sheet that surface (β) is pasted in process (1)
Draw, resin film formation also can together be dragged down with piece, so that the resin film formation piece be peeled off from silicon wafer.
As the peeling rate and peel angle of bonding sheet, it is not particularly limited, can suitably sets.
In addition, in this process, machinery can also be used to pull bonding sheet, but from the viewpoint of operability,
It is preferred that pulling bonding sheet by manual working, above-mentioned resin film formation piece is peeled off from silicon wafer.
It should be noted that in this process, after resin film formation piece is peeled off, can also utilize as needed
The organic solvents such as ethanol are washed to the surface of silicon wafer.
By passing through above process, the silicon wafer for being temporarily pasted with resin film formation piece can be made to realize regeneration.
Embodiment
<The measure of weight average molecular weight (Mw), number-average molecular weight (Mn)>
Using gel permeation chromatography device (TOSOH Co., Ltd's system, product name " HLC-8220GPC ") under the following conditions
It is measured, has used the value for converting and determining through polystyrene standard.
(condition determination)
Chromatographic column：By " TSK guard column HXL-L " " TSK gel GMHXL (× 2) " " TSK gel
G2000HXL " (being manufactured by TOSOH Co., Ltd) links successively.
Column temperature：40℃
Eluting solvent：Tetrahydrofuran
Flow velocity：1.0mL/min
<The average grain diameter of composition in resin film formation composition>
Use dynamic light scattering formula grain-distribution detection instrument (Nikkiso Company Limited's system, product name " Nanotrack
Wave-UT151 ") it is determined.
<The measure of surface roughness (Ra)>
Use light interference type surface-profile measuring instrument (Veeco Metrology Group company systems, product name " WYKO
WT1100 "), the surface roughness (Ra) using PSI patterns, with multiplying power 10 again to the surface of measure object is determined.
<The evaluation of the releasable of resin film formation piece>
The supporter (I) that the resin film formation composite sheet made in embodiment and comparative example has is removed, and
Exposed resin film formation is stacked in the silicon wafer (diameter that have passed through #2000 grindings with the surface (α) of piece：200mm, thickness：
280 μm) abradant surface on, use belt chip mounter (Lindeke Co., Ltd's system, product name " Adwill RAD-3600F/
12 "), pasted while being heated to 70 DEG C.
After stickup, resin film formation is also removed with the supporter (II) of composite sheet under room temperature (25 DEG C), will be commercially available
The adhesive aspect of general cutting belt (Lindeke Co., Ltd's system, trade name " Adwill D-510T ") is pasted onto exposed tree
On the surface of adipose membrane formation piece.
Then, for whether the general cutting belt can be pulled by using manual working and by resin film formation piece one
Rise from being peeled off on silicon wafer and the surface of silicon wafer after stripping is whether there is from remnant carried out, and according to subscript
Standard is evaluated with the releasable of piece resin film formation.
A：Resin film formation can be completely exfoliated from silicon wafer with piece.On silicon wafer after stripping, do not observe
The remnant for the resin film formation piece that can be confirmed by range estimation.
B：Resin film formation piece can be peeled off from silicon wafer.On silicon wafer after stripping, it observed
The remnant of resin film formation piece, but in the degree that can be removed completely if using ethanol.
C：Even if there occurs in stripping silicon wafer breakage or can be real in the case where not causing silicon wafer damaged
Now peel off, can also be confirmed on the silicon wafer after stripping the degree for being difficult by ethanol resin film formation piece it is residual
Storage.
<The measure of the gloss value of resin film>
The supporter (I) that the resin film formation composite sheet made in embodiment and comparative example has is removed, and
Exposed resin film formation is stacked in silicon wafer (diameter 200mm, the thickness that have passed through #2000 grindings with the surface (α) of piece
280 μm) abradant surface on, use belt chip mounter (Lindeke Co., Ltd's system, product name " Adwill RAD-3600F/
12 "), pasted while being heated to 70 DEG C.
After stickup, resin film formation is also removed with the supporter (II) of composite sheet, put into 2 in 130 DEG C of heating furnace
Hour and solidify resin film formation piece, so as to form resin film on silicon.
Then, using gloss meter (electricity Se Industrial Co., Ltd of Japan system, product name " VG 2000 "), based on JIS Z
8741st, 60 degree of the mirror surface luster on the surface of the resin film of formation is surveyed from side opposite with the side with silicon wafer
It is fixed.Using the value of the mirror surface luster as resin film gloss value.
<The measure of light transmittance of the resin film under wavelength 1250nm>
The supporter (I) that the resin film formation composite sheet made in embodiment and comparative example has is removed, and
Exposed resin film formation is stacked on the tabular surface of thickness 2mm glass plate with the surface (α) of piece, existed using laminater
It is heated to being pasted while 70 DEG C.
After stickup, resin film formation is also removed with the supporter (II) of composite sheet, put into 2 in 130 DEG C of heating furnace
Hour and solidify resin film formation piece, so as to form resin film on a glass.
Then, using spectrophotometer (Shimadzu Scisakusho Ltd's system, product name " UV-VIS-
NIRSPECTROPHOTOMETER UV-3600 ") transmissivity of resin film on above-mentioned glass plate is determined, and extracted ripple
Long 1250nm light transmittance (%).
Measure is using the incidental large-scale sample room " MPC-3100 " (product name) of above-mentioned spectrophotometer, is being not used
Carried out in the case of built-in integrating sphere.Take and the single light transmittance under wavelength 1250nm of glass plate of measured in advance
Difference, has calculated light transmittance of the resin film under wavelength 1250nm.
Embodiment 1
Each composition of species shown in addition table 1 and use level is simultaneously diluted using MEK, is prepared for active ingredient dense
Spend the solution of the resin film formation composition for 51 mass %.
Then, as supporter (II), polyethylene terephthalate (PET) film (beautiful jade of lift-off processing is being implemented
Obtain section's Co. Ltd. system, trade name " SP-PET381031 ", thickness：38 μm) lift-off processing face on be coated with above-mentioned resin film shape
Into with the solution of composition and being dried, the resin film formation piece of 25 μm of thickness is formd.
Further, on the surface exposed outside of the resin film formation piece formed, pasted as supporter (I)
Peeling paper (Lindeke Co., Ltd's system, trade name " SP-8LK blue ", thickness：88 μm, to glassine paper carry out polyolefine
And implement organosilicon lift-off processing and form, surface roughness (the Ra)=370nm in lift-off processing face) lift-off processing face, and profit
It is laminated, is made under room temperature (25 DEG C) with laminater (Taisei Laminator Co., Ltd.'s system, product name " VA-400 ")
The resin film constituted with piece/supporter (II) formed by supporter (I)/resin film formed and use composite sheet.
Comparative example 1
On the exposed surface of the resin film formation piece formed similarly to Example 1, glued as supporter (I)
Polyethylene terephthalate (PET) film (Lindeke Co., Ltd's system, the trade name " SP- for implementing lift-off processing are pasted
PET251130 ", thickness：25 μm) lift-off processing face, in addition, made similarly to Example 1 by supporter (I)/
The resin film formation composite sheet that resin film formation piece/supporter (II) is constituted.
For each composition described in the table 1 of the preparation of resin film formation composition, that Details as Follows is described.
<Component of polymer (A)>
·(A-1)：By methyl acrylate (MA), n-butyl acrylate (BA), GMA (GMA),
And acrylic copolymer (BA/MA/GMA/HEA=37/28/20/15 (matter obtained from acrylic acid 2- hydroxy methacrylates (HEA) copolymerization
Measure %), Mw=80 ten thousand, Tg=-10.1 DEG C).
<Curability composition (B)>
·(B-1)：Bisphenol A type epoxy resin (Mitsubishi chemical Co., Ltd's system, trade name " jER828 ", epoxide equivalent=
184~194g/eq, Mn=370, viscosity=120~150P (12~15Pas) at 25 DEG C, liquid-state epoxy resin, equivalent to
The compound of mentioned component (B11)).
·(B-2)：Bisphenol A type epoxy resin (Mitsubishi chemical Co., Ltd's system, trade name " jER1055 ", epoxide equivalent=
800~900g/eq, Mn=1600, solid epoxy, the compound equivalent to mentioned component (B11)).
·(B-3)：Dicyclopentadiene type epoxy resin (Dainippon Ink Chemicals's system, trade name " EpiclonHP-7200HH ",
Compounds of epoxide equivalent=255~260g/eq, the Mw less than 20,000, solid epoxy, the change equivalent to mentioned component (B11)
Compound).
·(B-4)：(" Adeka HardenerEH-3636AS ", amine are solid for Asahi Denka Co., Ltd.'s system, trade name for dicyandiamide
Agent, active hydrogen amount=21g/eq, the compound equivalent to mentioned component (B12)).
·(B-5)：2- phenyl -4,5- bishydroxymethyls imidazoles (Shikoku Chem's system, trade name
" CUREZOL 2PHZ ", curing accelerator, the compound equivalent to mentioned component (B13)).
<Packing material (C)>
·(C-1)：Silica filler (Admatechs company systems, trade name " SC2050MA ", average grain diameter=
500nm)。
<Colouring agent (D)>
·(D-1)：Carbon black (Mitsubishi chemical Co., Ltd's system, trade name " #MA650 ", average grain diameter=28nm).
<Silane coupler (E)>
·(E-1)：Silane coupler (3- glycidoxypropyls dimethoxysilane, SHIN-ETSU HANTOTAI's chemical industry strain formula
Commercial firm's system, trade name " KBM-402 ", Mn=220.3).
The measure of physical property has been carried out with piece to the resin film formation made in embodiment and comparative example based on the above method
And evaluate, as a result as shown in table 1.
[table 1]
As shown in Table 1, as the resin film formation composite sheet made in the embodiment 1 of an embodiment of the invention
The resin film formation being had has obtained the excellent result of releasable with piece.In addition, forming what is formed with piece by the resin film
The gloss value of resin film and wavelength 1250nm light transmittance have also obtained high level.
On the other hand, the resin film formation piece having for the resin film formation made in comparative example 1 with composite sheet
For, the value of the surface roughness (Ra) of surface (α) is small, therefore is difficult to after silicon wafer is pasted on to peel off, and has obtained shelling again
The result bad from property.
Industrial applicibility
The resin film formation of an embodiment of the invention is with piece suitably as the guarantor at the back side for protecting semiconductor chip
The formation material of cuticula can be bonded in the formation material of brilliant pad portion or the adhesive film on other positions.
Claims (15)
1. a kind of resin film formation piece, it is to be pasted on silicon wafer, the piece for forming resin film on the silicon wafer,
Wherein, it is more than 40nm to treat the surface roughness (Ra) that the surface (α) of the piece of side is pasted with silicon wafer.
2. resin film formation piece according to claim 1, it includes component of polymer (A) and curability composition (B).
3. resin film formation piece according to claim 2, wherein, component of polymer (A) includes acrylic polymer
(A1)。
4. according to resin film formation piece according to any one of claims 1 to 3, it includes thermosetting component (B1).
5. according to resin film formation piece according to any one of claims 1 to 4, it includes packing material (C).
6. resin film formation piece according to claim 5, wherein, relative to the total amount of the resin film formation piece,
The content of packing material (C) is 10~80 mass %.
7. the resin film formation piece according to claim 5 or 6, wherein, the average grain diameter of packing material (C) for 100~
1000nm。
8. according to resin film formation piece according to any one of claims 1 to 7, it is to be used to form protection on silicon
The diaphragm formation piece of film.
9. according to resin film formation piece according to any one of claims 1 to 8, wherein, by the resin film formation piece
Surface (α) be pasted on after silicon wafer, from the side opposite with the silicon wafer that the resin film formed with piece is formed by the resin film
The gloss value that surface (β ') is determined is more than 25.
10. a kind of resin film formation composite sheet, it has：
Resin film according to any one of claims 1 to 9 formation with piece and
Supporter.
11. a kind of resin film formation composite sheet, it has：
Be pasted on silicon wafer, on the silicon wafer formed resin film resin film formation piece and
Supporter (I),
The composite sheet, which has, treats that the resin film formation with silicon wafer stickup side is with surface roughness with the surface (α) of piece
The structure of the surface (i) of more than 40nm supporter (I) directly lamination.
12. resin film formation composite sheet according to claim 11, wherein, remove the resin film formation composite sheet
The surface roughness (Ra) on the surface (α) of the resin film formation piece exposed during supporter (I) having is more than 40nm.
13. the resin film formation composite sheet according to claim 11 or 12, wherein, the resin film formation is included with piece
Thermosetting component (B1).
14. the resin film formation composite sheet according to claim 11 or 12, it has in the resin film formation piece
Side opposite with surface (α) surface (β) on further directly lamination has the structure of the 2nd supporter (II),
The resin film formation piece contains thermosetting component (B1).
15. resin film formation composite sheet according to claim 14, wherein, supporter (II) is with adhesive phase
Bonding sheet,
The composite sheet has the adhesive phase and structure of the resin film formation with surface (β) the directly lamination of piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202011201640.0A CN112625609B (en) | 2015-03-30 | 2016-03-25 | Sheet for forming resin film and composite sheet for forming resin film |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015069795 | 2015-03-30 | ||
| JP2015-069795 | 2015-03-30 | ||
| PCT/JP2016/059573 WO2016158727A1 (en) | 2015-03-30 | 2016-03-25 | Sheet for forming resin film and composite sheet for forming resin film |
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| CN202011201640.0A Division CN112625609B (en) | 2015-03-30 | 2016-03-25 | Sheet for forming resin film and composite sheet for forming resin film |
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| CN107001876A true CN107001876A (en) | 2017-08-01 |
| CN107001876B CN107001876B (en) | 2020-11-20 |
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| CN201680003816.7A Active CN107001876B (en) | 2015-03-30 | 2016-03-25 | Sheet for forming resin film and composite sheet for forming resin film |
| CN202011201640.0A Active CN112625609B (en) | 2015-03-30 | 2016-03-25 | Sheet for forming resin film and composite sheet for forming resin film |
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|---|---|
| JP (2) | JP6501428B2 (en) |
| KR (1) | KR102499451B1 (en) |
| CN (2) | CN107001876B (en) |
| SG (1) | SG11201704075PA (en) |
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| WO (1) | WO2016158727A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113692352A (en) * | 2019-04-26 | 2021-11-23 | 琳得科株式会社 | Method for producing third laminate, method for producing fourth laminate, method for producing semiconductor device with back surface protective film, and third laminate |
| CN117433564A (en) * | 2023-12-05 | 2024-01-23 | 北京航空航天大学 | Polarization sensor error online calibration method based on sun sensor assistance |
| TWI839508B (en) | 2019-04-26 | 2024-04-21 | 日商琳得科股份有限公司 | Method for manufacturing a third laminate, method for manufacturing a fourth laminate, method for manufacturing a semiconductor device with an inner surface protective film, and method for manufacturing a third laminate |
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| WO2020026666A1 (en) * | 2018-08-01 | 2020-02-06 | 株式会社有沢製作所 | Resin composition for resists and use thereof |
| JP7457513B2 (en) | 2020-02-03 | 2024-03-28 | リンテック株式会社 | PRODUCTION METHOD OF PROTECTIVE FILM-FORMING FILM, COMPOSITE SHEET FOR PROTECTIVE FILM-FORMING, AND APPARATUS |
| JP2022146565A (en) | 2021-03-22 | 2022-10-05 | リンテック株式会社 | Protective film-forming film, protective film-forming composite sheet, and wafer recycling method |
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- 2016-03-25 CN CN202011201640.0A patent/CN112625609B/en active Active
- 2016-03-25 JP JP2017509895A patent/JP6501428B2/en active Active
- 2016-03-25 SG SG11201704075PA patent/SG11201704075PA/en unknown
- 2016-03-25 WO PCT/JP2016/059573 patent/WO2016158727A1/en active Application Filing
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| CN113692352A (en) * | 2019-04-26 | 2021-11-23 | 琳得科株式会社 | Method for producing third laminate, method for producing fourth laminate, method for producing semiconductor device with back surface protective film, and third laminate |
| TWI839508B (en) | 2019-04-26 | 2024-04-21 | 日商琳得科股份有限公司 | Method for manufacturing a third laminate, method for manufacturing a fourth laminate, method for manufacturing a semiconductor device with an inner surface protective film, and method for manufacturing a third laminate |
| CN117433564A (en) * | 2023-12-05 | 2024-01-23 | 北京航空航天大学 | Polarization sensor error online calibration method based on sun sensor assistance |
| CN117433564B (en) * | 2023-12-05 | 2024-03-01 | 北京航空航天大学 | Polarization sensor error online calibration method based on sun sensor assistance |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6562172B2 (en) | 2019-08-21 |
| CN112625609A (en) | 2021-04-09 |
| TW201708477A (en) | 2017-03-01 |
| CN107001876B (en) | 2020-11-20 |
| SG11201704075PA (en) | 2017-10-30 |
| JP2019096913A (en) | 2019-06-20 |
| JPWO2016158727A1 (en) | 2018-01-25 |
| KR20170134960A (en) | 2017-12-07 |
| JP6501428B2 (en) | 2019-04-17 |
| WO2016158727A1 (en) | 2016-10-06 |
| KR102499451B1 (en) | 2023-02-13 |
| CN112625609B (en) | 2022-11-08 |
| TWI695872B (en) | 2020-06-11 |
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