CN106992138A - 治具和使用了治具的加工方法 - Google Patents

治具和使用了治具的加工方法 Download PDF

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CN106992138A
CN106992138A CN201710009150.2A CN201710009150A CN106992138A CN 106992138 A CN106992138 A CN 106992138A CN 201710009150 A CN201710009150 A CN 201710009150A CN 106992138 A CN106992138 A CN 106992138A
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北原信康
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Abstract

提供治具和使用了治具的加工方法，能够高效地对多个长方形的被加工物进行加工。本发明是对多个长方形的被加工物(1)的排列进行辅助的治具(2)，由具有互相平行的多个槽(21)的板状物(20)构成，多个槽(21)的一端(23)排列在一条直线上，槽(21)的深度(21a)形成为比被加工物(1)的厚度浅。因此，在将被加工物(1)嵌合到多个槽(21)中之后，在多个被加工物(1)上粘贴粘合带而进行转印，由此，能够使多个被加工物(1)在粘合带上排列。因此，能够防止多个被加工物(1)在粘合带上被粘贴得散乱，并能够对多个被加工物(1)进行高效地加工。

Description

治具和使用了治具的加工方法
技术领域
本发明涉及用于使多个长方形的被加工物排列的治具和使用了该治具的加工方法。
背景技术
为了将晶片等被加工物分割成各个芯片，例如，在下述的专利文献1所示的划线装置中，在通过划线器(scriber)形成沿着间隔道的分割槽之后，例如，使用下述的专利文献2所示的切割装置对被加工物施加外力从而沿着分割槽断裂成各个芯片。在被加工物的分割时，为了不使分割得到的各个芯片飞散，将粘合带粘贴在中央开口的环状的环状框架上，并使被加工物的一个面朝上而将该被加工物粘贴在从该开口部露出的粘合带的另一个面上，由此，借助该粘合带利用环状框架对被加工物进行支承。
这里，如图7所示，在作为加工对象的被加工物是由长方形构成的被加工物10的情况下，通过将多个被加工物10排列并粘贴在粘合带11之上，能够借助粘合带11利用环状框架12对多个被加工物10进行支承。
专利文献1：日本特开2003-45823号公报
专利文献2：日本特开2006-156896号公报
然而，在将多个被加工物10排列在上述的粘合带11上时，如果能够使被加工物10的一端对齐地排列在一条直线上，则能够利用一次动作对多个被加工物10进行加工，但由于通过作业人员的手动作业将被加工物10载置在粘合带11上，所以很难在粘合带11上将多个被加工物10的一端排列在一条直线上。因此，对各被加工物10进行拍摄并通过图像处理对从其一端到另一端的距离进行测量而对每个被加工物10进行加工，存在作业效率较差的问题。
发明内容
因此，本发明的目的在于，提供能够使多个长方形的被加工物的一端对齐地互相平行地排列的治具和对使用了该治具的多个长方形的被加工物进行加工的加工方法。
根据本发明，提供治具，其对多个长方形的被加工物的排列进行辅助，其中，该治具由板状物构成，该板状物具有互相平行的多个槽，该多个槽的一端排列在一条直线上，该槽的深度比该被加工物的厚度浅，在将该被加工物嵌合到该多个槽中之后在该被加工物上粘贴粘合带而进行转印，使多个该被加工物排列。
根据本发明的另一方面，提供使用了治具的加工方法，是对多个长方形的被加工物的加工方法，该治具具有互相平行的多个槽，该多个槽的一端排列在一条直线上，该槽的深度形成为比被加工物的厚度浅，其中，该使用了治具的加工方法具有如下的步骤：嵌合步骤，将该多个被加工物分别嵌合到该治具的多个槽中；转印步骤，在实施了该嵌合步骤之后，在被加工物的与嵌合到该治具的该槽中的那一侧的第2面相反的一侧的第1面上粘贴粘合带，并将该多个被加工物从该治具转印到粘合带上而使多个该被加工物排列；以及加工步骤，在实施了该转印步骤之后，对排列后的该多个被加工物进行加工。
由于本发明的治具由包含有互相平行的多个槽的板状物构成，多个槽的一端排列在一条直线上，槽的深度比被加工物的厚度浅，所以在分别将被加工物嵌合到多个槽中之后，在多个被加工物上粘贴粘合带而将被加工物从治具转印到粘合带上，由此，能够使多个被加工物在粘合带上排列。因此，能够防止多个被加工物在粘合带中被粘贴得位置和朝向变得散乱，并能够对多个被加工物进行高效地加工。
由于本发明的加工方法包含如下步骤：嵌合步骤，将被加工物嵌合到治具的槽中；转印步骤，在被加工物的与嵌合到治具的槽中的那一侧的面相反的一侧的面上粘贴粘合带并进行转印而使多个被加工物排列；以及加工步骤，对排列后的多个被加工物进行加工，所以与上述同样，能够使多个被加工物排列地粘贴在粘合带上，并能够对多个被加工物进行高效地加工。
附图说明
图1是示出长方形的被加工物的结构的立体图。
图2是示出治具的结构的局部放大剖视图。
图3是示出治具的结构的俯视图。
图4是示出嵌合步骤的局部放大剖视图。
图5的(a)、(b)和(c)是示出转印步骤的剖视图。
图6是示出加工步骤的立体图。
图7是示出多个长方形的被加工物排列并粘贴在粘合带上的以往例的立体图。
标号说明
1：被加工物；1a：第1面；1b：第2面；1c：侧面；1d：端面；2：治具；20：板状物；20a：正面；21：槽；210：内壁；21a：深度；21b：宽度；21c：长度；21d：开口部；22：间隔；23：一端；3：工件套件；4：环状框架；5：粘合带；6：卡盘工作台；7：激光加工单元；10：被加工物；11：粘合带；12：环状框架。
具体实施方式
1被加工物的结构
图1所示的被加工物1是长方形的被加工物的一例，例如，由磷化铟(InP)的单结晶构成。被加工物1具有上表面侧的第1面1a、处于第1面1a的相反侧的第2面1b、在长度方向上延伸的一对侧面1c、以及在宽度方向上延伸的一对端面1d。被加工物1的大小并没有特别地限定，例如，高度H形成为80μm、宽度W形成为200μm、长度L形成为20mm。
2治具的结构
图2所示的治具2在将多个被加工物1粘贴在粘合带上时使用，是用于对多个被加工物1的排列进行辅助的治具。治具2由板状物20构成，该板状物20包含用于嵌合多个被加工物1的互相平行的多个槽21。板状物20例如由硅(Si)构成。多个槽21例如通过激光切槽(激光照射所进行的槽形成)而预先形成在板状物20的正面20a。另外，板状物20的厚度或大小并没有特别限定，可以设定为任意。
槽21的深度21a形成为比被加工物1的厚度浅。即，槽21的深度21a为能够将被加工物1嵌入到槽21中的程度的深度即可，例如形成为15μm。为了使被加工物1容易进入到槽21中，槽21的宽度21b稍微比被加工物1的宽度W宽，例如，形成为250～300μm。相邻的槽21之间的间隔22例如为10μm左右。
如图3所示，槽21在形成于板状物20的一个侧面侧的开口部21d处开口。槽21的长度21c形成为与图1所示的被加工物1的长度L为相同程度。多个槽21在各自的一端23在一条直线上对齐的状态下互相平行地排列。在将多个被加工物1嵌合到这样构成的多个槽21中时，在使被加工物1粗略地与各个槽21对位而进行收纳之后，将被加工物1的端面1d推抵于各个一端23，由此，能够将多个被加工物1的端面1d对齐在一条直线上。在将被加工物1收纳到槽21中时，可以使被加工物从槽21的上方下降，也可以从开口部21d侧***被加工物1。由于在槽21中形成有开口部21d，所以也能够将长度方向的长度比槽21长的被加工物收纳在槽21中。另外，槽21的个数并没有特别地限定。
这样，由于本发明的治具2由包含有能够嵌合长方形的被加工物1的多个槽21的板状物20构成，并采用了在多个槽21的一端23在一条直线上对齐的状态下多个槽21互相平行地排列的结构，所以在对多个被加工物1进行加工时，将被加工物1嵌合到多个槽21中，并在多个被加工物1上例如粘贴粘合带而进行转印，由此，能够使多个被加工物1在粘合带中排列。因此，防止了多个被加工物1在粘合带中被粘贴得位置和朝向变得散乱，能够对多个被加工物1进行高效地加工。
3加工方法
接着，对使用了治具2的多个被加工物1的加工方法进行说明。在本实施方式中，对如下的情况进行说明：在对多个被加工物1实施激光加工(激光划线)而形成分割起点(槽)之后，沿着分割起点进行切割而将各被加工物1分割成规定的长度。
(1)嵌合步骤
如图4所示，将多个被加工物1嵌合到治具2的多个槽21中。具体来说，将被加工物1的第2面1b侧载置在治具2的槽21上而使第1面1a朝上露出。此时，由于被加工物1的一对侧面1c进入到槽21的比内壁210靠内侧的位置，所以能够容易地将被加工物1定位在槽21中。并且，如图2所示，由于槽21的深度21a形成为比被加工物1的厚度浅，所以第1面1a位于比板状物20的正面20a靠上方的位置。
接着，将被加工物1的端面1d推抵在图3所示的槽21的一端23，由此，对被加工物1的位置进行定位。也就是说，成为被加工物1被嵌合到槽21中的状态。并且，如果将各被加工物1嵌合到全部的槽21中，则嵌合步骤完成。
(2)转印步骤
如图5所示，在被加工物1的与嵌合到治具2的槽21中的那一侧的第2面1b相反的一侧的第1面1a上粘贴粘合带5而进行转印。具体来说，如图5的(a)所示，将粘合带5粘贴在中央开口的环状的环状框架4上并使粘合带5的粘合面从该中央朝向下方露出。之后，如图5的(b)所示，将该从中央露出的粘合带5的粘合面粘贴在多个被加工物1的第1面1a上。
接着，如图5的(c)所示，使治具2从多个被加工物1离开而将多个被加工物1转印到粘合带5上，并使各被加工物1的第2面1b朝上。其结果是，多个被加工物1借助粘合带5被环状框架4支承而形成为一体的工件套件3。这样，在粘合带5上，如图6所示，多个被加工物1成为在多个被加工物1的端面1d在一条直线上对齐的状态下排列的状态。
(3)加工步骤
如图6所示，进行在粘合带5中排列后的多个被加工物1上形成分割起点的激光加工。在本实施方式所示的加工步骤中，使用至少具有如下部件的加工装置：卡盘工作台6，其能够对工件套件3进行保持并在加工进给方向(X轴方向)上移动；以及激光加工单元7，其在多个被加工物1上形成分割起点。
如果将工件套件3载置并保持在卡盘工作台6上，则使卡盘工作台6移动至激光加工单元7的下方。接着，一边使卡盘工作台6在加工进给方向上移动，一边通过激光加工单元7沿着要分割的分割预定线S照射具有规定的波长的激光束LB而在各被加工物1上形成分割起点。
由于多个被加工物1在X轴方向上在一条直线上排列，所以能够通过卡盘工作台6的一次加工进给而在多个被加工物1上形成沿着分割预定线S的分割起点。接着，一边使卡盘工作台6在Y轴方向上按照规定的长度进行转位进给，一边重复进行上述同样的激光束LB的照射，在全部的被加工物1上形成分割起点。然后，将被加工物1搬送到未图示的切割装置并对被加工物1施加外力而以分割起点为起点将被加工物1分割成规定的长度。这样在被加工物1被分割成规定的长度之后，对单片化后的各部件实施希望的加工，例如作为激光振荡器的部件来进行使用。
关于加工步骤，除了在激光划线之后进行切割之外，例如，也可以通过沿着分割预定线S照射1次或多次的激光束而将被加工物1完全切断(全切割)。
这样，本发明的加工方法包含如下的步骤：嵌合步骤，将被加工物1嵌合到治具2的槽21中；转印步骤，在被加工物1的与嵌合到治具2的槽21中的那一侧的第2面1b相反的一侧的第1面1a上粘贴粘合带5并进行转印而使多个被加工物1排列；以及加工步骤，对排列后的多个被加工物1进行加工，所以能够使多个被加工物1排列而粘贴在粘合带5上，能够对多个被加工物1进行高效地加工。
另外，作为本发明的加工对象的被加工物1的材质并不仅限于磷化铟(InP)。因此，在被加工物1例如由硅(Si)、碳化硅(SiC)等构成的情况下，加工步骤并不仅限于由激光加工进行的情况，在使用切削装置或划线装置对被加工物1进行划线之后也可以进行切割等。

Claims (2)

1.一种治具，其对多个长方形的被加工物的排列进行辅助，其中，
该治具由板状物构成，该板状物具有互相平行的多个槽，
该多个槽的一端排列在一条直线上，该槽的深度比该被加工物的厚度浅，
在将该被加工物嵌合到该多个槽中之后在该被加工物上粘贴粘合带而进行转印，使多个该被加工物排列。
2.一种使用了治具的加工方法，是对多个长方形的被加工物的加工方法，该治具具有互相平行的多个槽，该多个槽的一端排列在一条直线上，该槽的深度形成为比被加工物的厚度浅，其中，该使用了治具的加工方法具有如下的步骤：
嵌合步骤，将该多个被加工物分别嵌合到该治具的多个槽中；
转印步骤，在实施了该嵌合步骤之后，在被加工物的与嵌合到该治具的该槽中的那一侧的第2面相反的一侧的第1面上粘贴粘合带，并将该多个被加工物从该治具转印到粘合带上而使多个该被加工物排列；以及
加工步骤，在实施了该转印步骤之后，对排列后的该多个被加工物进行加工。
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